JPS558363A - Thermocompression bonding method - Google Patents
Thermocompression bonding methodInfo
- Publication number
- JPS558363A JPS558363A JP8131078A JP8131078A JPS558363A JP S558363 A JPS558363 A JP S558363A JP 8131078 A JP8131078 A JP 8131078A JP 8131078 A JP8131078 A JP 8131078A JP S558363 A JPS558363 A JP S558363A
- Authority
- JP
- Japan
- Prior art keywords
- bonding
- gold
- sheet
- terminal
- thicknesses
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Pressure Welding/Diffusion-Bonding (AREA)
- Wire Bonding (AREA)
Abstract
PURPOSE: To improve the reliability of bonding by superposing a sheet material of copper and sheet material of gold between the terminals of electronic parts and substrate conductive layer, so disposing these that the gold sheet side contacts the terminal bonding face side and performing thermocompression bonding in production o hybride integrated circuit devices, etc.
CONSTITUTION: A copper sheet 12 of thicknesses 100 to 200 μm whose surfaces are covered with metal layers 11 of gold or other for bonding of thicknesses 0.1 to 5 μm is disposed on the conductive layer 2 of a thin film substrate 7. A gold sheet 8 of thicknesses 10 to 50 μm is superposedly disposed on this copper sheet 12. Next, the terminal 3 to be bonded is positioned onto the gold sheet 8, after which a heated compression bonding tool 6 is force contacted to the bonding portion 5 of the terminal 3 for the specified time, whereby the terminal 3 and thin plate substrate are thermocompression bonded.
COPYRIGHT: (C)1980,JPO&Japio
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP8131078A JPS558363A (en) | 1978-07-03 | 1978-07-03 | Thermocompression bonding method |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP8131078A JPS558363A (en) | 1978-07-03 | 1978-07-03 | Thermocompression bonding method |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS558363A true JPS558363A (en) | 1980-01-21 |
Family
ID=13742817
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP8131078A Pending JPS558363A (en) | 1978-07-03 | 1978-07-03 | Thermocompression bonding method |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS558363A (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0891027A (en) * | 1995-10-03 | 1996-04-09 | Hitachi Ltd | Drive assisting device for automobile |
US20110131798A1 (en) * | 2009-03-05 | 2011-06-09 | Teledyne Scientific & Imaging, Llc | Microfabricated inductors with through-wafer vias |
-
1978
- 1978-07-03 JP JP8131078A patent/JPS558363A/en active Pending
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0891027A (en) * | 1995-10-03 | 1996-04-09 | Hitachi Ltd | Drive assisting device for automobile |
US20110131798A1 (en) * | 2009-03-05 | 2011-06-09 | Teledyne Scientific & Imaging, Llc | Microfabricated inductors with through-wafer vias |
US8826514B2 (en) * | 2009-03-05 | 2014-09-09 | Teledyne Scientific & Imaging, Llc | Microfabricated inductors with through-wafer vias |
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