JP3853896B2 - Heating component device - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a heat generating component device capable of cooling a heat generating component such as a PGA (Pin Grid Array) package or a resistor by a heat pipe or a heat conductor.
[0002]
[Prior art]
Conventionally, there are first to fifth examples described below that are configured to cool a PGA package by fixing a heat sink to a semiconductor component such as an integrated circuit.
In the first example (Japanese Utility Model Publication No. 6-9517), as shown in FIG. 11, a plurality of radiating fins 33a are provided on the upper surface of a semiconductor component 32 made of PGA, for example, which is detachably supported by the PGA socket 31. In order to mount the heat sink 33 having the heat sink, there is one using a heat sink fixture 34 made of a spring having a shape as shown in the figure obtained by bending a wire.
[0003]
In this case, the heat sink attachment 34 forms a pressing portion 34a extending across the upper surface of the heat sink 33, a stopper portion 34b formed by bending both ends of the wire rod at both ends of the pressing portion 34a, and a pressing portion 34a. The wire portion is provided with a U-shaped bent portion 34c that is bent so that at least one of the heat radiating fins 33a is included from the upper surface of the heat sink 33. FIG. 11A is a front view, and FIG. 11B is a plan view.
[0004]
In the second example (Japanese Patent Publication No. 3-25024), as shown in FIG. 12, an elastic locking hook 45 is sandwiched between an integrated module 41, for example, a PGA package, and an insulating plate 44, for example, a PGA socket. A heat sink (cooling body) 47 is attached using a hook 45. Specifically, an insulating plate 44 having at least the number of holes 43 corresponding to the number, size, and arrangement of the connection pins 42 of the integrated module 41 and disposed under the integrated module 41, and an insulating plate For example, when the elastic locking hook 45 is mounted on the integrated module 41 with a heat sink (cooling body) 47, The engaging edge 48 of the heat sink 47 is tightened.
[0005]
In a third example (US Pat. No. 5,313,099), as shown in FIG. 13, a dedicated adapter 52 is mechanically attached to a PGA package 51, and a female thread portion 52 a formed in the dedicated adapter 52. In addition, a male screw portion 53 a formed at the bottom of the heat sink 53 is screwed.
[0006]
In the fourth example (Japanese Patent Publication No. 3-34227), as shown in FIG. 14, the dedicated adapter 61 is mounted on the semiconductor 62 and the heat sink 63 is mounted via the dedicated adapter 61. The dedicated adapter 61 includes a notch hole 61a, a counterbore 61b, and a screw hole 61c. Reference numeral 64 is a printed board, 65 is a cooling fin, and 66 is a radiation fin.
In the fifth example, a semiconductor 73 is sandwiched between a printed board 71 and a heat sink 72 as shown in FIG.
[0007]
[Problems to be solved by the invention]
Each of the conventional examples described above has the following problems.
(1) Problems of the first example a) It is necessary to use a dedicated PGA socket 31.
[0008]
b) Since the heat sink attachment 34 made of a spring is used, the force for pressing the heat sink 33 against the semiconductor component 32 is weak, and the contact thermal resistance between the semiconductor component 32 and the heat sink 33 is increased.
[0009]
c) The pressing force that presses the heat sink 33 against the semiconductor component 32 changes over time.
d) Since the fixing force of the heat sink fixture 34 to the semiconductor component 32 is weak, the heat sink 33 comes off depending on the applied impact direction.
[0010]
(2) Problems of the second example a) Since the elastic locking hook 45 uses springiness, the pressing force against the integrated module 41 is weak.
[0011]
b) The pressing force of the heat sink 47 changes over time.
c) Impact resistance performance is direction dependent.
(3) Problems of the third example a) A mold is required to manufacture the dedicated adapter 52, and the manufacturing cost becomes high in small-scale production.
[0012]
(4) Problem a of the fourth example a) Since the dedicated adapter 61 cannot be removed from the semiconductor 62 later, the maintainability is inferior.
[0013]
b) Secular change of the adhesive force of the dedicated adapter 61 and chemical change of the adhesive surface occur.
(5) Problems of the fifth example a) Four mounting holes 71a for mounting the four leg portions 74a formed at the corners for mounting the spring bracket 74 on the printed circuit board 71 are provided. Need to form.
[0014]
b) There is a problem of direction dependency of impact resistance.
The object of the present invention is that when a heat conductor or heat pipe is mechanically mounted on a heat-generating component, no special processing is required for the printed circuit board, and the direction dependency of the impact resistance performance is small, so that it does not change over time. An object of the present invention is to provide a heat-generating component device that maintains a sufficient contact pressure, can flexibly cope with various shapes of heat-generating components and heat conductors, and is low in manufacturing cost.
[0015]
[Means for Solving the Problems]
In order to achieve the above object, the invention corresponding to claim 1 is to directly or indirectly attach a heat generating component to a printed circuit board, and has a heat conductive sheet having good heat conductivity, and heat conduction. A plate-like heat conductor having good properties, a fixing block , first and second bracket covers, a cover fixing means, and a plurality of pressing means,
The first and second bracket covers are each composed of an upper wall portion and a lower wall portion that face each other, and a connecting wall portion that connects the upper wall portion and the lower wall portion,
The cover fixing means includes the first and second bracket covers at both ends of the heat generating component in a state where the heat conductive sheet, the heat conductor, and the fixing block are sequentially in contact with each other. And sandwiching the first and second bracket cover to the fixed block,
Each of the pressing means penetrates the first bracket cover and the fixed block and the second bracket cover and the fixed block, respectively, and allows the protruding length from the fixed block to be arbitrarily adjusted. And
Wherein by adjusting the protruding length of the pressing means, a heat generating component device was characterized to give a pressing force to the heat generating component sequentially through the thermally conductive sheet and the heat conductor.
[0016]
In order to achieve the above object, the invention corresponding to claim 2 is to directly or indirectly attach a heat generating component to a printed circuit board , and has a heat conductive sheet having good heat conductivity, and heat conduction. A plate-shaped heat pipe with good properties, a fixing block, first and second bracket covers, a cover fixing means, and a plurality of pressing means,
The first and second bracket covers are each composed of an upper wall portion and a lower wall portion that face each other, and a connecting wall portion that connects the upper wall portion and the lower wall portion,
The cover fixing means sandwiches the first and second bracket covers at both ends of the heat generating component in a state where the heat conductive sheet, the heat pipe, and the fixing block are sequentially in contact with each other. And fixing the first and second bracket covers to the fixing block,
Each of the pressing means penetrates the first bracket cover and the fixed block and the second bracket cover and the fixed block, respectively, and allows the protruding length from the fixed block to be arbitrarily adjusted. And
By adjusting the projecting length of each of the pressing means, a heat generating component apparatus characterized by providing a pressing force against the turn the heat generating component through the thermally conductive sheet and the heat pipe.
[0017]
In order to achieve the above object, an invention corresponding to claim 3 is to directly or indirectly attach a heat generating component to a printed circuit board, and has a heat conductive sheet having good heat conductivity, and heat conduction. A plate-like heat pipe with good properties, a pressing member, a fixing block , first and second bracket covers, a cover fixing means, and a plurality of pressing means,
The first and second bracket covers are each composed of an upper wall portion and a lower wall portion that face each other, and a connecting wall portion that connects the upper wall portion and the lower wall portion,
The cover fixing means is in a state where the heat conductive sheet, the heat pipe, the pressing member, and the fixing block are sequentially in contact with the heat generating component, and the first and second end portions thereof are in contact with each other. While sandwiching the bracket covers, respectively, the first and second bracket covers are fixed to the fixing block,
Each of the pressing means penetrates the first bracket cover and the fixed block and the second bracket cover and the fixed block, respectively, and allows the protruding length from the fixed block to be arbitrarily adjusted. And
A heat generating component device that applies a pressing force to the heat generating component through the pressing member, the heat pipe, and the heat conductive sheet in order by adjusting a protruding length of each pressing means. is there.
[0018]
In order to achieve the above object, the invention corresponding to claim 4 is characterized in that the pressing means according to claim 1 or claim 3 is formed at least at the lower part of a through hole formed in the vertical direction of the fixed block, and thus is a screw part. And a heat generating component device comprising a pressing screw threaded through the bracket cover and having a threaded portion formed only at least at the tip.
[0019]
In order to achieve the above object, the invention corresponding to claim 5 is formed integrally with the upper surface of the bracket cover as the pressing means according to claim 1, and a female thread portion is formed on the inner peripheral surface of the hole. The heat generating component device includes a cylindrical boss and a pressing screw that is screwed to the boss and passes through a through hole formed in the fixed block.
[0020]
In order to achieve the above object, the invention corresponding to claim 6 is formed integrally with the upper surface of the bracket cover as the pressing means according to claim 2, and a female thread portion is formed on the inner peripheral surface of the hole. The heat generating component device includes a cylindrical boss and a pressing screw screwed to the boss.
[0021]
In order to achieve the above object, the invention corresponding to claim 7 is the pressing means according to claim 1 or claim 3, wherein the pressing means is inserted into a through hole formed in the bracket cover and the fixed block, and a spring property is provided at the tip. It is the heat-emitting component apparatus which consists of a pressing member which has a hook part which has.
[0022]
According to the invention of any one of claims 1 to 7, when the heat conductor or the heat pipe is mechanically attached to the heat generating component, no special processing is required for the printed circuit board, and the impact resistance performance. It is possible to maintain a sufficient contact pressure without changing over time, flexibly cope with various shapes of heat-generating components and heat conductors, and reduce manufacturing costs.
[0023]
DETAILED DESCRIPTION OF THE INVENTION
Embodiments of the present invention will be described below with reference to the drawings.
<First Embodiment>
FIG. 1 is a schematic configuration diagram showing a first embodiment of a heat generating component device of the present invention, and FIG. 2 is a side sectional view of FIG. This includes a printed circuit board 1, a PGA socket 2, a PGA package 3, a heat conductive sheet 4, a heat conductor 5, a fixing block 6, a bracket cover 7, a cover mounting screw 8, a cover mounting nut 9, and a pressing screw 10. The fixing screw 11 is used.
[0024]
A desired circuit pattern (not shown) is formed on the printed circuit board 1, and a PGA socket 2 is mounted on the printed circuit board 1 and is electrically connected to the circuit pattern.
[0025]
A plurality of pins 3 a protrude from the lower end portion of the PGA package 3, and each pin 3 a can be inserted into the PGA socket 2. The heat conductive sheet 4 is made of a sheet having good heat conductivity such as silicone rubber, and is placed on the upper surface of the PGA package 3.
[0026]
The heat conductor 5 is made of, for example, a copper plate or an aluminum plate having a good heat conductivity, which is bent into an L shape by sheet metal processing, and one end thereof is between the upper surface of the heat conductive sheet 4 and the lower surface of the fixed block 6. A plurality of fixing screw insertion holes 5a for fixing to the side wall of the device storage case 12 are formed at the other end. In this case, each of the fixing screw insertion holes 5 a may be either a simple through hole or a female screw hole, and conversely, a plurality of female screw holes 12 a are formed on the side wall of the device storage case 12.
[0027]
The fixing block 6 is made of a rectangular parallelepiped made of a material having a small thermal deformation caused by a temperature change, such as a stainless steel, and has a female screw hole 6a so that the pressing screw 10 penetrates and is screwed in the thickness direction (vertical direction). Two screw insertion holes 6b are formed, through which the cover mounting screws 8 are inserted in the horizontal direction in the width direction (left-right direction) of the rectangular parallelepiped.
[0028]
The bracket cover 7 is formed by forming a plate material into a substantially U -shaped cross section by sheet metal processing, and a plurality of through holes 7a through which the pressing screws 10 are respectively inserted and two cover mounting screws 8 are inserted into two orthogonal plate surfaces. Two of the plurality of through-holes 7b formed are used as follows.
[0029]
In order to fix to the device case 12 using the heat generating component device having such a configuration, the following is performed. In advance, the PGA socket 2 is attached to the printed circuit board 1 by soldering. Next, with the heat conductive sheet 4, the heat conductor 5, and the fixing block 6 sequentially stacked on the upper surface of the PGA package 3, for example, on the right end thereof, the upper and lower walls facing one bracket cover 7 and It fits between the connecting walls which connect the upper and lower walls, and the other bracket cover 7 is similarly fitted to the left end portion thereof.
[0030]
In this state, one cover mounting screw 8 is inserted into the through hole 7b of the left bracket cover 7 in FIG. 1, the screw insertion hole 6b of the fixed block 6, and the through hole 7b of the right bracket cover 7 in FIG. At the same time, a cover mounting nut 9 is screwed to the end of the cover mounting screw 8 protruding from the bracket cover 7, and similarly, the cover mounting nut 9 is screwed to the other cover mounting screw 8. The bracket cover 7 is fixed to the fixed block 6.
[0031]
Next, the pressing screw 10 is inserted into the through hole 7 a on the upper wall of the bracket cover 7, and is screwed into the female screw hole 6 a formed in the vertical direction of the fixing block 6. There is screwed until it abuts against the heat conductor 5 is given a predetermined contact pressure by Rinetsu conductor 5 and the heat-conductive sheet 4, the thermally conductive sheet 4 and contact surface of the PGA package 3 mutually thereto .
[0032]
In this state, that is, in a state where the fixing block 6, the heat conductor 5, the heat conductive sheet 4, and the PGA package 3 are fixed to the bracket cover 7, a plurality of pins 3 a included in the PGA package 3 are inserted into the PGA socket 2. Then, the fixing screw 11 is inserted into the fixing screw insertion hole 5a formed on the vertical surface of the heat conductor 5, and the fixing screw 11 is inserted into the female screw hole 12a formed on the side wall of the device storage case 12, respectively. Screw together. In this way, the heat generating component device is fixed to the device case 12.
[0033]
As a result, the heat generated from the PGA package 3 is released to the electronic device case 12 through the heat conductor 5 through the heat conductive sheet 4, so that even if the PGA package 3 is not forcedly cooled by air, the PGA package 3 3 surface temperature can be kept below a predetermined temperature.
[0034]
According to the first embodiment of the present invention described above, the heat conductor 5 can be mechanically attached to the PGA package 3 without performing drilling for attaching the PGA package 3 to the printed circuit board 1. For this reason, it is possible to perform cooling with excellent impact resistance. Moreover, since the heat conductor 5 and the bracket cover 7 of this embodiment can be manufactured by sheet metal processing, it contributes to manufacturing cost reduction in a small-volume product. Since the bracket cover 7 has a configuration in which the PGA package 3, the heat conductive sheet 4, the heat conductor 5, and the fixing block 6 are stacked and disposed on both the left and right sides, the PGA package 3 and the heat conductor 5 Can be used even if the dimensions change slightly.
[0035]
<Second Embodiment>
FIG. 3 is a side sectional view showing a second embodiment of the present invention. The difference from the first embodiment is a configuration for attaching the bracket cover 7 to the fixed block 6. Specifically, female screw holes 6c having a predetermined depth are formed on both side surfaces of the fixing block 6, and screw attachment holes 7c having cover mounting screws 13 in the bracket cover 7 are screwed into the female screw holes 6c. It is made to let you.
[0036]
Since the bracket cover 7 is attached to the fixed block 6 with the cover mounting screw 13 as described above, the only tool used is a screwdriver that turns the cover mounting screw 13.
[0037]
<Third Embodiment>
FIG. 4 is a side sectional view showing a third embodiment of the present invention. The difference from the first embodiment is that the PGA package 3 is pressed through the heat conductor 5 and the heat conductive sheet 4. It is a configuration. Specifically, the left and right bracket covers 7 are attached with bosses 15 each having a female screw hole 15a formed on the inner peripheral surface of a cylindrical boss body. The bracket cover 7 has a through hole 7a and a fixed block. 6 is formed with a screw insertion hole 6b.
[0038]
The pressing screw 16 is screwed into the female screw hole 15 a of the boss 15 having such a configuration, and the screw insertion hole 6 b is inserted into the fixing block 6, and the tip of the pressing screw 16 is connected to the heat conductor 5. It comes to contact.
[0039]
As a result, the same effect as the above-described embodiment can be obtained.
<Fourth Embodiment>
FIG. 5 is a side sectional view showing the fourth embodiment of the present invention. The difference from the first embodiment is that the PGA package 3 is pressed through the heat conductor 5 and the heat conductive sheet 4. It is a configuration. Specifically, through holes 7a are formed in the left and right bracket covers 7, and female screw holes 6a are formed in the fixing block 6. The through holes 7a and the female screw holes 6a are threaded only at the front ends as shown in FIG. A pressing screw 17 formed with a portion 17a is inserted and screwed together.
[0040]
Thus, since the pressing screw 17 having the screw portion 17a only at the tip portion is used, a constant contact pressure can be obtained without managing the screw stroke. That is, with a screw having a long threaded portion, the screw can be tightened at all the lengths of the threaded portion, and thus there is a possibility that excessive pressing force is applied to the heat conductor 5, but in this embodiment, Since the working screw 17 is used, the screw cannot be tightened before a certain position, and an excessive pressing force can be avoided.
[0041]
Other functions and effects are the same as those in the above-described embodiment.
<Fifth Embodiment>
FIG. 7 is a side sectional view showing a fifth embodiment of the present invention. The difference from the first embodiment is that the PGA package 3 is pressed through the heat conductor 5 and the heat conductive sheet 4. It is a configuration. Specifically, a through hole 7a is formed in the bracket cover 7, and a pressing part insertion hole 6e is formed in the fixed block 6. A pressing part 18 shown in FIG. 8 is inserted into the through hole 7a and the pressing part insertion hole 6e. ing. The pressing part 18 has a notch 18b formed at the tip, and has a hook part 18a spreading on both sides across the notch 18b. When the pressing screw 18 is inserted into the through hole 7a and the pressing part insertion hole 6e, the hook portion 18a is narrowed with the notch 18b interposed therebetween. However, when the hook portion 18a protrudes from the fixed block 6, the hook portion 18a Since the front end interval of the hook portion 18a is widened by the restoring force, the pressing component 18 does not come out of the fixed block 6, and the front end portion of the hook portion 18a of the pressing component 18 is in contact with the heat conductor 5. The conductor 5 and the PGA package 3 are in contact with each other with a predetermined contact pressure via the heat conductive sheet 4.
[0042]
In this embodiment, since the PGA package 3 is pressed by the pressing component 18 via the heat conductor 5 and the heat conductive sheet 4, a constant contact pressure can be obtained with one touch without managing the stroke. As a result, since the work can be performed with one touch, the assembly cost can be reduced.
[0043]
Except for the functions and effects described above, the same functions and effects as those of the above-described embodiment can be obtained.
<Sixth Embodiment>
FIG. 9 is a side sectional view showing a sixth embodiment of the present invention. The difference from the first embodiment is that a plate-like heat pipe 20 is used instead of the heat conductor 5 and the heat pipe 20 is fixed. The block 6 is pressed.
[0044]
Specifically, a long hole 6f having a substantially racetrack cross section is formed in the fixed block 6, a cover mounting screw 8 is inserted into the long hole 6f, and a cover mounting nut 9 is provided at the tip of the cover mounting screw 8. The point to be screwed is the same as in the first embodiment.
[0045]
The left and right bracket covers 7 are each provided with a boss 15 having a female screw hole 15a formed on the inner peripheral surface of the cylindrical boss body, and the bracket cover 7 has a through hole 7a.
[0046]
The pressing screw 16 is screwed into the female screw hole 15 a of the boss 15 having such a configuration, and the tip of the pressing screw 16 comes into contact with the upper surface of the fixed block 6.
Therefore, by adjusting the protruding length of the pressing screw 16, the fixed block 6 moves down along the long hole 6f, and the heat pipe 20 can be pressed by the uniform surface of the fixed block 6. As a result, the flow of the working fluid inside the heat pipe 20 is hindered, and the heat pipe 20 can be brought into close contact with the PGA package 3 via the heat conductive sheet 4 without deteriorating the cooling performance.
[0047]
<Seventh Embodiment>
As an embodiment shown in FIG. 7, the pressing screw 16 shown in FIG. 9 is elongated as shown in FIG. 4, and a screw insertion hole 6b is formed in the fixed block 6 so that the pressing surface of the heat pipe 20 is pressed against the surface. You may make it provide the metal plate which is a member.
[0048]
In this embodiment, the same effect as that of the sixth embodiment can be obtained.
<Eighth Embodiment>
FIG. 10 is a front sectional view showing an eighth embodiment of the present invention. The difference from the first embodiment is only the configuration for attaching the heat conductor 5 to the device storage case 12. That is, a substantially L-shaped fixture 21 is fixed to the device storage case 12, and the end of the heat conductor 5 is attached to the fixture 21. This embodiment can provide the same effects as those of the previous embodiment.
[0049]
【The invention's effect】
According to the present invention described above, when a heat conductor or a heat pipe is mechanically mounted on a heat generating component, no special processing is required for the printed circuit board, and the impact resistance performance is less dependent on the direction and changes over time. Therefore, it is possible to provide a heat-generating component device that can maintain a sufficient contact pressure without being damaged, can flexibly cope with various shapes of heat-generating components and heat conductors, and can be manufactured at low cost.
[Brief description of the drawings]
FIG. 1 is a perspective view showing a first embodiment of a heat-generating component device according to the present invention.
FIG. 2 is a side sectional view of FIG.
FIG. 3 is a front sectional view showing a second embodiment of the heat generating component device of the present invention.
FIG. 4 is a front sectional view showing a third embodiment of the heat generating component device of the present invention.
FIG. 5 is a front sectional view showing a fourth embodiment of the heat generating component device of the present invention.
6 is an enlarged front view showing the pressing screw of FIG. 5;
FIG. 7 is a front sectional view showing a fifth embodiment of the heat generating component device of the present invention.
FIG. 8 is an enlarged front view showing the pressing component of FIG.
FIG. 9 is a front sectional view showing a sixth embodiment of the heat generating component device of the present invention.
FIG. 10 is a side sectional view showing a seventh embodiment of the heat generating component device of the present invention.
FIG. 11 is a view for explaining a first example of a conventional heat generating component device.
FIG. 12 is an exploded perspective view for explaining a second example of a conventional heat generating component device.
FIG. 13 is an exploded perspective view for explaining a third example of a conventional heat generating component device.
FIG. 14 is a view for explaining a fourth example of a conventional heat generating component device.
FIG. 15 is an exploded perspective view for explaining a fifth example of a conventional heat generating component device.
[Explanation of symbols]
DESCRIPTION OF SYMBOLS 1 ... Printed circuit board 2 ... PGA socket 3 ... PGA package 4 ... Thermally conductive sheet 5 ... Thermal conductor 6 ... Fixed block 7 ... Bracket cover 8 ... Cover attaching screw 9 ... Cover attaching nut 10 ... Pressing screw 11 ... Fixing screw 12 ... Device storage case 13 ... Cover mounting screw 16 ... Pressing screw 17 ... Pressing screw 18 ... Pressing component 20 ... Heat pipe 21 ... Mounting tool

Claims (7)

A heat generating component is directly or indirectly mounted on a printed circuit board, and has a heat conductive sheet with good heat conductivity, a plate-like heat conductor with good heat conductivity, a fixing block , The first and second bracket covers, cover fixing means, and a plurality of pressing means,
The first and second bracket covers are each composed of an upper wall portion and a lower wall portion that face each other, and a connecting wall portion that connects the upper wall portion and the lower wall portion,
The cover fixing means includes the first and second bracket covers at both ends of the heat generating component in a state where the heat conductive sheet, the heat conductor, and the fixing block are sequentially in contact with each other. And sandwiching the first and second bracket cover to the fixed block,
Each of the pressing means penetrates the first bracket cover and the fixed block and the second bracket cover and the fixed block, respectively, and allows the protruding length from the fixed block to be arbitrarily adjusted. And
Wherein by adjusting the protruding length of the pressing means, the heat generating component device which is characterized by providing a pressing force against the turn the heat generating component through the thermally conductive sheet and the heat conductor. The printed circuit board, the heat generating component be one which directly or indirectly attached, the good thermal conductive sheet thermal conductivity, and good plate-shaped heat pipe thermally conductive, and the fixed block, the The first and second bracket covers, cover fixing means, and a plurality of pressing means,
The first and second bracket covers are each composed of an upper wall portion and a lower wall portion that face each other, and a connecting wall portion that connects the upper wall portion and the lower wall portion,
The cover fixing means sandwiches the first and second bracket covers at both ends of the heat generating component in a state where the heat conductive sheet, the heat pipe, and the fixing block are sequentially in contact with each other. And fixing the first and second bracket covers to the fixing block,
Each of the pressing means penetrates the first bracket cover and the fixed block and the second bracket cover and the fixed block, respectively, and allows the protruding length from the fixed block to be arbitrarily adjusted. And
Wherein by adjusting the protruding length of the pressing means, the heat generating component device was characterized to give a pressing force to the heat generating component sequentially through the thermally conductive sheet and the heat pipe. A heat-generating component is mounted directly or indirectly on a printed circuit board, and has a heat-conductive sheet with good heat conductivity, a plate-shaped heat pipe with good heat-conductivity, and a holding member. A block , first and second bracket covers, cover fixing means, and a plurality of pressing means;
The first and second bracket covers are each composed of an upper wall portion and a lower wall portion that face each other, and a connecting wall portion that connects the upper wall portion and the lower wall portion,
The cover fixing means is in a state where the heat conductive sheet, the heat pipe, the pressing member, and the fixing block are sequentially in contact with the heat generating component, and the first and second end portions thereof are in contact with each other. While sandwiching the bracket covers, respectively, the first and second bracket covers are fixed to the fixing block,
Each of the pressing means penetrates the first bracket cover and the fixed block and the second bracket cover and the fixed block, respectively, and allows the protruding length from the fixed block to be arbitrarily adjusted. And
A heat generating component device that applies a pressing force to the heat generating component through the pressing member, the heat pipe, and the heat conductive sheet in order by adjusting the protruding length of each pressing means .   The pressing means is formed at least at the lower part of a through hole formed in the up-down direction of the fixed block, and is therefore screwed into the threaded portion through the bracket cover, so that the threaded portion is formed at least at the tip portion. The heat-generating component device according to claim 1 or 3, comprising a pressing screw.   The pressing means is integrally formed on the upper surface of the bracket cover, and is formed into a cylindrical boss having an internal thread formed on the inner peripheral surface of the hole, and is screwed to the boss, and is attached to the fixed block. The heat generating component device according to claim 1, comprising a pressing screw that penetrates the formed through hole.   The pressing means includes a cylindrical boss formed integrally with the upper surface of the bracket cover and having a female screw portion formed on the inner peripheral surface of the hole, and a pressing screw screwed into the boss. Item 3. The heat generating component device according to Item 2.   The heat generating component device according to claim 1 or 3, wherein the pressing means includes a pressing member that has a hook portion that is inserted into a through hole formed in the bracket cover and the fixed block and has a spring property at a tip.

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