JP2002280712A - Method of manufacturing cover lay film and flexible printed wiring board - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a method of manufacturing cover lay film by which a cover lay film can be manufactured quickly and inexpensively without manufacturing moulds nor victory moulds which have been manufactured at every drill and product for working the opening, external form, and unnecessary portion of the film. SOLUTION: In this method of manufacturing cover lay film, the opening, external form, and unnecessary portion of the cover lay film used for a flexible printed wiring board are successively worked following a preset procedure by using a cutting plotter.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for manufacturing a coverlay film and a flexible printed wiring board.

[0002]

2. Description of the Related Art Sheets used in the production of flexible printed wiring boards are composed of an insulating resin film, a copper-clad board made of circuit copper foil, and a coverlay film, and an adhesive is applied between the insulating resin film and the circuit copper foil. A base material that has or has no adhesive between the insulating resin film and the circuit copper foil in part, and a cover lay film that covers the circuit (copper foil) with an insulating resin film with adhesive The circuit pattern is imposed. The cover lay film used for these components should be cut off as an opening before connecting to other printed wiring boards, capacitors, resistors, connectors, etc. The surrounding area is processed and used. Drilling with these coverlay film drills, punching with dies, and Victory dies are generally performed.However, in these processes, it is necessary to prepare dies and Victory dies in advance. It took time. Furthermore, since the shape and specifications of the flexible printed wiring board are frequently changed at the design stage, it is necessary to remodel or re-create a mold or a Victory mold every time the change is made, which requires cost and time. There was a problem that took time.

[0003]

According to the present invention, a mold or a Victory mold is conventionally manufactured for each drill or each product and the opening, outer shape and unnecessary portion of the coverlay film are processed. By using a cutting plotter instead of a mold, these molds become unnecessary, and a coverlay film manufacturing method and a flexible printed wiring board capable of processing the coverlay film more quickly and inexpensively are provided. .

[0004]

According to the present invention, there is provided [1] an opening, an outer shape, and an unnecessary portion of a coverlay film used for a flexible printed wiring board are sequentially processed in a preset procedure using a cutting plotter. [2] The cover lay film is characterized in that an adhesive or a thermosetting adhesive is applied to one side of a thermosetting resin film or a thermoplastic resin film, and the adhesive side is separated. The method for producing a coverlay film according to the item [1], wherein the coverlay film is covered with a pattern paper or a release film,
[3] A flexible printed wiring board using the cover lay film according to item [1] or [2].

[0005]

BEST MODE FOR CARRYING OUT THE INVENTION The present invention will be specifically described below. The flexible printed wiring board used in the present invention, on one or both sides of an insulating substrate such as a thermoplastic resin film or a thermosetting resin film, there is an adhesive, or a copper foil without an adhesive, An insulating resin sheet with a copper foil on which a circuit is formed in advance by etching or the like is coated with a coverlay film of an insulating base material as an overlay. The insulating substrate of the insulating resin sheet with copper foil on which the circuit is formed is integrally formed by heating and pressing the copper foil via an adhesive on one or both sides of a flexible insulating substrate such as a polyimide resin film. There is a thing without the adhesive layer which applied the varnish of the polyimide resin directly to the copper foil and heat-molded it, and it is the same as the thing for the flexible printed wiring board conventionally used, and the thickness is 5 μm A 100 μm film, electrolytic copper foil or rolled copper foil is used as the copper foil for the circuit, and a thickness of 1 μm to 50 μm is used. A predetermined circuit is formed on the copper foil by etching or the like. It is.

The coverlay film used in the present invention is a flexible insulating base material such as a polyimide resin film and the like, which is a resin film that can withstand the heat received during the production process of an overlay press or a flexible printed wiring board. If it is, it is not limited to a thermoplastic resin film or a thermosetting resin film, etc., but an adhesive or a thermosetting adhesive is applied to one surface thereof, and a foreign substance or the like adheres to the adhesive or the adhesive. It is covered with a release paper or a release film so that the opening is not processed in this state. The release paper or release film is peeled off and used immediately before the coverlay film is bonded to the resin sheet with copper foil on which the circuit is formed.

In general, a flexible printed wiring board is composed of other printed wiring boards, connectors, resistors, capacitors,
Because it is used by being connected to components such as liquid crystal panels and ICs, before overlaying the connected portion of the coverlay film on the insulating base sheet with copper foil where the predetermined circuit has been etched, It is necessary to process it along the shape. In the processing of this coverlay film, a punching die and a Victory die have to be manufactured for each product because the circuit pattern and the outer shape differ from product to product conventionally. Therefore, it takes time and cost to manufacture a mold and the like. However, by using a cutting plotter, it is necessary to create a program for recognizing the shape and position to be processed in advance, and only to sequentially process necessary parts in a preset procedure, which is necessary for manufacturing a flexible printed wiring board. The time can be reduced, and the cost can be reduced because no mold is manufactured.

The cutting plotter device used in the present invention is used by being connected to a computer or the like. A cutting blade is provided on a pen portion of a head of the pen plotter device capable of drawing diagrams, pictures, characters, and the like. It is attached. The position accuracy of the cutting plotter is not particularly limited, but is preferably one having an accuracy of 0.1 mm or more, and the blade to be used is preferably a carbide blade having excellent durability. There is no particular limitation as long as the release paper or release film can be cut at the same time. In the processing of the coverlay film, a cutting plotter and a mold or a cutting plotter and a Victory mold used in the present invention, or a cutting plotter and a drill, such as a cutting plotter and one or more other tools are used in combination. Is also good.

Hereinafter, a flexible printed wiring board according to the present invention will be briefly described with reference to the drawings. FIG.
Insulating resin sheet 1 having a circuit (copper foil) 2 formed with a circuit formed thereon, and an insulating resin sheet with a copper foil formed thereon, and a cutting plotter processed into the shape of outer portion 4 from which opening 3 and unnecessary portions have been removed. 2 shows a covered coverlay film 5. FIG.
Is a schematic view of a flexible printed wiring board after an insulating resin sheet on which a circuit is formed (with a copper foil) and a coverlay film 5 are bonded by an overlay press such as a hot press, and heated and pressed to be integrally formed. Show.

[0010]

According to the method for manufacturing a cover lay film of the present invention, a punching die and a Victory die for manufacturing a cover lay film for each product, which have been conventionally required, are not required, so that a flexible printed wiring board is manufactured. In addition to shortening the time required for molding, the cost of the mold can be reduced, which is industrially useful.

[Brief description of the drawings]

FIG. 1 is a perspective view showing an insulating resin sheet with a copper foil having a circuit formed on one side, and a coverlay film processed into a shape of an external portion from which an opening and an unnecessary portion have been removed using a cutting plotter.

FIG. 2 is a schematic view showing a state where an insulating resin sheet with (copper foil) on which a circuit is formed and a coverlay film are integrally formed.

Claims (3)

[Claims] 1. A method of manufacturing a cover lay film, wherein an opening, an outer shape, and an unnecessary portion of a cover lay film used for a flexible printed wiring board are sequentially processed in a preset procedure using a cutting plotter. 2. A coverlay film, wherein a thermosetting resin film or a thermoplastic resin film is coated with an adhesive or a thermosetting adhesive on one side, and the adhesive side is covered with a release paper or a release film. The method for producing a cover lay film according to claim 1. 3. A flexible printed wiring board using the cover lay film according to claim 1.