JPH0851267A - Circuit board and its manufacture - Google Patents

Abstract

PURPOSE:To obtain a thin circuit board without sagging by presswork, consisting of a substrate material where a conductor layer is formed on the surface of a conductive substrate via an insulation layer by providing a protruding part formed by half punching of the conductor layer of the substrate material and by forming a wiring pattern with the protruding part. CONSTITUTION:A substrate material 4 is constituted of three layers of a substrate 1 consisting of a conductive material such as metal, an insulation layer 2 consisting of thermosetting resin formed on one side of the substrate 1, and a conductor layer 3 consisting of a copper plate formed on the insulation layer 2. A half punching is performed to a surface where the substrate 1 is exposed at the lower side of the substrate material 4 and a protruding part 5 is formed at the side of the conductor layer 3. The conductor layer 3 lifted upward by the protruding part 5 becomes a wiring pattern in a proper shape, thus eliminating sagging at the time of half punching.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a circuit board on which electronic parts and the like are mounted and a method for manufacturing the same.

[0002]

2. Description of the Related Art The present applicant has previously applied for a circuit board on which electronic parts and the like are mounted and a method for manufacturing the circuit board, as shown in FIGS. 5 and 6. Japanese Patent Application 5-
That is the invention relating to No. 329553. In FIG. 5, the substrate material 24 is a base 2 made of a conductive material such as metal.
1, an insulating layer 22 made of a thermosetting resin or the like, and a conductor layer 23 made of a copper plate or the like. Board material 24
The surface of the conductor layer 23 side is subjected to press working to form a concave half-cut portion 28. The concave half-cut portion 2
8 causes the protruding portion 25 to
Is occurring. A part of the conductor layer 23 on the substrate material 24 is sunk and separated downward by the half-cut portion 28, and the portion sunk in the half-cut portion 28 has a wiring pattern of an appropriate shape. As described above, the half blank portion 28 is formed on the substrate material 24 and the wiring pattern is formed from the conductor layer 23, whereby the substrate material 24 becomes a circuit board.

Next, a method of manufacturing the above circuit board will be described. First, a substrate 21 made of a conductive material such as metal and a conductor layer 23 made of a copper plate or the like are bonded together with an insulating layer 22 made of a thermosetting resin or the like interposed therebetween to form a substrate material 24. Next, as shown in FIG.
The surface of No. 4 on the side of the base 21 is supported by the die 26 of the press die. Next, the punch 27 is pressed against the surface of the substrate material 24 on the conductor layer 23 side to form the half-blanked portion 28. By forming the half-blanked portion 28, a part of the conductor layer 23 is separated and sunk into the half-blanked portion 28, and the conductor layer 23 remaining without being sunk into the half-blanked portion 28 has an appropriate shape. A pattern is formed to form a circuit board.

[0004]

As shown in FIG. 6, when the substrate material 24 is subjected to half blanking, the die 21 of the press die holds the substrate 21 of the substrate material 24 and the insulating layer 22 is used.
Therefore, the conductor layer 23 and the base 21 are half-blanked. The insulating layer 22 includes a conductor layer 23 and a base 21.
In many cases, a thermosetting resin having elasticity is used to bond the two. Therefore, when the half-opened portion 28 is formed by pressing the conductor layer 23 side of the substrate material 24, the conductor layer 23 around the half-opened portion 28 becomes the insulating layer 2 as shown in FIG.
The press sag 23a protruding downward against the elasticity of No. 2 is generated. In particular, when the insulating layer 22 is thin, the press sag 23a reaches the conductive base 21 across the insulating layer 22, and the conductor layer 23 and the base 21 are short-circuited.

Pressed sag 23a which is a part of the conductor layer 23
Therefore, in order to prevent the conductor layer 23 and the conductive substrate 21 from being short-circuited, the thickness of the insulating layer 22 and the depth dimension of the half-blanked portion 28 are set to be sufficiently large.
It is necessary to prevent 3a from reaching the base body 21, but if the thickness of the insulating layer 22 and the depth dimension of the half-blanked portion 28 are set to be large, the thickness dimension of the circuit board increases and the thickness can be reduced. There is a problem that it does not exist.

The present invention has been made in order to solve the above problems of the prior art, and an object of the present invention is to provide a thin circuit board which is free from press sag and a method for manufacturing the same.

[0007]

The invention according to claim 1 comprises a substrate material in which a conductor layer is formed on the surface of a conductive substrate through an insulating layer, and the surface of the substrate material on the conductor layer side is formed. It is characterized in that it has a protrusion formed by half blanking, and a wiring pattern is formed by this protrusion.

According to a second aspect of the present invention, there is provided a substrate material in which conductive layers are formed on both surfaces of a conductive substrate with insulating layers interposed therebetween.
The substrate material has a half-blanked portion on one surface and a half-blanked protrusion portion on the other surface, and wiring patterns are formed on both surfaces of the substrate material by the half-blanked portion and the protrusion portion. It is characterized by

According to a third aspect of the present invention, a step of forming a conductor layer on the surface of the substrate to obtain a substrate material, a step of supporting the surface of the substrate material on the conductor layer side with a die of a die, and a substrate of the substrate material. It is characterized by including a step of forming a wiring pattern by forming a protrusion on the surface on the conductor layer side by performing half blanking on the surface on the side according to an appropriate pattern.

[0010]

By forming a protrusion on the conductor layer side by half-cutting the substrate material, the conductor layer pressed by the protrusion is separated into a wiring pattern, and the substrate material becomes a circuit board.

[0011]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS A circuit board according to the present invention and a method of manufacturing the same will be described below with reference to the drawings. In FIG. 1, a substrate material 4 is formed on a base 1 made of a conductive material such as metal, an insulating layer 2 made of a thermosetting resin or the like formed on one surface of the base 1, and an insulating layer 2. The conductor layer 3 is composed of three layers, such as a copper plate. The surface of the lower side of the substrate material 4 on which the base body 1 is exposed is subjected to a half-pressing process by press working, and the protruding part 5 is formed on the conductor layer 3 side by this half-cutting process. A part of the conductor layer 3 on the substrate material 4 is lifted upward and separated by the end surface of the protruding portion 5. The conductor layer 3 lifted upward by the protrusion 5 has a wiring pattern of an appropriate shape. In this way, the board member 4 is a circuit board by forming the protrusions 5 on the board member 4 and forming the conductor layer 3 into a wiring pattern.

Next, a method for manufacturing the above circuit board will be described. First, a substrate 1 made of a conductive material such as a metal and a conductor layer 3 made of a copper plate or the like are attached with an insulating layer 2 made of a thermosetting resin or the like interposed therebetween to form a substrate material 4. Next, as shown in FIG. 2, the surface of the substrate material 4 on the conductor layer 3 side is supported by the die 6 of the press die. Next, the punch 7 is pressed against the surface on the side of the base 1 to carry out half blanking, and the protrusion 5 is formed on the surface on the side of the conductor layer 3 supported by the die 6 of the press die. By forming the projecting portion 5, a part of the conductor layer 3 is pushed upward by the end surface of the projecting portion 5 and is separated from the conductor layer 3 to form an independent wiring pattern of an appropriate shape. Further, since the wiring pattern is formed by the projecting portions 5, the board material 4 becomes a circuit board.

According to the circuit board and the manufacturing method thereof as described above, as shown in FIG. 3, the conductor layer 3 around the protrusion 5 is formed.
However, since the conductor layer 3 is directly supported by the die of the pressing die, it is possible to prevent the conductor layer 3 from being affected by the elastic deformation of the base 1 and the insulating layer 2 and causing the press sag. Therefore, the thickness of the insulating layer 2 may be set to the minimum, and
Since the size of the protrusion formed by half blanking can be short, the circuit board can be thinned.

Next, another embodiment shown in FIG. 4 will be described. In FIG. 4, insulating layers 2, 2 ′ are provided on both sides of the substrate 1.
The wiring pattern is formed by using the substrate material 9 on which the conductor layers 3 and 3'are formed, and forming the protruding portion 5 by half blanking on the substrate material 9. The conductor layer 3 existing on the projecting portion 5 formed on one surface of the substrate material 9 and separated from the other portion, and the conductor layer 3 ′ existing in the half-cut portion 8 on the other surface of the substrate material 9. Can be used as a wiring pattern, respectively. Therefore, the substrate material 9 is a circuit board having wiring patterns on both sides. In addition, when half-cutting,
Since the conductor layer 3 side surface on which the projecting portion 5 is formed is supported by the die of the press die, press sag does not occur, but the conductor layer 3 ′ side surface is directly pressed,
Press sag is likely to occur in the portion of the conductor layer 3 ′ around the half-blanked portion 8. Therefore, in order to prevent the press sag generated on the conductor layer 3 ′ side from adversely affecting the substrate 1, the insulating layer 2 ′ is
It is preferable to set a relatively large thickness.

[0015]

According to the present invention, it is made of a substrate material in which a conductor layer is formed on the surface of a conductive substrate through an insulating layer, and the surface of the substrate material on the conductor layer side is formed by half blanking. Since it has a protruding portion and the wiring pattern is formed by this protruding portion, press sag at the time of half blanking can be eliminated,
It is not necessary to set the thickness of the insulating layer or the depth of the half-blank portion to a large value, which can contribute to the reduction in thickness.

[Brief description of drawings]

FIG. 1 is a sectional view showing an embodiment of a circuit board according to the present invention.

FIG. 2 is a cross-sectional view showing a step in the method of manufacturing the same circuit board.

FIG. 3 is a cross-sectional view showing an enlarged main part of the above embodiment.

FIG. 4 is a sectional view showing still another embodiment of the circuit board according to the present invention.

FIG. 5 is a cross-sectional view showing an example of a conventional circuit board.

FIG. 6 is a cross-sectional view showing a step of the method for manufacturing the same circuit board.

FIG. 7 is a perspective view showing an enlarged main part of an example of the same circuit board.

[Explanation of symbols]

 1 Base 2 Insulation Layer 3 Conductor Layer 4 Substrate Material 5 Projection

Claims (3)

[Claims] 1. A substrate material comprising a conductive substrate and a conductor layer formed on the surface of the conductive substrate with an insulating layer interposed therebetween. The conductor layer side surface of the substrate material has a protrusion formed by half blanking. A circuit board having a wiring pattern formed by the protrusions. 2. A substrate material in which conductor layers are formed on both sides of a conductive substrate with an insulating layer interposed between the substrate materials. A circuit board having a protrusion, wherein a wiring pattern is formed on both surfaces of the substrate material by the half-blanked portion and the protrusion. 3. A step of forming a conductor layer on the surface of a substrate to obtain a substrate material; a step of supporting the surface of the substrate material on the conductor layer side with a die of a mold; A method for manufacturing a circuit board, comprising the step of forming a wiring pattern by forming a protrusion on the surface on the conductor layer side by performing half blanking according to the pattern.