M350722 八、新型說明： 【新型所屬之技術領域】 本創作有關一種液晶面板用背光模組L ED散熱組合裝置， 尤指一種結合於液晶顯示設備殼體本身金屬背板之背光模組L e D散熱組合裝置。 【先前技術】 按’液BB顯示器與液晶電視等設備外殼大多係由一前侧框 參架、一殼體及一後側背板對接組成，以共同固定液晶顯示模組及 其液晶面板、背光模組與其相關組件。 以在液晶顯示器與液晶電視之背光模組主要採用冷陰極勞光 燈官，以提供此類平面型顯示設備的背面光源。惟目前液晶顯示 器與液晶電視之背紐組已逐漸制固壯ED光源，以提高照 明效率與使用壽命’並且節省電力。惟此照明光社ed必須於 電路板上排列佈置多數個發光二極體，隨著發光二極體之設置數 #量及輸出功率增加，在電>光>熱轉換過程，相對產生高溫度熱量， 目此必須透過電路板及其本身金料熱基板料至散魅進行散 熱。 L E D發光—鋪之導電接點賴崎接絲錄著於電路 板之電氣線路上’最後將電路板藉由導熱膠齡於散熱器表面。 惟LED發光二極體高溫度熱量必須透過電路板之絕緣層傳導至 本身金屬導熱基板，再經轉_傳導至散絲，以致影響 導效率’減造成賴效率差，散祕度慢，因此l e d發光二 5 M350722 而=長期間制時，容易造成溫度過高，嚴重影響照明效能，進 w成光衰’喊使用壽命。尤其此種背光模社電路板本身金 ‘、、、基板與政熱器相對增加成本，耗費加卫組立製程工時，並 且佔用體積與空間，因此有必要進—步創作改良。 【新型内容】 •人本創作之目的即在提供一種液晶面板用背光模組L E D散熱 :-裝置i要由金屬背板側面折板直接結合導熱絕緣層及其電M350722 VIII. New Description: [New Technology Field] This is a backlight module for liquid crystal panel L ED heat-dissipating device, especially a backlight module L e D combined with the metal back plate of the liquid crystal display device housing itself. Heat sink assembly. [Prior Art] According to the 'liquid BB display and LCD TV and other equipment casings are mostly composed of a front side frame, a casing and a rear side backplane to jointly fix the liquid crystal display module and its liquid crystal panel, backlight Module and its related components. The backlight module of the liquid crystal display and the liquid crystal television mainly adopts a cold cathode light lamp to provide a back light source of such a flat type display device. However, the current rear panel of liquid crystal displays and LCD TVs has gradually strengthened the ED light source to improve lighting efficiency and service life and save power. However, the illumination light agency ed must arrange a plurality of light-emitting diodes on the circuit board. As the number of the light-emitting diodes and the output power increase, the electric light is relatively high in the heat conversion process. The temperature and heat, so it is necessary to dissipate heat through the circuit board and its own gold material substrate. L E D illuminating—the conductive contact of the shop is printed on the electrical circuit of the circuit board. Finally, the board is made of a thermal conductive adhesive on the surface of the heat sink. However, the high temperature heat of the LED light-emitting diode must be transmitted to the metal heat-conducting substrate through the insulation layer of the circuit board, and then transferred to the loose wire, so that the conduction efficiency is reduced, resulting in poor efficiency and slow dispersion. Luminous two 5 M350722 and = long period system, it is easy to cause the temperature is too high, seriously affecting the lighting efficiency, into the light decay 'call life. In particular, the circuit board of the backlight module itself has a relatively high cost, and the substrate and the political heater increase the cost, and it takes a lot of time and space to occupy the assembly process, so it is necessary to further improve the design. [New content] • The purpose of human creation is to provide a backlight module for LCD panels. L E D heat dissipation: - device i should be directly bonded to the thermal insulation layer and its electricity by the metal back plate side flap
• ⑥線路與絕緣漆，並且配合導熱凸體傳導熱量，能狗達到L E D 、子電路複Q散熱设计’以進行全面性直接擴散迅速散熱，大幅 度降低熱阻係數’確保L E D發光二極體效能及使用壽命，並且 免除習用LED金屬導熱基板及散熱器，能夠降低背光模組成本 及空間’具備產業利用價值。 為達上揭目的，本創作設置在液晶顯示設備之金屬背板内 部；該金屬背板具有-主板體，以及於主板體四周侧彎設出折板， • 其中之一側折板内表面設有多數個彼此相隔之導熱凸體；多數個 -L E D發光二_分職有導電接概導錄座；該電路裝置一 -側絕緣設置於金射板之，折油表面，其另—侧電氣線路電 性連接設置多數個L E D發光二_之相對導電接腳；藉由金屬 背板之-側折板具有多數個導熱凸體，以對應接觸多數個leD 發光二極體之相對導熱基座表面。 於較佳實施例中，該電路裝置於金屬f板之—側折板内表面 設有多數個彼此相隔之絕緣部，以於絕緣部另一側結合電氣線路。 6 M350722 於較隹實施例中 緣層，以於㈠數靖繼相連成絕 應置入折满辦熱凸體=板，於電路板上設有對 、纟/電路裝置之電氣線路局部與絕緣部表面設有絕緣 :又α亥金属方板之導熱凸體由折板往内延伸為中空凸出體。 【實施方式】• 6 lines and insulating varnish, and with heat conduction convex body to conduct heat, can reach the LED, sub-circuit complex Q heat dissipation design 'for comprehensive direct diffusion and rapid heat dissipation, greatly reduce the thermal resistance coefficient' to ensure LED light-emitting diode performance And the service life, and the elimination of the use of LED metal heat-conducting substrates and heat sinks, can reduce the cost and space of the backlight module's industrial use value. In order to achieve the above, the present invention is disposed inside the metal back plate of the liquid crystal display device; the metal back plate has a main body, and a folding plate is formed on the side of the main body, and one of the inner side surfaces of the side flap is provided There are a plurality of thermally conductive protrusions separated from each other; a plurality of LED-emitting diodes have a conductive connection guide; the circuit device has a side-side insulation disposed on the gold plate, the oil-removing surface, and the other side electrical The electrical connection of the circuit is provided with a plurality of LEDs illuminating the opposite conductive pins; the metal backing plate has a plurality of thermally conductive protrusions for correspondingly contacting the surface of the opposite thermally conductive pedestals of the plurality of LED illuminating diodes . In a preferred embodiment, the circuit device is provided with a plurality of insulating portions spaced apart from each other on the inner surface of the side flap of the metal f-plate to bond the electric circuit on the other side of the insulating portion. 6 M350722 in the middle layer of the comparative example, in order to (1) the number of Jingji connected into the absolute placement of the hot convex = plate, the electrical circuit on the circuit board with the 纟 / circuit device part and insulation The surface of the part is provided with insulation: the heat-conducting convex body of the α-shaped metal square plate extends inwardly from the folded plate into a hollow convex body. [Embodiment]
有關本創作為達成上述目的，所採用之技術手段及其功效， 茲舉出可行實施例，並且配合圖式說明如下： 首先α參閱第1、2及3圖，本創作背光模組L ED散熱 組合裝置騎對液晶顯示H與液晶電視之類平面型齡設備，而 適用於L E D背光模組之多數個L E D發光二極體3〇及其電路 裝置2 0設計’以設置在液晶顯示設備殼體（圖未示）之金屬背 板10内侧邊與背光模組（圖未示）侧邊之間；藉由L E D發光 二極體3 0朝向_方發光，以提供此類平_顯示設備的背面 光源。 於第1至4圖所示之L E D散熱組合裝置設計中，液晶顯示 設備之金屬背板1 〇設為矩形體，該金屬背板1〇具有一主板體 11 ’以及由主板體11四周側彎設出折板12、13、14、 15 ’其中之一側或兩相對側折板12、13内表面設有多數個 彼此相隔之導熱凸體16。而多數個L E D發光二極體3 〇分別 具有一LED晶片3 1、兩側導電接腳3 2及底端導熱基座3 3。如圖所示’該電路裝置2 〇—侧絕緣設置於金屬背板1〇之 7 M3 50722 -侧或兩側折板12、i 3内表面，其另_側電氣線路2 2電性 連接設置多數個L E D發光二極體3 0之相對導電接腳3 2 ;藉 由金屬背板10之1或兩侧折板工2、丄3具有多數個導教: 體16，以對應接觸多數個LED發光二_3〇之相對導教基 座3 3表面，以有欵傳導熱量。 …土 本創作液“如背賴組L E D散触合裝置特點在於. ._大_金屬背板1 Q本身折板1 2、！ 3直接絕緣結合電路 _ 裝置2 ◦及其魏線路2 2，能夠達到L ED電子電路裝置2 〇 複合散熱設計’以進行全面性直接擴散，更配合金屬背板丄〇本 身折板12、13及其導熱凸體丨6朝向外部全面迅速散熱，大 幅度降低熱阻係數，確保L E D發光二極體3 〇效能及使用壽 命’並且免除習用LED金屬導熱基板及散熱器，能夠降低背光 模組成本及空間。 於第1至4_示之較佳實施例中，在金屬f板i 〇與電路 • 裝置2 0上之多數個L E D發光二極體3 0彼此等距相隔排列分 佈，以作為液晶顯不設備之背光模組光源。尤其如第3至6圖所 不之L ED散熱組合裝置設計中，該電路裝置2 〇於金屬背板丄 0之-侧折板1 2内表面設有錄個彼此相連或相隔之絕緣部2 1 ’以於絕緣部21另-側結合電氣線路2 2。而如第7、8及 9圖所不之較佳實施例巾，將金屬背幻G之導熱凸體i 6由折 板12往内延伸為中空凸出體，以方便加工成型。 繼續說明第3至6圖所示之電路裝置2◦結構設計，將電路 M350722 裝置2 Q之多數個絕緣部21彼此相連成導熱絕緣層，以於另一 侧結合電氣線路2 2構錢路板，於電路板上設有對應置入折板 12多數個導熱凸體16之通孔2 4，使導熱凸體丨6對應接觸 led發光二極體3〇之導熱基座33。 進步將電路裝i20之絕緣部21-侧與電氣線路22局 部表面結合同一層絕緣漆2 3，而只顯露出電氣線路2 2之相關 接點#位以電性連接設置多數相對發光二極體3 〇。除 _ 外該電路裝置2 〇可設成複合板體，其整層絕緣部21以 導熱膠接合111定於金射板1 〇之折板1 2内絲。當然亦可改 為如第1◦及11圖所示，將金屬背板10之折板12内表面直 接塗佈、喷塗、網版印刷或熱壓成型出彼此相隔之絕緣部21， 然後依序施作結合電氣線路2 2與絕緣漆2 3，⑽成複合型電 路結構，進一步電氣線路2 2電性連接設置多數個l ED發光二 極體3 0之相對導電接腳3 2，藉由導熱凸體16對應接觸l e 籲 D發光一極體3 0之相對導熱基座3 3表面，以有效傳導熱量。 本創作液晶顯示設備利用金屬背板侧面折板直接結合L E D 電子電路複合散熱設計，並且配合導熱凸體傳導熱量，以進行全 面性直接擴散迅速散熱，大幅度降低熱阻係數，確保L E D發光 —極體效能及使用壽命，並且免除習用L· ED金屬導熱基板及散 …、器此夠降低背光模組成本及空間，具備產業利用價值，爰依 法提出新型專利申請。 以上所舉實施例僅用為方便說明本創作，而並非加以限制， 9 M350722 在不離本釗作精神範疇，熟悉此一行業技藝人士所可作 易變化與修飾，均仍應含括於以下申請專利範圍中。 【圖式簡單說明】 第1圖係本創作較佳實施例背光模組L E D散埶 第2圖係第1圖金屬背板立體圖； 第3圖係第1圖局部放大剖視圖； 第4圖係如第3圖之分解圖； 第5圖係第4圖電路裝置立體圖； 第6圖係第4圖電路裝置示意圖； 第7圖係第4圖金屬背板局部放大圖； 第8圖係第4圖金屬背板加工前之立體圖； 2圖係第4®金屬背她合電路敍立體圖； 第1 創作另—較佳實施例局部放大剖視圖； 第11圖係第1〇圖今屬北 【主要元件符號說明】 合電路裝置立體圖。 10金屬背板 1 3折板 16導熱凸體 2 0電路裝置 2 3絕緣漆 3 0 L E D發光二極體 31 LED晶片 2折板 5折板 1 1主板體 1 4折板 2 2電氣線ί 3 3導熱基座 2 1絕緣部 2 4通孔 3 2導電接腳For the purpose of achieving the above objectives, the technical means and its functions, the feasible embodiments are described, and the following description is given as follows: First, referring to Figures 1, 2 and 3, the backlight module L ED is cooled. The combination device rides a flat-age device such as a liquid crystal display H and a liquid crystal television, and a plurality of LED light-emitting diodes 3 适用 and its circuit device 20 for the LED backlight module are disposed in the liquid crystal display device housing. (not shown) between the inner side of the metal back plate 10 and the side of the backlight module (not shown); the LED light emitting diode 30 is illuminated toward the side to provide the back of such a flat display device light source. In the design of the LED heat sink assembly shown in FIGS. 1 to 4, the metal back plate 1 of the liquid crystal display device is a rectangular body, and the metal back plate 1 has a main body 11' and is bent from the side of the main body 11. The inner surface of one of the flaps 12, 13, 14, 15' or the opposite side flaps 12, 13 is provided with a plurality of thermally conductive projections 16 spaced apart from each other. The plurality of L E D LEDs 3 具有 respectively have an LED chip 31, two side conductive pins 3 2 and a bottom end heat conduction base 33. As shown in the figure, 'the circuit device 2 〇-side insulation is disposed on the side of the metal back plate 1 7 7 M3 50722 - or the inner surfaces of the side flaps 12, i 3 , and the other side electrical circuit 2 2 is electrically connected A plurality of LED light-emitting diodes 30 have opposite conductive pins 3 2; and one of the metal back plates 10 or two sides of the folding plate 2, 丄 3 has a plurality of teachings: body 16, to correspondingly contact a plurality of LEDs The light illuminates the surface of the opposite pedestal base 3 3 to conduct heat. ... soil creation liquid "such as the back-and-forth group LED loose-contact device is characterized by .__large_metal back plate 1 Q itself folding plate 2, ! 3 direct insulation combined circuit _ device 2 ◦ and its Wei line 2 2, The L ED electronic circuit device 2 〇 composite heat dissipation design can be achieved for comprehensive direct diffusion, and the metal back plate itself, the folding plates 12 and 13 and the heat-conducting convex body 丨6 thereof, can be completely and rapidly radiated toward the outside, and the heat is greatly reduced. The resistance coefficient ensures the LED light-emitting diode 3 〇 performance and service life' and eliminates the conventional LED metal heat-conducting substrate and heat sink, which can reduce the cost and space of the backlight module. In the preferred embodiments of the first to fourth embodiments, The plurality of LED light-emitting diodes 30 on the metal plate i and the circuit 20 are arranged equidistantly spaced apart from each other to serve as a backlight module light source for the liquid crystal display device, especially as shown in Figures 3 to 6. In the design of the L ED heat dissipating device, the circuit device 2 is disposed on the inner surface of the side back plate 1 2 of the metal back plate 丄0, and is provided with an insulating portion 2 1 ' which is connected to or separated from each other for the insulating portion 21 - Side combined with electrical circuit 2 2. As with 7, 8 In the preferred embodiment of the present invention, the thermally conductive projection i 6 of the metal back G is extended inwardly from the flap 12 into a hollow projection to facilitate the forming. Continue to explain the figures 3 to 6. The circuit device 2◦ is designed to connect a plurality of insulating portions 21 of the device M350722 device 2 Q to each other to form a heat conductive insulating layer, and the other side is combined with the electric circuit 2 2 to construct a money board, and the corresponding board is disposed on the circuit board. The plurality of through holes 24 of the heat conducting protrusions 16 of the folding plate 12 enable the heat conducting protrusions 丨6 to correspond to the heat conducting base 33 of the LED light emitting diodes 3. The improvement of the insulating portion 21 side of the circuit assembly i20 and the electrical circuit 22 The partial surface is combined with the same layer of insulating varnish 2 3, and only the relevant contact point # of the electrical circuit 2 2 is exposed to electrically connect a plurality of relatively light-emitting diodes 3 〇. In addition to _, the circuit device 2 can be set to In the composite plate body, the entire insulating portion 21 is fixed to the inner plate of the folding plate 1 2 of the gold plate 1 by the thermal conductive adhesive 111. Of course, the metal back plate 10 may be replaced as shown in FIGS. 1 and 11 . The inner surface of the flap 12 is directly coated, sprayed, screen printed or thermoformed to form an insulating portion 21 spaced apart from each other. Then, the combined electrical circuit 2 2 and the insulating varnish 2 3, (10) are combined into a composite circuit structure, and the electrical circuit 2 2 is electrically connected to set a plurality of relatively conductive pins 3 2 of the ED light emitting diode 30. The heat-conducting convex body 16 correspondingly contacts the surface of the opposite heat-conducting base 3 3 of the light-emitting body 3 to effectively conduct heat. The liquid crystal display device of the present invention directly combines the LED electronic circuit to heat the composite by using the side back plate of the metal back plate. Designed and combined with heat-conducting convex body to conduct heat for comprehensive direct diffusion and rapid heat dissipation, greatly reducing the thermal resistance coefficient, ensuring LED light-polarity performance and service life, and eliminating the use of L·ED metal heat-conducting substrate and dispersion... This is enough to reduce the cost and space of the backlight module, and has the industrial use value, and proposes a new type of patent application according to law. The above examples are for illustrative purposes only and are not intended to be limiting. 9 M350722 is not subject to the spirit of this book. Those skilled in the art can make changes and modifications, and should still be included in the following application. In the scope of patents. BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a perspective view of a preferred embodiment of a backlight module LED divergence. FIG. 1 is a perspective view of a metal back plate; FIG. 3 is a partially enlarged cross-sectional view of FIG. 3 is an exploded view of the circuit device; Fig. 5 is a perspective view of the circuit device of Fig. 4; Fig. 6 is a schematic view of the circuit device of Fig. 4; Fig. 7 is a partial enlarged view of the metal back plate of Fig. 4; Fig. 8 is a fourth figure A perspective view of the metal back plate before processing; 2 is a 4th metal back and her circuit is a perspective view; 1st is another - a preferred embodiment partial enlarged cross-sectional view; the 11th figure is the first figure now north [main component symbol Description] A perspective view of the circuit device. 10 metal back plate 1 3 folding plate 16 thermal convex body 2 0 circuit device 2 3 insulating varnish 3 0 LED light emitting diode 31 LED chip 2 folding plate 5 folding plate 1 1 main body 1 4 folding plate 2 2 electric wire ί 3 3 heat conductive base 2 1 insulation part 2 4 through hole 3 2 conductive pin