JPH08222838A - Manufacture of thick copper circuit board - Google Patents

Abstract

PURPOSE: To provide a method by which a thick copper circuit board having an excellent heat radiating property and large current capacity can be manufactured efficiently. CONSTITUTION: A thick circuit board is manufactured by putting a thick copper plate 1 on copper foil 2 which is thinner than the plate 1 and punching the plate 1 and foil 2 in the shape of a thick copper circuit section 3 from the plate 1 side and, at the same time, press-fitting the punched pieces of the plate 1 in the foil 2. Then, the whole body 4 of the foil 2 carrying the punched pieces of the plate 4 is blackened and stuck to a metallic substrate 8 with an adhesive layer 7 and the foil 2 is removed or a circuit is formed of the foil 2. When such a method is used, a thick copper circuit board which has an excellent heat radiating property, large current capacity, and excellent adhesive property against an insulating resin layer can be manufactured efficiently.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a thick copper circuit board having a heat dissipation property and a large current capacity, and a method for punching a thick copper plate to form a thick copper circuit. The present invention relates to a manufacturing method capable of efficiently forming an excellent thick copper circuit board.

[0002]

2. Description of the Related Art A metal substrate such as an aluminum plate is used as a substrate preferably used for applications requiring heat dissipation and a large current capacity, and a thick copper is formed on one surface of the metal substrate with an insulating layer interposed therebetween. A thick copper circuit board on which a circuit is formed is known, and as a method of forming a circuit, an insulating board in which a conductive circuit formed by punching out a thick copper plate is partially fitted is used and laminated on a metal board via an adhesive layer. A method utilizing circuit formation by a so-called punch-fitting method has been proposed.

However, in the above method, since the conductive circuit formed by punching a thick copper plate is fitted into the insulating substrate, even if the thick copper plate is subjected to a surface treatment such as a blackening treatment in order to improve the adhesion with the insulating substrate. However, there is a problem that the material of the punched surface comes out and the adhesiveness with the insulating substrate deteriorates at that portion.

Further, since a conductive circuit formed by punching out a thick copper plate is forcibly press-fitted into the insulating substrate, the fitting boundary surface appears to be torn, and cracks or delamination occurs. There was a problem.

[0005]

DISCLOSURE OF THE INVENTION The present invention has found a method of manufacturing a thick copper circuit board capable of solving the above problems, and the gist thereof is a thick copper plate 1 and the thick copper plate 1.
After stacking the copper foils 2 thinner than the above, punching out the shape of the thick copper circuit portion 3 from the thick copper plate 1 side, and at the same time press fitting into the copper foil 2,
After blackening the whole of the punched fitting body 4 into which the thick copper circuit portion 3 is press-fitted, it is laminated and integrated with the metal substrate 8 via the adhesive layer 7, and then the copper foil 2 portion is removed or the copper foil 2 is formed. A method of manufacturing a thick copper circuit board is characterized by forming a circuit.

The present invention will be described in detail below with reference to the drawings. FIG. 1 is a schematic sectional view showing an example of steps of the method of the present invention. An example of a method of manufacturing an insulating substrate in which a conductive circuit used in the present invention is press-fitted will be described with reference to FIG. First, (a)
As shown in FIG. 2, a thick copper plate 1 and a copper foil 2 thinner than the thick copper plate 1 are stacked, and punched from the thick copper plate 1 side to a shape of the thick copper circuit portion 3 by a punching tool 10, and at the same time, the copper foil 2 Press into. The thickness of the thick copper plate 1 is preferably 0.5 to 3.0 mm, preferably 1.0 to 1.5 mm, and the copper foil 2 is 0.1 mm to 0.4 mm, preferably 0.1. The thing of 1 mm-0.2 mm can be used conveniently.

The punched fitting 4 into which the thick copper circuit portion 3 is press-fitted as shown in (a) is as shown in (b), and the entire surface may be copper-plated with a thickness of several tens of μm. Further, as shown in (c), the blackening process 5 is applied to the whole. The blackening treatment 5 is for improving the adhesion with the insulating resin, and according to the method of the present invention, the side surface portion of the thick copper circuit portion 3 can be sufficiently treated and the adhesion can be improved.

Next, as shown in (d), the punched fitting 4 which has been subjected to the blackening treatment 5 is placed on one surface of the metal substrate 8 via the adhesive layer 7 and laminated and integrated. A normal hot pressing method may be used as a method of laminating and integrating. Here, a copper plate, an aluminum plate, an iron plate, or the like having excellent heat dissipation can be used for the metal substrate 8, and one having a thickness in the range of 0.3 mm to 5 mm can be preferably used. As the resin used for the adhesive layer 7, a thermoplastic resin such as polyetherimide, polyetheretherketone, or polyetherphone, or a thermosetting resin such as an epoxy resin or a polyimide resin can be used. If necessary, a glass fiber cloth can be used. You may interpose a reinforcing material such as.

Using the laminated body integrated by the above method,
By removing the copper foil 2 portion by etching or the like as shown in (e), a substrate consisting of only thick copper circuits is obtained. Further, in the state of (d), a circuit can be provided on the copper foil 2 by an ordinary means, and a board in which a thick copper circuit and an ordinary fine circuit are mixed can be obtained.

[0010]

As described above, according to the manufacturing method of the present invention, a thick copper circuit board having a heat dissipation property and a large current capacity, which is excellent in adhesion to the insulating resin layer, can be efficiently manufactured. Can be manufactured in a simple manner.

[Brief description of drawings]

FIG. 1 is a schematic sectional view showing an example of steps of the method of the present invention.

[Explanation of symbols]

 1 Thick Copper Plate 2 Copper Foil 3 Thick Copper Circuit 4 Stamped Fitting 7 Adhesive Layer 8 Metal Board

Claims (2)

[Claims] 1. A thick copper plate (1) and a copper foil (2) having a thickness smaller than that of the thick copper plate (1) are superposed, and the thick copper plate (1) side is stamped into a shape of a thick copper circuit portion (3). At the same time as pulling out, after press-fitting into the copper foil (2), the entire punched fitting body (4) into which the thick copper circuit part (3) is press-fitted is blackened, and then the metal substrate is bonded via the adhesive layer (7). A method for manufacturing a thick copper circuit board, which comprises integrally laminating with (8) and then removing the copper foil (2) portion. 2. A thick copper plate (1) and a copper foil (2) having a thickness smaller than that of the thick copper plate (1) are overlapped, and the thick copper plate (1) side is stamped into a shape of a thick copper circuit portion (3). Simultaneously with the punching, after press-fitting into the copper foil (2), the entire surface of the punching fitting body (4) into which the thick copper circuit portion (3) is press-fitted is subjected to surface treatment, and then the metal substrate ( 8) A method for manufacturing a thick copper circuit board, which comprises laminating and integrating with 8) and then forming a circuit on the copper foil (2) portion.