GB1243097A - Improvements in or relating to methods of producing patterns of electrical connectors - Google Patents

Improvements in or relating to methods of producing patterns of electrical connectors

Info

Publication number
GB1243097A
GB1243097A GB02927/69A GB1292769A GB1243097A GB 1243097 A GB1243097 A GB 1243097A GB 02927/69 A GB02927/69 A GB 02927/69A GB 1292769 A GB1292769 A GB 1292769A GB 1243097 A GB1243097 A GB 1243097A
Authority
GB
United Kingdom
Prior art keywords
pillars
substrate
areas
electrical connectors
pattern
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB02927/69A
Inventor
Yener Gurler
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Services Ltd
Original Assignee
Fujitsu Services Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Services Ltd filed Critical Fujitsu Services Ltd
Priority to GB02927/69A priority Critical patent/GB1243097A/en
Publication of GB1243097A publication Critical patent/GB1243097A/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3457—Solder materials or compositions; Methods of application thereof
    • H05K3/3473—Plating of solder
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N97/00—Electric solid-state thin-film or thick-film devices, not otherwise provided for
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/12—Structure, shape, material or disposition of the bump connectors prior to the connecting process
    • H01L2224/13—Structure, shape, material or disposition of the bump connectors prior to the connecting process of an individual bump connector
    • H01L2224/13001—Core members of the bump connector
    • H01L2224/13099—Material
    • H01L2224/131—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof
    • H01L2224/13101—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof the principal constituent melting at a temperature of less than 400°C
    • H01L2224/13111—Tin [Sn] as principal constituent
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
    • H01L2224/818—Bonding techniques
    • H01L2224/81801—Soldering or alloying
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/0105—Tin [Sn]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01074—Tungsten [W]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01079—Gold [Au]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01082—Lead [Pb]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/14—Integrated circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/03—Metal processing
    • H05K2203/0338—Transferring metal or conductive material other than a circuit pattern, e.g. bump, solder, printed component
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0703—Plating
    • H05K2203/0726—Electroforming, i.e. electroplating on a metallic carrier thereby forming a self-supporting structure

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Manufacturing Of Electrical Connectors (AREA)

Abstract

1,243,097. Semi-conductor devices. INTERNATIONAL COMPUTERS Ltd. 23 Feb., 1970 [12 March, 1969], No. 12927/69. Heading H1K. A method of producing a pattern of electrical connectors on an integrated circuit 1 comprises forming a pattern of conductive areas 2 on one surface of the circuit 1 and also forming a corresponding pattern of pillars 3 of conductive material on a temporary substrate 4, aligning the circuit 1 and substrate 4 so that the pillars contact the areas 2, and conductively bonding the pillars to the areas 2 subsequently removing the substrate 4. The pillars 3 may be of tin/lead alloy, and capped with gold on one or both ends. They may be formed by deposition of material through an apertured mask. The substrate 4 may be of oxidized stainless steel. Ultrasonic bonding may be used to bond areas 2 to pillars 3.
GB02927/69A 1969-03-12 1969-03-12 Improvements in or relating to methods of producing patterns of electrical connectors Expired GB1243097A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
GB02927/69A GB1243097A (en) 1969-03-12 1969-03-12 Improvements in or relating to methods of producing patterns of electrical connectors

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GB02927/69A GB1243097A (en) 1969-03-12 1969-03-12 Improvements in or relating to methods of producing patterns of electrical connectors

Publications (1)

Publication Number Publication Date
GB1243097A true GB1243097A (en) 1971-08-18

Family

ID=10013693

Family Applications (1)

Application Number Title Priority Date Filing Date
GB02927/69A Expired GB1243097A (en) 1969-03-12 1969-03-12 Improvements in or relating to methods of producing patterns of electrical connectors

Country Status (1)

Country Link
GB (1) GB1243097A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0018557A1 (en) * 1979-05-07 1980-11-12 International Business Machines Corporation Apparatus and method for dressing a chip site on a substrate
EP0039160A2 (en) * 1980-04-29 1981-11-04 Minnesota Mining And Manufacturing Company Methods for bonding conductive bumps to electronic circuitry
EP0048829A2 (en) * 1980-09-26 1982-04-07 Licentia Patent-Verwaltungs-GmbH Method of making electrical contacts on a silicon solar cell

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0018557A1 (en) * 1979-05-07 1980-11-12 International Business Machines Corporation Apparatus and method for dressing a chip site on a substrate
EP0039160A2 (en) * 1980-04-29 1981-11-04 Minnesota Mining And Manufacturing Company Methods for bonding conductive bumps to electronic circuitry
EP0039160A3 (en) * 1980-04-29 1982-08-25 Minnesota Mining And Manufacturing Company Methods for bonding conductive bumps to electronic circuitry
EP0048829A2 (en) * 1980-09-26 1982-04-07 Licentia Patent-Verwaltungs-GmbH Method of making electrical contacts on a silicon solar cell
EP0048829A3 (en) * 1980-09-26 1982-12-08 Licentia Patent-Verwaltungs-GmbH Method of making electrical contacts on a silicon solar cell

Similar Documents

Publication Publication Date Title
GB1481015A (en) Bonding of a semiconductor device to an electrical conductor on a supporting substrate
JPS6418246A (en) Lead frame for semiconductor device
EP0039160A3 (en) Methods for bonding conductive bumps to electronic circuitry
GB1285258A (en) Improvements in or relating to semiconductor devices
JPS5279773A (en) Bonding method of ic
GB1243097A (en) Improvements in or relating to methods of producing patterns of electrical connectors
JPS5240973A (en) Method of connecting semiconductor devices
JPS5240968A (en) Process for production of semiconductor device
GB1188451A (en) Improvements relating to methods of making Connections to Small Components
GB1430640A (en) Printed circuits and their manufacture
JPS5412263A (en) Semiconductor element and production of the same
JPS523383A (en) Manufacturing method of semiconductor device electrode
JPS5735331A (en) Semiconductor device
JPS5211771A (en) Semiconductor device and its manufacturing method
JPS558363A (en) Thermocompression bonding method
JPS5261480A (en) Production of lead frame for ic
GB1197272A (en) Improvements relating to Semiconductor Circuit Assemblies
JPS52149066A (en) Connecting method of silicon semiconductor chip to ceramic substrate
JPS5355971A (en) Engagement method and electronic device using said method
JPS5280798A (en) Electrical connection equipment for display substance
JPS56155556A (en) Semiconductor device
JPS5414675A (en) Bonding method for semiconductor elements
JPS5368163A (en) Production of flip chip
JPS5552231A (en) Semiconductor attaching device
JPS5287978A (en) Bump electrode forming method in semiconductor device