JPS57103341A - Resin sealed semiconductor device - Google Patents

Resin sealed semiconductor device

Info

Publication number
JPS57103341A
JPS57103341A JP56174579A JP17457981A JPS57103341A JP S57103341 A JPS57103341 A JP S57103341A JP 56174579 A JP56174579 A JP 56174579A JP 17457981 A JP17457981 A JP 17457981A JP S57103341 A JPS57103341 A JP S57103341A
Authority
JP
Japan
Prior art keywords
leads
tab
holes
outer frames
resin
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP56174579A
Other languages
Japanese (ja)
Other versions
JPS5750068B2 (en
Inventor
Sadao Ogura
Kazuo Hoya
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP56174579A priority Critical patent/JPS57103341A/en
Publication of JPS57103341A publication Critical patent/JPS57103341A/en
Publication of JPS5750068B2 publication Critical patent/JPS5750068B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H01L23/49541—Geometry of the lead-frame
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/491—Disposition
    • H01L2224/4912—Layout
    • H01L2224/49171—Fan-out arrangements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation

Abstract

PURPOSE:To eliminate the floating and lateral displacement of a tab lead by forming a strain absorbing hole at a part of the tab lead forming a lead frame, thereby absorbing the thermal strain produced at the resin sealing time by the deformation of the hole. CONSTITUTION:Parallel leads 4 are formed via a dam 4 for preventing the resin flow between parallel outer frames at both sides of the lead frame 1, and a plurality of leads are projected from the leads 4 toward the tab 5 of the supporting member for placing a semiconductor element 6 disposed between two leads 4. When the tab 5 disposed between the leads is supported by the tab leads 8, 8' bridged between the outer frames, strain absorbing holes 9, 9' are formed at the positions where the leads 8, 8' approaching the outer frames. That is, the holes 9, 9' are annularly formed at the branches A, A'. Thus, the thermal strain caused at the time of sealing the element 6 with resin can be absorbed by the deformation of the holes 9, 9', and floating and displacement do not occur at the leads, 8, 8'.
JP56174579A 1981-11-02 1981-11-02 Resin sealed semiconductor device Granted JPS57103341A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP56174579A JPS57103341A (en) 1981-11-02 1981-11-02 Resin sealed semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP56174579A JPS57103341A (en) 1981-11-02 1981-11-02 Resin sealed semiconductor device

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
JP10208574A Division JPS5129086A (en) 1974-09-06 1974-09-06 RIIDOFUREEMU

Publications (2)

Publication Number Publication Date
JPS57103341A true JPS57103341A (en) 1982-06-26
JPS5750068B2 JPS5750068B2 (en) 1982-10-25

Family

ID=15981018

Family Applications (1)

Application Number Title Priority Date Filing Date
JP56174579A Granted JPS57103341A (en) 1981-11-02 1981-11-02 Resin sealed semiconductor device

Country Status (1)

Country Link
JP (1) JPS57103341A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04350960A (en) * 1991-05-28 1992-12-04 Fuji Xerox Co Ltd Semiconductor package

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6076273U (en) * 1983-10-31 1985-05-28 リズム時計工業株式会社 Car clock battery voltage display device

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4964373A (en) * 1972-06-23 1974-06-21

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4964373A (en) * 1972-06-23 1974-06-21

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04350960A (en) * 1991-05-28 1992-12-04 Fuji Xerox Co Ltd Semiconductor package

Also Published As

Publication number Publication date
JPS5750068B2 (en) 1982-10-25

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