TWI400532B - Backlight module and liquid crystal display device including the same - Google Patents

Backlight module and liquid crystal display device including the same Download PDF

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TWI400532B
TWI400532B TW99102655A TW99102655A TWI400532B TW I400532 B TWI400532 B TW I400532B TW 99102655 A TW99102655 A TW 99102655A TW 99102655 A TW99102655 A TW 99102655A TW I400532 B TWI400532 B TW I400532B
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frame
backlight module
liquid crystal
crystal display
light emitting
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TW99102655A
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Chinese (zh)
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TW201126240A (en
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Yijen Chiu
Chinnan Chang
Shyantsung Wu
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Radiant Opto Electronics Corp
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背光模組及應用此背光模組之液晶顯示裝置Backlight module and liquid crystal display device using the same

本發明是有關於一種背光模組及其應用,且特別是有關於具有散熱結構之背光模組及其在液晶顯示裝置上的應用。The present invention relates to a backlight module and an application thereof, and more particularly to a backlight module having a heat dissipation structure and its application to a liquid crystal display device.

液晶顯示器目前正朝著薄型化發展,藉此提高空間利用率。同時,隨著地球天然能源漸漸枯竭,液晶顯示器亦朝著強調節能的方向作設計。在液晶顯示器中,背光模組為主要的耗能元件之一。而為了達到節能的效果,目前有越來越多的背光模組之光源改採發光二極體(Light Emitting Diode;LED)來取代傳統的冷陰極燈管(Cold Cathode Fluorescent Lamp;CCFL)。發光二極體除了能夠達到節能的效果之外,同時亦可兼顧薄型化之需求。此外,相較於冷陰極燈管,發光二極體另一優點在於其不包含容易對環境造成長久性污染的汞成分。Liquid crystal displays are currently evolving toward thinner, thereby increasing space utilization. At the same time, as the earth's natural energy is gradually depleted, liquid crystal displays are also designed to emphasize energy conservation. In a liquid crystal display, a backlight module is one of the main energy consuming components. In order to achieve energy-saving effects, more and more backlight modules have been replaced with Light Emitting Diodes (LEDs) to replace the traditional Cold Cathode Fluorescent Lamps (CCFLs). In addition to the energy-saving effect, the light-emitting diode can also meet the needs of thinning. In addition, another advantage of the light-emitting diode compared to a cold cathode lamp is that it does not contain a mercury component that is prone to permanent environmental pollution.

請參照第3圖,在一般採用發光二極體作為發光源之背光模組中,背光模組包含背板402、框架結構(未繪示)、導光板(未繪示)、包含多個發光二極體404a的燈條(Light Bar)404以及燈條固定座406。背光模組中的發光二極體404a先焊接至印刷電路板(Printed Circuit Board;PCB)404b上形成燈條404。接著將燈條404接合在燈條固定座406上。完成上述步驟後,將燈條固定座406藉由螺絲410與螺孔412接合至散熱鰭片408上。接著,同樣藉著螺絲410與螺孔412將散熱鰭片408接合至背板402上,使得多個發光二極體404a鄰接於導光板的入射面。最後,將框架結構與背板402接合完成背光模組的組裝。在上述背光模組中,框架結構一般係由多個框體(未繪示)組合而成,而在背光模組的組裝過程中,一般係將部分之框體先接合在背板上,藉此來容置上述之其他元件,而最後一框體接合至背板上即完成背光模組的組裝。Referring to FIG. 3, in a backlight module generally using a light-emitting diode as a light source, the backlight module includes a back plate 402, a frame structure (not shown), a light guide plate (not shown), and a plurality of light-emitting layers. A light bar 404 of the diode 404a and a light bar mount 406. The light emitting diode 404a in the backlight module is soldered to a printed circuit board (PCB) 404b to form a light strip 404. The light bar 404 is then joined to the light bar mount 406. After the above steps are completed, the light bar holder 406 is joined to the heat dissipation fins 408 by screws 410 and screw holes 412. Next, the heat dissipation fins 408 are also bonded to the back plate 402 by the screws 410 and the screw holes 412, so that the plurality of light emitting diodes 404a are adjacent to the incident surface of the light guide plate. Finally, the frame structure is bonded to the backplane 402 to complete the assembly of the backlight module. In the above backlight module, the frame structure is generally composed of a plurality of frames (not shown). In the assembly process of the backlight module, a part of the frame body is first joined to the back plate. The other components described above are accommodated, and the assembly of the backlight module is completed by bonding the last frame to the backplane.

在一般的設計中,散熱鰭片408的設置係為了滿足發光二極體404a的散熱需求。為了強化燈條404的散熱能力,燈條404與燈條固定座406之間,以及燈條固定座406與散熱鰭片408之間通常會加入導熱材414與416,其中導熱材414與416更可充當黏著劑,將二元件更牢固地接合在一起。此外,同樣為了強化燈條的散熱能力,燈條固定座406、散熱鰭片408及背板402通常均以金屬材質製造。In a general design, the heat dissipating fins 408 are disposed to meet the heat dissipation requirements of the LEDs 404a. In order to enhance the heat dissipation capability of the light bar 404, heat conductive materials 414 and 416 are usually added between the light bar 404 and the light bar fixing seat 406, and between the light bar fixing seat 406 and the heat dissipation fin 408, wherein the heat conductive materials 414 and 416 are further It acts as an adhesive to bond the two components together more firmly. In addition, in order to enhance the heat dissipation capability of the light bar, the light bar fixing seat 406, the heat dissipation fin 408 and the back plate 402 are generally made of a metal material.

然而,上述傳統設計之背光模組的缺點是組裝程序繁複。However, the conventional design of the backlight module has the disadvantage that the assembly process is complicated.

因此,本發明之目的係在提供一種背光模組及應用此背光模組之液晶顯示裝置,其中背光模組具有散熱結構,且其設計可降低結構複雜度,藉此達到簡化組裝程序之目的。Therefore, the object of the present invention is to provide a backlight module and a liquid crystal display device using the same, wherein the backlight module has a heat dissipation structure, and the design thereof can reduce the structural complexity, thereby achieving the purpose of simplifying the assembly process.

根據本發明之一實施例,提供一種背光模組。此具有散熱結構之背光模組包含背板、與背板接合的框架結構、導光板及多個發光二極體。框架結構與背板定義出一容置空間以設置導光板,且框架結構包含第一框體以及與第一框體接合之至少一第二框體。第一框體具有面向上述容置空間的第一側面,其中第一框體在第一側面之外的其他表面部分設有多個散熱鰭片。多個發光二極體電性連接地設置在第一框體的第一側面上,且鄰設於導光板的一第二側面。According to an embodiment of the invention, a backlight module is provided. The backlight module with a heat dissipation structure comprises a back plate, a frame structure joined to the back plate, a light guide plate and a plurality of light emitting diodes. The frame structure and the backboard define an accommodating space for arranging the light guide plate, and the frame structure comprises a first frame body and at least one second frame body joined to the first frame body. The first frame body has a first side surface facing the accommodating space, wherein the first frame body is provided with a plurality of heat dissipation fins on other surface portions other than the first side surface. The plurality of light emitting diodes are electrically connected to the first side of the first frame and adjacent to a second side of the light guide plate.

根據本發明之另一實施例,提供一種液晶顯示裝置。此液晶顯示裝置包含液晶顯示模組及背光模組,其中背光模組設於液晶顯示模組之背面。而上述背光模組包含背板、與背板接合的框架結構、導光板及多個發光二極體。框架結構與背板定義出一容置空間以設置導光板,且框架結構包含第一框體以及與第一框體接合之至少一第二框體。第一框體具有面向上述容置空間的第一側面,其中第一框體在第一側面之外的其他表面部分設有多個散熱鰭片。多個發光二極體電性連接地設置在第一框體的第一側面上,且鄰設於導光板的一第二側面。According to another embodiment of the present invention, a liquid crystal display device is provided. The liquid crystal display device comprises a liquid crystal display module and a backlight module, wherein the backlight module is disposed on the back of the liquid crystal display module. The backlight module includes a back plate, a frame structure joined to the back plate, a light guide plate, and a plurality of light emitting diodes. The frame structure and the backboard define an accommodating space for arranging the light guide plate, and the frame structure comprises a first frame body and at least one second frame body joined to the first frame body. The first frame body has a first side surface facing the accommodating space, wherein the first frame body is provided with a plurality of heat dissipation fins on other surface portions other than the first side surface. The plurality of light emitting diodes are electrically connected to the first side of the first frame and adjacent to a second side of the light guide plate.

本發明之優點為,透過將發光二極體直接接合在框架結構之設計,除可達到簡化組裝程序的目的,進而提高生產效率之外,更可減少背光模組元件的數量,減少材料成本之支出。另外,由於框架結構與背光模組外部之空氣接觸,將發光二極體直接接合在框架結構上具有散熱快的功效。再者,相較於一般設計之燈條固定座,將發光二極體設置在具有散熱鰭片的框體上,可具有較好的抗扭曲強度。The invention has the advantages that, by directly bonding the LEDs to the frame structure, in addition to simplifying the assembly process and improving the production efficiency, the number of backlight module components can be reduced, and the material cost can be reduced. expenditure. In addition, since the frame structure is in contact with the air outside the backlight module, the light-emitting diode is directly bonded to the frame structure to have a fast heat dissipation effect. Furthermore, compared with the generally designed light strip fixing seat, the light emitting diode is disposed on the frame body with the heat dissipating fins, and has better anti-twisting strength.

請參照第1圖,其係繪示根據本發明之一實施例之液晶顯示裝置的側視圖。在本實施例中,液晶顯示裝置100係由液晶顯示模組200與具有散熱結構之背光模組300組合而成。背光模組300係一側光式(Edge Lighting)背光模組,且背光模組300係相對於液晶顯示模組200設置,亦即液晶顯示模組200係設置於背光模組300之上。Referring to FIG. 1, there is shown a side view of a liquid crystal display device according to an embodiment of the present invention. In the present embodiment, the liquid crystal display device 100 is composed of a liquid crystal display module 200 and a backlight module 300 having a heat dissipation structure. The backlight module 300 is an edge lighting backlight module, and the backlight module 300 is disposed relative to the liquid crystal display module 200, that is, the liquid crystal display module 200 is disposed on the backlight module 300.

請參照第2A及2B圖,其中第2A圖係繪示第1圖中之背光模組的俯視示意圖,第2B圖係繪示沿著第2A圖中剖面線AA’剖切的剖面示意圖。背光模組300包含背板302(如第2B圖所示)、框架結構304、導光板306及多個發光二極體308,其中框架結構304係與背板302互相接合。在本實施例中,框架結構304包含第一框體304a以及至少一第二框體304b,其中第二框體304b與第一框體304a接合,形成如第2A圖所示之矩形結構。2A and 2B, wherein FIG. 2A is a schematic plan view of the backlight module in FIG. 1 and FIG. 2B is a cross-sectional view taken along line AA' in FIG. 2A. The backlight module 300 includes a back plate 302 (shown in FIG. 2B), a frame structure 304, a light guide plate 306, and a plurality of light emitting diodes 308, wherein the frame structure 304 and the back plate 302 are joined to each other. In the present embodiment, the frame structure 304 includes a first frame 304a and at least a second frame 304b, wherein the second frame 304b is joined to the first frame 304a to form a rectangular structure as shown in FIG. 2A.

在第2A及2B圖所示之實施例中,第二框體304b係由三個次框體304ba、304bb及304bc(如第2A圖所示)組合而成。上述組成第二框體304b的三個次框體304ba、304bb及304bc係與第一框體304a依序接合,且每個次框體304ba、304bb及304bc具有與第一框體304a實質相同之剖面結構(如第2B圖所示)。然而,組成背光模組第二框體304b之次框體的數量與幾何形狀並不以本實施例之三個為限,其數量與形狀可根據背光模組的幾何形狀加以調整。在特定之實施例中,第二框體亦可為一體成型框體,其並不以第2A及2B圖所示之結構為限,亦即不限於由三個次框體304ba、304bb及304bc組合形成第二框體304b。此外,在特定之實施例中,形成第二框體之次框體之剖面結構係與第一框體之剖面結構不同。In the embodiment shown in Figures 2A and 2B, the second frame 304b is composed of three sub-frames 304ba, 304bb and 304bc (as shown in Figure 2A). The three sub-frames 304ba, 304bb, and 304bc constituting the second frame 304b are sequentially joined to the first frame 304a, and each of the sub-frames 304ba, 304bb, and 304bc has substantially the same as the first frame 304a. Profile structure (as shown in Figure 2B). However, the number and geometry of the sub-frames constituting the second frame 304b of the backlight module are not limited to the three of the embodiments, and the number and shape thereof can be adjusted according to the geometry of the backlight module. In a specific embodiment, the second frame may also be an integrally formed frame, which is not limited to the structure shown in FIGS. 2A and 2B, that is, not limited to three sub-frames 304ba, 304bb, and 304bc. The second frame body 304b is combined to form. Moreover, in a particular embodiment, the cross-sectional structure of the secondary frame forming the second frame is different from the cross-sectional structure of the first frame.

在第2A及2B圖所示之實施例中,矩形之框架結構304接合在背板302上,與背板302定義出容置空間310(如第2B圖所示),其中容置空間310之主要功能係用來設置導光板306。In the embodiment shown in FIGS. 2A and 2B, the rectangular frame structure 304 is bonded to the backing plate 302, and the backing plate 302 defines an accommodating space 310 (as shown in FIG. 2B), wherein the accommodating space 310 is The main function is to set the light guide plate 306.

第一框體304a具有面向容置空間310的側面304c,用以設置多個發光二極體308,使得多個發光二極體308鄰設在導光板306的側面306a(如第2B圖所示)。導光板306的側面306a亦即入射面,多個發光二極體308產生的光由側面306a進入導光板306中,經過多次的擴散後,經由出光面306b(如第2B圖所示)射出。在將多個發光二極體308設置於第一框體304a的側面304c之前,通常需將多個發光二極體308電性連接,使其成為一發光二極體燈條。The first frame body 304a has a side surface 304c facing the accommodating space 310 for arranging a plurality of light emitting diodes 308 such that the plurality of light emitting diodes 308 are disposed adjacent to the side surface 306a of the light guide plate 306 (as shown in FIG. 2B). ). The side surface 306a of the light guide plate 306 is also the incident surface, and the light generated by the plurality of light-emitting diodes 308 enters the light guide plate 306 from the side surface 306a. After being diffused a plurality of times, the light is emitted through the light-emitting surface 306b (as shown in FIG. 2B). . Before the plurality of light-emitting diodes 308 are disposed on the side surface 304c of the first frame body 304a, the plurality of light-emitting diodes 308 are usually electrically connected to form a light-emitting diode light bar.

為了將多個發光二極體308所產生的廢熱排除,第一框體304a在相對於第一側面304c的表面部分設有散熱鰭片304d。散熱鰭片304d的設置位置並不以本實施例為限,在第一框體304a中,除了第一側面304c需保留,以做為設置發光二極體308之用,第一框體304a其餘之表面均可設置散熱鰭片304d。此外,散熱鰭片304d的數量可以根據多個發光二極體308所產生之廢熱的多寡加以調整。In order to exclude waste heat generated by the plurality of light emitting diodes 308, the first frame body 304a is provided with heat radiating fins 304d at a surface portion with respect to the first side surface 304c. The arrangement position of the heat dissipating fins 304d is not limited to the embodiment. In the first frame body 304a, in addition to the first side surface 304c, it is required to be used as the light emitting diode 308, and the first frame body 304a remains. Heat sink fins 304d may be disposed on the surface. In addition, the number of heat dissipation fins 304d can be adjusted according to the amount of waste heat generated by the plurality of light emitting diodes 308.

由於多個發光二極體308係直接接合在第一框體304a的第一側面304c上,且散熱鰭片304d位在相對於第一側面304c之第一框體304a的表面上,故多個發光二極體308產生之廢熱傳導至散熱鰭片304d後,可藉由外面開放空間之冷空氣將廢熱帶走,達到快速散熱的功效。Since the plurality of light emitting diodes 308 are directly bonded to the first side surface 304c of the first frame body 304a, and the heat dissipation fins 304d are located on the surface of the first frame body 304a relative to the first side surface 304c, After the waste heat generated by the light-emitting diode 308 is transmitted to the heat-dissipating fins 304d, the waste air can be removed by the cold air in the open space to achieve rapid heat dissipation.

此外,如第2A圖所示,在本實施例中,第二框體304b之次框體304bb面向導光板306的側面上亦設置有多個發光二極體308,藉此增加背光模組300整體的亮度值。在特定之實施例中,當背光模組300的亮度需求較低時,亦可僅於第一框體304a之側面304c設置多個發光二極體308即可。而為了移除設置在次框體304bb上之多個發光二極體308產生的廢熱,故在次框體304bb上亦設置有如第2B圖所示之散熱鰭片304d。In addition, as shown in FIG. 2A, in the embodiment, the second frame 304b of the second frame 304b is also provided with a plurality of light emitting diodes 308 on the side of the light guide plate 306, thereby adding the backlight module 300. The overall brightness value. In a specific embodiment, when the brightness requirement of the backlight module 300 is low, the plurality of light emitting diodes 308 may be disposed only on the side surface 304c of the first frame 304a. In order to remove the waste heat generated by the plurality of light-emitting diodes 308 disposed on the sub-frame 304bb, the heat-dissipating fins 304d as shown in FIG. 2B are also disposed on the sub-frame 304bb.

請再參照第2B圖。框架結構304之第一框體304a與第二框體304b以及背板302上均包含有螺孔314,其中框架結構304與背板302係藉由螺絲312與前述之螺孔314之搭配而互相接合。框架結構304與背板302除利用上述螺絲312與螺孔314互相接合之外,更可利用其他接合結構(例如卡固結構、黏膠或上述之組合)互相接合。由於框架結構與背板之接合結構屬於此技術領域常用之技術特徵,故不再詳細說明。Please refer to Figure 2B again. The first frame 304a and the second frame 304b of the frame structure 304 and the back plate 302 respectively include a screw hole 314. The frame structure 304 and the back plate 302 are mutually matched by the screw 312 and the screw hole 314. Engage. The frame structure 304 and the back plate 302 can be joined to each other by other engaging structures (for example, a fastening structure, an adhesive, or a combination thereof) in addition to the above-mentioned screws 312 and the screw holes 314. Since the joint structure of the frame structure and the back plate belongs to the technical features commonly used in the technical field, it will not be described in detail.

另外,在本實施例中,第一框體304a係一體成型框體。此一設計的優點在於,發光二極體308產生之廢熱不需經由習知之燈條固定座即可傳遞至散熱鰭片304d,因此可增加散熱的效率。在特定之實施例中,一體成型之第一框體304a係一鋁擠型框體。為了提供散熱之功效,第一框體304a係以具有良好的熱傳導特性之材料加以製造。而在特定之實施例中,第一框體304a的材料為金屬材料,例如以上所述之鋁。Further, in the present embodiment, the first frame body 304a is integrally formed with the frame body. The advantage of this design is that the waste heat generated by the LED 308 can be transmitted to the heat dissipation fins 304d without passing through the conventional light bar holder, thereby increasing the efficiency of heat dissipation. In a particular embodiment, the integrally formed first frame 304a is an aluminum extruded frame. In order to provide heat dissipation, the first frame 304a is fabricated from a material having good heat transfer characteristics. In a particular embodiment, the material of the first frame 304a is a metallic material, such as the aluminum described above.

此外,相較於一般將發光二極體接合在平板狀的燈條固定座上,將發光二極體308接合在一體成型且具有散熱鰭片的第一框體304a上,可具有較好的抗扭曲強度。In addition, the light-emitting diode 308 is bonded to the first frame body 304a having the heat-dissipating fins, and the light-emitting diode 308 is preferably bonded to the flat-shaped light-strip fixing base. Resistance to twisting.

請參照第4圖,其係繪示根據本發明之另一實施例之背光模組的剖面示意圖。在本實施例中,背光模組500之結構係類似於第2B圖所示之結構,故其中類似之結構或元件、及類似之結構或元件之間的關係即不再加以敘述。以下以僅就背光模組500與第2B圖所示之背光模組300之間差異加以說明。在背光模組300中,矩形之框架結構304的第一框體304a及第二框體304b係位在背板302上,以螺絲312將框架結構304接合在背板302上,藉此定義出如第2B圖所示容置空間310。而在第4圖所示之背光模組500中,分別與背光模組300之第一框體304a及第二框體304b對應之第一框體504a及第二框體504b係延伸至背板502的底面,亦即背板502位在第一框體504a及第二框體504b上,並藉由螺絲312將背板502、第一框體504a及第二框體504b互相接合。Please refer to FIG. 4, which is a cross-sectional view of a backlight module according to another embodiment of the present invention. In the present embodiment, the structure of the backlight module 500 is similar to that shown in FIG. 2B, and thus the relationship between similar structures or elements, and similar structures or elements will not be described. Hereinafter, only the difference between the backlight module 500 and the backlight module 300 shown in FIG. 2B will be described. In the backlight module 300, the first frame 304a and the second frame 304b of the rectangular frame structure 304 are fastened on the back plate 302, and the frame structure 304 is joined to the back plate 302 by screws 312, thereby defining The space 310 is accommodated as shown in FIG. 2B. In the backlight module 500 shown in FIG. 4, the first frame 504a and the second frame 504b corresponding to the first frame 304a and the second frame 304b of the backlight module 300 respectively extend to the back plate. The bottom surface of the 502, that is, the back plate 502 is positioned on the first frame 504a and the second frame 504b, and the back plate 502, the first frame 504a and the second frame 504b are joined to each other by screws 312.

在特定之實施例中,導光板係利用例如射出成型的方式來製成平板形結構或楔形板結構,其材質例如為光硬化型樹脂、丙烯或聚甲基丙烯酸甲脂(PMMA)。In a specific embodiment, the light guide plate is formed into a flat plate structure or a wedge plate structure by, for example, injection molding, and the material thereof is, for example, a photocurable resin, acryl or polymethyl methacrylate (PMMA).

此外,在特定之實施例中,背光模組300更包含至少一光學膜片(未繪示),且此光學膜片係設置在上述之導光板之上,此光學膜片可為擴散片、稜鏡片、增亮膜(Brightness Enhancement Film;BEF)、反射式增亮膜(Dual Brightness Enhancement Film;DBEF)、非多層膜式反射偏光片(Diffused Reflective Polarizer Film;DRPF)或上述之任意組合。In addition, in a specific embodiment, the backlight module 300 further includes at least one optical film (not shown), and the optical film is disposed on the light guide plate, and the optical film may be a diffusion sheet. A film, a brightness enhancement film (BEF), a dual brightness enhancement film (DBEF), a non-multilayer film reflective polarizer (DRPF), or any combination thereof.

雖然本發明已以實施方式揭露如上,然其並非用以限定本發明,任何熟習此技藝者,在不脫離本發明之精神和範圍內,當可作各種之更動與潤飾,因此本發明之保護範圍當視後附之申請專利範圍所界定者為準。Although the present invention has been disclosed in the above embodiments, it is not intended to limit the present invention, and the present invention can be modified and modified without departing from the spirit and scope of the present invention. The scope is subject to the definition of the scope of the patent application attached.

100...液晶顯示裝置100. . . Liquid crystal display device

200...液晶顯示模組200. . . Liquid crystal display module

300...背光模組300. . . Backlight module

302...背板302. . . Backplane

304...框架結構304. . . Framework

304a...第一框體304a. . . First frame

304b...第二框體304b. . . Second frame

304ba...次框體304ba. . . Secondary frame

304bb...次框體304bb. . . Secondary frame

304bc...次框體304bc. . . Secondary frame

304c...側面304c. . . side

304d...散熱鰭片304d. . . Heat sink fin

306...導光板306. . . Light guide

306a...側面306a. . . side

306b...出光面306b. . . Glossy surface

308...發光二極體308. . . Light-emitting diode

310...容置空間310. . . Housing space

312...螺絲312. . . Screw

314...螺孔314. . . Screw hole

402...背板402. . . Backplane

404...燈條404. . . Light

404a...發光二極體404a. . . Light-emitting diode

404b...印刷電路板404b. . . A printed circuit board

406...燈條固定座406. . . Light bar mount

408...散熱鰭片408. . . Heat sink fin

410...螺絲410. . . Screw

412...螺孔412. . . Screw hole

414...導熱材414. . . Heat conductive material

416...導熱材416. . . Heat conductive material

500...背光模組500. . . Backlight module

502...背板502. . . Backplane

504a...第一框體504a. . . First frame

504b...第二框體504b. . . Second frame

504c...側面504c. . . side

AA’...剖面線AA’. . . Section line

為了能夠對本發明之觀點有較佳之理解,請參照上述之詳細說明並配合相應之圖式。要強調的是,根據工業之標準常規,附圖中之各種特徵並未依比例繪示。事實上,為清楚說明上述實施例,可任意地放大或縮小各種特徵之尺寸。相關圖式內容說明如下。For a better understanding of the present invention, reference is made to the above detailed description and the accompanying drawings. It is emphasized that, in accordance with the standard of the industry, the various features in the drawings are not to scale. In fact, the dimensions of the various features may be arbitrarily enlarged or reduced in order to clearly illustrate the above embodiments. The relevant schema description is as follows.

第1圖係繪示根據本發明之一實施例之液晶顯示裝置的側視圖。Fig. 1 is a side view showing a liquid crystal display device according to an embodiment of the present invention.

第2A圖係繪示第1圖中之背光模組的俯視示意圖。FIG. 2A is a schematic plan view showing the backlight module in FIG. 1 .

第2B圖係繪示沿著第2A圖中剖面線AA’剖切的剖面示意圖。Fig. 2B is a schematic cross-sectional view taken along line AA' of Fig. 2A.

第3圖係繪示一習知之背光模組部分元件的剖面示意圖。FIG. 3 is a cross-sectional view showing a part of a conventional backlight module.

第4圖係繪示根據本發明之另一實施例之背光模組的剖面示意圖。4 is a cross-sectional view showing a backlight module according to another embodiment of the present invention.

300...背光模組300. . . Backlight module

302...背板302. . . Backplane

304a...第一框體304a. . . First frame

304b...第二框體304b. . . Second frame

304bb...次框體304bb. . . Secondary frame

304c...側面304c. . . side

304d...散熱鰭片304d. . . Heat sink fin

306...導光板306. . . Light guide

306a...側面306a. . . side

306b...出光面306b. . . Glossy surface

308...發光二極體308. . . Light-emitting diode

310...容置空間310. . . Housing space

312...螺絲312. . . Screw

314...螺孔314. . . Screw hole

Claims (10)

一種背光模組,包含:一背板;一框架結構,與該背板接合,其中該框架結構與該背板定義出一容置空間,且該框架結構包含:一第一框體,具有面向該容置空間之一第一側面,其中該第一框體在該第一側面之外的其他表面部分設有複數個散熱鰭片;以及至少一第二框體,與該第一框體接合;一導光板,設置在該容置空間中;以及複數個發光二極體,電性連接地設置在該第一框體之該第一側面上,其中該些發光二極體係鄰設於該導光板的一第二側面,其中該些發光二極體直接接合該第一框體之該第一側面。 A backlight module includes: a back plate; a frame structure engaged with the back plate, wherein the frame structure and the back plate define an accommodating space, and the frame structure comprises: a first frame having a face a first side of the accommodating space, wherein the first frame body is provided with a plurality of heat dissipating fins on other surface portions other than the first side surface; and at least one second frame body is engaged with the first frame body a light guide plate disposed in the accommodating space; and a plurality of light emitting diodes electrically connected to the first side of the first frame body, wherein the light emitting diode systems are adjacent to the light emitting diode a second side of the light guide plate, wherein the light emitting diodes directly engage the first side of the first frame. 如請求項1所述之背光模組,其中該第一框體之材料為金屬材料。 The backlight module of claim 1, wherein the material of the first frame is a metal material. 如請求項1所述之背光模組,其中該第一框體係一體成型框體。 The backlight module of claim 1, wherein the first frame system integrally forms a frame. 如請求項3所述之背光模組,其中該第一框體係一鋁擠型框體。 The backlight module of claim 3, wherein the first frame system is an aluminum extruded frame. 如請求項1所述之背光模組,其中該第二框體係由三次框體所組成,該些次框體與該第一框體依序接合。 The backlight module of claim 1, wherein the second frame system is composed of three frames, and the second frames are sequentially engaged with the first frame. 如請求項1所述之背光模組,其中該框架結構之該第一框體、第二框體以及該背板均更包含一接合結構,該接合結構係選自於由螺絲、螺孔、卡固結構、黏膠與上述之組合所組成之一群組。 The backlight module of claim 1, wherein the first frame body, the second frame body and the back plate of the frame structure further comprise an engaging structure selected from the group consisting of a screw and a screw hole. A combination of a carding structure, a glue, and a combination of the above. 一種液晶顯示裝置,包含:一液晶顯示模組;以及一種背光模組,設於該液晶顯示模組之背面,包含:一背板;一框架結構,與該背板接合,其中該框架結構與該背板定義出一容置空間,且該框架結構包含:一第一框體,具有面向該容置空間之一第一側面,其中該第一框體在該第一側面之外的其他表面部分設有複數個散熱鰭片;以及至少一第二框體,與該第一框體接合;一導光板,設置在該容置空間中;以及複數個發光二極體,電性連接地設置在該第一框體之該第一側面上,其中該些發光二極體係鄰設於該導光板的一第二側面,其中該些發光二極體直接接合該第一框體之該第一側面。 A liquid crystal display device comprising: a liquid crystal display module; and a backlight module disposed on the back of the liquid crystal display module, comprising: a back plate; a frame structure engaged with the back plate, wherein the frame structure and The backplane defines an accommodating space, and the frame structure comprises: a first frame having a first side facing the accommodating space, wherein the first frame is outside the first side The portion is provided with a plurality of heat dissipation fins; and at least one second frame body is engaged with the first frame body; a light guide plate is disposed in the accommodating space; and a plurality of light emitting diodes are electrically connected On the first side of the first frame, the light emitting diodes are disposed adjacent to a second side of the light guide plate, wherein the light emitting diodes directly engage the first side of the first frame side. 如請求項7所述之液晶顯示裝置,其中該背光模組之該第一框體的材料為金屬材料。 The liquid crystal display device of claim 7, wherein the material of the first frame of the backlight module is a metal material. 如請求項7所述之液晶顯示裝置,其中該背光模組之該第一框體係一體成型框體,且該第一框體為一鋁擠型框體。 The liquid crystal display device of claim 7, wherein the first frame system of the backlight module integrally forms a frame, and the first frame is an aluminum extruded frame. 如請求項7所述之液晶顯示裝置,其中該背光模組之該第二框體係由三次框體所組成,該些次框體與該第一框體依序接合。 The liquid crystal display device of claim 7, wherein the second frame system of the backlight module is composed of a tertiary frame, and the secondary frames are sequentially engaged with the first frame.
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