TW574760B - LED display module having high heat dissipation property and its substrate - Google Patents

Abstract

A kind of LED (light emitting diode) display module having high heat dissipation property and its substrate are disclosed in the present invention. The invented LED display module contains a substrate having high heat dissipation property; and plural LEDs and electronic devices are disposed one the substrate. For the substrate, an insulation layer is formed on the metal plate surface and is followed by disposing the copper circuit layer on the insulation layer, in which the copper circuit layer can be used to bond the light emitting display device. The insulation layer also is the material with excellent thermal conduction property and, particularly, is the metal oxide of which the conduction coefficient is higher than that of resin or fiber. Thus, the display module is capable of uniformly diffusing heat to the entire circuit board such that heat can be quickly dissipated in the air of the ambient.

Description

574760 A7 B7 Five invention descriptions 1 Field of the invention The present invention relates to a kind of light emitting diode display module with high heat dissipation property and its substrate, especially the light emitting diode display module uses a metal plate and metal oxide. Of laminated circuit boards. 1 Bright background At present, full-color light-emitting diode (LED) display screens have been widely used for advertising display, outdoor activities and real-time display of competitions. Through computer control, various silicon images are played on large-scale presentation screens. Obtain the approval and support of the people at the scene. Since the LED full-color display screen is mostly installed outdoors or in an open building space, the LEDs used in the assembly must have high brightness characteristics to provide long-distance viewing. The traditional luminous efficiency of LEDs is about 10 ~ 20 lumens per watt (Lm / W). Through continuous improvement and improvement of various technologies, the luminous efficiency can reach more than 50 lumens per watt. In order for the brightness to continue to improve, in addition to solving the problem of external packaging, it is also necessary to design characteristics that can accept higher electrical power and higher current performance. Due to the increase of the consumed electric power, the problem of thermal energy generation is serious. The overheated operating temperature will make the brightness of Le D not reach the standard of setting specifications, which will seriously affect the performance of the entire LED display. As shown in FIG. 1, a conventional display module 10 of a LED display screen is a plurality of LEDs 1 1 adhered to a printed circuit board 12 in a high-density array. Thanks to the package of LED 11! The thermal conductivity of η is not good, so the thermal energy generated by the chip 110 is mostly conducted through the outer pins 丨 丨 2. Part of the thermal energy is directly dissipated into the ambient air from the outer pin 1 12 (Hot_Taohe New Technology Taiwan Patent \ 7918〇d〇c _ 4 & Zhang scale applies to ϋϋϋϋ 准 (CNS) M specifications (No. 297 public love)-574760 V. Description of the invention (the path is indicated by arrows), and another part of the heat is conducted to the printed circuit board i 2 and escapes. 3 Metal circuit of the printed circuit board 1 2 丨 2 1 The area and heat dissipation capacity are limited, and Wang Yao still needs to use the largest composite substrate, such as FR-4, to dissipate heat. However, FR_4 is impregnated and laminated with epoxy resin and glass fiber. However, its thermal conductivity is not good, so it cannot conduct thermal energy effectively. In other words, most of the thermal energy transmitted from the wafer 1 丨 0 cannot be dissipated through the surface of the edge substrate 122. Similarly, not only FR_4 The substrate f has the disadvantage of poor heat dissipation, and other substrates made of other polymer resins (PTef or PI) and fibrous reinforcing materials (glass fiber, argon fiber or quartz fiber) also have the same problem. Brief description of this A first object of the invention is to provide a The thermal light-emitting diode display module can effectively transmit the heat energy generated by the LED to the surface of the substrate, and then quickly dissipate the heat into the air through the large area of the surface. The second object of the present invention is to provide A material for reducing the heat dissipation cost of a display module can eliminate the related expenses of devices such as a fan radiator, a heat pipe or a heat sink used in the display module. A second object of the present invention is to provide a reliable heat dissipation method for a display module. It is not necessary to worry about the breakdown of the heat sink and the crash of the display module or the entire system. A fourth object of the present invention is to provide a method for manufacturing a substrate, which uses a metal plate to directly form an insulating layer and a circuit layer on the surface thereof. Compared with multi-layer circuit boards, there are simpler manufacturing steps. H: \ Hu \ lgc \ Xinzhi Technology Taiwan Patent \ 7918〇d〇c-5-This paper rule ^^ SPC Standard (CNS) A4 specification (210X297) (Mm)

574760 A7 B7 V. Description of the invention (3) In order to achieve the above object, the present invention discloses a light-emitting diode display module with high heat-dissipation, comprising a substrate with high heat-dissipation, a plurality of light-emitting diodes and electronic components The main component of the substrate is a metal plate, and an insulating layer is formed on the surface of the metal plate. The insulating layer is a film of an insulating substance or a polymer material formed of a metal compound. Through the process of surface activation and electroplating, a circuit layer is provided above the insulating layer, and the circuit layer is used for the surface adhesion and electrical connection of electronic or optoelectronic components. Since metal oxides and metal plates are materials with good thermal conductivity, they can effectively transfer the heat energy generated by the electrons or optoelectronic elements on the substrate to the entire substrate, so that the heat energy is dissipated into the air through a wider surface area. Brief description of the drawings The present invention will be explained in accordance with the following drawings: Figure 1 is a schematic diagram of a heat dissipation path of a multilayer circuit board used in a conventional light emitting diode display module; Figure 2 is a light emitting diode of the present invention The structure of the single-layer substrate of the liquid crystal display module is not intended. FIG. 3 is a schematic diagram of the structure of another single-layer substrate of the light-emitting diode display module of the present invention; FIG. 4 is the structure of the light-emitting diode display module of the present invention. Schematic diagram of the structure of a through-hole double-layer substrate; Figure 5 is a schematic diagram of the structure of another double-layer substrate of the light-emitting diode display module of the present invention, and Figure 6 is the first of the light-emitting diode display module of the present invention. Example H: \ Hu \ lgc \ Xinzhi Technology Taiwan Patent \ 79180.doc -6-This paper size applies to China National Standard (CNS) A4 (210X 297 mm) 574760 A7

Schematic diagram of the thermal path of the pins outside the LED of the display module 1 10 chip 112; Figure 7 is a schematic diagram of the heat dissipation path of the second embodiment of the light emitting diode display module of the present invention; Figure 8 is the light emitting diode of the present invention The manufacturing flowchart of the single-layer substrate of the display module; and ~ FIG. 9 is the manufacturing flowchart of the double-layer substrate of the light-emitting diode display module of the present invention.

Component symbol says I 1 0 Known light-emitting diode display 11 Surface-adhesive led 1 1 1 LED package 1 2 Printed circuit board 121 Circuit layer 122 Composite substrate 2 0, 3 0, 4 0, 50 The substrate 2 of the light-emitting diode display module of the invention 2 1, 3 1, 4 1 1, 4 1 2, 5 1 1, 5! 2 Circuit layers 413, 513 vertical wires 22, 32, 42, 52 Insulating layers 23, 33, 43, 53 metal sheet 34 insulation layer

45 through-hole 71-pin LED 711 LED package 712 Pins other than LED Description of preferred embodiments FIG. 2 is a schematic diagram showing the structure of a single-layer substrate of a light-emitting diode display module of the present invention. An insulating layer 22 is covered above a metal plate 23, and the insulating layer 22 is a metal compound of the metal plate, that is, an oxide film layer or a nitride film layer, or an insulating ceramic material or a polymer material is deposited on the metal plate H : \ Hu \ lgc \ Xinzhi Technology Taiwan Patent \ 79180.doc-7-This paper size is applicable to China National Standard (CNS) A4 specification (210X297 mm). Binding line 574760

Install the surface of 23. The insulating film 22 can be used as an electrical insulator between the circuit layer 21 and the metal plate 23 instead of the conventional composite substrate. For example, an aluminum plate is used as the material of the metal plate 23, and an insulating film layer of aluminum oxide or aluminum nitride is formed on the surface of the aluminum plate. It can be seen from Table 1 that the thermal conductivity of aluminum is 2 3 7W / M · K, the oxide name is 46 W / M · κ, and the nitride name ^ M0 ~ 23 0 W / M · K. Compared with FR_4, which is 2 w / m.K, the above materials have superior thermal conductivity, and also prove that the substrate of the conventional light-emitting diode display module is almost a thermal insulator. On the other hand, alumina or aluminum nitride is also a good electrical insulator, which can prevent the electrons of the circuit layer 21 from penetrating to the metal plate 23 and cause a short circuit. Generally speaking, the driving voltage of the red LED is 18V, and others such as green are, so the substrate of the present invention is used for LED_displays with phase / available electrical safety. Order materials

Table 1 Thermal conductivity (W / MK)

In order to prevent the metal plate 33 from being exposed, which may easily cause contact with other circuits in the system, H: \ Hu \ lgc \ Xinzhi Technology Taiwan Patent \ 79180.doc _ 8 _ This paper size applies to Chinese national standards (ΠΝΆ 格 (〇1 卩 V卩 一线 574760 A7 ___B7 V. Description of the invention (~~ Zhao " A short circuit is formed, so another insulating layer 3 4 needs to be formed on the bottom surface of the metal plate 33, as shown in Figure 3. Similarly, the substrate 30 has an insulating layer 32 and circuit layer 31 are sequentially placed on the upper surface of metal sheet 33. In addition to considering the substrate suitable for surface-adhesive components, the present invention also provides a substrate for socket-type components, as shown in Figure 4. In the through hole 45 The inner wall is provided with vertical wires 413 to electrically connect the upper and lower circuit layers 411 and 412. There is still a metal plate 43 including a plurality of holes in the substrate 40, and a protective insulating layer is formed in the holes and the upper and lower surfaces of the metal plate 43 42. As shown in tf in FIG. 5, it is another substrate 50 suitable for surface-adhesive components (SMD), and it is also drilled in the metal plate 53 and formed a protective insulating layer 52 around the through hole and the surface of the upper and lower plates. In the middle of the through hole There are vertical wires 5 1 3 for electrically connecting the upper and lower circuit layers 5 丨 丨 and 5 丨 2, and this type of substrate 50 can be provided with circuit patterns or soldering surface adhesive components on both the upper and lower sides. Figure 6 A schematic diagram of the heat dissipation path of the first embodiment of the light-emitting diode display module of the invention, in which the heat transfer path is indicated by an arrow. The thermal energy generated inside the package 111 of the LED module is transmitted from the outer pin 112 to the substrate 30, A small part of the thermal energy is scattered from the upper surface of the outer pin 112, and another large # is not conducted from the upper insulating layer 3 2 to the lower insulating layer 3 4 and escapes into the air rolling, and the middle sheet metal 3 3, the thermal energy of the upper insulating layer 32 is quickly transmitted to the lower insulating layer 34. The heat dissipation path of the substrate 40, which is another type of pin LED71, is also substantially the same, as shown in FIG. 7. Part of the thermal energy is also conducted to the substrate 40 through the outer pins 7 丨 2, and the same thermal energy can be quickly transmitted to H: \ Hu \ lgc \ New Technology Taiwan Patent \ 79i8〇d〇c _ 9 _ Zhang scale such as A4W (21GX297 (Mm) --- one pack. 574760 A7

574760 A7 B7 V. Description of the invention (8) It should not be limited to those disclosed in the examples, but should include various substitutions and modifications that do not depart from the present invention, and are covered by the scope of patent application below. H: \ Hu \ lgc \ Xinzhi Technology Taiwan Patent \ 79180.doc -11 This paper size is applicable to China National Standard (CNS) A4 specification (210X297 mm).

Claims (1)

574760 Printed D8 by the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs 夂, patent application scope 1 · A light-emitting diode display module with high heat dissipation, including a substrate with high heat dissipation and a plurality of substrates provided on the substrate The light-emitting diode is characterized in that the substrate comprises: a metal plate; an insulating layer, which is covered with an insulating substance on the surface of the metal plate; and at least one circuit layer provided on the surface of the insulating layer. 2. The light-emitting diode display module according to item 1 of the patent application scope, wherein the insulating layer of the substrate is a metal compound of the metal plate. 3. The light-emitting diode display module according to item 1 of the patent application scope, wherein the insulating layer of the substrate is a metal oxide of the metal plate. 4. The light emitting diode display module according to item 1 of the patent application scope, wherein the insulating layer of the substrate is a metal nitride of the metal plate. 5. The light-emitting diode display module according to item 1 of the patent application scope, wherein the insulating layer of the substrate is a ceramic material. 6. The light-emitting diode display module according to item 丨 of the application, wherein the insulating layer of the substrate is a polymer material. 7 · The light-emitting diode display module according to item 丨 of the application, wherein the insulating layer of the substrate is formed on at least one surface of the metal plate. 8 · The light emitting diode display module according to item 丨 of the patent application, wherein the circuit layer of the substrate is formed by chemical copper plating or hot pressing. 9 · The light emitting diode display module according to item 丨 of the application, wherein the substrate < insulation layer is produced by a thermal oxidation method, vapor deposition or anodizing. -------------------- * 1 Order --------- (Please read the back, note the above, and then fill in this page) H : \ HU \ LGC \ ff Knowledge Technology Taiwan Patent \ 791801) 〇 (^ -12- 574760 Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs. Among them, the plurality of light-emitting diode system surface-adhesive elements. 1 1 As the light-emitting diode display module of item i in the patent claim, the metal plate of the substrate further includes a plurality of through-holes, The inner wall is covered by an insulating layer, and a plurality of vertical wires are provided on the surface of the insulating layer of the through-hole. 12. If the light-emitting diode display module of the nth item of the patent application is applied, the plurality of through-holes can be provided for a plurality of The pins of the jack-type light-emitting diodes are inserted and electrically connected to the circuit layer through the plurality of vertical wires. 1 3 · —A substrate with high heat dissipation properties, including: a metal plate; an insulating layer Is covered with an insulating substance on the surface of the metal plate; and at least one circuit layer is provided on the surface of the insulating layer. 1 4 · The substrate of the scope of patent application No. 13 in which the insulation layer is a ceramic material. 1 5 · The substrate of the scope of patent application No. 13 in which the insulation layer is the metal compound of the metal plate. The substrate according to item 13 of the patent, wherein the insulating layer is a metal oxide of the metal plate. 1 7 · The substrate according to item 13 of the application, wherein the insulating layer is a metal nitride of the metal plate. 1 8 · If the substrate in the 13th scope of the patent application, the insulation layer is a high H: \ HU \ LGC \ lf know technology Taiwan patent \ 79180.DOC _ 13-This paper size applies to China National Standard (CNS) A4 Specifications (210 X 297 mm) _____________ ^ -1 (Please read the note of back healing ^ before filling this page) Order · 574760 Scope of patent application Molecular materials. 19. For example, the substrate 1 in the scope of the patent, the insulation layer is generated by thermal oxidation, vapor deposition, or anodizing. 2 0 If the substrate of the scope of patent application No. 丨 3, wherein the metal plate of the substrate further includes a plurality of through holes, the inner wall of the through hole is covered by the insulating layer, and a plurality of vertical wires are provided in the through hole. Insulation surface. — — — — — — N -I · 1 H ϋ n I · n I (please read the note of the ® first and then the note? Please fill out this page) : \ HU \ LGC \ ff Know-how Taiwan Patent \ 79180 was 0 € 14- This paper size is applicable to China National Standard (CNS) A4 (210 X 297 mm)