JPS5831429Y2 - Watch board - Google Patents

Description

[Detailed Description of the Invention] The present invention relates to a watch substrate, and its purpose is to eliminate secondary processing thereof.

When conventional watch substrates, particularly circuit boards, are cut using a milling cutter, the following problems arise.

(1) Planar shapes formed at acute angles cannot be processed.

(2) A step is created in the cross section. (3) Fluff, etc. occurs.

(4) If the part forming the circuit pattern is processed, the circuit pattern will peel off.

(5) Processing time is required.

(6) It is difficult to process complicated planar shapes.

The present invention solves the above problems, and will be described in detail below with reference to plan views showing embodiments of the present invention.

FIG. 1 is a sectional view showing an embodiment of the present invention.

Reference numerals 1 and 2 denote first and second substrates (the thickness of the side substrates are almost the same) having circuit patterns 1a and 2a formed by etching or the like on the negative side, respectively.

The first substrate 1 and the second substrate 2 are glued together like a single board with an adhesive or the like on the surfaces on which the circuit patterns 1a and 2a are not formed, and are double-sided substrates having the circuit patterns 1a and 2a on both sides. is forming.

In order to support and guide members such as IC chips on this double-sided board, or to secure a gap between other parts and the double-sided board, a recess 1 is provided.
When forming C, a double-sided substrate is punched (including half-blanking, in which the punched-out portion and other parts are separated).

Then, the punched portion 1b of the first substrate (hereinafter referred to as the punching scrap) was pushed into the second substrate 2, and a part of the second substrate 2 was formed by the punching scrap 1b (however, the second substrate opposite to the punching scrap 1b The punched scraps 2 are separated from the punched scraps 1b and do not become a constituent part of the double-sided substrate), so cutting with a milling cutter is not necessary.

In addition, since punching is used, the planar shape can be set according to the intended use, and the depth of the recess 1C can be arbitrarily selected to such an extent that the punching stubs 1b do not come off the second substrate 2.

Next, the second section shows a circuit mounting method using this double-sided board.
Explain the diagram.

1b and 2b are the scraps of the first and second substrates 1 and 2, respectively, a part of the first substrate 1 is the scraps 2b, and a part of the second board 2 is the scraps 1b. The scraps will not come off from the double-sided board even if you apply some force).

The first and second substrates 1 and 2 have circuit patterns la and 2a formed by etching or the like on one side, and the surfaces without the circuit patterns 1a and 2a are fixed with adhesive to form a double-sided substrate.

An IC chip 3 is inserted into the recess 1C of the first board,
The planar shape of the four parts 1C is set so that the planar position of the IC chip 3 can be guided when the IC chip 3 is attached.

4 is a gold wire for connecting the circuit pattern 1a and the IC chip 3.

These are then sealed with resin 5 as shown.

Also, second. substrate? (An element 6 such as a capacitor or a resistor having terminals 6a and 6b is inserted into the upper part 2CI having the shape 1, and the terminals 6a and 6b and the circuit pattern 2a are fixed and conductive by soldering or the like.

The depth of these four parts 2C can be set according to the thickness of the element 6, and since its planar shape is also punched, it can be made into any shape depending on its use. .

Reference numeral 7 denotes a pin, which not only establishes conduction between the circuit pattern 1a and the circuit pattern 2a, but also secures the fixation of both substrates.

Furthermore, as shown in FIG. 3, there is a circuit mounting method that has recently started to be used: first, a recess 1C of the first substrate 1 is formed in advance, and then a circuit pattern 1a is formed using metal foil. An IC chip 3 having a bump at one end is disposed, the circuit pattern 1a and the bump 3a of the IC chip are directly bonded, the circuit pattern is fixed to the first substrate 1, and the periphery thereof is sealed with resin 5. It can also be applied to other methods, making circuit creation easier.

Further, in this application, one of the substrates is made of a metal plate, which can be used to improve the appearance, reinforce the substrate, and even serve as a conductive path.

As mentioned above, the present invention eliminates the secondary machining of the base for watches by pushing the scraps of one board generated during the punching process into the other board to form a recess, and eliminates the numerous steps involved. It eliminates the shortcomings.

In Figure 1, the thickness of the two substrates is almost the same, but the substrates have different thicknesses or are made of different materials (for example, plastic,
A lint substrate and a metal plate, etc.) or at least two metal plates may be used.The substrate is not limited to a two-layer structure, but may be a plurality of laminated substrates.

In addition, in the embodiment, by arranging the bonding surfaces of both substrates within the thickness of the punched scrap, the bonding of both substrates can be made more secure, and thereby the first substrate and the second substrate can be bonded together using an adhesive. It does not have to be fixed with etc.

Furthermore, the scraps from the second board are removed from the first board. The first one is stuck to the scraps of the board. The substrate may be composed of a second substrate.

[Brief explanation of drawings]

Figure 1 is a sectional view showing one embodiment of the present invention, Figures 2 and 3.
The figure is a sectional view showing an application example of the present invention. 1...First board, 1a...Circuit pattern, 1b...Damage, 1C...Concavity, 2...Second board , 2a... circuit pattern, 2b... punching residue, 2C... recess, 3... IC chip, 4... gold wire,
5...Resin, 6...,...Element, 7...
····pin.

Claims (1)

[Claims for Utility Model Registration] A timepiece substrate on which an electric element constituting a part of a timepiece circuit is installed, wherein the timepiece substrate has a laminated structure of two substrates fixed at least in part. An electrode pattern is disposed on the upper surface of the watch substrate, and the portion where the electric element is mounted is a recess formed by punching a part of one substrate and fixing it to the other substrate. A watch substrate characterized by: □