JPH11274716A - Flexible wiring board - Google Patents

Abstract

PROBLEM TO BE SOLVED: To reduce residual volatile matter and to dry a flexible wiring board at a low temperature by using a heat-resistance resin composition containing siloxane modification polyamideimide resin and a thermosetting resin constituent for the adhesive or the cover lay film of a base film and a circuit conductor. SOLUTION: A flexible wiring board uses a heat resistance resin composition containing siloxane modification polyamideimide resin and a thermosetting resin constituent for the adhesive and/or the cover lay film of a base film and a circuit conductor. Diamine with at least three siloxane and aromatics, a solution containing diimidecarboxylic acid being obtained by allowing trimellitic acid anhydride, and polyamideimide resin being obtained by allowing aromatic series diazocianate to react are used for the siloxane modification polyamide resin. The thermosetting resin constituent should contain an epoxy resin with at least two glycidyl groups and its curing accelerator and a curing agent as needed.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a flexible wiring board using a siloxane-modified polyamideimide resin.

[0002]

2. Description of the Related Art A flexible wiring board mainly uses a polyimide film as a base film, a copper foil is adhered to the base film with an adhesive, and unnecessary portions of the copper foil are removed by etching to form circuit conductors. And the coverlay film is laminated and bonded using an adhesive. Such a flexible wiring board is used in a narrow place by utilizing its flexibility,
Widely used for electronic mounting on uneven surfaces.
Further, a flexible wiring board with a rigid board having both the high density of the rigid wiring board and the flexibility of the flexible wiring board is manufactured by bonding the rigid board and the flexible wiring board with an adhesive.

[0003]

However, a flexible wiring board uses an adhesive for bonding between materials, and its heat resistance is significantly inferior to that of a base film.
There was a problem that the overall heat resistance was low. Similarly, a flexible wiring board with a rigid board also has a problem of heat resistance, and further has problems such as low adhesiveness of a coverlay film (mainly a polyimide film) and low smear removal of various adhesives. .

[0004] Materials having high heat resistance and high flexibility include:
Polyamide-imide resin, epoxy resin and its curing agent,
There is an adhesive material such as a curing accelerator. However, polyamide-imide resins are generally synthesized using a high-boiling point solvent, and thus require long-time drying under low-temperature drying conditions of, for example, 150 ° C. or lower, and the residual volatile matter of the obtained film is still 10% by weight. %, And even under high-temperature drying conditions of 150 ° C. or more, when the film thickness exceeds 100 μm, it was difficult to reduce the residual volatile matter to 5% by weight or less.

Further, when a resin composition in which a thermosetting component such as an epoxy resin and a curing agent is mixed with a polyamideimide resin is formed into a film, a large amount of the polyamideimide resin solvent remains at a low temperature and a high temperature at a low temperature. In this case, since the curing reaction of the thermosetting component proceeds, it was not possible to hold the adhesive so that it would not be cured until the flexible wiring board was laminated and bonded with the adhesive.

An object of the present invention is to provide a flexible wiring board using a resin composition which has a low residual volatile content, can be dried at a low temperature, and can maintain a B-stage state in a manufacturing process.

[0007]

The flexible wiring board of the present invention is a flexible wiring board composed of a base film, a circuit conductor and a coverlay film, and contains a siloxane-modified polyamideimide resin and a thermosetting resin component. The heat-resistant resin composition is used for an adhesive between a base film and a circuit conductor and / or an adhesive between a circuit conductor and a coverlay film and / or a coverlay film.

A flexible wiring board comprising a base film, a circuit conductor, a coverlay film, and a rigid substrate, wherein a heat-resistant resin composition containing a siloxane-modified polyamideimide resin and a thermosetting resin component is provided on the base film. And a flexible wiring board used for the adhesive between the circuit conductor and / or the adhesive between the circuit conductor and the coverlay film and / or the adhesive between the base film and the rigid substrate and / or the coverlay film.

The siloxane-modified polyamide-imide resin has a siloxane diamine and / or an aromatic ring having three or more aromatic rings.
Polyamideimide obtained by reacting a solution containing a diimidedicarboxylic acid represented by Formula 1 and / or Formula 3 obtained by reacting a diamine having at least one diamine with trimellitic anhydride and an aromatic diisocyanate represented by Formula 2 A resin is used, and an epoxy resin having two or more glycidyl groups can be used as the thermosetting resin component.

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In the siloxane-modified polyamideimide resin, the molar ratio of siloxane diamine to diamine having three or more aromatic rings is siloxane diamine / diamine having three or more aromatic rings = 0.1 / 99.9 to 100/100. 0, and trimellitic anhydride is reacted in a range of 2.05 to 2.20 mol with respect to a total of 1 mol of the siloxane diamine and / or the diamine having three or more aromatic rings to convert the aromatic diisocyanate. It is preferable to use a siloxane-modified polyamideimide resin obtained by reacting the siloxane diamine and / or the diamine having three or more aromatic rings at 1.05 to 1.50 mol with respect to 1 mol in total.

As the siloxane diimide dicarboxylic acid obtained by reacting a diamine with trimellitic anhydride, bis (5-hydroxycarbonyl-1,3-dione-isoindolino) propylpolydimethylsiloxane is used, and three aromatic rings are used. It is preferable to use 2,2-bis [4- {4- (5-hydroxycarbonyl-1,3-dione-isoindolino) phenoxy} phenyl] propane as the diamine.

As the thermosetting resin component, it is preferable to use an epoxy resin having two or more glycidyl groups, a curing accelerator for the epoxy resin and, if necessary, a curing agent.

[0013]

BEST MODE FOR CARRYING OUT THE INVENTION As the siloxane diamine used in the present invention, those represented by Formula 4 can be used.

[0014]

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Such a siloxane diamine has the formula 5
The amino-modified silicone oils X-22-161AS (amine equivalent: 450, manufactured by Shin-Etsu Chemical Co., Ltd., trade name), X-22
-161A (amine equivalent 840, manufactured by Shin-Etsu Chemical Co., Ltd., trade name), X-22-161B (amine equivalent 150
0, manufactured by Shin-Etsu Chemical Co., Ltd.), BY16-
853 (amine equivalent 650, manufactured by Toray Dow Corning Silicone Co., Ltd., trade name), BY16-853B (amine equivalent 2200, manufactured by Toray Dow Corning Silicone Co., Ltd., trade name) and the like can be used as commercial products.

[0016]

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The diamine having three or more aromatic rings used in the present invention includes 2,2-bis [4- (4-aminophenoxy) phenyl] propane and bis [4- (3-aminophenoxy) phenyl] Sulfone, bis [4- (4
-Aminophenoxy) phenyl] sulfone, 2,2-bis [4- (4-aminophenoxy) phenyl] hexafluoropropane, bis [4- (4-aminophenoxy)
Phenyl] methane, 4,4'-bis (4-aminophenoxy) biphenyl, bis [4- (4-aminophenoxy) phenyl] ether, bis [4- (4-aminophenoxy) phenyl] ketone, 1,3- Bis (4-aminophenoxy) benzene, 1,4-bis (4-aminophenoxy) benzene and the like can be used, and they can be used alone or in combination.

The aromatic diisocyanate used in the present invention includes 4,4'-diphenylmethane diisocyanate, 2,4-tolylene diisocyanate, 2,6-tolylene diisocyanate, naphthalene-1,5-diisocyanate, and 2,4-triisocyanate. Lendimer and the like can be exemplified, and these can be used alone or in combination.

As the thermosetting resin component, it is preferable to use an epoxy resin having two or more glycidyl groups and a curing agent thereof, or an epoxy resin having two or more glycidyl groups and a curing accelerator thereof. More preferably, the resin has three or more glycidyl groups. The blending amount of the thermosetting resin component varies depending on the number of glycidyl groups, and the blending amount may be smaller as the number of glycidyl groups increases.

The curing agent or curing accelerator for the epoxy resin may be any one which reacts with the epoxy resin or promotes the curing. Examples thereof include amines, imidazoles, and polyfunctional phenols. And acid anhydrides.

As amines, dicyandiamide, diaminodiphenylmethane, guanylurea and the like can be used.
As the imidazoles, alkyl group-substituted imidazoles, benzimidazoles and the like can be used, and as the polyfunctional phenols, hydroquinone, resorcinol, bisphenol A and their halogen compounds, and novolak and resole, which are addition condensates of phenol and aldehydes Resins and the like can be used, and phthalic anhydride and benzophenonetetracarboxylic acid can be used as acid anhydrides, and phthalic anhydride and benzophenonetetracarboxylic acid can be used as acid anhydrides. Among them, imidazoles are preferably used as the curing agent.

The necessary amount of these curing agents or curing accelerators is such that the amount of diamine contained in the siloxane-modified polyamideimide resin is such that one mole of epoxy group reacts with one mole of amide group, and Is present in such an amount as to leave the epoxy group, the amount is sufficient to cure the remaining epoxy group. In the case of amines, the equivalent of the active hydrogen of the amine and the epoxy equivalent of the epoxy resin are almost equivalent. Equal amounts are preferred. In the case of imidazole, the equivalent ratio to active hydrogen is not simply obtained, but empirically, 1 to 10 parts by weight is required for 100 parts by weight of the epoxy resin. In the case of polyfunctional phenols and acid anhydrides, 0.6 to 1.2 equivalents are required for 1 equivalent of the epoxy resin. The amount of these curing agents or curing accelerators is
If the amount is too small, the uncured epoxy resin remains, and the Tg becomes low. If the amount is too large, the unreacted curing agent and curing accelerator remain, and the insulating property decreases.

This condition was confirmed by an experiment.
And N-methylpyrrolidone solution of a siloxane-modified polyamideimide resin shown in Synthesis Example 2
The blending ratio of SCN-195 (trade name, manufactured by Sumitomo Chemical Co., Ltd.) is such that the siloxane-modified polyamideimide resin / epoxy resin = 80/20 (1 mol of amide group / 0.49 mol of epoxy group) in weight ratio. Formula A mixed with
Siloxane-modified polyamide-imide resin / epoxy resin =
60/40 (1 mol of amide group / 1.3 mol of epoxy group)
Formula B was applied to a stainless steel plate, and a cured product was prepared at 290 ° C. for 1 hour.
g was measured. As a result, as shown in FIG. 2, the compound A exhibited a Tg of 200 ° C., but the compound B exhibited a maximum value of tan δ at 150 ° C. corresponding to the unreacted epoxy resin.

The siloxane-modified polyamideimide resin of the present invention is prepared by mixing these compositions in an organic solvent to obtain a heat-resistant resin composition. As such an organic solvent, any organic solvent may be used as long as solubility can be obtained.
Dimethylacetamide, dimethylformamide, dimethylsulfoxide, N-methyl-2-pyrrolidone, γ-butyrolactone, sulfolane, cyclohexanone and the like can be used.

The mixing ratio of the siloxane-modified polyamideimide resin and the heat-resistant resin composition is determined by the amount of siloxane in the polyamideimide resin and the epoxy equivalent of the epoxy resin. That is, the solvent volatilization rate (drying rate) of the heat-resistant resin composition varnish increases as the amount of siloxane in the composition increases, and even when many thermosetting components such as epoxy resins are blended, a varnish having a high drying rate can be obtained. As a result, a sheet with less residual solvent can be obtained under milder drying conditions. The epoxy group of the epoxy resin is
Since it reacts with the amide group of the siloxane-modified polyamide-imide resin, after curing, unreacted epoxy resin remains in the film or sheet to prevent Tg from rising.
It is preferable that the epoxy equivalent in the thermosetting component is 1 or less with respect to the amide equivalent in the siloxane-modified polyamideimide resin.

When the epoxy resin alone is used as the thermosetting component, the curing temperature is usually at least 180 ° C., preferably at least 200 ° C., and the glycidyl group of the epoxy resin and the amide group of the siloxane-modified polyamideimide resin are preferably used. An addition reaction takes place between the two to obtain a three-dimensional crosslinking resin. When a basic catalyst such as imidazole is used as a curing accelerator, the curing temperature can be started from about 160 ° C., and an insertion reaction between the glycidyl group of the epoxy resin and the amide group of the siloxane-modified polyamideimide resin is prevented. As a result, a three-dimensional crosslinking resin is obtained.

The heat-resistant resin composition is applied to a polyimide film and dried to form an adhesive sheet, which is then laminated and adhered to a copper foil, or applied to one side of a metal foil to form a copper foil with an adhesive. Then, a film with a copper foil can be produced by thermocompression bonding with a polyimide film.

After laminating a film for an etching resist on the surface of the film with a copper foil thus produced, the film is exposed to ultraviolet light through a negative film and exposed to light.
Develop, form an etching resist, etch away the copper foil where the etching resist is not formed to form a circuit, peel off the etching resist, and coverlay the circuit insulation where necessary. A flexible wiring board can be manufactured by thermocompression bonding of the film.

As a coverlay film, instead of a conventional polyimide film with an adhesive, a heat-resistant resin composition comprising a siloxane-modified polyamideimide resin and a thermosetting component is applied to, for example, a support film and dried. A product obtained by thermocompression bonding the produced adhesive film can also be used.

A flexible wiring board with a rigid board is manufactured by integrating a flexible wiring board and a rigid wiring board using a heat-resistant resin composition comprising a siloxane-modified polyamideimide resin and a thermosetting component as a laminating adhesive. Can also.

As a preferred combination, the coverlay film of the flexible wiring board portion and the copper foil adhesive are the heat-resistant resin composition, and are further laminated and integrated with the rigid wiring board by the heat-resistant resin composition. is there. In such a flexible wiring board with a rigid board, an adhesive film made of the heat-resistant resin composition, a base film, an adhesive film made of the heat-resistant resin composition, and a copper foil are laminated on the rigid wiring board, and heated and heated. Pressure, stacking and integrating, drilling through-holes with a drill, removing smear with an alkali permanganate solution, performing electroless plating to metalize the inner walls of the through-holes, and selectively removing unnecessary copper by etching. To form a solder resist.

[0032]

EXAMPLES Synthesis Examples 1 to 3 A diamine having three or more aromatic rings was placed in a 1-liter separable flask equipped with a faucet connected to a reflux condenser and having a 25 ml water content receiver, a thermometer and a stirrer. ,
2,2-bis [4- (4-aminophenoxy) phenyl] propane (denoted as BAPP in Table 1);
X-22-161AS (represented as 161AS in Table 1) which is a reactive silicone oil as siloxane diamine; amine equivalent 416, trade name, manufactured by Shin-Etsu Chemical Co., Ltd .; and trimellitic anhydride (TMA in Table 1) ) And N-methylpyrrolidone having an aprotic polarity as a solvent (indicated as NMP in Table 1) at a mixing ratio shown in Table 1, stirred at 80 ° C for 30 minutes, and added with water. 100ml of toluene which is an aromatic hydrocarbon that can be azeotroped with
, And then the temperature was raised and refluxed at about 160 ° C. for 2 hours. Then, it is confirmed that water has been collected in the water content determination receiver at about 7.2 ml or more, and that no outflow of water has been observed. The temperature was increased to remove toluene, the solution was returned to room temperature, and 4,4′-diphenylmethane diisocyanate was used as an aromatic diisocyanate.
0.1 g (indicated as MDI in Table 1)
The reaction was carried out at 90 ° C. for 2 hours. After the reaction was completed, an N-methylpyrrolidone solution of the siloxane-modified polyamideimide resin was obtained.

[0033]

[Table 1]

Examples 1 to 10 A solution of the siloxane-modified polyamideimide resin of Synthesis Examples 1 to 3 in N-methylpyrrolidone was used as an epoxy resin.
-ESCN which is a cresol novolac type epoxy resin
195 (epoxy equivalent: 195, trade name, manufactured by Sumitomo Chemical Co., Ltd.) was blended at a blending ratio (weight ratio) shown in Table 2 and stirred for about 1 hour until the resin became uniform. After standing at room temperature for a time, a heat-resistant resin composition was obtained.
The resin composition is dried on a release film to a thickness of 5
It was applied to a thickness of 0 μm and dried at 120 ° C. for 30 minutes to obtain a B-stage film. Thereafter, the film was peeled off, fixed on a Teflon frame, and heat-treated at 180 ° C. for 60 minutes. The properties of the cured film were measured, and the results are shown in Table 2.
The volatile content remaining in the film at the B stage was evaluated from the weight change of the film before and after the heat treatment, and the results are shown in Table 2.

[0035]

[Table 2]

Comparative Example 1 The compound of Example 6 was used, except that X-22, a siloxane diamine, was used.
Using a resin not containing -161AS (trade name, manufactured by Shin-Etsu Chemical Co., Ltd.), a B-stage film was produced under the same drying conditions as in Examples 1 to 10, and the residual volatile matter was measured. It showed a high value. Further, a film having a thickness of 120 μm was applied with the heat-resistant resin compositions of Examples 6, 10 and Comparative Example 1, and the relationship between the drying time and the remaining volatile components was measured. As a result, as shown in FIG. , Comparative Example 1
In Example 6, the residual volatile matter decreased to 8% by weight with the passage of time, but remained flat thereafter. In Examples 6 and 10, the residual volatile matter decreased to 3% by weight or less. did.

The measured values in the examples and comparative examples are as follows:
It was measured by the following measurement method. (1) Glass transition temperature (Tg), storage elastic modulus Using DVE-V4 type (trade name, manufactured by Rheology Co.) ・ Jig: Pull ・ Distance between chucks: 20 mm ・ Measurement temperature: 50-350 ° C. ・ Raise temperature Speed: 5 ° C./min Measurement frequency: 10 Hz Sample size: Measured at 5 mm width × 30 mm length.
Tg used the maximum value of tan δ. (2) Copper foil adhesive strength A varnish was applied to the roughened surface of electrolytically roughened copper foil TSC-35 (trade name, manufactured by Furukawa Circuit Foil Co., Ltd.) so that the film thickness after drying was 50 μm, and 150 ° C. After drying for 30 minutes, a heat treatment was further performed at 180 ° C. for 1 hour to obtain a sample.
The resin surface was polished with sandpaper # 600 and bonded to the resin plate with an epoxy adhesive (Araldito Standard). The copper foil was peeled off at the varnish dry film interface with a width of 10 mm, and the adhesive strength of the copper foil was measured.

(Flexible Wiring Board with Rigid Board) On a release film, the film thickness after drying is 50 μm.
The heat resistant resin composition of Example 6 was applied,
After drying for a minute, a B-stage adhesive film was obtained. The heat-resistant resin composition of Example 6 was applied to a roughened surface of electrolytically roughened copper foil TSC-35 (trade name, manufactured by Furukawa Circuit Foil Co., Ltd.) so that the film thickness after drying was 50 μm, 12
It dried at 0 degreeC-30 minute, and produced the copper foil with an adhesive agent. Next, the copper foil with the adhesive was overlaid on both sides of a Kapton (trade name, manufactured by Toray Dupont Co., Ltd.), which is a polyimide film having a thickness of 50 μm, so that the adhesive surface was in contact with the polyimide film. 60 minutes, pressure 25k
By heating and pressing under the conditions of g / cm ² , a flexible film with a copper foil was obtained. A dry film for etching resist, HW-440 (trade name, manufactured by Hitachi Chemical Co., Ltd.) is laminated on both surfaces, exposed and developed to form an etching resist, and a copper foil not covered with the etching resist is formed. , And the etching resist was peeled off to form a circuit. A circuit was formed, and the adhesive film of the B stage was overlaid thereon as a coverlay film, and the pressure was 25 kg / cm ² at 180 ° C. for 60 minutes. Heating and pressing were performed under the conditions to produce a flexible wiring board. next,
MCL is an epoxy laminated board with copper foil of 0.6mm thickness
On one side of E679 (trade name, manufactured by Hitachi Chemical Co., Ltd.), a dry film for etching resist, HW-
440 (trade name, manufactured by Hitachi Chemical Co., Ltd.) is laminated, exposed and developed, an etching resist is formed, copper foil not covered by the etching resist is removed by etching, and the etching resist is peeled off and removed. Then, two copper foils were prepared without etching on the other surface, and the copper foil was left as it was. The surface of the circuit on which this substrate was formed was subjected to oxidation / reduction treatment to promote the adhesion of the inner copper foil. Was carried out to produce a rigid wiring board. Place the above B-stage adhesive film on both sides of the flexible wiring board,
Further, the rigid wiring board is superimposed on both sides such that the circuit forming surface is on the inside, and the temperature is 180 ° C. and the time is 60 hours.
Under a pressure of 30 kg / cm ² . Thereafter, a hole is drilled to remove smear (alkaline permanganate solution, NaOH: 40 g / l, KMnO ₄ : 60 g)
/ L, 60 ° C, treatment time 10 minutes), electroless copper sulfate plating and electrolytic copper plating are performed to a thickness of 35 µm to form through-hole plating, form an etching resist, and cover the etching resist. The portions not touched were selectively removed by etching to produce a flexible wiring board with a rigid board.

The wiring board was subjected to a thermal shock test (−65 ° C., 30
Min. To normal temperature 5 min. To 125 ° C. 30 min. Heat cycle test), the circuit breakage did not occur from 300 cycles to 350 cycles, and the connection reliability was as follows. It was higher than the one used. An acrylic rubber epoxy adhesive was used for the copper foil adhesive, an acrylic modified epoxy adhesive Pyralux (trade name, manufactured by DuPont) was used for the multilayer laminating adhesive, and an acrylic was used for the coverlay film. A conventional flexible wiring board with a rigid board manufactured in the same process as above using a rubber epoxy adhesive was disconnected in about 100 cycles.

[0040]

As described above, according to the present invention, there is provided a flexible wiring board using a resin composition which has a low residual volatile content, can be dried at a low temperature, and can maintain a B-stage state in a manufacturing process. Thus, a flexible wiring board having excellent heat resistance, smear removal properties, and reliability can be provided.

[Brief description of the drawings]

FIG. 1 is a diagram for explaining the effect of the present invention.

FIG. 2 is a diagram for explaining another effect of the present invention.

 ──────────────────────────────────────────────────の Continuing on the front page (72) Inventor Kazumasa Takeuchi 1500 Oji Ogawa, Shimodate City, Ibaraki Pref.Hitachi Chemical Industry Co., Ltd. Inside Shimodate Plant (72) Inventor Takeshi Horiuchi 1500 Ogawa, Oaza, Shimodate-shi, Ibaraki Pref.

Claims (7)

[Claims] 1. A flexible wiring board comprising a base film, a circuit conductor and a coverlay film, comprising: a heat-resistant resin composition containing a siloxane-modified polyamideimide resin and a thermosetting resin component; A flexible wiring board used for an adhesive and / or an adhesive between a circuit conductor and a coverlay film and / or a coverlay film. 2. A flexible wiring board comprising a base film, a circuit conductor, a coverlay film and a rigid substrate, wherein a heat-resistant resin composition containing a siloxane-modified polyamideimide resin and a thermosetting resin component is used as a base film. A flexible wiring board used for an adhesive for a circuit conductor and / or an adhesive for a circuit conductor and a coverlay film and / or an adhesive for a base film and a rigid substrate and / or a coverlay film. 3. The method according to claim 1, wherein the siloxane-modified polyamideimide resin is
A polyamidoimide resin obtained by reacting a solution containing a diimide dicarboxylic acid represented by Formula 1 obtained by reacting siloxane diamine with trimellitic anhydride and an aromatic diisocyanate represented by Formula 2; The flexible wiring board according to claim 1, wherein the conductive resin component is an epoxy resin having two or more glycidyl groups. Embedded image Embedded image 4. A siloxane-modified polyamide-imide resin,
Formula 1 obtained by reacting a diamine having three or more aromatic rings with a siloxane diamine and trimellitic anhydride
A polyamideimide resin obtained by reacting a solution containing a siloxane-containing diimide dicarboxylic acid represented by and a diimide dicarboxylic acid having three or more aromatic rings represented by Formula 3 with an aromatic diisocyanate represented by Formula 2, The flexible wiring board according to claim 1, wherein the thermosetting resin component is an epoxy resin having two or more glycidyl groups. Embedded image Embedded image Embedded image 5. A siloxane-modified polyamide-imide resin,
The molar ratio of the diamine having three or more aromatic rings to the siloxane diamine is in the range of siloxane diamine / diamine having three or more aromatic rings = 0.1 / 99.9 to 100/0, and the siloxane diamine and / or Trimellitic anhydride is reacted in a range of 2.05 to 2.20 mol with respect to a total of 1 mol of the diamine having three or more aromatic rings to form a solution containing diimide dicarboxylic acid, and the aromatic diisocyanate is converted into siloxane diamine and And / or 1 to 1 mole of the total of the diamine having three or more aromatic rings.
The flexible wiring board according to claim 3, wherein a product obtained by reacting the same with a molar amount of from 0.5 to 1.50 is used. 6. The siloxane diimide dicarboxylic acid is bis (5-hydroxycarbonyl-1,3-dione-isoindolino) propyl polydimethylsiloxane, and the diimide dicarboxylic acid having three or more aromatic rings is 2,2.
2-bis [4- {4- (5-hydroxycarbonyl-
The flexible wiring board according to claim 5, which is [1,3-dione-isoindolino) phenoxydiphenyl] propane. 7. A thermosetting resin component comprising an epoxy resin having two or more glycidyl groups and a curing accelerator thereof, and optionally containing a curing agent.
7. The flexible wiring board according to any one of items 6 to 6.