JP2007005344A - Material for forming circuit, method of manufacturing same, and method of manufacturing printed circuit board - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a material for forming a circuit capable of manufacturing a flexible printed circuit board, or the like easily regardless of the material of an insulating film, to provide a method of manufacturing the material for forming a circuit, and to provide a method of manufacturing the printed circuit board using the material for forming a circuit. <P>SOLUTION: The material for forming a circuit is manufactured, where a patterned conductive thin-film layer is formed by removing the unneeded part of the metal foil of a metal foil laminated base in which the metal foil is laminated through a separation layer made of a fine adhesive formed on the surface of the body of the base by etching. The patterned conductive thin-film layer of the material for forming a circuit is transferred to an insulating material. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

  The present invention relates to a circuit forming material, a method for manufacturing a circuit forming material, and a method for manufacturing a printed circuit board.

  For example, as shown in FIG. 5, a flexible printed circuit board 100 includes a circuit 130 formed in a desired pattern with a metal between upper and lower insulating layers 110 and 120, and both insulating layers 110 and 120 In some cases, a through hole 140 is formed in advance at a position facing a part of the circuit 130 such as a portion.

Conventionally, this type of flexible printed circuit board 100 has been obtained through a process as shown in FIG. 6 (see, for example, Non-Patent Document 1).
That is, first, as shown in FIG. 6 (a), a small hole 141 was formed by punching at a position where the through hole 140 of the insulating film 111 to be the insulating layers 110 and 120 formed of a resin such as polyester or polyimide was formed. After that, as shown in FIG. 6B, a metal foil 131 such as a copper foil is bonded onto the insulating film 111 by hot pressing.

  Next, as shown in FIG. 6C, a desired circuit pattern portion on the surface of the metal foil 131 is covered with a photoresist film 150, and the entire exposed surface of the insulating film 111 is covered with a photoresist film 160. The exposed portion 132 of the metal foil 131 is removed by etching with an etchant to form a circuit 130 as shown in FIG. 6D, and then a photoresist film 150 and a photoresist film as shown in FIG. 160 is removed.

Thereafter, although not shown, another insulating film to be the insulating layer 120 is hot-pressed on the insulating film 111 so as to sandwich the circuit 130 between the insulating film 111 and a flexible printed board as shown in FIG. Get 100.
Moreover, the flexible printed circuit board 100 obtained in this way may be made into a plurality of small flexible printed circuit boards by being shot out or cut by an outer shape die as necessary.

Introduction to high-density flexible boards (issued on December 24, 1998)

However, since the circuit 130 is obtained by etching the metal foil 131 with the etching solution in the method for manufacturing the flexible printed board as described above, there is a problem that the material of the insulating film 111 is limited. .
That is, when the insulating film 111 is made of a material that can be easily impregnated with a liquid such as cloth or paper, the etching solution penetrates into the insulating film 111, thereby causing a problem to the product.

  In view of the above circumstances, the present invention uses a circuit-forming material, a method for producing the circuit-forming material, and a circuit-forming material capable of easily producing a flexible printed circuit board and the like regardless of the material of the insulating film. It is an object of the present invention to provide a printed circuit board manufacturing method.

  In order to achieve the above object, a circuit forming material according to the present invention is characterized in that a patterned conductive thin film layer formed in a desired circuit pattern is detachably laminated on the surface of a substrate. .

  The method for producing a circuit forming material according to the present invention includes an unnecessary portion of the metal foil of the metal foil laminated base material in which the metal foil is laminated via a release layer made of a fine adhesive formed on the surface of the base body. Is removed by etching to form a patterned conductive thin film layer.

In the circuit forming material and the method for producing the same according to the present invention, the substrate body is generally in the form of a sheet, but may be in the form of a roll.
The material of the substrate body is not particularly limited as long as it is not corroded by the etching solution and is not melted by a heating press or the like, and examples thereof include general plastic materials having high heat resistance.

The pressure-sensitive adhesive layer is not particularly limited as long as it is not corroded by the etching solution and the patterned conductive thin film layer is peeled off during transfer. For example, an acrylic light pressure-sensitive adhesive layer can be used. It is done.
The material of the metal foil is not particularly limited as long as it has conductivity, and examples thereof include copper, silver, aluminum, and gold.

The thickness of the metal foil is not particularly limited as long as it is a thickness required for circuit formation, but is usually about 9 to 35 μm.
The etching method is not particularly limited, and a known method conventionally used for circuit formation of a printed board can be used.
If the patterned conductive thin film layer does not peel off from the slightly adhesive layer when etching with an etching solution and the patterned conductive thin film layer can be successfully formed, the metal foil laminated substrate can be manufactured as a printed circuit board. In doing so, those conventionally used can also be used.

  The printed circuit board manufacturing method according to the present invention includes a circuit-forming material according to the present invention, wherein the patterned conductive thin film layer faces the insulating substrate material side, and a part of the patterned conductive thin film layer is an insulating material. A circuit-forming material is thermocompression-bonded to an insulating material in a state where the small hole formed in the desired portion is exposed to the surface, and the patterned conductive thin film layer is transferred to the insulating material. It is characterized by being.

  In the method for producing a printed circuit board according to the present invention, the insulating material is not particularly limited as long as it has insulating properties, and examples thereof include resins such as polyester and polyimide, fabrics, papers, and the like. It may be the one that does not have hard flexibility.

  The small holes are not particularly limited, but can be formed by, for example, a method of punching an insulating material, a method of extracting a small hole portion of an insulating material by a laser beam, or the like.

  In the method for producing a printed circuit board according to the present invention, although not particularly limited, after the patterned conductive thin film layer is transferred to an insulating material, the surface of the transferred patterned conductive thin film layer is covered with another insulating material. It doesn't matter.

Alternatively, a plurality of patterned conductive thin film layers may be transferred onto the insulating material at a time, and the insulating material may be cut into small sections including a desired number of patterned conductive thin film layers.
An adhesive or the like may be applied in advance to the transfer surface of the insulating material.

  In the circuit forming material according to the present invention, as described above, the patterned conductive thin film layer formed in the desired circuit pattern is detachably laminated on the surface of the base material. Is peeled off from the substrate and attached to the insulating material, or the patterned conductive thin film layer is transferred to the insulating material, whereby a printed board can be easily produced. In addition, since the insulating material never comes into contact with the etching solution, it is possible to use a cloth or paper that is difficult to use conventionally as the insulating material. For example, a circuit is directly attached to clothes or the like. be able to.

Hereinafter, the present invention will be described in detail with reference to the drawings showing embodiments thereof.
FIG. 1 and FIG. 2 show one embodiment of the circuit forming material according to the present invention.

As shown in FIGS. 1 and 2, the circuit forming material 1 includes a base material 2 and a plurality of patterned conductive thin film layers 3.
The base material 2 includes a base body 21 made of a polyester or polyimide resin film, and a slightly adhesive layer 22 provided on one surface of the base body 21.

  Each of the patterned conductive thin film layers 3 is formed in a circuit shape partially including the land portion 30 by a conductive metal material such as copper, silver, aluminum, or gold. It is attached to one surface of the substrate 2 so as to be peelable.

As shown in FIG. 3, the circuit forming material 1 is prepared by preparing a metal foil laminated base material 2 a in which a metal foil 3 a is laminated on a whole surface of a base body 21 via a slightly adhesive layer 22. A portion of the foil 3 a that becomes the patterned conductive thin film layer 3 is covered with a photoresist film 4.
Thereafter, the exposed portion 32 of the metal foil 3a not covered with the photoresist film 4 is etched with an etching solution, and then the photoresist film 4 is removed.

  By using the circuit forming material 1 thus obtained, a flexible printed circuit board 7 can be obtained as shown in FIG.

That is, as shown in FIG. 4A, an insulating film 5a is prepared as an insulating material in which small holes 51 to be through holes are pre-punched in advance, and the insulating film 5a is land portions 30 corresponding to the small holes 51. The patterned conductive thin film layer 3 is hot-pressed in a state of being superimposed on the circuit forming material 1 so as to coincide with a predetermined portion.
Next, as shown in FIG. 4B, only the patterned conductive thin film layer 3 is transferred to one surface of the insulating film 5a by peeling off the substrate 2.

Next, as shown in FIG.4 (c), another insulating film 5b used as an insulating material is hot-pressed on the insulating film 5a so that the patterned electroconductive thin film layer 3 may be pinched | interposed between the insulating films 5a. A flexible printed circuit board 7 as shown in FIG. 5 is obtained.
Moreover, the flexible printed circuit board 7 obtained in this way may be made into a plurality of small flexible printed circuit boards by being shot or cut by an outer shape die as necessary.

The present invention is not limited to the above embodiment. For example, in the above-described embodiment, the patterned conductive thin film layer is one layer, but a multilayer printed board can also be manufactured.
In the above embodiment, the flexible splint board is manufactured using the circuit forming material, but it can also be used for manufacturing a hard printed board.

  Furthermore, in the above-described embodiment, the small holes that are through-holes are provided in advance on the insulating films on both sides, but the through-holes may be on only one side. Moreover, you may make it form later with a laser, a chemical | medical agent, etc.

  The circuit forming material of the present invention can be used, for example, for circuit formation of printed circuit boards and IC tags (cloth, paper, etc.).

It is a top view showing one embodiment of a circuit formation material concerning the present invention. FIG. 2 is a cross-sectional view schematically showing the circuit forming material of FIG. 1. It is sectional drawing explaining the manufacturing method of the circuit formation material of FIG. It is explanatory drawing explaining the manufacturing method of the printed circuit board using the circuit formation material of FIG. 1 in order of a process. It is sectional drawing which represents the conventional printed circuit board typically. It is explanatory drawing explaining the manufacturing method of the conventional printed circuit board in order of a process.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Circuit formation material 2 Base material 2a Metal foil laminated base material 21 Base material main body 22 Fine adhesion layer 3 Patterned conductive thin film layer 3a Metal foil 30 Land part 32 Exposed part 4 Photoresist film 5a, 5b Insulating film (insulating material) )
51 Small hole 7 Flexible printed circuit board

Claims (3)

  A circuit-forming material, wherein a patterned conductive thin film layer formed in a desired circuit pattern is detachably laminated on a surface of a substrate.   The patterned conductive thin film layer is formed by etching away unnecessary portions of the metal foil of the metal foil laminated base material in which the metal foil is laminated via the fine adhesion layer formed on the surface of the base body. The manufacturing method of the circuit formation material as described in 2.   The circuit-forming material according to claim 1, wherein the patterned conductive thin film layer faces the insulating material side, and a part of the patterned conductive thin film layer is perforated in a desired portion of the insulating material. A printed circuit board manufacturing method comprising: a step of thermocompression bonding a circuit forming material to an insulating material in a state of being arranged so as to face the hole, and transferring the patterned conductive thin film layer to the insulating material.

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