CN218825068U - Lamp panel, backlight module and display device - Google Patents

Abstract

The embodiment of the application provides a lamp plate, a backlight module and a display device. The lamp panel includes base plate and light emitting structure. The substrate comprises a base layer and a conducting layer arranged on one side of the base layer, at least one through hole is formed in the substrate, the light-emitting structure is accommodated in the through hole, a gap is formed between the light-emitting structure and the wall of the through hole, and the light-emitting structure is conducted with the conducting layer. According to the lamp plate in this application embodiment, be formed with the through-hole on the base plate of lamp plate, light emitting structure holds in the through-hole, that is to say, the base plate and the light emitting structure of lamp plate set up with the layer, like this, when light emitting structure at luminous in-process, the heat of production will not pass through the base plate transmission. Compared with the heat dissipation mode of the lamp panel in the related art, the lamp panel in the embodiment can not allow heat to pass through the substrate when dissipating heat, and therefore, the heat dissipation efficiency can be improved. The lamp panel in this embodiment not only has better heat dispersion, also possesses frivolous design demand. The display with this lamp plate also has better heat dispersion.

Description

Lamp panel, backlight module and display device

Technical Field

The invention relates to the technical field of display, in particular to a lamp panel, a backlight module and a display device.

Background

LCD (Liquid Crystal Display) displays are developed in the direction of higher resolution, higher brightness, lighter and thinner, or narrower frames, and the above requirements also demand higher brightness and thinner backlight for providing light source. Generally, an LCD liquid crystal display includes a back panel and a lamp panel disposed at one side of the back panel. The display is at the course of the work, and the lamp pearl of lamp plate can continuously give out light to produce the heat, heat from one side of lamp pearl transmit to the backplate in proper order, and in the correlation technique, the position that the heat contacted in the transfer process is more, consequently causes the heat dissipation slowly easily. Along with the demand to hi-lite display panel, the power of lamp pearl is also higher and higher on the lamp plate for the heat that the lamp pearl produced in the course of the work is also higher and higher, so leads to LCD liquid crystal display's heat dissipation problem more outstanding.

SUMMERY OF THE UTILITY MODEL

The embodiment of the invention provides a lamp panel, a backlight module and a display device. So as to improve the heat dissipation performance of the display.

In order to achieve the above purpose, the embodiment of the invention adopts the following technical scheme:

an embodiment of the first aspect of the present application provides a lamp panel, which includes a substrate and a light emitting structure. The substrate comprises a base layer and a conducting layer arranged on one side of the base layer, at least one through hole is formed in the substrate, the light-emitting structure is accommodated in the through hole, a gap is formed between the light-emitting structure and the wall of the through hole, and the light-emitting structure is conducted with the conducting layer.

According to the lamp plate in this application embodiment, be formed with the through-hole on the base plate of lamp plate, light emitting structure holds in the through-hole, that is to say, the base plate of lamp plate and light emitting structure are with the layer setting, and moreover, the pore wall of light emitting structure and through-hole is formed with the clearance, and like this, when light emitting structure in light-emitting process, the heat of production will not pass through the base plate transmission. Compared with the heat dissipation mode of the lamp panel in the related art, when the lamp panel in the embodiment dissipates heat, the heat cannot pass through the substrate, and therefore the heat dissipation efficiency can be improved. In the light emitting structure setting through-hole on the base plate in this application embodiment, that is to say, base plate and light emitting structure are with the layer setting, like this, and the gross thickness of lamp plate is the biggest one of size in the thickness of base plate thickness and lamp pearl, and is visible, compares in the lamp plate among the correlation technique, and the lamp plate in this application embodiment can reduce the thickness of a lamp pearl at most. Therefore, when the thickness of the lamp plate is reduced, the light-emitting structure has shorter light-incident distance, so that the thinner design requirement of a direct type display panel is met, the narrower design requirement of a side type display panel is met, and the light and thin design requirement of a display is met. Therefore, the lamp panel in the embodiment not only has better heat dissipation performance, but also has light and thin design requirements. The display with this lamp plate also has better heat dispersion.

The lamp panel according to this application embodiment can also possess following technical characterstic:

in some embodiments of the present application, a dimension of the light emitting structure in a thickness direction of the substrate is greater than or equal to a dimension of the substrate in the thickness direction.

In some embodiments of the present application, a dimension of the light emitting structure in a thickness direction of the substrate is smaller than a dimension of the substrate in the thickness direction, and a difference between the dimension of the light emitting structure in the thickness direction of the substrate and the dimension of the substrate in the thickness direction is less than or equal to 0.3mm.

In some embodiments of the present application, the light emitting structure is an LED lamp, the LED lamp is connected to the conductive layer by welding, a fillet is formed at a welding position of the LED lamp and the conductive layer, and at least a portion of the fillet is located on one side of the conductive layer away from the base layer.

In some embodiments of this application, the lamp plate still includes the solder mask, the solder mask is located the conducting layer is kept away from one side of basic unit.

In some embodiments of this application, the lamp plate still includes heat conduction insulating tape, heat conduction insulating tape sets up the conducting layer is kept away from one side of basic unit.

An embodiment of a second aspect of the present application provides a backlight module, including a lamp panel in any embodiment of the first aspect.

According to the backlight module in this application embodiment, because it has the lamp plate in any embodiment of the first aspect, consequently, it also possesses the beneficial effect of any embodiment of the first aspect. And will not be described in detail herein.

In some embodiments of the present application, the backlight module includes a back plate body and an adhesion layer, and the lamp panel is connected to the back plate body through the adhesion layer.

In some embodiments of this application, the lamp plate still includes the solder mask, the solder mask sets up the conducting layer with between the adhesion layer.

An embodiment of a third aspect of the present application provides a display device, including the backlight module in any embodiment of the second aspect.

According to the display device in the embodiment of the present application, since the display device has the backlight module in any embodiment of the second aspect, the display device also has the beneficial effects of any embodiment of the second aspect. And will not be described in detail herein.

Drawings

In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the drawings without creative efforts.

Fig. 1 is a schematic structural view of a lamp panel in the related art;

FIG. 2 is a schematic view of a backlight module according to the related art;

fig. 3 is a schematic diagram of heat dissipation of a lamp panel of a backlight module in the related art;

FIG. 4 is a schematic structural diagram of a lamp panel in an embodiment of the present application;

fig. 5 is a schematic structural diagram of a lamp panel in another embodiment of the present application;

FIG. 6 is a schematic view of a lamp panel according to still another embodiment of the present application;

FIG. 7 is a schematic view of a backlight module according to an embodiment of the present application;

FIG. 8 is a schematic diagram of heat dissipation of the backlight module shown in FIG. 7;

FIG. 9 is a schematic view of a backlight module according to another embodiment of the present application;

fig. 10 is a schematic diagram of heat dissipation of the backlight module shown in fig. 9.

Detailed Description

The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be obtained by a person skilled in the art without making any creative effort based on the embodiments in the present invention, belong to the protection scope of the present invention.

In the embodiments of the present invention, the terms "first", "second", "third", "fourth", and the like are used for distinguishing identical items or similar items having substantially the same functions and actions, and are used only for clearly describing technical solutions of the embodiments of the present invention, and are not understood as indicating or implying relative importance or implicitly indicating the number of indicated technical features.

In the embodiments of the present invention, "a plurality" means two or more, and "at least one" means one or more, unless specifically defined otherwise.

In the embodiments of the present invention, the terms "upper", "lower", and the like indicate orientations or positional relationships based on those shown in the drawings, and are only for convenience in describing the present invention and simplifying the description, but do not indicate or imply that the referred devices or elements must have a specific orientation, be constructed and operated in a specific orientation, and thus, should not be construed as limiting the present invention.

In the related art, as shown in fig. 1 to 3, the LCD liquid crystal display is developing in a direction of higher resolution, higher brightness, lighter weight, or narrower frame, and the above requirements also put demands on higher brightness and thinner backlight for providing a light source. Generally, LCD includes backplate and the lamp plate of setting in backplate one side, and the lamp plate passes through sticky tape 40 and metal back plate laminating, and the lamp plate includes basic unit 10 and sets up lamp pearl 50 in basic unit one side, still is provided with copper layer 30 and insulating layer 20 between lamp pearl 50 and the basic unit 10, and lamp pearl 50 is connected with copper layer 30 through leg 60. Referring to fig. 3, the direction of arrow M in the figure is the direction of heat transfer on the lamp panel. The display is at the course of the work, and lamp pearl 50 can continuously give out light to produce the heat, the heat is followed weld leg 60, copper layer 30, insulating layer 20 and sticky tape 40 transfer to backplate 70 along one side of lamp pearl 50 in proper order on, the heat is in the transfer process, the position of contact is more, consequently makes the heat gathering on above-mentioned contact position easily, and makes the heat dissipation slow. Along with the demand to hi-lite display panel, lamp pearl 50's power is also higher and higher on the lamp plate for lamp pearl 50 also is higher and higher at the heat that the course of the work produced, so leads to LCD liquid crystal display's heat dissipation problem more outstanding.

As shown in fig. 4 and 5, an embodiment of the first aspect of the present application provides a lamp panel 100, which includes a substrate 110 and a light emitting structure 120. The substrate 110 includes a base layer 111 and a conductive layer 112 disposed on one side of the base layer 111, at least one through hole 101 is formed on the substrate 110, the light emitting structure 120 is accommodated in the through hole 101, a gap is formed between the light emitting structure 120 and a hole wall of the through hole 101, and the light emitting structure 120 is electrically connected to the conductive layer 112.

In this embodiment, the substrate 110 is a basic structure of the lamp panel 100, and may include a base layer 111 and a conductive layer 112 disposed on one side of the base layer 111. The base layer 111 serves as a support, and thus, the base layer 111 may be an aluminum layer or a resin layer. The conductive layer 112 mainly functions as a conductor, and therefore, the conductive layer 112 may be a metal layer having a conductive function, such as a copper layer.

According to the lamp panel 100 in the embodiment of the application, the through hole 101 is formed on the substrate 110 of the lamp panel 100, and the light emitting structure 120 is accommodated in the through hole 101, that is, the substrate 110 of the lamp panel 100 and the light emitting structure 120 are disposed on the same layer, and a gap is formed between the light emitting structure 120 and a hole wall of the through hole 101, so that when the light emitting structure 120 emits light, the generated heat will not be transferred through the substrate 110. Compared with the heat dissipation method of the lamp panel 100 in the related art, when the lamp panel 100 in this embodiment dissipates heat, the heat does not pass through the substrate 110, and thus the heat dissipation efficiency can be improved. In addition, referring to fig. 1, in the related art, the lamp beads are disposed on one side of the substrate 110, that is, the total thickness of the lamp panel 100 is the sum of the thickness of the substrate 110 and the thickness of the lamp beads. And light-emitting structure 120 in this application embodiment sets up in through-hole 101 on base plate 110, that is to say, base plate 110 and light-emitting structure 120 are the same layer setting, and like this, the gross thickness of lamp plate 100 is the biggest one of the thickness of base plate 110 and the thickness of lamp pearl, and it is thus clear that lamp plate 100 in this application embodiment can reduce the thickness of at most one lamp pearl compared with lamp plate 100 in the correlation technique. Thus, when the thickness of the lamp panel 100 is reduced, the light-emitting structure 120 has a shorter light-incident distance, so as to satisfy the thinner design requirement of the direct type display panel and the narrower design requirement of the lateral type display panel, and thereby satisfy the light and thin design requirement of the display. It can be seen that the lamp panel 100 in this embodiment not only has better heat dissipation performance, but also has light and thin design requirements. The display with the lamp panel 100 also has good heat dissipation performance.

In some embodiments of the present application, a size of the light emitting structure 120 in a thickness direction of the substrate 110 is greater than or equal to a size of the substrate 110 in the thickness direction.

In the present embodiment, the thickness of the light emitting structure 120 may be greater than or equal to the thickness of the substrate 110, that is, the light emitting structure 120 may protrude from the substrate 110. In some specific embodiments, when the brightness of the display panel is higher, the power of the lamp beads on the lamp panel 100 is also higher, and it can be understood that the lamp beads with higher power are generally larger in size, so that when the lamp panel 100 in the related art is adopted, the thickness of the display panel is undoubtedly increased. And according to lamp plate 100 in the embodiment of this application, the lamp pearl holds in base plate 110's through-hole 101, even the size of lamp pearl is great, also can attenuate display panel thickness. For example, in some embodiments in the related art, the thickness of the base layer 111 may be 0.6mm, and the thickness of the lamp bead may be 0.6mm, and generally, an insulating layer and a copper layer are further disposed between the base layer 111 and the lamp bead, the thickness of the insulating layer may be 150um, the thickness of the copper layer is 35um, and the total thickness of the lamp panel 100 is about 1.5mm, and when a larger-sized lamp bead is required, for example, the thickness of the lamp bead is 0.8mm, the thickness of the lamp bead may reach about 1.7 mm. In the embodiment of the present application, referring to fig. 3, when the thickness of the base layer 111 is 0.6mm, the thickness of the lamp bead is 0.6mm, and the thickness of the conductive layer 112 is 35um, the total thickness of the lamp panel 100 is about 0.8mm, and compared with the lamp panel 100 in the related art, the thickness of the lamp panel 100 in the embodiment of the present application is reduced by about 0.7mm. When the lamp beads with the thickness of 0.8mm are adopted, the total thickness of the lamp panel 100 is about 0.9mm, and compared with the lamp panel 100 in the related art, the total thickness of the lamp panel 100 in the embodiment can also be reduced by about 0.7mm, that is, compared with the lamp panel 100 in the related art, the total thickness of the lamp panel 100 in the embodiment of the application is reduced by about 50%.

In some specific embodiments of the present application, the light emitting structure 120 may have a size of 0.4mm, 0.5mm, 0.6mm, 0.7mm, 0.8mm, 0.9mm, 1mm, or more than 1mm in a thickness direction of the substrate 110. The thickness of the base layer 111 may be 0.4mm, 0.5mm, 0.6mm, 0.7mm, 0.8mm, 0.9mm, and 1mm, or more than 1mm. In this embodiment, when designing the lamp panel 100, the size of the light emitting structure 120 may be designed according to the thickness of the base layer 111 in the substrate 110, and in addition, considering the thickness of the conductive layer 112 in the substrate 110, it is only necessary to ensure that the size of the light emitting structure 120 in the thickness direction of the substrate 110 is greater than or equal to the size of the substrate 110 in the thickness direction.

In some embodiments of the present application, a dimension of the light emitting structure 120 in the thickness direction of the substrate 110 is smaller than a dimension of the substrate 110 in the thickness direction, and a difference between the dimension of the light emitting structure 120 in the thickness direction of the substrate 110 and the dimension of the substrate 110 in the thickness direction is less than or equal to 0.3mm.

In the present embodiment, the thickness of the light emitting structure 120 may be less than that of the substrate 110. When the display panel is in operation, the light emitting structure 120 of the lamp panel 100 emits light, and generally, the light emitting structure 120 has a light emitting angle, and when the thickness of the light emitting structure 120 is smaller than that of the substrate 110, if the sidewall of the substrate 110 is located within the light emitting angle of the light emitting structure 120, the light emitting amount of the light emitting structure 120 is affected to a certain extent. Through long-term research by the applicant, it is found that when the difference between the dimension of the light emitting structure 120 in the thickness direction of the substrate 110 and the dimension of the substrate 110 in the thickness direction is less than or equal to 0.3mm, the influence of the substrate 110 on the light emitting amount of the light emitting structure 120 can be effectively avoided. In addition, the light emitting structure 120 in the embodiment of the present application is disposed in the through hole 101 on the substrate 110, that is, the substrate 110 and the light emitting structure 120 are disposed on the same layer, and when the thickness of the light emitting structure 120 may be smaller than that of the substrate 110, the total thickness of the lamp panel 100 is the thickness of the substrate 110, and thus, compared with the lamp panel 100 in the related art, the lamp panel 100 in the embodiment of the present application may reduce the thickness of one light emitting structure 120. Thus, when the thickness of the lamp panel 100 is reduced, the light-emitting structure 120 has a shorter light-incident distance, so as to satisfy the thinner design requirement of the direct type display panel and the narrower design requirement of the lateral type display panel, and thereby satisfy the light and thin design requirement of the display.

In some specific embodiments of the present application, the light emitting structure 120 may have a size of 0.4mm, 0.5mm, 0.6mm, 0.7mm, 0.8mm, 0.9mm, 1mm, or more than 1mm in a thickness direction of the substrate 110. The thickness of the base layer 111 may be 0.4mm, 0.5mm, 0.6mm, 0.7mm, 0.8mm, 0.9mm, and 1mm, and may be greater than 1mm. In this embodiment, when the lamp panel 100 is designed, the size of the light emitting structure 120 may be designed according to the thickness of the base layer 111 in the substrate 110, and in addition, considering the thickness of the conductive layer 112 in the substrate 110, it is only required to ensure that the size of the light emitting structure 120 in the thickness direction of the substrate 110 is smaller than the size of the substrate 110 in the thickness direction, and the difference between the size of the light emitting structure 120 in the thickness direction of the substrate 110 and the size of the substrate 110 in the thickness direction is smaller than or equal to 0.3mm.

In some embodiments of the present application, the light emitting structure 120 is an LED lamp, the LED lamp is connected to the conductive layer 112 by soldering, a solder fillet 130 is formed at a portion where the LED lamp is soldered to the conductive layer 112, and at least a portion of the solder fillet 130 is located on a side of the conductive layer 112 away from the base layer 111.

In this embodiment, the LED lamp is connected to the conductive layer 112 by soldering, in some specific processes of the present application, a conductive layer 112 may be formed on the base layer 111, then the through hole 101 is formed on the base layer 111 and the conductive layer 112, and the LED lamp is placed in the through hole 101, where the LED lamp generally includes a lead wire, and it should be noted that the lead wire of the LED lamp is disposed in the through hole 101 near the conductive layer 112, and finally the lead wire of the LED lamp can be electrically connected to the conductive layer 112 by soldering, for example, the lead wire of the LED lamp can be connected to the conductive layer 112 by soldering. In some embodiments, when soldering the LED lamp to the conductive layer 112, the leads of the LED lamp may be placed flush with the conductive layer 112 and soldered to the side of the conductive layer 112 away from the base layer 111. Thus, the LED lamp can be more firmly fixed to the substrate 110.

In some embodiments of the present application, the lamp panel 100 further includes a solder resist layer 140, and the solder resist layer 140 is located on a side of the conductive layer 112 away from the base layer 111.

In the present embodiment, the solder resist layer 140 is located on the side of the conductive layer 112 away from the base layer 111, so that a protective film layer can be formed on the conductive layer 112. In some embodiments, before the light emitting structure 120 is soldered on the substrate 110, a solder resist layer 140 may be formed on the conductive layer 112 to protect the conductive layer 112 and prevent the conductive layer 112 from being damaged during soldering. In other embodiments, a solder mask layer 140 may be formed on the conductive layer 112 after the light emitting structure 120 is soldered on the substrate 110, so as to prevent the conductive layer 112 from being exposed to air for a long time and surface oxidation. In still other embodiments, a solder mask layer 140 may be formed on the conductive layer 112 before the light emitting structure 120 is soldered on the substrate 110, and a solder mask layer 140 may be coated on the soldered periphery after the light emitting structure 120 is soldered on the substrate 110, so as to avoid dead corners in the soldered periphery area on the conductive layer 112. According to the solder resist layer 140 in the embodiment of the present application, the conductive layer 112 can be protected.

As shown in fig. 6, in some embodiments of the present application, the lamp panel 100 further includes a thermal conductive insulating tape disposed on a side of the conductive layer 112 away from the base layer 111.

In this embodiment, a heat conductive insulating tape is further disposed on one side of the conductive layer 112 away from the base layer 111, and generally, the lamp panel 100 needs to be assembled on the metal back plate to form the backlight module 200. Compared with the above-mentioned embodiment of the lamp panel 100 including the solder resist layer 140, the embodiment does not need to provide the solder resist layer 140, that is, when the light-emitting structure 120 of the lamp panel 100 in the embodiment of the present invention emits light, heat generated by the light-emitting structure 120 does not pass through the solder resist layer 140, so that a layer of heat-transferring film is reduced, that is, compared with the above-mentioned embodiment, the embodiment has more excellent heat dissipation performance.

In some embodiments of the present application, a plurality of through holes 101 are formed on the substrate 110, and each of the light emitting structures 120 is sequentially received in the through hole 101.

In this embodiment, a plurality of through holes 101 are formed on the substrate 110, the lamp panel 100 includes a plurality of light emitting structures 120, each light emitting structure 120 corresponds to one through hole 101, and the light emitting structures 120 are sequentially accommodated in the through holes 101. So, can attenuate the thickness of lamp plate 100, and then the thickness of the display that the attenuate has this lamp plate 100.

An embodiment of the second aspect of the present application provides a backlight module 200, which includes the lamp panel 100 in any embodiment of the first aspect.

In the present embodiment, the backlight module 200 is applied to a liquid crystal display device, wherein the liquid crystal display device includes a liquid crystal display panel and the backlight module 200, liquid crystal molecules in the liquid crystal display panel do not emit light, the backlight module 200 is disposed on a back surface of the liquid crystal display panel, and light emitted by the backlight module 200 is transmitted through the liquid crystal molecules to realize light emission for image display. The backlight module 200 may include one lamp panel 100, or may include a plurality of lamp panels 100, and the number of the lamp panels 100 in the backlight module 200 is not particularly limited in the present application. In addition, the backlight module 200 may further include a circuit board, and the circuit board may be used to connect a plurality of lamp panels 100, and may also control the light emitting structures 120 in the lamp panels 100 by using the conductive layer 112 of the lamp panels 100.

According to the backlight module 200 in the embodiment of the present application, since it includes the lamp panel 100 in any embodiment of the first aspect, it also has the beneficial effects of any embodiment of the first aspect. That is to say, in the backlight module 200 of the present embodiment, the through hole 101 is formed on the substrate 110 of the lamp panel 100, and the light emitting structure 120 is accommodated in the through hole 101, that is, the substrate 110 of the lamp panel 100 and the light emitting structure 120 are disposed on the same layer, so that when the light emitting structure 120 emits light, the generated heat will not be transferred through the substrate 110. Compared with the heat dissipation method of the lamp panel 100 in the related art, when the lamp panel 100 in this embodiment dissipates heat, the heat does not pass through the substrate 110, and therefore, the heat dissipation efficiency can be improved. In addition, referring to fig. 1, in the related art, the lamp beads are disposed on one side of the substrate 110, that is, the total thickness of the lamp panel 100 is the sum of the thickness of the substrate 110 and the thickness of the lamp beads. And light-emitting structure 120 in this application embodiment sets up in through-hole 101 on base plate 110, that is to say, base plate 110 and light-emitting structure 120 are the same layer setting, and like this, the gross thickness of lamp plate 100 is the biggest one of the thickness of base plate 110 and the thickness of lamp pearl, and it is thus clear that lamp plate 100 in this application embodiment can reduce the thickness of at most one lamp pearl compared with lamp plate 100 in the correlation technique. Thus, when the thickness of the lamp panel 100 is reduced, the light-emitting structure 120 has a shorter light-incident distance, so as to satisfy the thinner design requirement of the direct type display panel and the narrower design requirement of the lateral type display panel, and thereby satisfy the light and thin design requirement of the display. It can be seen that the lamp panel 100 in this embodiment not only has better heat dissipation performance, but also has a light and thin design requirement.

As shown in fig. 7, in some embodiments of the present application, the backlight module 200 includes a backplane body 210 and an adhesive layer 220, and the lamp panel 100 is connected to the backplane body 210 through the adhesive layer 220.

In this embodiment, the backplane body 210 is used to support and bear other optical devices, the lamp panel 100 is connected with the backplane body 210 through the adhesion layer 220, the adhesion layer 220 may be made of an adhesive tape, and the lamp panel 100 is connected with the backplane body 210 through an adhesive manner. In some specific embodiments of the present application, the adhesion layer 220 is a heat conductive insulating tape, so that an insulating isolation layer can be formed between the lamp panel 100 and the backplane body 210, and heat generated by the light emitting structure 120 during operation can be transferred from the backplane body 210, that is, the backlight module 200 has excellent heat dissipation performance through the heat conductive insulating tape.

In some embodiments of the present disclosure, the material of the backplate body 210 may be selected to have good thermal conductivity, and the material of the backplate body 210 may be selected to be aluminum, aluminum alloy, copper or copper alloy, for example. So that the back plate body 210 has good heat conduction and dissipation performance.

In some embodiments of the present disclosure, the backlight assembly 200 may further include a diffusion plate and an optical film. The diffusion plate is positioned on the light-emitting side of the lamp panel 100 and scatters incident light, so that the light passing through the diffusion plate is more uniform; the optical film may include a variety of functional films for optimizing the display effect of the display device.

As shown in fig. 9, in this embodiment, the lamp panel 100 further includes a solder resist layer 140, and the solder resist layer 140 is disposed between the conductive layer 112 and the adhesion layer 220.

In the embodiment, the solder resist layer 140 is located between the conductive layer 112 and the adhesion layer 220, before the lamp panel 100 is assembled to the backplane body 210, the lamp panel 100 is in an assembled state, and when the solder resist layer 140 is coated on the conductive layer 112, a protective film layer can be formed on the surface of the conductive layer 112. In some embodiments, before the light emitting structure 120 is soldered on the substrate 110, a solder resist layer 140 may be formed on the conductive layer 112 to protect the conductive layer 112 from being damaged during soldering. In other embodiments, a solder mask layer 140 may be formed on the conductive layer 112 after the light emitting structure 120 is soldered on the substrate 110, so as to prevent the conductive layer 112 from being exposed to air for a long time and surface oxidation. In still other embodiments, a solder mask layer 140 may be formed on the conductive layer 112 before the light emitting structure 120 is soldered on the substrate 110, and a solder mask layer 140 may be coated on the soldered periphery after the light emitting structure 120 is soldered on the substrate 110, so as to avoid dead corners in the soldered periphery area on the conductive layer 112. According to the backlight module 200 in the embodiment of the application, before the lamp panel 100 is assembled to the backplane body 210, the solder resist layer 140 can protect the conductive layer 112 of the lamp panel 100.

An embodiment of the third aspect of the present application provides a display device, which includes the backlight module 200 in any embodiment of the second aspect.

In this embodiment, the display device is specifically a liquid crystal display device, wherein the liquid crystal display device includes a liquid crystal display panel and a backlight module 200, liquid crystal molecules in the liquid crystal display panel do not emit light, the backlight module 200 is disposed on the back of the liquid crystal display panel, and light emitted by the backlight module 200 is transmitted through the liquid crystal molecules to realize light emission for image display.

According to the display device in the embodiment of the present application, since the display device includes the backlight module 200 in any embodiment of the second aspect, the display device also has the advantages of any embodiment of the second aspect. That is to say, in the display device of the embodiment, the through hole 101 is formed on the substrate 110 of the lamp panel 100, and the light emitting structure 120 is accommodated in the through hole 101, that is, the substrate 110 of the lamp panel 100 and the light emitting structure 120 are disposed on the same layer, so that when the light emitting structure 120 emits light, the generated heat will not be transferred through the substrate 110. Compared with the heat dissipation method of the lamp panel 100 in the related art, when the lamp panel 100 in this embodiment dissipates heat, the heat does not pass through the substrate 110, and therefore, the heat dissipation efficiency can be improved. In addition, referring to fig. 1, in the related art, the lamp beads are disposed on one side of the substrate 110, that is, the total thickness of the lamp panel 100 is the sum of the thickness of the substrate 110 and the thickness of the lamp beads. And light-emitting structure 120 in this application embodiment sets up in through-hole 101 on base plate 110, that is to say, base plate 110 and light-emitting structure 120 are the same layer setting, and like this, the gross thickness of lamp plate 100 is the biggest one of the thickness of base plate 110 and the thickness of lamp pearl, and it is thus clear that lamp plate 100 in this application embodiment can reduce the thickness of at most one lamp pearl compared with lamp plate 100 in the correlation technique. Thus, when the thickness of the lamp panel 100 is reduced, the light-emitting structure 120 has a shorter light-incident distance, so as to satisfy the thinner design requirement of the direct type display panel and the narrower design requirement of the lateral type display panel, and thereby satisfy the light and thin design requirement of the display. It can be seen that the lamp panel 100 in this embodiment not only has better heat dissipation performance, but also has light and thin design requirements. Therefore, the display device in the embodiment not only has better heat dissipation performance, but also has the design requirement of being light and thin.

The above description is only for the specific embodiments of the present invention, but the scope of the present invention is not limited thereto, and any person skilled in the art can easily think of the changes or substitutions within the technical scope of the present invention, and shall cover the scope of the present invention. Therefore, the protection scope of the present invention shall be subject to the protection scope of the claims.

Claims (10)

1. The utility model provides a lamp plate, its characterized in that includes:

the substrate comprises a base layer and a conductive layer arranged on one side of the base layer, and at least one through hole is formed in the substrate;

and the light-emitting structure is accommodated in the through hole, a gap is formed between the light-emitting structure and the wall of the through hole, and the light-emitting structure is communicated with the conductive layer.

2. The lamp panel of claim 1, wherein a dimension of the light emitting structure in a thickness direction of the substrate is greater than or equal to a dimension of the substrate in the thickness direction.

3. The lamp panel of claim 1, wherein the dimension of the light emitting structure in the thickness direction of the substrate is smaller than the dimension of the substrate in the thickness direction, and the difference between the dimension of the light emitting structure in the thickness direction of the substrate and the dimension of the substrate in the thickness direction is smaller than or equal to 0.3mm.

4. The lamp panel of claim 1, wherein the light emitting structure is an LED lamp, the LED lamp is connected with the conductive layer in a welding manner, a welding leg is formed at a welding position of the LED lamp and the conductive layer, and at least a part of the welding leg is located on one side, away from the base layer, of the conductive layer.

5. The lamp panel of claim 4, wherein the lamp panel further comprises a solder mask layer, and the solder mask layer is located on one side, away from the base layer, of the conductive layer.

6. The lamp panel of claim 1, further comprising a heat conductive insulating tape disposed on a side of the conductive layer away from the base layer.

7. A backlight module characterized by comprising the lamp panel according to any one of claims 1 to 6.

8. The backlight module according to claim 7, wherein the backlight module comprises a back plate body and an adhesive layer, and the lamp panel is connected with the back plate body through the adhesive layer.

9. The backlight module of claim 8, wherein the lamp panel further comprises a solder resist layer disposed between the conductive layer and the adhesion layer.

10. A display device comprising the backlight module according to any one of claims 7 to 9.

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