JPS5745961A - Resin-sealed semiconductor device - Google Patents

Resin-sealed semiconductor device

Info

Publication number
JPS5745961A
JPS5745961A JP12265780A JP12265780A JPS5745961A JP S5745961 A JPS5745961 A JP S5745961A JP 12265780 A JP12265780 A JP 12265780A JP 12265780 A JP12265780 A JP 12265780A JP S5745961 A JPS5745961 A JP S5745961A
Authority
JP
Japan
Prior art keywords
resin
slits
semiconductor device
sealed
heat dissipating
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP12265780A
Other languages
Japanese (ja)
Inventor
Kazuo Terakawa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Tokyo Shibaura Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp, Tokyo Shibaura Electric Co Ltd filed Critical Toshiba Corp
Priority to JP12265780A priority Critical patent/JPS5745961A/en
Publication of JPS5745961A publication Critical patent/JPS5745961A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
    • H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)

Abstract

PURPOSE:To effectively prevent the introduction of water from the exterior by forming slits at a heat dissipating plate sealed with resin and forming a resin barrier passing through the slits. CONSTITUTION:Three slits 151-153 are arranged along the widthwise direction of a heat dissipating plate 11 at the part sealed with resin 13 between the semiconductor element section at the center of the plate 11 and the exposed part, and resin barriers are formed elevationally through the respective slits with the resin 13. Thus, the introduction passage of the water can be largely prolonged to increase the shielding effect.
JP12265780A 1980-09-04 1980-09-04 Resin-sealed semiconductor device Pending JPS5745961A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP12265780A JPS5745961A (en) 1980-09-04 1980-09-04 Resin-sealed semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP12265780A JPS5745961A (en) 1980-09-04 1980-09-04 Resin-sealed semiconductor device

Publications (1)

Publication Number Publication Date
JPS5745961A true JPS5745961A (en) 1982-03-16

Family

ID=14841394

Family Applications (1)

Application Number Title Priority Date Filing Date
JP12265780A Pending JPS5745961A (en) 1980-09-04 1980-09-04 Resin-sealed semiconductor device

Country Status (1)

Country Link
JP (1) JPS5745961A (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6322747U (en) * 1986-07-30 1988-02-15
JPS63279014A (en) * 1987-03-18 1988-11-16 ル・エール・リクイツド・ソシエテ・アノニム・プール・ル・エチユド・エ・ル・エクスプルワテシヨン・デ・プロセデ・ジエオルジエ・クロード Method and device for decomposing noxious outflow gas
US5068712A (en) * 1988-09-20 1991-11-26 Hitachi, Ltd. Semiconductor device
US5863817A (en) * 1988-09-20 1999-01-26 Hitachi, Ltd. Semiconductor device

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4945447B1 (en) * 1968-11-01 1974-12-04

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4945447B1 (en) * 1968-11-01 1974-12-04

Cited By (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6322747U (en) * 1986-07-30 1988-02-15
JPS63279014A (en) * 1987-03-18 1988-11-16 ル・エール・リクイツド・ソシエテ・アノニム・プール・ル・エチユド・エ・ル・エクスプルワテシヨン・デ・プロセデ・ジエオルジエ・クロード Method and device for decomposing noxious outflow gas
US6130114A (en) * 1988-03-20 2000-10-10 Hitachi, Ltd. Semiconductor device
US6081023A (en) * 1988-03-20 2000-06-27 Hitachi, Ltd. Semiconductor device
US6072231A (en) * 1988-03-20 2000-06-06 Hitachi, Ltd. Semiconductor device
US5914530A (en) * 1988-09-20 1999-06-22 Hitachi, Ltd. Semiconductor device
US6100115A (en) * 1988-09-20 2000-08-08 Hitachi, Ltd. Semiconductor device
US6018191A (en) * 1988-09-20 2000-01-25 Hitachi, Ltd. Semiconductor device
US6069029A (en) * 1988-09-20 2000-05-30 Hitachi, Ltd. Semiconductor device chip on lead and lead on chip manufacturing
US5863817A (en) * 1988-09-20 1999-01-26 Hitachi, Ltd. Semiconductor device
US5358904A (en) * 1988-09-20 1994-10-25 Hitachi, Ltd. Semiconductor device
US6100580A (en) * 1988-09-20 2000-08-08 Hitachi, Ltd. Semiconductor device having all outer leads extending from one side of a resin member
US5981315A (en) * 1988-09-20 1999-11-09 Hitachi, Ltd. Semiconductor device
US6124629A (en) * 1988-09-20 2000-09-26 Hitachi, Ltd. Semiconductor device including a resin sealing member which exposes the rear surface of the sealed semiconductor chip
US5068712A (en) * 1988-09-20 1991-11-26 Hitachi, Ltd. Semiconductor device
US6303982B2 (en) 1988-09-20 2001-10-16 Hitachi, Ltd. Semiconductor device
US6326681B1 (en) 1988-09-20 2001-12-04 Hitachi, Ltd Semiconductor device
US6531760B1 (en) 1988-09-20 2003-03-11 Gen Murakami Semiconductor device
US6720208B2 (en) 1988-09-20 2004-04-13 Renesas Technology Corporation Semiconductor device
US6919622B2 (en) 1988-09-20 2005-07-19 Renesas Technology Corp. Semiconductor device

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