JPS52142966A - Production of ceramic package sealed semiconductor device - Google Patents
Production of ceramic package sealed semiconductor deviceInfo
- Publication number
- JPS52142966A JPS52142966A JP5911676A JP5911676A JPS52142966A JP S52142966 A JPS52142966 A JP S52142966A JP 5911676 A JP5911676 A JP 5911676A JP 5911676 A JP5911676 A JP 5911676A JP S52142966 A JPS52142966 A JP S52142966A
- Authority
- JP
- Japan
- Prior art keywords
- production
- semiconductor device
- ceramic package
- sealed semiconductor
- package sealed
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Lead Frames For Integrated Circuits (AREA)
Abstract
PURPOSE: To increase the tightness of the bonding faces between package and cap by lapping together the ceramic package and ceramic cap fixed with a semiconductor element, holding their side faces with a resin frame unit, then thermally setting the frame unit.
COPYRIGHT: (C)1977,JPO&Japio
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP5911676A JPS52142966A (en) | 1976-05-24 | 1976-05-24 | Production of ceramic package sealed semiconductor device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP5911676A JPS52142966A (en) | 1976-05-24 | 1976-05-24 | Production of ceramic package sealed semiconductor device |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS52142966A true JPS52142966A (en) | 1977-11-29 |
Family
ID=13104011
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP5911676A Pending JPS52142966A (en) | 1976-05-24 | 1976-05-24 | Production of ceramic package sealed semiconductor device |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS52142966A (en) |
-
1976
- 1976-05-24 JP JP5911676A patent/JPS52142966A/en active Pending
Similar Documents
Publication | Publication Date | Title |
---|---|---|
CA1017071A (en) | Plastic power semiconductor flip chip package | |
JPS5315763A (en) | Resin sealed type semiconductor device | |
JPS52142966A (en) | Production of ceramic package sealed semiconductor device | |
JPS5372456A (en) | Glass sealing semiconductor device | |
JPS533165A (en) | Wire bonding apparatus | |
JPS53135579A (en) | Liquid sealing semiconductor device | |
JPS5275180A (en) | Package for integrated circuits | |
JPS51126764A (en) | Resin sealed semiconductor unit manufacturing process | |
JPS5325360A (en) | Production of semiconductor device | |
JPS5364470A (en) | Lead frame of semiconductor device | |
JPS5385160A (en) | Production of semiconductor device | |
JPS5374368A (en) | Package for semiconductor device | |
JPS5347770A (en) | Production of semiconductor device | |
JPS5314560A (en) | Production of semiconductor device | |
JPS5460564A (en) | Resin mold semiconductor device | |
JPS54579A (en) | Resin seal semiconductor device | |
JPS54578A (en) | Resin seal semiconductor device | |
JPS538567A (en) | Sealing structure of semiconductor device | |
JPS5364495A (en) | Ceramic case for thermoelectric transducer | |
JPS51144179A (en) | Element fixing method in semiconductor unit | |
JPS5291647A (en) | Production of semiconductor device | |
JPS5370766A (en) | Semiconductor device | |
JPS5212574A (en) | Pellet bonding device | |
JPS5394769A (en) | Manufacture of semiconductor device | |
JPS5367358A (en) | Semiconductor device |