JPH06232529A - Cutoff method of flexible printed board sheet - Google Patents

Cutoff method of flexible printed board sheet

Info

Publication number
JPH06232529A
JPH06232529A JP1776493A JP1776493A JPH06232529A JP H06232529 A JPH06232529 A JP H06232529A JP 1776493 A JP1776493 A JP 1776493A JP 1776493 A JP1776493 A JP 1776493A JP H06232529 A JPH06232529 A JP H06232529A
Authority
JP
Japan
Prior art keywords
flexible printed
board sheet
copper foil
cutting
circuit board
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1776493A
Other languages
Japanese (ja)
Inventor
Eiji Murazaki
英次 村崎
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Priority to JP1776493A priority Critical patent/JPH06232529A/en
Publication of JPH06232529A publication Critical patent/JPH06232529A/en
Pending legal-status Critical Current

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  • Structure Of Printed Boards (AREA)

Abstract

PURPOSE:To enable a flexible printed board sheet to be accurately separated into unit flexible boards by cutting by a method wherein either of two pressing members fixed to the upside and underside of the flexible printed board sheet is pressed along the cut surface of the printed board. CONSTITUTION:A copper foil 6 is pasted on a base film with adhesive agent, a pattern, wherein a copper foil 6a whose ends are located along a separating.cutting line K adjacent to the bases of connections 2a, 2b, and 2c is left and remains is formed on the copper foil 6 besides a circuit pattern, and a cover film is pasted on the copper foil 6 on which the circuit pattern and the separating.cutting copper foil 6a are formed for the formation of a flexible printed board sheet 3. When the flexible printed board sheet 3 is divided into separate flexible printed boards 1 by cutting, pressing members are made to abut against the upside and underside of the flexible board sheet 3 along the separating-cutting line K, either of the pressing members is fixed, and the other pressing member is pressed from above or below to divide the board sheet 3 into the boards 1.

Description

【発明の詳細な説明】Detailed Description of the Invention

【0001】[0001]

【産業上の利用分野】本発明は電子機器を生産する場合
に用いるフレキシブルプリント基板シートの分離切断方
法に関する。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for separating and cutting a flexible printed circuit board sheet used for producing electronic equipment.

【0002】[0002]

【従来の技術】近年、電子機器の軽薄短小化が著しく進
展し、フレキシブルプリント基板を用いた電子機器の生
産が急増している。
2. Description of the Related Art In recent years, the miniaturization of electronic equipment has been remarkably advanced, and the production of electronic equipment using a flexible printed circuit board is rapidly increasing.

【0003】そして、実開昭55−14716号公報
に、低容量のコンデンサを薄形,軽量,可撓化されたプ
リント基板で構成し、電子式小形卓上計算機用として好
適な技術が開示されている。
Japanese Utility Model Application Laid-Open No. 55-14716 discloses a technique in which a low-capacity capacitor is composed of a thin, lightweight, and flexible printed circuit board, which is suitable for an electronic compact desktop computer. There is.

【0004】一般にフレキシブルプリント基板を製作す
る場合、ICチップなどの電子部品のフレキシブルプリ
ント基板への装着を効率化するため、フレキシブルプリ
ント基板は次のように製作される。すなわち、図5に示
すように、フレキシブルプリント基板51は、原板をプ
レス加工で打ち抜いた数個ずつ互いに連結部52a,5
2b,52cで連結されたベースフィルム上に接着剤で
接着された銅箔(図示していない)に回路パターンを破
線P内に形成し、その上に接着剤でカバーフィルム(図
示していない)を接着したフレキシブルプリント基板シ
ート53を作成する。そして、電子機器にフレキシブル
プリント基板51を組込むときに、フレキシブルプリン
ト基板シート53の連結部52a,52b,52cを分
離切断してそれぞれのフレキシブルプリント基板51を
製作する。
Generally, when manufacturing a flexible printed circuit board, the flexible printed circuit board is manufactured as follows in order to efficiently mount an electronic component such as an IC chip on the flexible printed circuit board. That is, as shown in FIG. 5, the flexible printed circuit board 51 has a plurality of connecting parts 52a, 5 which are formed by stamping a master plate.
A circuit pattern is formed in a broken line P on a copper foil (not shown) adhered with an adhesive on a base film connected by 2b and 52c, and a cover film (not shown) is formed on the circuit pattern with an adhesive. A flexible printed circuit board sheet 53 to which is adhered is created. Then, when the flexible printed circuit board 51 is incorporated into the electronic device, the flexible printed circuit board 51 is manufactured by separating and cutting the connecting portions 52a, 52b, 52c of the flexible printed circuit board sheet 53.

【0005】その際、従来の技術では図7に示すよう
に、上刃54と下刃55を分離切断線Kに沿ってフレキ
シブルプリント基板シート53の上面56と下面57に
当接し加圧して切断していた。これによりフレキシブル
プリント基板シート53に回路パターンを形成するとき
に銅箔の除去された連結部52a,52b,52cのベ
ースフィルム58とベースフィルム58上に接着剤59
で接着されたカバーフィルム60は分離切断線Kに沿っ
て切断される。
At this time, in the conventional technique, as shown in FIG. 7, the upper blade 54 and the lower blade 55 are brought into contact with the upper surface 56 and the lower surface 57 of the flexible printed circuit board sheet 53 along the separation cutting line K to press and cut. Was. Accordingly, when the circuit pattern is formed on the flexible printed circuit board sheet 53, the base film 58 of the connecting portions 52a, 52b, 52c from which the copper foil is removed and the adhesive 59 on the base film 58.
The cover film 60 adhered by is cut along the separation cutting line K.

【0006】[0006]

【発明が解決しようとする課題】しかし、フレキシブル
プリント基板シート53を切断する工程においては、作
業者の作業ばらつきやフレキシブルプリント基板シート
53の寸法ばらつき、さらにフレキシブルプリント基板
シート53の柔軟性のばらつきなどにより、フレキシブ
ルプリント基板シート53をカッター(上刃54,下刃
55)に対して精度よく位置決めすることが困難であっ
た。このため図6に示すように、フレキシブルプリント
基板シート53の分離切断後フレキシブルプリント基板
51の多くに連結部52a,52b,52cが残り、電
子機器にフレキシブルプリント基板51を組込めないと
いう問題があった。すなわち、フレキシブルプリント基
板51の設計形状は、図5に示す形状であり、電子機器
に組込むときに連結部52a,52b,52cの残りが
邪魔になる。
However, in the process of cutting the flexible printed circuit board sheet 53, variations in the work of the operator, variations in the dimensions of the flexible printed circuit board sheet 53, variations in the flexibility of the flexible printed circuit board sheet 53, etc. Therefore, it is difficult to accurately position the flexible printed board sheet 53 with respect to the cutter (upper blade 54, lower blade 55). Therefore, as shown in FIG. 6, the connecting portions 52a, 52b, and 52c remain in many of the flexible printed circuit boards 51 after the flexible printed circuit board sheet 53 is separated and cut, and there is a problem that the flexible printed circuit board 51 cannot be incorporated into an electronic device. It was That is, the design shape of the flexible printed circuit board 51 is the shape shown in FIG. 5, and the rest of the connecting portions 52a, 52b, 52c becomes an obstacle when incorporated in an electronic device.

【0007】本発明は、このような従来の課題を解消す
るものであり、一枚のフレキシブルプリント基板シート
からそれぞれのフレキシブルプリント基板を精度良く分
離切断できるフレキシブルプリント基板シートの分離切
断方法を提供することを目的とする。
The present invention solves such a conventional problem, and provides a method of separating and cutting a flexible printed circuit board sheet, which can accurately separate and cut each flexible printed circuit board from one flexible printed circuit board sheet. The purpose is to

【0008】[0008]

【課題を解決するための手段】上記目的を達成するため
本発明のフレキシブルプリント基板シートの分離切断方
法は、ベースフィルム上に接着剤で貼り付けられた銅箔
に、回路パターンに加えて連結部の基部近傍の分離切断
線に沿って端部が位置する分離切断用の銅箔を残したパ
ターンを形成し、前記回路パターンと分離切断用のパタ
ーンが形成された銅箔上に接着剤でカバーフィルムを貼
り付けて形成したフレキシブルプリント基板シートの前
記分離切断線に沿って前記フレキシブルプリント基板シ
ートの上面と下面にそれぞれ上面押え部材と下面押え部
材を当接し、いずれか一方の押え部材を固定し、もう一
方の押え部材を上方または下方から押圧して分離切断す
るものである。
In order to achieve the above object, the method for separating and cutting a flexible printed circuit board sheet according to the present invention comprises a copper foil adhered on a base film with an adhesive, a connecting portion in addition to a circuit pattern. A pattern is formed by leaving a copper foil for separation and cutting, the end of which is located along the separation and cutting line near the base of, and is covered with an adhesive on the copper foil on which the circuit pattern and the pattern for separation and cutting are formed. The upper surface pressing member and the lower surface pressing member are respectively brought into contact with the upper surface and the lower surface of the flexible printed circuit board sheet along the separation cutting line of the flexible printed circuit board sheet formed by attaching a film, and one of the pressing members is fixed. The other pressing member is pressed from above or below to separate and cut.

【0009】[0009]

【作用】上記の方法により、連結部の基部近傍の分離切
断線に沿って端部が位置する分離切断用の銅箔が残され
ていることにより、フレキシブルプリント基板シートの
銅箔の残されている部分は、銅箔の残されていない部分
より強度が強いため、上,下面押え部材の当接位置が切
断線から多少ずれていても上,下面押え部材によって加
えられた圧力によって、銅箔の端部に沿って連結部を分
離切断することができることとなる。
According to the above method, since the copper foil for separating and cutting whose end is located along the separation cutting line near the base of the connecting portion is left, the copper foil of the flexible printed circuit board sheet is left. Since the portion where the copper foil is left is stronger than the portion where the copper foil is not left, even if the contact position of the upper and lower pressing members deviates slightly from the cutting line, the copper foil is pressed by the pressure applied by the upper and lower pressing members. The connecting portion can be separated and cut along the end portion of the.

【0010】[0010]

【実施例】以下、本発明の一実施例のフレキシブルプリ
ント基板シートの分離切断方法について図面を参照して
説明する。図1(a)に示すように本実施例のフレキシ
ブルプリント基板1は、数個ずつ互いに連結部2a,2
b,2cで連結されてフレキシブルプリント基板シート
3を形成し、回路パターンが破線P内に形成される。そ
して図3に示すように、ベースフィルム4上に接着剤5
aで貼り付けられた銅箔6に、回路パターンに加えて、
図1(b),(c)および(d)に示すように、連結部
2a,2b,2cの基部近傍の分離切断線(矢印K)に
沿って端部Tが位置する分離切断用の銅箔6aを残した
パターンを形成し、前記回路パターンと分離切断用の銅
箔6aが形成された銅箔6上に、図3に示すように接着
剤5bでカバーフィルム7を貼り付けてフレキシブルプ
リント基板シート3を形成する。
DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS A method for separating and cutting a flexible printed board sheet according to an embodiment of the present invention will be described below with reference to the drawings. As shown in FIG. 1A, the flexible printed circuit board 1 of the present embodiment has several connecting parts 2a and 2a.
The flexible printed board sheet 3 is connected by b and 2c, and the circuit pattern is formed within the broken line P. Then, as shown in FIG. 3, an adhesive 5 is formed on the base film 4.
In addition to the circuit pattern on the copper foil 6 pasted with a,
As shown in FIGS. 1 (b), (c) and (d), copper for separation cutting in which an end portion T is located along a separation cutting line (arrow K) near the bases of the connecting portions 2a, 2b, 2c. A pattern is formed by leaving the foil 6a, and the cover film 7 is attached by an adhesive 5b on the copper foil 6 on which the circuit pattern and the copper foil 6a for separating and cutting are formed, as shown in FIG. The substrate sheet 3 is formed.

【0011】そして、図4に示すように、フレキシブル
プリント基板1を連結部2a,2bまたは2cを分離切
断するときは、連結部2a,2bまたは2cの基部近傍
の分離切断線Kに沿って、フレキシブルプリント基板シ
ート3の上面と下面にそれぞれ上面押え部材8と下面押
え部材9を当接し、いずれか一方の押え部材を固定し、
もう一方の押え部材を上方または下方から押圧して分離
切断するものである。図2に本実施例の方法で分離切断
したフレキシブルプリント基板1を示す。連結部2a,
2b,2cの基部近傍の分離切断線(矢印K)に沿って
端部Tが位置する分離切断用の銅箔6aが残っているた
め、上,下面押え部材8,9と分離切断線(矢印K)の
相対位置が多少ずれていても銅箔6aの端部近傍の銅箔
6aの残っていない部分のカバーフィルム7とベースフ
ィルム4の部分が切断される。これは銅箔6aの残され
ていない部分の強度が、銅箔6aの残されている部分の
強度より弱いためである。
Then, as shown in FIG. 4, when the flexible printed board 1 is separated and cut at the connecting portions 2a, 2b or 2c, along the separating cutting line K in the vicinity of the base of the connecting portion 2a, 2b or 2c, The upper surface pressing member 8 and the lower surface pressing member 9 are brought into contact with the upper surface and the lower surface of the flexible printed circuit board sheet 3, respectively, and one of the pressing members is fixed,
The other pressing member is pressed from above or below to separate and cut. FIG. 2 shows a flexible printed board 1 separated and cut by the method of this embodiment. Connection part 2a,
Since the copper foil 6a for separating and cutting having the end T located along the separating and cutting line (arrow K) near the bases of 2b and 2c remains, the upper and lower pressing members 8 and 9 and the separating and cutting line (arrow). Even if the relative position of (K) is slightly deviated, the portion of the cover film 7 and the base film 4 in the portion near the end of the copper foil 6a where the copper foil 6a does not remain is cut. This is because the strength of the part where the copper foil 6a is not left is weaker than the strength of the part where the copper foil 6a is left.

【0012】[0012]

【発明の効果】以上の説明により明らかなように本発明
のフレキシブルプリント基板シートの分離切断方法によ
れば、フレキシブルプリント基板を一枚のフレキシブル
プリント基板シートから分離切断するときの、作業のば
らつきやフレキシブルプリント基板の寸法のばらつきに
関係なく、連結部を残すことなくフレキシブルプリント
基板シートを分離切断できるものであり、フレキシブル
プリント基板の寸法精度の向上および作業性の向上に大
いに役立つものである。
As is apparent from the above description, according to the method of separating and cutting a flexible printed circuit board sheet of the present invention, there are variations in work when separating and cutting a flexible printed circuit board from one flexible printed circuit board sheet. The flexible printed board sheet can be separated and cut without leaving a connecting portion regardless of variations in the dimensions of the flexible printed board, which is very useful for improving dimensional accuracy and workability of the flexible printed board.

【図面の簡単な説明】[Brief description of drawings]

【図1】(a)本発明の一実施例のフレキシブルプリン
ト基板シートの分離切断方法に用いるフレキシブルプリ
ント基板シートの平面図 (b)図1(a)のA部の拡大平面図 (c)同B部の拡大平面図 (d)同C部の拡大平面図
1A is a plan view of a flexible printed board sheet used in a method for separating and cutting a flexible printed board sheet according to an embodiment of the present invention. FIG. 1B is an enlarged plan view of a portion A of FIG. 1A. Enlarged plan view of section B (d) Enlarged plan view of section C

【図2】本発明の一実施例のフレキシブルプリント基板
シートの分離切断方法による分離後のフレキシブルプリ
ント基板の平面図
FIG. 2 is a plan view of a flexible printed circuit board after separation by a method for separating and cutting a flexible printed circuit board sheet according to an embodiment of the present invention.

【図3】同フレキシブルプリント基板シートの分離切断
方法に用いるフレキシブルプリント基板シートの断面図
FIG. 3 is a cross-sectional view of a flexible printed board sheet used in the method for separating and cutting the flexible printed board sheet.

【図4】同フレキシブルプリント基板シートの分離切断
方法によるフレキシブルプリント基板シートの分離切断
状態を示す断面図
FIG. 4 is a cross-sectional view showing a state of separating and cutting the flexible printed circuit board sheet by the method of separating and cutting the flexible printed circuit board sheet.

【図5】従来のフレキシブルプリント基板シートの分離
切断方法に用いるフレキシブルプリント基板シートの平
面図
FIG. 5 is a plan view of a flexible printed board sheet used in a conventional method for separating and cutting a flexible printed board sheet.

【図6】同フレキシブルプリント基板シートの分離切断
方法による分離後のフレキシブルプリント基板の平面図
FIG. 6 is a plan view of the flexible printed circuit board after separation by the method for separating and cutting the flexible printed circuit board sheet.

【図7】同フレキシブルプリント基板シートの分離切断
方法によるフレキシブルプリント基板シートの分離切断
状態を示す断面図
FIG. 7 is a cross-sectional view showing a state of separating and cutting the flexible printed circuit board sheet by the method of separating and cutting the flexible printed circuit board sheet.

【符号の説明】[Explanation of symbols]

1 フレキシブルプリント基板 2a,2b,2c 連結部 3 フレキシブルプリント基板シート 4 ベースフィルム 5a,5b 接着剤 6 銅箔 6a 分離切断用の銅箔 7 カバーフィルム 8 上面押え部材 9 下面押え部材 K 分離切断線 P 回路パターン形成部分 T 分離切断用の銅箔の端部 DESCRIPTION OF SYMBOLS 1 Flexible printed circuit board 2a, 2b, 2c Connection part 3 Flexible printed circuit board sheet 4 Base film 5a, 5b Adhesive 6 Copper foil 6a Copper foil for separation cutting 7 Cover film 8 Top holding member 9 Bottom holding member K Separation cutting line P Circuit pattern forming part T Edge of copper foil for separation and cutting

Claims (1)

【特許請求の範囲】[Claims] 【請求項1】 ベースフィルム上に接着剤で貼り付けら
れた銅箔に、回路パターンに加えて連結部の基部近傍の
分離切断線に沿って端部が位置する分離切断用の銅箔を
残したパターンを形成し、前記回路パターンと分離切断
用のパターンが形成された銅箔上に接着剤でカバーフィ
ルムを貼り付けて形成したフレキシブルプリント基板シ
ートの前記分離切断線に沿って前記フレキシブルプリン
ト基板シートの上面と下面にそれぞれ上面押え部材と下
面押え部材とを当接し、いずれか一方の押え部材を固定
し、もう一方の押え部材を上方または下方から押圧して
分離切断するフレキシブルプリント基板シートの分離切
断方法。
1. A copper foil adhered on a base film with an adhesive, in addition to a circuit pattern, leaving a copper foil for separating and cutting whose ends are located along a separating and cutting line near the base of a connecting portion. The flexible printed circuit board is formed along the separation cutting line of the flexible printed circuit board sheet by forming a pattern, and attaching a cover film with an adhesive on the copper foil on which the circuit pattern and the pattern for separation cutting are formed. In the flexible printed circuit board sheet, the upper surface pressing member and the lower surface pressing member are respectively brought into contact with the upper surface and the lower surface of the sheet, one of the pressing members is fixed, and the other pressing member is pressed from above or below to separate and cut. Separation cutting method.
JP1776493A 1993-02-05 1993-02-05 Cutoff method of flexible printed board sheet Pending JPH06232529A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1776493A JPH06232529A (en) 1993-02-05 1993-02-05 Cutoff method of flexible printed board sheet

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1776493A JPH06232529A (en) 1993-02-05 1993-02-05 Cutoff method of flexible printed board sheet

Publications (1)

Publication Number Publication Date
JPH06232529A true JPH06232529A (en) 1994-08-19

Family

ID=11952780

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1776493A Pending JPH06232529A (en) 1993-02-05 1993-02-05 Cutoff method of flexible printed board sheet

Country Status (1)

Country Link
JP (1) JPH06232529A (en)

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