201042329 六、發明說明： 【發明所屬之技術領域】 本發明係關於一種顯示裝置及發光模組，特別關於 種液晶顯示裝置、背光模組及發光模組。 ； 【先前技術】 Ο 〇 現行發光模組可作為多種用途，例如：背光模組/ 照明模組、或顯示面板。而發光模組之光源種類 極發光燈管（CCFL)及發光二極體所形成之燈條（2 Ught Bar)之區別。發光模組可應用在液晶顯示裳置之此 光模組中，其中背光模組除光源外，尚包含光學^件及: 學膜片組。因背光模組之各組件組襄繁複，以致增加 杈組及其所應用的液晶顯示裝置的生產時間。 [^參照圖1所示，一種習知之背光模組U)包含一光 :凡件U、—電路板12以及複數發光元㈣。 側光式f光模組。該等發光元件二為2 i ίΓΓ電路板12而成為—發光二極體燈 冬先7L件13與電路板12電性連接。 體係以裸晶加上封錢㈣成騎光二極二a ^ 面黏著方式設置於電路板12上—曰片’再以表 導光板，並鄰設於該等發光㈣13 Z件11為—方型體 發光元件13與光學元件u具有板12,且該等 光源之光線入射於光學元件n之效另外，為提升 含一燈罩U包覆電路板】2及該等月光模組i〇更包 夺發先兀件13，並與光學 201042329 元件11接合。當該等發光元件13發出光線時，一部分光 線射入光學元件11，一部分則藉由燈罩14反射後再進入 光學元件11而出光。 然而，於背光模組10之組裝過程之中，該等發光元 件13在設置於電路板12之前，本身需經過發光二極體封 裝製程；而後再以表面黏著方式設置於電路板12 ;之後， 以發光元件13及電路板12組成之燈條，又需分別與光學 元件11及燈罩14 (或是背板）組裝，一連串之組裝過程 使得背光模組10之製程繁複費時，進而增加液晶顯示裝 置整體之生產成本及時程。此外，發光元件13與光學元 件11之間距D亦造成光線損耗及利用率降低。 因此，如何提供一種液晶顯示裝置、背光模組及發光 模組，能夠減少生產成本及時程並提升光線利用率，已成 為重要課題之一。 【發明内容】 有鑑於上述課題，本發明之目的為提供一種液晶顯示 裝置、背光模組及發光模組，藉由發光元件與光學元件結 合，能夠簡化模組架構，藉以縮短液晶顯示裝置之生產時 程、降低生產成本並提升光線利用率。 為達上述目的，依據本發明之一種發光模組包含一光 學元件、一電路板以及至少一發光元件。發光元件與電路 板電性連接。其中發光元件至少一部分結合於光學元件 内。 4 201042329 為達上述目的，依據本發明之—種背光模組包含一光 電性連接==及至少—發光"°件。發光元件與電路板 ，叙光疋件之至少一部分係結合於光學板内。 一為達上述目的，依據本發明之一種液晶顯示褒置包含 :=Γ板以及一背光模組。背光模組與液晶顯示面 板相對4。背光模組具有—光學板、—電路板及至少—201042329 VI. Description of the Invention: [Technical Field] The present invention relates to a display device and a light-emitting module, and more particularly to a liquid crystal display device, a backlight module, and a light-emitting module. [Prior Art] Ο 现行 Current lighting modules can be used for a variety of purposes, such as backlight modules/lighting modules, or display panels. The type of light source of the light-emitting module is different from the light-emitting tube (CCFL) and the light bar formed by the light-emitting diode (2 Ught Bar). The light-emitting module can be applied to the optical module in which the liquid crystal display is placed. The backlight module includes an optical component and a film set in addition to the light source. Due to the complexity of the various components of the backlight module, the production time of the silicon group and the liquid crystal display device to which it is applied is increased. [^, as shown in FIG. 1, a conventional backlight module U) includes a light: a device U, a circuit board 12, and a plurality of light-emitting elements (four). Side-light f-light module. The light-emitting elements 2 are 2 i ΓΓ ΓΓ 12 12 12 12 12 12 12 12 12 12 12 12 12 12 12 12 12 12 12 12 12 12 12 12 12 12 12 12 12 12 12 12 12 12 12 12 12 12 12 12 12 12 12 12 12 12 12 12 12 12 12 12 12 12 12 The system is set on the circuit board 12 with the bare crystal plus the sealed money (4) into the riding light diode 2 a ^ surface adhesion mode - the 曰 piece ' again with the table light guide plate, and adjacent to the light (4) 13 Z piece 11 is - square type The body light-emitting element 13 and the optical element u have a plate 12, and the light of the light sources is incident on the optical element n. In addition, in order to lift the cover circuit including the cover U, the moonlight module is further covered. The tamper 13 is spliced and joined to the optical 201042329 component 11. When the light-emitting elements 13 emit light, a part of the light is incident on the optical element 11, and a part of the light is reflected by the lamp cover 14 and then enters the optical element 11 to emit light. However, in the assembly process of the backlight module 10, the light-emitting elements 13 themselves need to pass through the LED package process before being disposed on the circuit board 12; and then disposed on the circuit board 12 in a surface-adhesive manner; The light bar composed of the light-emitting element 13 and the circuit board 12 is separately assembled with the optical component 11 and the lamp cover 14 (or the backplane). The series of assembly processes makes the process of the backlight module 10 complicated and time-consuming, thereby increasing the liquid crystal display device. The overall production cost and timeliness. Further, the distance D between the light-emitting element 13 and the optical element 11 also causes a loss of light and a decrease in utilization. Therefore, how to provide a liquid crystal display device, a backlight module, and a light-emitting module, which can reduce production cost and time and improve light utilization, has become an important subject. SUMMARY OF THE INVENTION In view of the above problems, an object of the present invention is to provide a liquid crystal display device, a backlight module, and a light-emitting module. By combining a light-emitting element and an optical element, the module structure can be simplified, thereby shortening the production of the liquid crystal display device. Time course, lower production costs and improve light utilization. To achieve the above object, a light emitting module according to the present invention comprises an optical component, a circuit board and at least one light emitting component. The light emitting element is electrically connected to the circuit board. Wherein at least a portion of the illuminating element is incorporated within the optical element. 4 201042329 In order to achieve the above object, a backlight module according to the present invention comprises a photo-electrical connection == and at least - illuminating < At least a portion of the light-emitting element and the circuit board and the polishing element are incorporated in the optical plate. In order to achieve the above object, a liquid crystal display device according to the present invention comprises: a seesaw and a backlight module. The backlight module is opposite to the liquid crystal display panel. The backlight module has an optical plate, a circuit board and at least
Ο 發光X件。發光元件與電路板電性連接。其中發光元件至 少一部分結合於光學板内。 承上所述，依據本發明之一種液晶顯示裝置、背光 組及發光模組藉由發光元件至少部份結合於光學元件 内，使光學元件與發光元件整合為單一構件，而能 學兀件及發光元件與其他構件（例如背板）組裝的時間光 此外.，由於發光元件至少部份結合於光學元 曰。 丁，因而避免 光線彳貝耗並提升光線利用率。此外，發光元件亦 、、 型式與光學元件結合’使光學元件成為發光元件的保=θθ 更可省去發光元件的封裝製程，進而降低成本。 【實施方式】 以下將參照相關圖式，說明依據本發明較佳實 一種液晶顯示裝置、背光模組及發光模組。 &例之· 第一實施例 請參照圖2所示，本發明第一實施例之一種發光模、 20包含一光學元件21、一電路板22以及至少— 、''a 赞光元件 23。發光模組20可作為多種用途，例如：昔也 201042329 照明模組、或_千品 " 板。本實施例之發光模組20係以一 搞的二二：杈組為例說明。另外’發光模組2〇為顯示面 、二’係以複數發光元件（例如LED)呈P+列設置， ，、例如為:LED顯示面板或戶外看板。 -墓%例中，光學元件21以光學板為例，例如為 二反本發明不限制光學元件的種類，例如光學元件 21依月光模組之不同j能 施例中，料4,丨可Γ、Ζ 難板；在其他實 ,,,. 亦可為透鏡。本發明亦不限制光學元件 的形狀，例如可為板體、 體#體方體、楔形體或球體，本 只例之導光板的形狀以—方板體為例說明。 Η 件23與電路板22電性連接，且發光元件23 来-Hr分結合於絲元件21内。於本實施例中，發 光兀件23可為紅綠藍（R、 _，並設置於電路板… 製中成型而將發光元件23結合於光學元件;1内。 光學元件21係藉由-模具m射出成型， 使發先70件23結合於来學开/土 ^ 踗柘79在A 、光予兀件21内。於本實施例中，電 路板22係為—印刷電路板。 為使光學元件21可精準連結於 元件23制結合，電路板2 槿=發光 或一強化紝槿799甘士 疋位結構221及/ :广構222。其中，定位結構221或強化結構 可為凸點、或凸塊、或凹部、戋 施例中，定位結構221係為—凸境f…且&。於本實 门凸塊，並對應於模且M 一 凹部C設置於電路板22之外 ’、 彖，而強化結構222係為一 201042329 孔型凹部，設置於兩相鄰發光元件23之間隔處。當模具 Μ與電路板22覆合時，模具Μ之凹部C與定位結構221 之凸塊相互卡合，並以射出成型方式使塑料成型為光學元 件21，並與發光元件23結合，此時，熔融之塑料可流進 強化結構222 (孔形凹部），增加光學元件21與電路板22 之結合強度，進而提升光學元件21與發光元件23結合可 靠度。在結合後，由於發光元件23與光學元件21毫無間 距，可使發光元件23發出之光線完全導入光學元件21 〇 内，即可省去例如燈罩之組件，並提升光線利用率。 又，於本實施例中，發光元件23可為裸晶（die)或 晶片（chip )。於此，晶片是指裸晶設置於基板上，並經由 打線接合或覆晶接合而與外界電性連接，再藉由封裝材及 /或螢光體進行封裝而成。當發光元件23為裸晶時，可直 接以射出成型方式結合於光學元件21内，並省去裸晶的 封裝製程。發光元件23除了發光二極體（LED)之外，依 〇 設計需求可為有機發光二極體（OLED)、或冷陰極螢光燈 管（CCFL )或其他光源。另外，本發明不限制發光元件 23的色系，可例如為紅、綠、藍、白，且可混合使用。 另外，於本實施例中，光學元件21之材料可包含高 分子聚合物，其例如為聚甲基丙烯酸曱酯（PMMA)、或聚 碳酸酯（PC)、或聚苯乙烯（PS)、或環氧樹脂（EPOXY)、 或矽膠、或橡膠。光學元件21之特性不一定要作為導光 或擴散，例如可作為發光二極體之透鏡，可具有較佳之照 明功效。光學元件21另可具有一微結構位於其一側，藉 201042329 由微結構可調整光線特性，例如聚光性或亮度等。 = ^二於本實施例中，電路板22不限於為非可撓式 (更式）i路板或可撓式電路板，而其材質可包含玻璃、 或樹脂、或金屬m或塑膠。λ中，非可撓式電路 板例如為含玻璃纖維（咖）電路板或含金屬層之金屬核 心電路板（MCPCB)。 另外，於本實施例中，電路板22具有一連接器223， 設置於電路板22突出於光學元件21的部分（即模μ之 外）以對外電性連接，使發光元件23通電發光。需補充 的是，由：發光元件23可為一裸晶，其形成晶粒後，於 未通電狀怨，可承受射出成型之塑料約2〇〇。(：至3〇〇1之 溫度，故適用於模製成型之製程。 為使發光杈組20之發光效率提高或發光更均勻或其 他應用’發光模組可有不同之變化態樣。請參照圖从所 示，本發明第一實施例之另—種發光模組2〇a包含一光學 元件2la、一電路板22以及至少—發光元件23。其中，電 路板22及|光讀23之結構及種類已於上述實施例中詳 述於此不再％述。光學兀件2U與上述光學元件以不同 之處在於：光學元件21a可更包含_擴散材質或一螢光材 質，本實施例之光學元件21a以加入擴散材 質211為例說 月（如圖3B所不），其可視為導光板與擴散板之結合，並 可使光學元件21a之光線傳導更加均句。 請參照圖4所示，本發明第—實施例之另一種發光模 組勘包含-光學元件21、二電路板η、现以及發光元 201042329 件23、23b。其中，光學元件21之結構及種類已於上述實 施例詳述，於此不再贅述。於本實施例中，電路板22、22b 以及發光元件23、23b分別設置於光學元件21之上、下 兩侧，以增加發光模組20b之發光亮度，使發光模組20b 可更加適合作為大尺寸液晶顯示裝置之背光模組。 第二實施例 請參照圖5所示，本發明第二實施例之一種發光模組 30包含一光學元件31、一電路板32以及至少一發光元件 33、331。發光元件33至少一部分結合於光學元件31内。 於本實施例中，兩發光元件33、33’分別設置於光學元件 31之上、下兩側，且發光元件33、33'為一冷陰極螢光燈 管（CCFL)，並與電路板32電性連接。於本實施例中，發 光元件33、33'之端部電極331及331'自光學元件31露出， 並與電路板32電性連接。 第三實施例 〇 請參照圖6所示，本發明第三實施例之一種發光模組 40包含一光學元件41、一電路板42以及至少一發光元件 43。發光模組40係可作為一背光模組或照明模組，於本 實施例中，發光模組.40以為一直下式背光模組為例說明。 光學元件41可作為背光模組之光學板，本實施例之光學 元件41係以一擴散板為例說明。於本實施例中，發光元 件43為複數冷陰極螢光燈管，並與光學元件43 (光學板） 模製成型，使發光元件43之燈管部分與光學元件41結 合，而發光元件43之端部電極431自光學元件41露出， 9 201042329 並與電路板42電性連接。由此結構，以縮短直下式背光 模組之組裝時間。電路板42係具有變壓器以提供高壓訊 號給發光元件43。本發明第三實施例之一種發光模組40 係可有不同的變化態樣，請參照圖7A所示，依據本發明 之一種發光模組40a包含一光學元件41a、一電路板42以 及至少一發光元件43。其中，電路板42及發光元件43之 結構與種類已於上述實施例所述，於此不再贅述。於本實 施例中，光學元件41a為一光學板，並具有擴散材質V(如 圖7B所示）及一微結構U。其中，擴散材質V散佈於光 學元件41a，微結構U則位於光學元件41a之一側，係較 佳設置於出光之一側面S，擴散材質V可使光學板作為擴 散板外，微結構U可類似一增亮膜之功效，以提升亮度。 當然，發光模組40a可更包括一上擴散板（圖未顯示）或 其他光學膜設置於光學元件41a上。 請再參照圖8所示，本發明較佳實施例之一種液晶顯 示裝置5包含一液晶顯示面板P以及一背光模組。背光模 組與液晶顯示面板P相對設置。背光模組具有一光學元件 51、一電路板52及至少一發光元件53。其中，背光模組 係應用上述第一實施例之發光模組20為例說明。光學元 件51、電路板52及發光元件53之種類與構造與上述第一 實施例之光學元件21、電路板22及發光元件23均等同， 於此不再贅述。背光模組更包含一光學膜片組R，其例如 可包含下擴散板、增亮膜及/或上擴散板，並設置於光學元 件51與液晶顯示面板P之間。 10 201042329 綜上所述，依據本發明之一種液晶顯示裝置、背光模 組及發光模組藉由發光元件結合於光學元件内，使光學元 件與發光元件整合為單一構件，而能減少光學元件及發光 元件與其他構件（例如背板）組裝的時間。此外，由於發 光元件部分結合於光學元件，因而避免光線損耗並提升光 線利用率。此外，發光元件亦可以裸晶型式與光學元件結 合，使光學元件成為發光元件的保護，更可省去發光元件 的封裝製程，進而降低成本。 Ο 以上所述僅為舉例性，而非為限制性者。任何未脫離 本發明之精神與範疇，而對其進行之等效修改或變更，均 應包含於後附之申請專利範圍中。 【圖式簡單說明】 圖1為一種習知之背光模組的示意圖； 圖2為依據本發明第一實施例之一種發光模組的示意 〇 圖； 圖3A為依據本發明第一實施例之另一種發光模組的 不意圖， 圖3B為圖3A之局部放大示意圖； 圖4為依據本發明第一實施例之另一種發光模組的示 意圖； 圖5為依據本發明第二實施例之一種發光模組的示意 圖； 圖6為依據本發明第三實施例之一種發光模組的示意 201042329 圖； 圖7A為依據本發明第三實施例之另一種發光模組的 示意圖； 圖7B為圖7A之局部放大不意圖，以及 圖8為依據本發明較佳實施例之一種液晶顯示裝置及 其背光模組的示意圖。 【主要元件符號說明】 10 :背光模組 11、 21、21a、3卜 41、41a、51:光學元件 12、 22、22b、32、42、52 :電路板 13、 23、23b、33、33'、43、53 :發光元件 14 :燈罩 20、20a、20b、30、40、40a :發光模組 211、V :擴散材質 221、 521 :定位結構 222、 522 :強化結構 223、 523 ··連接器 331、33Γ、431 :端部電極 5 ·液晶顯不裝置 C :凹部 D :間距 Μ :模具 Ρ :液晶顯示面板 12 201042329 R :光學膜片組 s :側面 u :微結構发光 Illuminated X pieces. The light emitting element is electrically connected to the circuit board. At least a portion of the light-emitting elements are incorporated into the optical plate. According to the present invention, a liquid crystal display device, a backlight assembly, and a light-emitting module are at least partially integrated into an optical component by the light-emitting component, so that the optical component and the light-emitting component are integrated into a single component, and the component and the component can be learned. The time light of the assembly of the illuminating element with other components, such as the backing plate, is furthermore, since the illuminating element is at least partially bonded to the optical element. Ding, thus avoiding light mussel consumption and improving light utilization. In addition, the combination of the light-emitting element and the pattern and the optical element makes it possible to save the optical element as a light-emitting element, and to eliminate the cost of the packaging process of the light-emitting element. [Embodiment] Hereinafter, a liquid crystal display device, a backlight module, and a light-emitting module according to the present invention will be described with reference to the related drawings. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Referring to FIG. 2, a light-emitting module 20 of a first embodiment of the present invention includes an optical element 21, a circuit board 22, and at least a ''a-lighting element''. The light-emitting module 20 can be used for various purposes, such as: 201042329 lighting module, or _1000 product " board. The illuminating module 20 of the present embodiment is described by taking a two-two: 杈 group as an example. Further, the 'light-emitting module 2' is a display surface, and the second light-emitting element (for example, LED) is provided in a P+ column, and is, for example, an LED display panel or an outdoor billboard. In the case of the tomb %, the optical element 21 is exemplified by an optical plate. For example, the invention is not limited to the type of the optical element. For example, the optical element 21 may be different in the case of the moonlight module. Ζ 难 难; in other real,,,. Also can be a lens. The present invention also does not limit the shape of the optical element, and may be, for example, a plate body, a body body, a wedge body or a sphere. The shape of the light guide plate of the present example is exemplified by a square plate body. The device 23 is electrically connected to the circuit board 22, and the light-emitting element 23 is coupled to the wire element 21 by -Hr. In this embodiment, the illuminating element 23 can be red, green and blue (R, _, and is formed in the circuit board to form the illuminating element 23 in the optical element; 1. The optical element 21 is made by the - dies m injection molding, so that the first 70 pieces of 23 are combined with the learning opening/soil 踗柘79 in the A, the light-feeding member 21. In the present embodiment, the circuit board 22 is a printed circuit board. The component 21 can be accurately coupled to the component 23, and the circuit board 2 发光 = illuminating or a reinforced 799 sang sang structure 221 and / : wide 222. The positioning structure 221 or the reinforcing structure can be a bump, or In the bump, or recess, in the embodiment, the positioning structure 221 is - the convex f... and & the real door bump, and corresponds to the mold and the M concave portion C is disposed outside the circuit board 22',强化, and the reinforcing structure 222 is a 201042329 hole-shaped recess provided at the interval between two adjacent light-emitting elements 23. When the mold Μ is overlapped with the circuit board 22, the concave portion C of the mold 与 and the convex portion of the positioning structure 221 are mutually Engaging, and molding the plastic into the optical element 21 by injection molding, and combining with the light-emitting element 23, At this time, the molten plastic can flow into the reinforcing structure 222 (hole-shaped recess), increasing the bonding strength between the optical element 21 and the circuit board 22, thereby improving the reliability of the bonding of the optical element 21 and the light-emitting element 23. After the bonding, due to the light-emitting element 23 Without any distance from the optical element 21, the light emitted from the light-emitting element 23 can be completely introduced into the optical element 21, and the components such as the lamp cover can be omitted, and the light utilization efficiency can be improved. Moreover, in the present embodiment, the light-emitting element 23 It may be a die or a chip. Here, the wafer means that the bare crystal is disposed on the substrate, and is electrically connected to the outside through wire bonding or flip chip bonding, and is further provided by a package material and/or a firefly. The light body is encapsulated. When the light-emitting element 23 is bare, it can be directly bonded into the optical element 21 by injection molding, and the die-packaging process is omitted. The light-emitting element 23 is in addition to the light-emitting diode (LED). In addition, depending on the design requirements, it may be an organic light emitting diode (OLED), or a cold cathode fluorescent lamp (CCFL) or other light source. In addition, the present invention does not limit the color system of the light emitting element 23, and may be, for example, red or green. In addition, in the present embodiment, the material of the optical element 21 may comprise a high molecular polymer, such as polymethyl methacrylate (PMMA), or polycarbonate (PC), Or polystyrene (PS), or epoxy resin (EPOXY), or silicone, or rubber. The characteristics of the optical element 21 do not have to be light or diffuse, for example, as a lens of a light-emitting diode, preferably The optical component 21 may have a microstructure on one side thereof, and the microstructure may adjust the light characteristics, such as condensing property or brightness, etc. by using 201042329. In the present embodiment, the circuit board 22 is not limited to A non-flexible (more) i-way board or flexible circuit board, and its material may include glass, or resin, or metal m or plastic. In λ, the non-flexible circuit board is, for example, a glass fiber (coffee) circuit board or a metal core circuit board (MCPCB) containing a metal layer. In addition, in the present embodiment, the circuit board 22 has a connector 223 disposed on a portion of the circuit board 22 that protrudes from the optical component 21 (i.e., outside the mode μ) for external electrical connection, so that the light-emitting component 23 is energized to emit light. It should be added that: the light-emitting element 23 can be a bare crystal, and after forming the crystal grains, it can withstand the injection molding plastic about 2 于. (: to the temperature of 3〇〇1, it is suitable for the molding process. In order to improve the luminous efficiency or uniform illumination of the luminescent group 20 or other applications, the illuminating module can have different variations. Referring to the drawings, another illumination module 2A of the first embodiment of the present invention includes an optical component 2la, a circuit board 22, and at least a light-emitting component 23. Among them, the circuit board 22 and the optical reading 23 The structure and the type are not described in detail in the above embodiments. The optical element 2U is different from the above optical element in that the optical element 21a may further include a diffusion material or a fluorescent material. The optical element 21a is exemplified by the addition of the diffusion material 211 (as shown in FIG. 3B), which can be regarded as a combination of the light guide plate and the diffusion plate, and can make the light transmission of the optical element 21a more uniform. Referring to FIG. In another embodiment of the present invention, the optical module 21, the two circuit boards η, the current and the illuminating elements 201042329, 23, 23b are included. The structure and type of the optical element 21 are as in the above embodiment. Detailed, no longer here In this embodiment, the circuit boards 22 and 22b and the light-emitting elements 23 and 23b are respectively disposed on the upper and lower sides of the optical element 21 to increase the light-emitting brightness of the light-emitting module 20b, so that the light-emitting module 20b can be more suitable as the light-emitting module 20b. The backlight module of the large-size liquid crystal display device. Referring to FIG. 5, a light-emitting module 30 according to a second embodiment of the present invention includes an optical component 31, a circuit board 32, and at least one light-emitting component 33. 331. At least a portion of the light-emitting element 33 is coupled to the optical element 31. In the present embodiment, the two light-emitting elements 33, 33' are respectively disposed on the upper and lower sides of the optical element 31, and the light-emitting elements 33, 33' are a cold A cathode fluorescent lamp (CCFL) is electrically connected to the circuit board 32. In this embodiment, the end electrodes 331 and 331' of the light-emitting elements 33, 33' are exposed from the optical element 31 and electrically connected to the circuit board 32. The third embodiment of the present invention is an optical component 41, a circuit board 42 and at least one light-emitting component 43. The light-emitting module 40 can be As a backlight module or In the present embodiment, the illumination module 40 is described as an example of the backlight module. The optical component 41 can be used as an optical panel of the backlight module. The optical component 41 of the embodiment is a diffusion plate. For example, in the embodiment, the light-emitting element 43 is a plurality of cold-cathode fluorescent tubes, and is molded with the optical element 43 (optical plate) so that the tube portion of the light-emitting element 43 is combined with the optical element 41. The end electrode 431 of the light-emitting element 43 is exposed from the optical element 41, and is electrically connected to the circuit board 42. The structure is configured to shorten the assembly time of the direct-type backlight module. The circuit board 42 has a transformer to provide a high voltage. The signal is given to the light-emitting element 43. A lighting module 40 according to a third embodiment of the present invention may have different variations. Referring to FIG. 7A, a lighting module 40a according to the present invention includes an optical component 41a, a circuit board 42 and at least one Light-emitting element 43. The structure and type of the circuit board 42 and the light-emitting element 43 are described in the above embodiments, and details are not described herein. In the present embodiment, the optical element 41a is an optical plate and has a diffusion material V (as shown in Fig. 7B) and a microstructure U. The diffusion material V is dispersed on the optical element 41a, and the microstructure U is located on one side of the optical element 41a, preferably disposed on one side S of the light exiting, and the diffusion material V can make the optical plate be used as a diffusion plate, and the microstructure U can be Similar to the effect of a brightening film to enhance brightness. Of course, the light-emitting module 40a may further include an upper diffusion plate (not shown) or other optical film disposed on the optical element 41a. Referring to FIG. 8, a liquid crystal display device 5 according to a preferred embodiment of the present invention includes a liquid crystal display panel P and a backlight module. The backlight module is disposed opposite to the liquid crystal display panel P. The backlight module has an optical component 51, a circuit board 52, and at least one light emitting component 53. The backlight module is described by using the light-emitting module 20 of the first embodiment. The types and structures of the optical element 51, the circuit board 52, and the light-emitting element 53 are the same as those of the optical element 21, the circuit board 22, and the light-emitting element 23 of the first embodiment described above, and will not be described herein. The backlight module further includes an optical film group R, which may include, for example, a lower diffusion plate, a brightness enhancement film, and/or an upper diffusion plate, and is disposed between the optical element 51 and the liquid crystal display panel P. 10 201042329 In summary, a liquid crystal display device, a backlight module and a light-emitting module according to the present invention are integrated into an optical component by a light-emitting component, so that the optical component and the light-emitting component are integrated into a single component, and the optical component can be reduced. The time during which the illuminating element is assembled with other components, such as the backing plate. In addition, since the light-emitting element is partially bonded to the optical element, light loss is avoided and the light utilization efficiency is improved. In addition, the light-emitting element can also be combined with the optical element in a bare crystal form, so that the optical element can be protected by the light-emitting element, and the packaging process of the light-emitting element can be omitted, thereby reducing the cost. Ο The above description is for illustrative purposes only and not as a limitation. Any equivalent modifications or alterations to the spirit and scope of the present invention are intended to be included in the scope of the appended claims. BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a schematic view of a conventional backlight module; FIG. 2 is a schematic view of a light emitting module according to a first embodiment of the present invention; FIG. 3A is another embodiment of the present invention. FIG. 3B is a partial enlarged view of FIG. 3A; FIG. 4 is a schematic diagram of another light emitting module according to a first embodiment of the present invention; FIG. 5 is a light emitting device according to a second embodiment of the present invention; Figure 6 is a schematic diagram of a light-emitting module according to a third embodiment of the present invention; Figure 7A is a schematic view of another light-emitting module according to a third embodiment of the present invention; Figure 7B is a schematic view of Figure 7A; The partial amplification is not intended, and FIG. 8 is a schematic diagram of a liquid crystal display device and a backlight module thereof according to a preferred embodiment of the present invention. [Description of main component symbols] 10: backlight modules 11, 21, 21a, 3b 41, 41a, 51: optical components 12, 22, 22b, 32, 42, 52: circuit boards 13, 23, 23b, 33, 33 ', 43, 53: light-emitting element 14: lampshade 20, 20a, 20b, 30, 40, 40a: light-emitting module 211, V: diffusion material 221, 521: positioning structure 222, 522: reinforcing structure 223, 523 · · connection 331, 33Γ, 431: end electrode 5 · liquid crystal display device C: recess D: pitch Μ : mold Ρ : liquid crystal display panel 12 201042329 R : optical film set s : side u : microstructure
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