JPH0497535A - Manufacture of semiconductor device - Google Patents
Manufacture of semiconductor deviceInfo
- Publication number
- JPH0497535A JPH0497535A JP21608390A JP21608390A JPH0497535A JP H0497535 A JPH0497535 A JP H0497535A JP 21608390 A JP21608390 A JP 21608390A JP 21608390 A JP21608390 A JP 21608390A JP H0497535 A JPH0497535 A JP H0497535A
- Authority
- JP
- Japan
- Prior art keywords
- resin
- semiconductor device
- cavity
- width
- stop block
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000004065 semiconductor Substances 0.000 title claims abstract description 13
- 238000004519 manufacturing process Methods 0.000 title claims description 7
- 229920005989 resin Polymers 0.000 claims abstract description 44
- 239000011347 resin Substances 0.000 claims abstract description 44
- 238000003780 insertion Methods 0.000 claims abstract description 10
- 230000037431 insertion Effects 0.000 claims abstract description 10
- 238000007789 sealing Methods 0.000 claims abstract description 7
- 238000000034 method Methods 0.000 claims description 4
- 238000000465 moulding Methods 0.000 abstract description 16
- 239000002245 particle Substances 0.000 description 4
- 239000003822 epoxy resin Substances 0.000 description 3
- 229920000647 polyepoxide Polymers 0.000 description 3
- 238000007796 conventional method Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明は半導体装置の製造方法に関し、特に樹脂封止型
の半導体装置の製造方法に関する。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a method of manufacturing a semiconductor device, and particularly to a method of manufacturing a resin-sealed semiconductor device.
従来の樹脂封止型の半導体装置の製造方法は、第３図、
第４図に示すように、半導体素子７を搭載したリードフ
レームの外部リード６−１．−・、の一部を、一定の温
度に加熱した成形金型の上型５−２．下型５−１を用い
て上下から押え、キャビティ２に熱硬化性のエポキシ樹
脂を流入させて成形封止して完成させていた。The conventional method for manufacturing a resin-sealed semiconductor device is shown in FIG.
As shown in FIG. 4, external leads 6-1. -, a part of the upper mold 5-2 of the molding die is heated to a constant temperature. The lower mold 5-1 was used to press down from above and below, and thermosetting epoxy resin was flowed into the cavity 2 to complete the molding and sealing.
この際、流入したエポキシ樹脂がリードフレームの板厚
分だけ流出して、外部導出リードの間に樹脂膜として発
生するのを防ぐため、従来は成形金型の、外部リードを
除いたキャビティ周囲にリードフレームの板厚に相当す
る凸状の樹脂止めブロックを設けることが行なわれてい
る。At this time, in order to prevent the inflowing epoxy resin from flowing out by the thickness of the lead frame and forming a resin film between the external leads, conventionally the epoxy resin was placed around the cavity of the molding die, excluding the external leads. A convex resin stopper block corresponding to the thickness of the lead frame is provided.
上述した従来の樹脂封止方法は、成形金型に、外部リー
ドの全面に沿って凸状の樹脂止めブロックを設けである
ので、外部リードと凸状の樹脂止めブロックのクリアラ
ンスの分だけ、リード側面全面に樹脂パリが付着すると
いう欠点がある。In the conventional resin sealing method described above, a convex resin stopper block is provided in the molding mold along the entire surface of the external lead, so the lead is closed by the clearance between the external lead and the convex resin stopper block. There is a drawback that resin particles adhere to the entire side surface.
本発明の半導体装置の製造方法は、リードフレームの外
部リードを挿入する外部リード挿入部を有する樹脂止め
ブロックの前記外部リード挿入部の幅が０．２〜０．３
ｍｍである成形金型を用いて樹脂封止を行なう工程を有
するというものである。In the semiconductor device manufacturing method of the present invention, the width of the external lead insertion portion of the resin stopper block having the external lead insertion portion into which the external lead of the lead frame is inserted is 0.2 to 0.3.
The method includes a step of performing resin sealing using a molding die having a diameter of 1.5 mm.
外部リードと成形金型の凸状の樹脂止めブロックのクリ
アランスの分だけ、リード側面に樹脂パリは付着するが
、樹脂止めブロックの先は、金型で押えていないためリ
ード側面への樹脂パリ付着はなくなる。従ってその樹脂
パリの長さは樹脂止めブロックの幅の０．２〜０．３ｍ
ｍ前後となり、はとんど問題とならなくなる。Due to the clearance between the external lead and the convex resin stopper block of the molding die, resin particles adhere to the side surfaces of the leads, but since the tips of the resin stopper blocks are not held down by the mold, resin particles adhere to the sides of the leads. will disappear. Therefore, the length of the resin stopper is 0.2 to 0.3 m of the width of the resin stopper block.
It will be around m, and will hardly be a problem.
次に、本発明について図面を参照して説明する。 Next, the present invention will be explained with reference to the drawings.
第３図は、リードフレーム上に半導体素子が接続された
状態を示す斜視図で、第１図はこのリードフレームが樹
脂封止のために入る本発明の一実施例で使用する成形金
型の斜視図である。FIG. 3 is a perspective view showing a semiconductor element connected to a lead frame, and FIG. 1 is a molding die used in an embodiment of the present invention into which this lead frame is inserted for resin sealing. FIG.
この成形金型は樹脂の流入するキャビティ２の周囲に、
外部リード挿入部１−１〜１−３及び樹脂の流入するゲ
ート３を除いた全面に凸状の樹脂止めブロック４ａを設
けてあり、かつこの樹脂止めブロック４ａはキャビティ
２の近傍にのみ設けてあり、その幅Ｗは外部リード挿入
部１−１〜１−３で０．２〜０．３ｍｍ程度になってい
る。ゲート３よりキャビティ２に樹脂を注入して、樹脂
を固化することによって樹脂封止半導体装置が得られる
。This mold has around the cavity 2 into which the resin flows.
A convex resin stopper block 4a is provided on the entire surface except for the external lead insertion parts 1-1 to 1-3 and the gate 3 through which the resin flows, and this resin stopper block 4a is provided only in the vicinity of the cavity 2. The width W of the external lead insertion portions 1-1 to 1-3 is approximately 0.2 to 0.3 mm. A resin-sealed semiconductor device is obtained by injecting resin into the cavity 2 through the gate 3 and solidifying the resin.
なお、第２図に示すように、樹脂止めブロック４ｂはキ
ャビティ２の近傍のみ外部リードに沿っておりその幅が
０．２〜０．３ｍｍ程度であり、その先はテーパー状に
末広がりにしてもよい。そうすると、成形金型の強度が
増し、使用中破損しにくいという利点がある。As shown in FIG. 2, the resin stopper block 4b extends along the external lead only in the vicinity of the cavity 2, and its width is about 0.2 to 0.3 mm, and even if the end thereof is tapered and widened at the end, good. This has the advantage that the strength of the molding die increases and it is less likely to be damaged during use.
以上説明したような成形金型を用いる半導体装置の製造
方法は、樹脂止めブロックの先は金型て押えていないた
め半導体装置の外部リードに、金型の樹脂止めブロック
の幅の程度しか樹脂パリか付着せず、樹脂パリをほとん
と問題とならなくなる長さに押えることができる効果が
ある。In the semiconductor device manufacturing method using a molding die as described above, the tip of the resin stopper block is not held down by the mold, so the external leads of the semiconductor device are only made of resin that is about the same width as the resin stopper block of the mold. It has the effect of being able to hold the resin particles to a length that hardly causes any problems, without causing any adhesion.
第１図は本発明の一実施例の使用する成形金型の下型の
構造を示す斜視図、第２図は同じく成形金型の下型の変
形例の斜視図、家な第３図はこの成形金型に入って樹脂
封止されるリードフレームを示す斜視図、第４図はリー
ドフレームを成形金型に装着した状態の断面図である。
１−１〜１−３・・・成形金型の外部リード挿入、２・
・・成形金型のキャビティ、３・・・成形金型のゲート
、４・・・樹脂止めブロック、５−１・・・下型、５−
２・・・上型、６−１〜６−３・・・外部リード、７・
・・半導体素子、８・・・金属細線。
桟部５ビ、ゴ；二原晋
熟 １ 図
ｂ
ｌ
！
兎
四
刀
霧FIG. 1 is a perspective view showing the structure of the lower mold of a molding die used in an embodiment of the present invention, FIG. 2 is a perspective view of a modified example of the lower mold of the molding mold, and FIG. FIG. 4 is a perspective view showing the lead frame which is inserted into the mold and sealed with resin, and a sectional view of the lead frame installed in the mold. 1-1 to 1-3... Insertion of external lead into molding die, 2.
...Molding mold cavity, 3...Molding mold gate, 4...Resin stopper block, 5-1...Lower mold, 5-
2... Upper mold, 6-1 to 6-3... External lead, 7.
...Semiconductor element, 8...Thin metal wire. Sambe 5 Bi, Go; Shinjuku Nihara 1 Figure b l! Rabbit Four Swords Mist
Claims (1)
入部を有する樹脂止めブロックの前記外部リード挿入部
の幅が０．２〜０．３ｍｍである成形金型を用いて樹脂
封止を行なう工程を有することを特徴とする半導体装置
の製造方法。The method includes the step of performing resin sealing using a mold in which the width of the external lead insertion part of the resin stopper block having an external lead insertion part into which the external lead of the lead frame is inserted is 0.2 to 0.3 mm. A method for manufacturing a semiconductor device, characterized by:
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2216083A JP2716252B2 (en) | 1990-08-16 | 1990-08-16 | Method for manufacturing semiconductor device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2216083A JP2716252B2 (en) | 1990-08-16 | 1990-08-16 | Method for manufacturing semiconductor device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0497535A true JPH0497535A (en) | 1992-03-30 |
| JP2716252B2 JP2716252B2 (en) | 1998-02-18 |
Family
ID=16682988
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2216083A Expired - Fee Related JP2716252B2 (en) | 1990-08-16 | 1990-08-16 | Method for manufacturing semiconductor device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2716252B2 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2020126902A (en) * | 2019-02-01 | 2020-08-20 | 第一精工株式会社 | Resin sealing device and resin sealing method |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5217769A (en) * | 1976-08-09 | 1977-02-09 | Toshiba Corp | Production method of semi-conductor device |
| JPS53104171A (en) * | 1977-02-23 | 1978-09-11 | Hitachi Ltd | Mold for semiconductor device |
-
1990
- 1990-08-16 JP JP2216083A patent/JP2716252B2/en not_active Expired - Fee Related
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5217769A (en) * | 1976-08-09 | 1977-02-09 | Toshiba Corp | Production method of semi-conductor device |
| JPS53104171A (en) * | 1977-02-23 | 1978-09-11 | Hitachi Ltd | Mold for semiconductor device |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2020126902A (en) * | 2019-02-01 | 2020-08-20 | 第一精工株式会社 | Resin sealing device and resin sealing method |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2716252B2 (en) | 1998-02-18 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| LAPS | Cancellation because of no payment of annual fees |