201126240 六、發明說明： 【發明所屬之技術領域】 本發明是有關於一種背光模組及其應用，且特別是有 關於具有散熱結構之背光模組及其在液晶顯示裝置上的應 用0 【先前技術】 液晶顯示器目前正朝著薄型化發展，藉此提高空間利 • 用率。同時，隨著地球天然能源漸漸枯竭，液晶顯示器亦 朝著強調節能的方向作設計。在液晶顯示器中，背光模組 為主要的耗能元件之一。而為了達到節能的效果，目前有 越來越多的背光模組之光源改採發光二極體（Light Emitting Diode ; LED)來取代傳統的冷陰極燈管（c〇ld Cathode Fluorescent Lamp ; CCFL)。發光二極體除 了能夠 達到節能的效果之外’同時亦可兼顧薄型化之需求。此外， 相較於冷陰極燈管，發光二極體另一優點在於其不包含容 # 易對環境造成長久性污染的汞成分。 請參照第3圖’在一般採用發光二極體作為發光源之 背光模組中，背光模組包含背板402、框架結構（未繪示）、 導光板(未繪示）、包含多個發光二極體4〇4a的燈條(Light Bar)404以及燈條固定座4〇6。背光模組中的發光二極體 4〇4a先焊接至印刷電路板(printed Circuit B〇ard; pCB)綱匕 上形成燈條404。接著將燈條4〇4接合在燈條固定座4〇6 -上。完成上述步驟後，將燈條固定座406藉由螺絲41〇與 累孔412接合至散熱鰭片408上。接著，同樣藉著螺絲 201126240 與螺孔412將散熱鰭片408接合至背板402上，使得多個 發光二極體404a鄰接於導光板的入射面。最後，將框架結 構與背板402接合完成背光模組的組裝。在上述背光模組 中，框架結構一般係由多個框體（未繪示）組合而成，而在 背光模組的組裝過程中，一般係將部分之框體先接合在背 板上，藉此來容置上述之其他元件，而最後一框體接合至 背板上即完成背光模組的組裝。 在一般的設計中，散熱鰭片408的設置係為了滿足發 光二極體404a的散熱需求。為了強化燈條404的散熱能 ® 力，燈條404與燈條固定座406之間，以及燈條固定座406 與散熱鰭片408之間通常會加入導熱材414與416，其中 導熱材414與416更可充當黏著劑，將二元件更牢固地接 合在一起。此外，同樣為了強化燈條的散熱能力，燈條固 定座406、散熱鰭片408及背板402通常均以金屬材質製 造。 然而，上述傳統設計之背光模組的缺點是組裝程序繁 複。 【發明内容】 因此，本發明之目的係在提供一種背光模組及應用此 背光模組之液晶顯示裝置，其中背光模組具有散熱結構， 且其設計可降低結構複雜度，藉此達到簡化組裝程序之目 的。 根據本發明之一實施例，提供一種背光模組。此具有 散熱結構之背光模組包含背板、與背板接合的框架結構、 201126240 導光板及多個發光二極體。框架結構與背板定義出一容置 空間以設置導光板’且框架結構包含第一框體以及與第一 框體接合之至少一第二框體。第一樞體具有面向上述容置 空間的第一側面’其中第一框體在第一侧面之外的其他表 面部分設有多個散熱鰭片。多個發光二極體電性連接地設 置在第一框體的第側面上’且鄰設於導光板的一第二側 面。 根據本發明之另一實施例，提供一種液晶顯示裝置。 此液晶顯示裝置包含液晶顯示模組及背光模組，其中背光 模組設於液晶顯示模組之背面。而上述背光模組包含背 板、與背板接合的框架結構、導光板及多個發光二極體。 框架結構與背板定義出一容置空間以設置導光板，且框架 結構包含第一框體以及與第一框體接合之至少一第二框 體。第一框體具有面向上述容置空間的第一側面，苴中第 -框體在第-側面之外的其他表面部分設有多個散熱鰭 片。多個發光二極體電性連接地設置在第一框體的第 面上，且鄰設於導光板的一第二側面。 本發明之優點為，透過將發光二極體直接接合在 結構之設計，除可達到簡化組裝程序的目的，進而提高生' 產效率之外’更可減少背光模組元件的數量，減少材g 本之支出。另外’由於框架結構與背光模組外部之空氣接 觸’將發光二極體直接接合在框架結構上具有散熱$的功 效。再者’相較於一般設計之燈條固定座，將發光^極體 設置在具有散熱鰭片的框體上’可具有較好的抗扭曲強度： [si 6 201126240 【實施方式】 請參照第1圖，其係繪示根據本發明之一實施例之液 晶顯示裝置的侧視圖。在本實施例中，液晶顯示裝置100 係由液晶顯示模組200與具有散熱結構之背光模組300組 合而成。背光模組300係一側光式(Edge Lighting)背光模 組，且背光模組300係相對於液晶顯示模組200設置，亦 即液晶顯示模組200係設置於背光模組300之上。 請參照第2A及2B圖，其中第2A圖係繪示第1圖中 之背光模組的俯視示意圖，第2B圖係繪示沿著第2A圖中 剖面線AA’剖切的剖面示意圖。背光模組300包含背板 302(如第2B圖所示）、框架結構304、導光板306及多個發 光二極體308 ’其中框架結構304係與背板302互相接合。 在本實施例中，框架結構304包含第一框體304a以及至少 一第二框體304b，其中第二框體304b與第一框體304a接 合，形成如第2A圖所示之矩形結構。 在第2A及2B圖所示之實施例中，第二框體3〇4b係 由三個次框體304ba、304bb及304bc(如第2A圖所示）組合 而成。上述組成第二框體304b的三個次框體304ba、304bb 及304bc係與第一框體304a依序接合，且每個次框體 304ba、304bb及304bc具有與第一框體3〇4a實質相同之剖 面結構（如第2B圖所示）。然而，組成背光模組第二框體 304b之次框體的數量與幾何形狀並不以本實施例之三個為 限，其數量與形狀可根據背光模組的幾何形狀加以調整。 在特定之實施例中，第二框體亦可為一體成型框體，其並 不以第2A及2B圖所示之結構為限，亦即不限於由三個次 201126240 框體304ba、304bb及304bc組合形成第二樞體3〇4b。此外， 在特定之實施例中，形成第二框體之次框體之剖面結構係 與第一框體之剖面結構不同。 在第2A及2B圖所示之實施例中，矩形之框 接合在背板302上，與背板302定義出容置空間^〇(如第 2B圖所示），其中容置空間31〇之主要功能;用來設置導 光板30卜 第-框體304a具有面向容置空間31〇的側面3〇4c，用 以設置多個發光二極體308，使得多個發光二極體3〇8鄰 設在導光板306的側面306a(如第2B圖所示）。導光板3〇6 的侧面306a亦即入射面，多個發光二極體3〇8產生的光由 側面306a進入導光板306中，經過多次的擴散後，經由出 光面306b(如第2B圖所示）射出。在將多個發光二極體3〇8 設置於第一框體304a的側面304c之前，通常需將多個發 光二極體308電性連接，使其成為一發光二極體燈條。 為了將多個發光二極體308所產生的廢熱排除，第一 框體304a在相對於第一側面304c的表面部分設有散熱鰭 片304d。散熱鰭片304d的設置位置並不以本實施例為限， 在第一框體304a中’除了第一側面304c需保留，以做為 設置發光一極體308之用’第一框體304a其餘之表面均可 設置散熱鰭片304d。此外’散熱鰭片304d的數量可以根 據多個發光二極體308所產生之廢熱的多寡加以調整。 由於多個發光二極體308係直接接合在第一框體304a 的第一侧面304c上，且散熱鰭片304d位在相對於第一側 面304c之第一框體304a的表面上，故多個發光二極體308 201126240 產生之廢熱傳導至散熱鰭片304d後，可藉由外面開放空間 之冷空氣將廢熱帶走，達到快速散熱的功效。 此外，如第2A圖所示，在本實施例中，第二框體304b 之次框體304bb面向導光板306的側面上亦設置有多個發 光二極體308，藉此增加背光模組300整體的亮度値。在 特定之實施例中，當背光模組300的亮度需求較低時，亦 可僅於第一框體304a之側面304c設置多個發光二極體308 即可。而為了移除設置在次框體304bb上之多個發光二極 體308產生的廢熱，故在次框體304bb上亦設置有如第2B 圖所示之散熱鰭片304d。 請再參照第2B圖。框架結構304之第一框體304a與 第二框體304b以及背板302上均包含有螺孔314，其中框 架結構304與背板302係藉由螺絲312與前述之螺孔314 之搭配而互相接合。框架結構304與背板302除利用上述 螺絲312與螺孔314互相接合之外，更可利用其他接合結 構（例如卡固結構、黏膠或上述之組合）互相接合。由於框 架結構與背板之接合結構屬於此技術領域常用之技術特 徵，故不再詳細說明。 另外，在本實施例中，第一框體304a係一體成型框 體。此一設計的優點在於，發光二極體308產生之廢熱不 需經由習知之燈條固定座即可傳遞至散熱鰭片304d，因此 可增加散熱的效率。在特定之實施例中，一體成型之第一 框體304a係一鋁擠型框體。為了提供散熱之功效，第一框 體304a係以具有良好的熱傳導特性之材料加以製造。而在 特定之實施例中，第一框體304a的材料為金屬材料，例如 201126240 以上所述之I呂。 此外，相較於一般將發光二極體接合在平板狀的燈條 固定座上，將發光二極體308接合在一體成型且具有散熱 鰭片的第一框體304a上，可具有較好的抗扭曲強度。 请參照第4圖，其係繪示根據本發明之另一實施例之 背光模組的剖面示意圖。在本實施例中，背光模組5〇〇之 結構係類似於第2B圖所示之結構，故其中類似之結構或元 件、及類似之結構或元件之間的關係即不再加以敘述。以 φ 下以僅就背光模組與第2B圖所示之背光模組3〇〇之間 差異加以說明。在背光模組300中，矩形之框架結構304 的第一框體304a及第二框體304b係位在背板302上，以 螺絲312將框架結構304接合在背板302上，藉此定義出 如第2B圖所示容置空間31 〇。而在第4圖所示之背光模組 5〇〇中’分別與背光模組300之第一框體304a及第二框體 3〇4b對應之第一框體504a及第二框體504b係延伸至背板 502的底面’亦即背板502位在第一框體504a及第二框體 50扑上’並藉由螺絲312將背板502、第一框體504a及第 二框體504b互相接合。 在特定之實施例中，導光板係利用例如射出成型的方 式來製成平板形結構或楔形板結構，其材質例如為光硬化 型樹脂、丙烯或聚甲基丙烯酸甲脂(PMMA)。 此外，在特定之實施例中，背光模組300更包含至少 一光學膜片（未繪示），且此光學膜片係設置在上述之導光 板之上，此光學膜片可為擴散片、稜鏡片、增亮膜 (Brightness Enhancement Film ; BEF)、反射式增亮膜(Dual 201126240201126240 VI. Description of the Invention: [Technical Field] The present invention relates to a backlight module and an application thereof, and particularly to a backlight module having a heat dissipation structure and an application thereof to a liquid crystal display device. Technology] Liquid crystal displays are currently being thinned to increase space utilization. At the same time, as the earth's natural energy is gradually depleted, liquid crystal displays are also designed to emphasize energy conservation. In liquid crystal displays, the backlight module is one of the main energy consuming components. In order to achieve energy-saving effects, more and more backlight modules have been replaced by Light Emitting Diodes (LEDs) to replace traditional cold cathode lamps (CCFLs). . In addition to the ability to achieve energy savings, the LEDs can also be used for thinning. In addition, another advantage of the light-emitting diode compared to a cold cathode lamp is that it does not contain a mercury component that is susceptible to long-term environmental pollution. Referring to FIG. 3, in a backlight module generally using a light-emitting diode as a light source, the backlight module includes a back plate 402, a frame structure (not shown), a light guide plate (not shown), and a plurality of light-emitting layers. The light bar 404 of the diode 4〇4a and the light bar fixing seat 4〇6. The light-emitting diodes 4〇4a in the backlight module are soldered to a printed circuit board (pCB) to form a light bar 404. The light bar 4〇4 is then joined to the light bar holder 4〇6-. After the above steps are completed, the light bar holder 406 is joined to the heat dissipation fin 408 by the screw 41 〇 and the hole 412. Next, the heat dissipation fins 408 are also bonded to the backing plate 402 by screws 201126240 and the screw holes 412, so that the plurality of light emitting diodes 404a are adjacent to the incident surface of the light guide plate. Finally, the frame structure is bonded to the backplane 402 to complete the assembly of the backlight module. In the above backlight module, the frame structure is generally composed of a plurality of frames (not shown). In the assembly process of the backlight module, a part of the frame body is first joined to the back plate. The other components described above are accommodated, and the assembly of the backlight module is completed by bonding the last frame to the backplane. In a typical design, the heat sink fins 408 are arranged to meet the heat dissipation requirements of the light emitting diode 404a. In order to enhance the heat dissipation energy of the light bar 404, between the light bar 404 and the light bar mount 406, and between the light strip mount 406 and the heat sink fin 408, heat conductive materials 414 and 416 are usually added, wherein the heat conductive material 414 and The 416 acts as an adhesive to bond the two components together more firmly. In addition, in order to enhance the heat dissipation capability of the light bar, the light bar fixing seat 406, the heat dissipation fin 408 and the back plate 402 are generally made of a metal material. However, the conventional design of the backlight module has the disadvantage that the assembly procedure is complicated. SUMMARY OF THE INVENTION Accordingly, an object of the present invention is to provide a backlight module and a liquid crystal display device using the same, wherein the backlight module has a heat dissipation structure, and the design thereof can reduce structural complexity, thereby simplifying assembly. The purpose of the program. According to an embodiment of the invention, a backlight module is provided. The backlight module with a heat dissipation structure includes a back plate, a frame structure joined to the back plate, a 201126240 light guide plate, and a plurality of light emitting diodes. The frame structure and the backboard define an accommodating space for arranging the light guide plate ‘ and the frame structure comprises a first frame body and at least one second frame body joined to the first frame body. The first pivot body has a first side surface facing the accommodating space, wherein the other surface portions of the first frame body other than the first side surface are provided with a plurality of heat dissipating fins. The plurality of light emitting diodes are electrically connected to the first side of the first frame and adjacent to a second side of the light guide plate. According to another embodiment of the present invention, a liquid crystal display device is provided. The liquid crystal display device comprises a liquid crystal display module and a backlight module, wherein the backlight module is disposed on the back of the liquid crystal display module. The backlight module includes a back plate, a frame structure joined to the back plate, a light guide plate, and a plurality of light emitting diodes. The frame structure and the backboard define an accommodating space for arranging the light guide plate, and the frame structure comprises a first frame body and at least one second frame body joined to the first frame body. The first frame body has a first side surface facing the accommodating space, and the other surface portion of the first frame body other than the first side surface is provided with a plurality of heat dissipating fins. The plurality of light emitting diodes are electrically connected to the first surface of the first frame and adjacent to a second side of the light guide plate. The invention has the advantages that, by directly bonding the LEDs to the structure design, in addition to simplifying the assembly process, thereby improving the productivity, the number of backlight module components can be reduced, and the material g can be reduced. The expenditure of this. In addition, since the frame structure is in contact with the air outside the backlight module, the light-emitting diode is directly bonded to the frame structure to have the effect of dissipating heat. Furthermore, 'the light-emitting body can be placed on the frame with the heat-dissipating fins', which has better resistance to twisting compared with the conventionally designed light-strip holder: [si 6 201126240 [Embodiment] Please refer to 1 is a side view showing a liquid crystal display device according to an embodiment of the present invention. In the present embodiment, the liquid crystal display device 100 is composed of a liquid crystal display module 200 and a backlight module 300 having a heat dissipation structure. The backlight module 300 is an edge lighting backlight module, and the backlight module 300 is disposed relative to the liquid crystal display module 200, that is, the liquid crystal display module 200 is disposed on the backlight module 300. 2A and 2B, wherein FIG. 2A is a schematic plan view of the backlight module in FIG. 1 and FIG. 2B is a cross-sectional view taken along line AA' in FIG. 2A. The backlight module 300 includes a back plate 302 (as shown in FIG. 2B), a frame structure 304, a light guide plate 306, and a plurality of light-emitting diodes 308', wherein the frame structure 304 and the back plate 302 are joined to each other. In the present embodiment, the frame structure 304 includes a first frame body 304a and at least a second frame body 304b, wherein the second frame body 304b is coupled to the first frame body 304a to form a rectangular structure as shown in FIG. 2A. In the embodiment shown in Figs. 2A and 2B, the second frame 3〇4b is composed of three sub-frames 304ba, 304bb and 304bc (as shown in Fig. 2A). The three sub-frames 304ba, 304bb, and 304bc constituting the second frame 304b are sequentially joined to the first frame 304a, and each of the sub-frames 304ba, 304bb, and 304bc has substantially the same as the first frame 3〇4a. The same cross-sectional structure (as shown in Figure 2B). However, the number and geometry of the sub-frames constituting the second frame 304b of the backlight module are not limited to the three of the embodiment, and the number and shape thereof can be adjusted according to the geometry of the backlight module. In a specific embodiment, the second frame may also be an integrally formed frame, which is not limited to the structure shown in FIGS. 2A and 2B, that is, not limited to three times 201126240 frames 304ba, 304bb and The 304bc combination forms a second pivot 3〇4b. Further, in a specific embodiment, the cross-sectional structure of the secondary frame forming the second frame is different from the cross-sectional structure of the first frame. In the embodiment shown in FIGS. 2A and 2B, the rectangular frame is joined to the back plate 302, and the back plate 302 defines an accommodation space (as shown in FIG. 2B), wherein the accommodation space 31 is The main function is used to set the light guide plate 30. The frame body 304a has a side surface 3〇4c facing the accommodating space 31〇 for arranging a plurality of light emitting diodes 308 such that the plurality of light emitting diodes are adjacent to each other. It is provided on the side surface 306a of the light guide plate 306 (as shown in FIG. 2B). The side surface 306a of the light guide plate 3〇6 is also the incident surface, and the light generated by the plurality of light-emitting diodes 3〇8 enters the light guide plate 306 from the side surface 306a, and after a plurality of diffusions, passes through the light-emitting surface 306b (as shown in FIG. 2B). Shown) shot. Before the plurality of light-emitting diodes 3〇8 are disposed on the side surface 304c of the first frame body 304a, the plurality of light-emitting diodes 308 are usually electrically connected to form a light-emitting diode light bar. In order to exclude the waste heat generated by the plurality of light-emitting diodes 308, the first frame body 304a is provided with a heat radiation fin 304d at a surface portion with respect to the first side surface 304c. The position of the heat dissipating fins 304d is not limited to the embodiment. In the first frame body 304a, the first side surface 304c is reserved for use as the first light body 308. Heat sink fins 304d may be disposed on the surface. Further, the number of heat radiating fins 304d can be adjusted according to the amount of waste heat generated by the plurality of light emitting diodes 308. Since the plurality of light emitting diodes 308 are directly bonded to the first side surface 304c of the first frame body 304a, and the heat dissipation fins 304d are located on the surface of the first frame body 304a relative to the first side surface 304c, After the waste heat generated by the light-emitting diode 308 201126240 is transmitted to the heat-dissipating fins 304d, the waste air can be removed by the cold air in the open space to achieve rapid heat dissipation. In addition, as shown in FIG. 2A, in the embodiment, a plurality of light-emitting diodes 308 are also disposed on the side surface of the light guide plate 306 of the second frame 304b of the second frame 304b, thereby increasing the backlight module 300. The overall brightness is 値. In a specific embodiment, when the brightness requirement of the backlight module 300 is low, the plurality of light emitting diodes 308 may be disposed only on the side surface 304c of the first frame 304a. In order to remove the waste heat generated by the plurality of light-emitting diodes 308 disposed on the sub-frame 304bb, the heat-dissipating fins 304d as shown in FIG. 2B are also disposed on the sub-frame 304bb. Please refer to Figure 2B again. The first frame body 304a and the second frame body 304b of the frame structure 304 and the back plate 302 respectively include a screw hole 314. The frame structure 304 and the back plate 302 are mutually coupled by the screw 312 and the screw hole 314. Engage. The frame structure 304 and the backing plate 302 can be joined to each other by other engaging structures (e.g., a fastening structure, an adhesive, or a combination thereof) in addition to the above-mentioned screws 312 and the screw holes 314. Since the joint structure of the frame structure and the back plate belongs to the technical features commonly used in the technical field, it will not be described in detail. Further, in the present embodiment, the first frame body 304a is integrally formed with a frame. The advantage of this design is that the waste heat generated by the light-emitting diode 308 can be transmitted to the heat-dissipating fins 304d without passing through a conventional light bar holder, thereby increasing the efficiency of heat dissipation. In a particular embodiment, the integrally formed first frame 304a is an aluminum extruded frame. In order to provide heat dissipation, the first frame 304a is fabricated from a material having good heat transfer characteristics. In a particular embodiment, the material of the first frame 304a is a metallic material, such as Ilu as described above in 201126240. In addition, the light-emitting diode 308 is bonded to the first frame body 304a having the heat-dissipating fins, and the light-emitting diode 308 is preferably bonded to the flat-shaped light-strip fixing base. Resistance to twisting. Please refer to FIG. 4, which is a cross-sectional view of a backlight module according to another embodiment of the present invention. In the present embodiment, the structure of the backlight module 5 is similar to that shown in Fig. 2B, and thus the relationship between similar structures or elements, and similar structures or elements will not be described. The difference between the backlight module and the backlight module 3〇〇 shown in Fig. 2B is explained by φ. In the backlight module 300, the first frame 304a and the second frame 304b of the rectangular frame structure 304 are fastened on the back plate 302, and the frame structure 304 is joined to the back plate 302 by screws 312, thereby defining The accommodation space 31 〇 is shown in Fig. 2B. In the backlight module 5A shown in FIG. 4, the first frame 504a and the second frame 504b corresponding to the first frame 304a and the second frame 3〇4b of the backlight module 300 respectively. The back surface 502 of the back plate 502 is located on the first frame 504a and the second frame 50, and the back plate 502, the first frame 504a and the second frame 504b are screwed 312. Join each other. In a specific embodiment, the light guide plate is formed into a flat plate structure or a wedge plate structure by, for example, injection molding, and the material thereof is, for example, a photocurable resin, acryl or polymethyl methacrylate (PMMA). In addition, in a specific embodiment, the backlight module 300 further includes at least one optical film (not shown), and the optical film is disposed on the light guide plate, and the optical film may be a diffusion sheet. Bracelet, Brightness Enhancement Film (BEF), Reflective Brightness Enhancement Film (Dual 201126240)
Brightness Enhancement Film ; DBEF)、非多層膜式反射偏 光片（Diffused Reflective Polarizer Film ; DRPF)或上述之任 意組合。 雖然本發明已以實施方式揭露如上，然其並非用以限 定本發明，任何熟習此技藝者，在不脫離本發明之精神和 範圍内’當可作各種之更動與潤飾，因此本發明之保護範 圍當視後附之申請專利範圍所界定者為準。Brightness Enhancement Film; DBEF), Diffused Reflective Polarizer Film (DRPF) or any combination of the above. While the invention has been described above by way of example, it is not intended to limit the invention, and the invention may be modified and modified in various ways without departing from the spirit and scope of the invention. The scope is subject to the definition of the scope of the patent application attached.
【圖式簡單說明】 ，為了能夠對本發明之觀點有較佳之理解，請參照上述 之評細說明並配合相應之圖式。要強調的是，根據工業之 標準常規，附圖中之各種特徵並未依比例繪示。事實上， 為清楚說明上述實_，可任意地放大或縮小各種特徵之 尺寸。相關圖式内容說明如下。 第1圖係繪示根據本發明之一實施例之液晶顯示裝置 的侧视圖。 第2A圖係繪示第！圖中之背光模組的俯視示意圖。 -第2B圖係繪示沿著第2A圖中剖面線AA，剖切的剖 面示意圖。 第3圖係繪不一習知之背光模組部分元件的剖面示意 圖。 第4圖係繪示根據本發明之另一實施例之背光模組的 剖面示意圖。 【主要元件符號說明】 201126240 100 :液晶顯示裝置 300 :背光模組 304 :框架結構 304b :第二框體 304bb :次框體 304c :側面 306 :導光板 306b :出光面 310 :容置空間 ® 314 :螺孔 404 :燈條 404b :印刷電路板 408 :散熱鰭片 412 :螺孔 416 :導熱材 502 :背板 504b :第二框體 • AA’ ：剖面線 200 :液晶顯示模組 302 :背板 304a :第一框體 304ba :次框體 304bc :次框體 304d :散熱鰭片 306a :側面 308 :發光二極體 312 :螺絲 402 :背板 404a :發光二極體 406 :燈條固定座 410 :螺絲 414 :導熱材 500 :背光模組 504a :第一框體 504c :側面 IS1 12BRIEF DESCRIPTION OF THE DRAWINGS In order to provide a better understanding of the present invention, reference is made to the above description and in conjunction with the corresponding drawings. It is emphasized that the various features in the drawings are not drawn to scale in accordance with the standard of the industry. In fact, the dimensions of the various features may be arbitrarily enlarged or reduced in order to clearly illustrate the above. The relevant schema description is as follows. Fig. 1 is a side view showing a liquid crystal display device according to an embodiment of the present invention. Figure 2A shows the first! A schematic top view of the backlight module in the figure. - Figure 2B is a cross-sectional view taken along section line AA of Figure 2A. Fig. 3 is a schematic cross-sectional view showing a part of a conventional backlight module. Figure 4 is a cross-sectional view showing a backlight module in accordance with another embodiment of the present invention. [Description of main component symbols] 201126240 100 : Liquid crystal display device 300 : Backlight module 304 : Frame structure 304b : Second frame 304bb : Secondary frame 304c : Side surface 306 : Light guide plate 306b : Light exit surface 310 : accommodating space ® 314 : screw hole 404: light bar 404b: printed circuit board 408: heat sink fin 412: screw hole 416: heat conductive material 502: back plate 504b: second frame body AA': hatching line 200: liquid crystal display module 302: back Plate 304a: first frame 304ba: secondary frame 304bc: secondary frame 304d: heat dissipation fin 306a: side surface 308: light emitting diode 312: screw 402: back plate 404a: light emitting diode 406: light bar mount 410: Screw 414: Heat conductive material 500: Backlight module 504a: First frame 504c: Side IS1 12