CN213904027U - Heat radiation structure and electronic equipment of camera module flash light - Google Patents
Heat radiation structure and electronic equipment of camera module flash light Download PDFInfo
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- CN213904027U CN213904027U CN202023104658.7U CN202023104658U CN213904027U CN 213904027 U CN213904027 U CN 213904027U CN 202023104658 U CN202023104658 U CN 202023104658U CN 213904027 U CN213904027 U CN 213904027U
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- base
- circuit board
- heat
- camera module
- heat conducting
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Abstract
The utility model discloses a heat dissipation structure of a camera module flash lamp and an electronic device, which comprises a base, a first circuit board and a flash lamp; the flashlight is arranged on the upper surface of a second circuit board, the lower surface of the second circuit board is provided with a heat conduction area and a contact area, and the contact area is connected with the first circuit board and is electrically conducted; the base comprises a top surface and a bottom surface, the second circuit board is arranged above the base and fixedly connected with the base, a first heat conducting piece is arranged between the heat conducting area and the top surface, and a second heat conducting piece is arranged on the bottom surface of the base. The utility model discloses set up the circuit board on the base of camera module, the heat that the flash light produced is transmitted to the base via the circuit board, finally dispels the heat by the base, can make the heat that the flash light produced in time distribute, ensures that the flash light can normally work, need not to dispel the heat via electronic equipment's mainboard, also need not set up connector and FPC, guarantees the stability of flash light in the time of reduce cost.
Description
Technical Field
The utility model relates to the field of electronic technology, concretely relates to heat radiation structure and electronic equipment of camera module flash light
Background
With the rapid development of electronic technology, the number of cameras of current electronic devices such as mobile phones and tablet computers is increasing, and the number of pixels is also increasing, which puts higher demands on the flash lamps installed on the camera module, for example, the flash lamps of some electronic devices are increased from the original one to double color temperature or multiple flash lamps, which generate larger heat during operation, thereby causing heat dissipation problems.
The current assembling mode of the flash lamp and the camera module comprises the following three modes:
firstly, directly mounting a flash lamp on a mainboard of the electronic equipment;
secondly, the flash lamp is lifted and then is mounted on a main board of the electronic equipment;
thirdly, the flashlight is pasted on one end of the FPC, and the connector at the other end of the FPC is connected to the mainboard.
In the three modes, the first two modes are that the heat generated by the flash lamp is radiated to the mainboard, and the heat is generated more when the flash lamp continuously works through the heat radiation of the mainboard, so that the heat radiation effect is poor; the third mode needs to connect the flash lamp with the mainboard by lengthening the FPC and the connector, and the assembling process is complex and the cost is high.
SUMMERY OF THE UTILITY MODEL
An object of the utility model is to provide a heat radiation structure of camera module flash light, it can be under the prerequisite that does not rely on FPC and connector, and the timely heat that produces the flash light gives off.
Another object of the present invention is to provide an electronic device.
In order to achieve the above object, the utility model adopts the following technical scheme:
the heat dissipation structure of the flash lamp of the camera module comprises a base provided with a camera, a first circuit board and the flash lamp;
the flashlight is arranged on the upper surface of a second circuit board, the lower surface of the second circuit board is provided with a heat conduction area and a contact area, and the contact area is connected with the first circuit board and is electrically conducted;
the base comprises a top surface and a bottom surface opposite to the top surface, the second circuit board is arranged above the base and fixedly connected with the base, a first heat conducting piece is arranged between the heat conducting area and the top surface, and a second heat conducting piece is arranged on the bottom surface of the base.
Preferably, the first heat conducting piece is a first heat conducting silica gel arranged between the top surface and the heat conducting area, and two surfaces of the heat conducting silica gel are respectively attached to the heat conducting area and the top surface.
Preferably, a downward-recessed upper groove is formed in the top surface of the base, and the first heat-conducting silica gel is arranged in the upper groove.
Preferably, the second heat conducting part comprises second heat conducting silica gel and a heat dissipation film covering the bottom surface of the base, and two surfaces of the second heat conducting silica gel are respectively attached to the heat dissipation film and the bottom surface.
Preferably, an upwardly concave lower groove is formed in the bottom surface of the base, and the second heat-conducting silica gel is placed in the lower groove.
Preferably, one of the base and the second circuit board is provided with a positioning column, and the other one of the base and the second circuit board is provided with a positioning groove for the positioning column to penetrate.
Preferably, the second circuit board is fixedly connected with the base through back glue or a buckle.
Preferably, the first circuit board is provided with a contact terminal, and the contact area on the second circuit board is located right above the contact terminal and is in contact conduction with the contact terminal.
Preferably, the base is provided with two cameras, and the second circuit board is located between the two cameras.
In order to achieve the second purpose, the utility model adopts the following technical scheme:
electronic equipment, including the heat radiation structure of foretell camera module flash light.
Compared with the prior art, the utility model discloses set up the circuit board on the base of camera module, the heat that the flash light produced transmits to the base via the circuit board, finally dispels the heat by the base, and the heat that can make the flash light produce is in time distributed, ensures that the flash light can normally work, need not to dispel the heat via electronic equipment's mainboard, also need not set up connector and FPC, guarantees the stability of flash light when reduce cost.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings needed to be used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the structures shown in the drawings without creative efforts.
Fig. 1 is a schematic structural view of the present invention;
fig. 2 is a cross-sectional view of the present invention.
The reference numbers illustrate:
| reference numerals | Name (R) | Reference numerals | Name (R) |
| 10 | |
20 | Flash |
| 101 | The |
30 | |
| 102 | |
31 | |
| 103 | |
40 | |
| 104 | |
41 | Locating |
| 11 | |
50 | First heat-conducting |
| 12 | |
60 | |
| 13 | |
70 | Second heat-conducting silica gel |
The objects, features and advantages of the present invention will be further described with reference to the accompanying drawings.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative efforts belong to the protection scope of the present invention.
It should be noted that all the directional indicators (such as upper, lower, left, right, front and rear … …) in the embodiment of the present invention are only used to explain the relative position relationship between the components, the motion situation, etc. in a specific posture (as shown in the drawings), and if the specific posture is changed, the directional indicator is changed accordingly.
In addition, the descriptions related to "first", "second", etc. in the present invention are for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicit ly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one such feature. In addition, the technical solutions in the embodiments may be combined with each other, but it must be based on the realization of those skilled in the art, and when the technical solutions are contradictory or cannot be realized, the combination of the technical solutions should not be considered to exist, and is not within the protection scope of the present invention.
As shown in fig. 1 and 2, for the utility model discloses a heat radiation structure of camera module flash light, it includes base 10, first circuit board 30, flash light 20, second circuit board 40, wherein, the upper surface at second circuit board 40 is installed in the paster of flash light 20, is provided with heat conduction area 402 and contact zone 401 at the lower surface of second circuit board 40, and contact zone 401 is connected and the electrical property switches on with first circuit board 30 the utility model discloses a when heat radiation structure was used for the cell-phone, this first circuit board 30 can be the mainboard of cell-phone, and second circuit board 40 is connected with first circuit board 30, is the mainboard that is connected to the cell-phone with flash light 20 promptly. The base 10 comprises a top surface 101 and a bottom surface 102, the bottom surface 102 is opposite to the top surface 101, the camera is installed on the top surface 101, the second circuit board 40 is located above the top surface 101 of the base 10 and is fixedly connected with the base 10, a first heat-conducting silica gel 50 is arranged between a heat-conducting area 402 of the second circuit board 40 and the top surface 101 of the base 10, a second heat-conducting silica gel 70 and a heat-dissipating film 60 are arranged on the bottom surface 102 of the base 10, and the first heat-conducting silica gel 50 forms a first heat-conducting member between the top surface of the base 10 and the heat-conducting area 402 of the second circuit board 40, namely, two surfaces of the first heat-conducting silica gel 50 are respectively attached to the heat-conducting area 402 of the second circuit board 40 and the top surface 101 of the base 10; the second thermal conductive silicone gel 70 and the heat dissipation film 60 form a second thermal conductive member on the bottom surface 102 of the base 10, the second thermal conductive silicone gel 70 is attached to the bottom surface 102 of the base 10, and the heat dissipation film 60 is covered on the bottom surface 102 of the base 10, that is, two surfaces of the second thermal conductive silicone gel 70 are respectively attached to the heat dissipation film 60 and the bottom surface 102 of the base 10.
The utility model discloses in, the heat transfer that flash light 20 during operation produced to second circuit board 40, by first heat-conducting piece make can carry out the heat transfer between second circuit board 40 and the base 10, the heat is transmitted to base 10 through first heat-conducting piece, then finally gives off from the second heat-conducting piece that sets up on base 10 bottom surface 102. Compared with the prior art, the utility model discloses set up the circuit board on the base of camera module, the heat that the flash light produced transmits to the base via the circuit board, finally dispels the heat by the base, and the heat that can make the flash light produce is in time distributed, ensures that the flash light can normally work, need not to dispel the heat via electronic equipment's mainboard, also need not set up connector and FPC, guarantees the stability of flash light when reduce cost.
In other embodiments of the present invention, the first heat conducting member and the second heat conducting member are not limited to the above-mentioned heat conducting silica gel, and may also be made of other heat conducting materials, which can achieve better heat transfer effect.
In a preferred embodiment, in order to reduce the crowding of the internal space of the electronic device, the utility model discloses set up a undercut upper groove 11 on the top surface 101 of base 10, the aforesaid first heat-conducting silica gel 50 times is arranged in this upper groove 11, like this, reduces the mounting height of second circuit board 50 for base 10 to make second circuit board 50 can laminate the top surface 101 of base 10, make the whole structure more compact reasonable. Similarly, a lower groove 12 is formed on the bottom surface 102 of the base 10, and the second heat conductive silicone gel 70 is disposed in the lower groove 12, so that the bottom surface 102 of the base 10 and the lower surface of the second heat conductive silicone gel 70 form a flat mating surface, when the heat dissipation film 60 is assembled, the heat dissipation film 60 can be more regularly covered on the bottom surface 102 of the base 10, and can be better attached to the bottom surface of the base 10 and the lower surface of the second heat conductive silicone gel 70, thereby ensuring good heat dissipation.
In addition, in order to facilitate the assembly of flash light 20 and base 10, the utility model discloses be provided with reference column 13 on base 10, corresponding set up constant head tank 41 on second circuit board 40, reference column 13 cross-under in constant head tank 41, fix a position second circuit board 40 and the relative displacement of base 10 on the horizontal plane to improve the precision of assembly, during the installation, install the formation subassembly on second circuit board 40 with the flash light 20 paster earlier, fix a position subassembly and base 10 and fix again. For positioning convenience, the positioning column 13 is disposed in the upper groove 11, and the specific positioning column 13 may be formed by protruding upward from the bottom surface of the upper groove 11; of course, the positioning column 13 may be disposed on the second circuit board 40, and the positioning slot 41 may be correspondingly disposed on the base 10. The second circuit board 40 and the base 10 may be fixed together by adhesive with a back adhesive therebetween, or of course, a buckle may be provided on the second circuit board 40 and the base 10 to fasten the second circuit board 40 to the base 10.
The utility model discloses in, be provided with the contact terminal 31 that is formed by metal shrapnel on first circuit board 30, contact zone 401 on the second circuit board 40 is located contact terminal 31 directly over to second circuit board 40 is fixed in on the base 10 back, and contact zone 41 switches on with contact terminal 31 contact, thereby connects flash light 20 on first circuit board 30. Of course, the contact area 401 on the second circuit board 40 may be formed by a metal dome, and correspondingly, a planar copper sheet contact may be provided on the first circuit board 30.
In order to achieve higher heat transfer efficiency, the heat conduction area 402 on the second circuit board 40 may be a copper exposed area on the lower surface of the second circuit board 40, so that the second circuit board 40 and the first heat conductive silicone rubber 50 can be better heat-transferred.
The utility model discloses in, set up camera 103 and camera 104 on base 10, foretell second circuit board 40 is located between camera 103 and the camera 104, so make full use of the vacant region between two cameras on the base 10, corresponding, foretell upper groove 11 is seted up between camera 103 and camera 104.
The utility model discloses an above-mentioned heat radiation structure is applicable to the heat dissipation of camera module flash light, is particularly useful for the heat dissipation of double-colored temperature flash light, or more flash lights, simultaneously, the utility model discloses a heat radiation structure of above-mentioned camera module flash light not only uses in the cell-phone, and it still is applicable to panel computer, notebook computer, intelligent wearing equipment or other electronic equipment that possess the shooting function.
The above only be the preferred embodiment of the utility model discloses a not consequently restriction the utility model discloses a patent range, all are in the utility model discloses a conceive, utilize the equivalent structure transform of what the content was done in the description and the attached drawing, or direct/indirect application all is included in other relevant technical field the utility model discloses a patent protection within range.
Claims (10)
1. The heat dissipation structure of the flash lamp of the camera module is characterized by comprising a base provided with a camera, a first circuit board and the flash lamp;
the flashlight is arranged on the upper surface of a second circuit board, the lower surface of the second circuit board is provided with a heat conduction area and a contact area, and the contact area is connected with the first circuit board and is electrically conducted;
the base comprises a top surface and a bottom surface opposite to the top surface, the second circuit board is arranged above the base and fixedly connected with the base, a first heat conducting piece is arranged between the heat conducting area and the top surface, and a second heat conducting piece is arranged on the bottom surface of the base.
2. The heat dissipating structure of a camera module flash of claim 1, wherein the first heat conducting member is a first heat conducting silicone interposed between the top surface and the heat conducting area, and two surfaces of the heat conducting silicone are respectively attached to the heat conducting area and the top surface.
3. The heat dissipating structure of a camera module flash of claim 2, wherein a downwardly recessed upper groove is disposed on the top surface of the base, and the first thermally conductive silicone is disposed in the upper groove.
4. The heat dissipating structure of a camera module flash of claim 1, wherein the second heat conducting member comprises a second heat conducting silicone and a heat dissipating film covering the bottom surface of the base, and two surfaces of the second heat conducting silicone are respectively attached to the heat dissipating film and the bottom surface.
5. The heat dissipating structure of a camera module flash of claim 4, wherein the bottom surface of the base has a lower groove that is upwardly concave, and the second thermally conductive silicone is disposed in the lower groove.
6. The heat dissipating structure of a camera module flash of claim 1, wherein one of the base and the second circuit board has a positioning post and the other has a positioning slot for the positioning post to penetrate.
7. The heat dissipating structure of a camera module flash of claim 6, wherein the second circuit board is fixedly connected to the base by a back adhesive or a clip.
8. The heat dissipating structure of a camera module flash as claimed in claim 1, wherein the first circuit board has a contact terminal, and the contact area of the second circuit board is located directly above the contact terminal and is in contact with the contact terminal.
9. The heat dissipating structure of a camera module flash of claim 1, wherein two cameras are disposed on the base, and the second circuit board is located between the two cameras.
10. An electronic device, comprising the heat dissipation structure of the camera module flash lamp according to any one of claims 1 to 9.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202023104658.7U CN213904027U (en) | 2020-12-21 | 2020-12-21 | Heat radiation structure and electronic equipment of camera module flash light |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202023104658.7U CN213904027U (en) | 2020-12-21 | 2020-12-21 | Heat radiation structure and electronic equipment of camera module flash light |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN213904027U true CN213904027U (en) | 2021-08-06 |
Family
ID=77105090
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202023104658.7U Active CN213904027U (en) | 2020-12-21 | 2020-12-21 | Heat radiation structure and electronic equipment of camera module flash light |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN213904027U (en) |
-
2020
- 2020-12-21 CN CN202023104658.7U patent/CN213904027U/en active Active
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