CN220381892U - High-temperature-resistant common-mode inductor - Google Patents

Abstract

The utility model relates to the technical field of common mode inductors, in particular to a high-temperature-resistant common mode inductor which comprises a mounting piece and a magnetic core, wherein a wire slot is formed in the magnetic core, a line is wound on the magnetic core, an upper binding post is fixedly arranged at the top end of the mounting piece, one end of the line is connected to the upper binding post, and semiconductor refrigerating sheets are arranged on two sides of the magnetic core. The semiconductor refrigerating sheet and the first radiating fin are arranged, the power supply of the semiconductor refrigerating sheet is connected, and as the semiconductor refrigerating sheet is a heat transfer tool, when electric current passes through a thermocouple pair formed by connecting an N-type semiconductor material and a P-type semiconductor material, heat transfer is generated between two ends, and heat is transferred from one end to the other end, so that a temperature difference is generated to form a cold end, once the temperature of an inductor is increased, the temperature of the inner side of the semiconductor refrigerating sheet connected with the power supply is reduced, and the first radiating fin is used for cooling the common-mode inductor, so that the common-mode inductor is resistant to high temperature.

Description

High-temperature-resistant common-mode inductor

Technical Field

The utility model relates to the technical field of common-mode inductors, in particular to a high-temperature-resistant common-mode inductor.

Background

Common mode inductors, also called common mode chokes, are commonly used in switching power supplies for computers to filter common mode electromagnetic interference signals.

The utility model discloses a grant bulletin number is CN207302830U, and it records a short circuit prevention common mode inductance to disclose a short circuit prevention common mode inductance, including upper cover, base, first magnetic core and second magnetic core, the base is U font structure, upper cover joint is in the base top, first magnetic core and second magnetic core are all installed perpendicularly in the base, the top of first magnetic core and second magnetic core is closely covered the inboard, the upper cover outside is equipped with the upper wiring post, set up down the terminal on the base outer wall, all open the wire casing on first magnetic core and the second magnetic core outer wall, just winding in the wire casing, terminal on winding one end electric connection, terminal under the other end electric connection, the inside of base and the inner wall of upper cover all set up the shielding piece.

The conventional common-mode inductor can prevent the electrical appliance from being shorted, but when the common-mode inductor is used, the winding position on the common-mode inductor is easy to generate heat, so that the common-mode inductor is more serious in temperature rise phenomenon, and the common-mode inductor is more easily damaged when the temperature is higher, so that the common-mode inductor can be used for a long time, and therefore, a high-temperature-resistant common-mode inductor needs to be designed to solve the problems.

Disclosure of Invention

The utility model aims to provide a high-temperature-resistant common-mode inductor, which solves the problems that the conventional common-mode inductor provided in the background art can prevent electrical short circuits, but when in use, the winding position on the common-mode inductor is easy to generate heat, so that the common-mode inductor has serious temperature rise phenomenon and is easy to damage when the temperature is higher.

In order to achieve the above purpose, the present utility model provides the following technical solutions: a high temperature resistant common mode inductor comprising: the wire slot has been seted up on installed part and the magnetic core, the winding has the line on the magnetic core, the top fixed mounting of installed part has last terminal, the one end of line is connected on last terminal, the both sides of magnetic core all are provided with the semiconductor refrigeration piece, the one side that the semiconductor refrigeration piece is close to each other all is fixed to be provided with first heat radiation fin, first heat radiation fin all adheres to the line.

Preferably, the bottom fixed mounting of mounting has lower terminal, the other end of line is connected on lower terminal.

Preferably, the top and bottom inside the mounting part are provided with sliding grooves, the top and bottom of the semiconductor refrigeration piece are provided with fixing mechanisms, each fixing mechanism comprises a connecting plate, the connecting plates are fixedly arranged on the semiconductor refrigeration piece, and threaded rods are arranged in the connecting plates and the mounting part in a threaded manner.

Preferably, the second heat dissipation fins are fixedly arranged on the sides, away from each other, of the semiconductor refrigeration sheets.

Preferably, an intermediate layer is coated between the semiconductor refrigeration sheet and the first radiating fin and between the semiconductor refrigeration sheet and the second radiating fin, and the intermediate layer is heat-conducting silicone grease.

Preferably, the front surface of the connecting plate is provided with a concave groove, and the end part of the threaded rod extends into the concave groove.

Preferably, the end of the threaded rod is provided with a bar-shaped groove.

Compared with the prior art, the utility model has the beneficial effects that:

1. the semiconductor refrigerating sheet and the first radiating fin are arranged, the power supply of the semiconductor refrigerating sheet is connected, and as the semiconductor refrigerating sheet is a heat transfer tool, when a current passes through a thermocouple pair formed by connecting an N-type semiconductor material and a P-type semiconductor material, heat transfer is generated between two ends, and heat is transferred from one end to the other end, so that a temperature difference is generated to form a cold end, once the temperature of the inductor is increased, the temperature of the inner side of the semiconductor refrigerating sheet connected with the power supply is reduced, and the first radiating fin is utilized to cool the common-mode inductor, so that the common-mode inductor is resistant to high temperature.

2. Through being provided with fixed establishment, screw threaded rod into connecting plate and installed part, realize the fixed of connecting plate to make the semiconductor refrigeration piece fixed, make the semiconductor refrigeration piece be in the installed part steadily, so that the semiconductor refrigeration piece uses.

Drawings

FIG. 1 is a schematic elevational view of the structure of the present utility model;

FIG. 2 is a schematic side cross-sectional view of the structure of the present utility model;

fig. 3 is a partial front view schematically illustrating the structures of a semiconductor refrigeration sheet, a first heat sink fin and a second heat sink fin according to the present utility model;

fig. 4 is an enlarged schematic view of a portion of the structure of fig. 2 a in accordance with the present utility model.

In the figure: 110. a mounting member; 111. a magnetic core; 112. a wire slot; 113. a line; 114. an upper binding post; 115. a lower terminal; 116. a semiconductor refrigeration sheet; 117. a first heat sink fin; 118. a second heat sink fin; 119. an intermediate layer; 120. sliding into the groove; 200. a fixing mechanism; 210. a connecting plate; 211. a threaded rod; 212. a concave groove; 213. a bar-shaped groove.

Detailed Description

The following description of the embodiments of the present utility model will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present utility model, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the utility model without making any inventive effort, are intended to be within the scope of the utility model.

Example 1

Referring to fig. 1-3, an embodiment of the present utility model is provided: a high temperature resistant common mode inductor comprising: the mounting piece 110 and the magnetic core 111, the wire casing 112 has been seted up on the magnetic core 111, the winding has the line 113 on the magnetic core 111, the top fixed mounting of mounting piece 110 has upper wiring post 114, the one end of line 113 is connected on upper wiring post 114, the both sides of magnetic core 111 all are provided with semiconductor refrigeration piece 116, the side that semiconductor refrigeration piece 116 is close to each other all is fixed to be provided with first heat radiation fin 117, first heat radiation fin 117 all adheres to line 113, switch on the power of semiconductor refrigeration piece 116, because semiconductor refrigeration piece 116 is a heat transfer's instrument, when the thermocouple pair that an N type semiconductor material and a P type semiconductor material tie together has the electric current to pass through, heat transfer will take place between the both ends, heat will be transferred to the other end from one end to produce the difference in temperature and form cold and hot end, so once the inductance temperature rise, the inboard temperature of semiconductor refrigeration piece 116 of switch on the power can reduce, thereby utilize first heat radiation fin 117 to give the common mode inductance cooling, make this common mode inductance resistant to high temperature.

Further, the bottom end of the mounting member 110 is fixedly provided with a lower terminal 115, the other end of the wire 113 is connected to the lower terminal 115, the wire 113 is wound around the magnetic core 111, the upper terminal 114 is provided for connecting one end of the wire 113, and the lower terminal 115 is provided for connecting the other end of the wire 113 for use.

Example two

Compared with the first embodiment, referring to fig. 1-4, the top and bottom ends of the inside of the mounting member 110 are provided with sliding grooves 120, the top and bottom ends of the semiconductor cooling plate 116 are provided with fixing mechanisms 200, the fixing mechanisms 200 comprise connecting plates 210, the connecting plates 210 are fixedly mounted on the semiconductor cooling plate 116, threaded rods 211 are mounted in the connecting plates 210 and the mounting member 110 in a threaded manner, the threaded rods 211 are screwed into the connecting plates 210 and the mounting member 110, and the fixing of the connecting plates 210 is realized, so that the semiconductor cooling plate 116 is fixed, and the semiconductor cooling plate 116 is stably positioned in the mounting member 110 for the semiconductor cooling plate 116 to be used.

Further, the front surface of the connecting plate 210 is provided with a concave groove 212, the end of the threaded rod 211 extends into the concave groove 212, after the semiconductor refrigeration piece 116 is fixed, the end of the threaded rod 211 is located in the concave groove 212, and the arranged concave groove 212 can prevent the threaded rod 211 from protruding outwards for use.

Further, the end of the threaded rod 211 is provided with a bar slot 213, and when the threaded rod 211 is screwed, a tool can be inserted into the bar slot 213, and then the threaded rod 211 is controlled to rotate, so that an installer screws the threaded rod 211.

Example III

In the high temperature resistant common-mode inductor according to the present utility model, compared with the first embodiment, referring to fig. 1-3, the second heat dissipation fins 118 are fixedly disposed on the sides of the semiconductor cooling fins 116 away from each other, and the semiconductor cooling fins 116 cool the inductor and raise the temperature of the outer side of the semiconductor cooling fins 116, so that the second heat dissipation fins 118 can be utilized to dissipate heat for use.

Further, an intermediate layer 119 is coated between the semiconductor cooling fin 116 and the first heat dissipation fin 117 and the second heat dissipation fin 118, the intermediate layer 119 is made of heat conduction silicone grease, and the heat conduction silicone grease has excellent heat conduction and is located between the semiconductor cooling fin 116 and the first heat dissipation fin 117 and between the semiconductor cooling fin 116 and the second heat dissipation fin 118, so that good heat conduction effect is achieved for use.

Working principle: when the device is used, the power supply of the semiconductor refrigerating sheet 116 is connected, and as the semiconductor refrigerating sheet 116 is a heat transfer tool, when a current passes through a thermocouple pair formed by connecting an N-type semiconductor material and a P-type semiconductor material, heat transfer is generated between two ends, and heat is transferred from one end to the other end, so that a temperature difference is generated to form a cold end, once the temperature of an inductor rises, the temperature of the inner side of the semiconductor refrigerating sheet 116 connected with the power supply is reduced, so that the first radiating fin 117 is utilized to cool the common mode inductor, the common mode inductor is resistant to high temperature, and the temperature of the outer side of the semiconductor refrigerating sheet 116 is raised while the temperature of the semiconductor refrigerating sheet 116 is lowered, so that the second radiating fin 118 can be utilized to radiate heat, and the device is convenient to use.

The threaded rod 211 is screwed into the connecting plate 210 and the mounting piece 110 to fix the connecting plate 210, so that the semiconductor refrigeration piece 116 is fixed, the semiconductor refrigeration piece 116 is stably positioned in the mounting piece 110, the semiconductor refrigeration piece 116 is used, the heat conduction silicone grease has excellent heat conductivity, and the heat conduction silicone grease is positioned between the semiconductor refrigeration piece 116 and the first heat dissipation fins 117 and between the semiconductor refrigeration piece 116 and the second heat dissipation fins 118, and plays a good heat conduction role, so that the semiconductor refrigeration piece 116 is used.

It will be evident to those skilled in the art that the utility model is not limited to the details of the foregoing illustrative embodiments, and that the present utility model may be embodied in other specific forms without departing from the spirit or essential characteristics thereof. The present embodiments are, therefore, to be considered in all respects as illustrative and not restrictive, the scope of the utility model being indicated by the appended claims rather than by the foregoing description, and all changes which come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein. Any reference sign in a claim should not be construed as limiting the claim concerned.

Claims (7)

1. A high temperature resistant common mode inductor comprising: mounting (110) and magnetic core (111), wire casing (112) have been seted up on magnetic core (111), the winding has line (113) on magnetic core (111), the top end of mounting (110) is fixed to have upper wiring post (114), the one end of line (113) is connected on upper wiring post (114), the both sides of magnetic core (111) all are provided with semiconductor refrigeration piece (116), the one side that semiconductor refrigeration piece (116) are close to each other is all fixed to be provided with first heat radiation fin (117), first heat radiation fin (117) all attach in line (113).

2. A high temperature resistant common mode inductor as claimed in claim 1, wherein: the bottom end of the mounting piece (110) is fixedly provided with a lower binding post (115), and the other end of the line (113) is connected to the lower binding post (115).

3. A high temperature resistant common mode inductor as claimed in claim 1, wherein: the top and the bottom inside the installation piece (110) are both provided with sliding grooves (120), the top and the bottom of the semiconductor refrigeration piece (116) are both provided with fixing mechanisms (200), the fixing mechanisms (200) comprise connecting plates (210), the connecting plates (210) are fixedly installed on the semiconductor refrigeration piece (116), and threaded rods (211) are installed in the connecting plates (210) and the installation piece (110) in a threaded mode.

4. A high temperature resistant common mode inductor as claimed in claim 1, wherein: the sides of the semiconductor refrigerating sheets (116) far away from each other are fixedly provided with second radiating fins (118).

5. A high temperature resistant common mode inductor as claimed in claim 3, wherein: an intermediate layer (119) is coated between the semiconductor refrigerating sheet (116) and the first radiating fins (117) and the second radiating fins (118), and the intermediate layer (119) is heat-conducting silicone grease.

6. A high temperature resistant common mode inductor as claimed in claim 3, wherein: the front surface of the connecting plate (210) is provided with a concave groove (212), and the end part of the threaded rod (211) extends into the concave groove (212).

7. A high temperature resistant common mode inductor as claimed in claim 3, wherein: a strip-shaped groove (213) is formed in the end portion of the threaded rod (211).