JPS5736852A - Circuit substrate and manufacture thereof - Google Patents

Circuit substrate and manufacture thereof

Info

Publication number
JPS5736852A
JPS5736852A JP11241780A JP11241780A JPS5736852A JP S5736852 A JPS5736852 A JP S5736852A JP 11241780 A JP11241780 A JP 11241780A JP 11241780 A JP11241780 A JP 11241780A JP S5736852 A JPS5736852 A JP S5736852A
Authority
JP
Japan
Prior art keywords
projection
pad
inner lead
hardness
gold
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP11241780A
Other languages
Japanese (ja)
Inventor
Kazuyoshi Haniwara
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Seiko Epson Corp
Suwa Seikosha KK
Original Assignee
Seiko Epson Corp
Suwa Seikosha KK
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Seiko Epson Corp, Suwa Seikosha KK filed Critical Seiko Epson Corp
Priority to JP11241780A priority Critical patent/JPS5736852A/en
Publication of JPS5736852A publication Critical patent/JPS5736852A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/79—Apparatus for Tape Automated Bonding [TAB]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/50—Tape automated bonding [TAB] connectors, i.e. film carriers; Manufacturing methods related thereto
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/45001—Core members of the connector
    • H01L2224/45099—Material
    • H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
    • H01L2224/45117—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 400°C and less than 950°C
    • H01L2224/45124—Aluminium (Al) as principal constituent
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/50—Tape automated bonding [TAB] connectors, i.e. film carriers; Manufacturing methods related thereto
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01013—Aluminum [Al]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01029—Copper [Cu]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01079—Gold [Au]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01082—Lead [Pb]

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Wire Bonding (AREA)

Abstract

PURPOSE:To enable the fixture of an inner lead to the pad of an IC at a low temperature under high pressure by hardening the hardness of the inner lead secured to the pad of the IC harder than copper. CONSTITUTION:Gold is plated partly or entirely on the projection 111 of an inner lead 100 in such a manner that the strength is higher than 90 of Vickers hardness, gold is thinly plated on the aluminum surface of an aluminum wire 202 on the IC pad 200, the projection 101 and the IC pad 200 are positioned, and are thermally pressed. Since the hardness of the projection is thus hardened, the projection is not crushed, and is not accordingly contacted with an insulating film 201, thereby eliminating the damage of the film, and since the pressure can be enhanced at the time of thermally pressing, its temperature can be lowered, thereby eliminating the damage under the aluminum wire. Since the crushed amount of the projection is constant, the contacting area can be constant and the projection can be stably bonded.
JP11241780A 1980-08-15 1980-08-15 Circuit substrate and manufacture thereof Pending JPS5736852A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP11241780A JPS5736852A (en) 1980-08-15 1980-08-15 Circuit substrate and manufacture thereof

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP11241780A JPS5736852A (en) 1980-08-15 1980-08-15 Circuit substrate and manufacture thereof

Publications (1)

Publication Number Publication Date
JPS5736852A true JPS5736852A (en) 1982-02-27

Family

ID=14586121

Family Applications (1)

Application Number Title Priority Date Filing Date
JP11241780A Pending JPS5736852A (en) 1980-08-15 1980-08-15 Circuit substrate and manufacture thereof

Country Status (1)

Country Link
JP (1) JPS5736852A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61134228A (en) * 1984-12-04 1986-06-21 Diafoil Co Ltd Manufacture of biaxial oriented polyester film
EP0917211A3 (en) * 1997-11-17 1999-11-17 Canon Kabushiki Kaisha Moldless semiconductor device and photovoltaic device module making use of the same

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61134228A (en) * 1984-12-04 1986-06-21 Diafoil Co Ltd Manufacture of biaxial oriented polyester film
JPH0449452B2 (en) * 1984-12-04 1992-08-11 Daiafoil
EP0917211A3 (en) * 1997-11-17 1999-11-17 Canon Kabushiki Kaisha Moldless semiconductor device and photovoltaic device module making use of the same
US6316832B1 (en) * 1997-11-17 2001-11-13 Canon Kabushiki Kaisha Moldless semiconductor device and photovoltaic device module making use of the same
AU753126B2 (en) * 1997-11-17 2002-10-10 Canon Kabushiki Kaisha Moldless semiconductor device and photovoltaic device module making use of the same
KR100401313B1 (en) * 1997-11-17 2003-11-15 캐논 가부시끼가이샤 Moldless semiconductor device and photovoltaic device module making use of the same

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