JPS558363A - Thermocompression bonding method - Google Patents

Thermocompression bonding method

Info

Publication number
JPS558363A
JPS558363A JP8131078A JP8131078A JPS558363A JP S558363 A JPS558363 A JP S558363A JP 8131078 A JP8131078 A JP 8131078A JP 8131078 A JP8131078 A JP 8131078A JP S558363 A JPS558363 A JP S558363A
Authority
JP
Japan
Prior art keywords
bonding
gold
sheet
terminal
thicknesses
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP8131078A
Other languages
Japanese (ja)
Inventor
Hideo Okamoto
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp, Nippon Electric Co Ltd filed Critical NEC Corp
Priority to JP8131078A priority Critical patent/JPS558363A/en
Publication of JPS558363A publication Critical patent/JPS558363A/en
Pending legal-status Critical Current

Links

Landscapes

  • Pressure Welding/Diffusion-Bonding (AREA)
  • Wire Bonding (AREA)

Abstract

PURPOSE: To improve the reliability of bonding by superposing a sheet material of copper and sheet material of gold between the terminals of electronic parts and substrate conductive layer, so disposing these that the gold sheet side contacts the terminal bonding face side and performing thermocompression bonding in production o hybride integrated circuit devices, etc.
CONSTITUTION: A copper sheet 12 of thicknesses 100 to 200 μm whose surfaces are covered with metal layers 11 of gold or other for bonding of thicknesses 0.1 to 5 μm is disposed on the conductive layer 2 of a thin film substrate 7. A gold sheet 8 of thicknesses 10 to 50 μm is superposedly disposed on this copper sheet 12. Next, the terminal 3 to be bonded is positioned onto the gold sheet 8, after which a heated compression bonding tool 6 is force contacted to the bonding portion 5 of the terminal 3 for the specified time, whereby the terminal 3 and thin plate substrate are thermocompression bonded.
COPYRIGHT: (C)1980,JPO&Japio
JP8131078A 1978-07-03 1978-07-03 Thermocompression bonding method Pending JPS558363A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP8131078A JPS558363A (en) 1978-07-03 1978-07-03 Thermocompression bonding method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP8131078A JPS558363A (en) 1978-07-03 1978-07-03 Thermocompression bonding method

Publications (1)

Publication Number Publication Date
JPS558363A true JPS558363A (en) 1980-01-21

Family

ID=13742817

Family Applications (1)

Application Number Title Priority Date Filing Date
JP8131078A Pending JPS558363A (en) 1978-07-03 1978-07-03 Thermocompression bonding method

Country Status (1)

Country Link
JP (1) JPS558363A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0891027A (en) * 1995-10-03 1996-04-09 Hitachi Ltd Drive assisting device for automobile
US20110131798A1 (en) * 2009-03-05 2011-06-09 Teledyne Scientific & Imaging, Llc Microfabricated inductors with through-wafer vias

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0891027A (en) * 1995-10-03 1996-04-09 Hitachi Ltd Drive assisting device for automobile
US20110131798A1 (en) * 2009-03-05 2011-06-09 Teledyne Scientific & Imaging, Llc Microfabricated inductors with through-wafer vias
US8826514B2 (en) * 2009-03-05 2014-09-09 Teledyne Scientific & Imaging, Llc Microfabricated inductors with through-wafer vias

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