JP2007115722A - Flexible wiring board and electronic component - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a flexible wiring board which avoids thermal damage to an insulating layer, and also to provide a high-performance electronic component using the flexible wiring board. <P>SOLUTION: A heat-resistant resin layer 200 and metal foil layers 301, 302 are laminated in this order at least on one surface of a polycarbonate polyurethane resin layer 100 containing an isocyanurate compound as a curing agent. The metal foil layers 301, 302 are patterned. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

  The present invention relates to a flexible wiring board and an electronic component using the same.

  A flexible wiring board has an insulating layer bonded to one side of a copper foil, is flexible and can be bent and used, so it is suitable for wiring in a limited space. There is an advantage that it can be attached to an electronic element of various shapes, and it is used in various electronic devices.

  Usually, general-purpose resins such as polyethylene and polypropylene are used as the insulating layer, but these resins have poor heat resistance and cannot be used for flexible wiring boards that are directly soldered.

  Therefore, heat-resistant resins such as polyimide resins and polyamide-imide resins are used as insulating layers for flexible wiring boards that require heat resistance. However, when a heat resistant resin such as a polyimide resin is used as the insulating layer, it is difficult to attach the polyimide resin alone by thermal bonding because of its high heat resistance.

As a means to solve problems related to thermal adhesiveness such as polyimide resin, in a circuit board application, a thermosetting silicone resin is used as an adhesive, a method of adhering polyimide resin (Patent Document 1), an epoxy resin A method of blending as an adhesive and adhering a polyamide-imide resin (Patent Document 2) has been proposed.
However, even in this case, high-temperature and high-pressure pressure bonding is required for thermal bonding, and heat treatment requires high-temperature and long-time treatment as well.
Japanese Patent Publication No. 63-30797 Japanese Patent No. 3223894

  An object of the present invention is to provide a flexible wiring board capable of avoiding thermal damage to an insulating layer, and a high-performance electronic component using the flexible wiring board.

  In order to solve the above-described problems, a flexible wiring board according to the present invention includes a heat-resistant resin layer and a metal foil containing a polyamideimide resin on at least one surface of a polycarbonate polyurethane resin layer containing an isocyanurate compound as a curing agent. The layer includes portions laminated in this order. The metal foil layer is patterned according to the purpose of use.

In the flexible wiring board described above, the heat-resistant resin layer and the polycarbonate polyurethane resin layer function as an insulating layer. A heat resistant resin layer (a layer of a heat resistant resin having a glass transition temperature (Tg) of 300 ° C. or more) is adjacent to a metal foil layer that directly receives heat from the outside during soldering or the like among the insulating layers. Therefore, since the insulating layer has high heat resistance, it is possible to avoid thermal damage to the insulating layer when it is attached to a predetermined position.
The heat-resistant resin layer is a polycarbonate polyurethane resin which is cured by using an isocyanurate compound having a suitable heat resistance and thermal adhesiveness as a curing agent on the other surface opposite to the one surface adjacent to the metal foil layer. Since the layers are adjacent to each other, it can be attached to a predetermined position of the object. For this reason, unlike the case where only the polyamideimide resin layer is provided on the metal foil layer, the high-temperature and high-pressure treatment is unnecessary in the adhesion treatment step, and the adhesion treatment step can be completed in a short time.

  Furthermore, the present invention also discloses a nonreciprocal circuit element such as an electronic component provided with a flexible wiring board, such as an isolator, as one application example of the flexible wiring board described above.

  As described above, according to the present invention, it is possible to provide a flexible wiring board that can be attached to a predetermined position of an object, and an electronic component using the flexible wiring board.

  Other objects, configurations and advantages of the present invention will be described in more detail with reference to the accompanying drawings. However, the attached drawings are merely examples.

  FIG. 1 is a diagram schematically showing a cross-sectional structure of a flexible wiring board according to the present invention. Referring to the figure, a heat resistant resin layer 200 and metal foil layers 301 and 302 are laminated in this order on one surface of a polycarbonate polyurethane resin layer 100 containing an isocyanurate compound as a curing agent. The metal foil layers 301 and 302 are typically made of copper foil and patterned according to the purpose of use. In the polycarbonate polyurethane resin layer 100, the isocyanurate compound serving as a curing agent can be contained in the range of 5 wt% to 30 wt%.

  Moreover, the polycarbonate polyurethane resin layer 100 and the heat resistant resin layer 200 may contain ceramic dielectric powder or magnetic powder or both. Ceramic dielectric powder can be used to improve the apparent relative permittivity, and magnetic powder can be used to improve the relative permeability. As the magnetic powder, ferrite magnetic powder or the like can be used.

  In the flexible wiring board, the heat-resistant resin layer 200 and the polycarbonate polyurethane resin layer 100 are adjacent to each other and function as an insulating layer as a whole. Among these insulating layers, the heat-resistant resin layer 200 is adjacent to the metal foil layers 301 and 302 that receive heat from the outside during soldering. Therefore, an insulating layer having high heat resistance can be formed.

  Further, the heat resistant resin layer 200 is hardened by using an isocyanurate compound curing agent having appropriate heat resistance and thermal adhesiveness on the other surface opposite to the one adjacent to the metal foil layers 301 and 302. Since the treated polycarbonate polyurethane resin layer is adjacent, it can be attached to a predetermined position of the object. For this reason, unlike the case where only the heat-resistant resin layer 200 is provided on the metal foil layers 301 and 302, the high-temperature and high-pressure treatment is unnecessary in the adhesion treatment process, and the adhesion treatment process can be completed in a short time. . Alternatively, as shown in FIG. 2, the polycarbonate polyurethane resin layer 100 can be adhered to the object 400 in the incorporation into the electronic component.

  The thicknesses of the polycarbonate polyurethane resin layer 100, the heat resistant resin layer 200, and the metal foil layers 301 and 302 are not particularly limited, but can be selected in the range of 5 μm to 100 μm. Therefore, the flexible wiring board according to the present invention is actually a very thin flexible film or sheet.

  The flexible wiring board described above can be generally manufactured by the steps shown in FIGS. First, a mixed solution of a heat-resistant resin containing polyamideimide resin and a solvent is applied onto a metal foil layer 300 made of copper foil using an applicator, for example, so that the layer thickness after drying becomes 5 μm. ,dry.

  Next, the polycarbonate polyurethane resin layer 100 is formed on the heat resistant resin layer 200 by coating and dried. Specifically, a polycarbonate polyurethane resin and an isocyanurate compound added in an amount of 5 to 30 wt% with respect to the polycarbonate polyurethane resin are dissolved in a solvent MEK to prepare a lacquer solution having a concentration of 20 wt%.

  Then, this lacquer solution is applied onto the dried heat-resistant resin layer 200 using an applicator so that the layer thickness after drying becomes 5 μm, and is dried.

  Next, the sheet is subjected to a curing reaction in an environment of 180 to 200 ° C. and 3 to 5 hours.

  Next, a photoresist mask is applied on the metal foil layer 300, photolithography is performed, and resist films 501 and 502 are formed in a desired pattern as shown in FIG. In the photolithography process, an ultraviolet curing process or the like is performed and then an etching process is performed to obtain patterned metal foil layers 301 and 302 as shown in FIG.

  Thereafter, by removing the resist masks 501 and 502, metal foil layers 301 and 302 having a predetermined pattern are formed on the surface of the heat resistant resin layer 200 adjacent to the polycarbonate polyurethane resin layer 100, as shown in FIG. The flexible wiring board material which has is obtained. This is cut into predetermined dimensions to obtain a desired flexible wiring board. Note that the various numerical values, patterns, processes, and the like described above are merely examples for the purpose of specific description, and are not intended to limit the present invention.

  Next, the contents of the present invention will be described more specifically with reference to comparative examples and examples.

Comparative Example 1
Polyamideimide resin (Toyobo Viromax HR14ET solid content concentration: 30 wt% Tg: 250 ° C.) was dissolved using a solvent mixture (weight ratio of ethyl alcohol to toluene 1: 1) to give a 20 wt% concentration. A lacquer solution was prepared, and 5 wt% of epoxy resin (Epofix Resin manufactured by Struers) was added to the polyamideimide resin. By adding an epoxy resin, an amide group, a carboxyl group, or the like in the polyamide-imide resin is cross-linked to improve the heat resistance and chemical resistance as a three-dimensional structure. This lacquer solution is applied onto an electrolytic copper foil having a thickness of 12 μm (F1-WS-12, manufactured by Furukawa Circuit Co., Ltd.) using an applicator so that the layer thickness after drying is 10 μm, and after drying, winding is performed. I took it.

  Next, a photoresist dry film (Photec RY-3215 manufactured by Hitachi Chemical Co., Ltd.) was laminated on the metal copper surface side, and a predetermined pattern was exposed with a high-pressure mercury lamp. Next, it developed by spraying the anhydrous sodium carbonate aqueous solution (0.8 wt%). Next, the metal copper surface was etched for 30 minutes. (Material: water 400 cc, sulfuric acid (specific gravity 1.84 g / cc) 5 cc, pre-posit etch 748 (manufactured by Shipley) 18 g mixed solution), then mask stripping (material: sodium hydroxide aqueous solution (2 wt%), 50 ° C., Time: 1 minute), and a flexible wiring board having a predetermined size was prepared.

  The flexible wiring board obtained in this way was cut into a predetermined size, and in the assembly process, it was sequentially bent and heated, and a structure was produced by thermal bonding. However, the polyamide-imide resin did not adhere even when heated to 280 ° C., but the resin was hard and cracked and the desired product could not be obtained.

Comparative Example 2
A polyimide precursor (RC5057, solid content concentration: 15 wt%, manufactured by IS Corporation) was dried on a 12 μm thick electrolytic copper foil (F1-WS-12, manufactured by Furukawa Circuit Co., Ltd.), and the layer thickness was 10 μm. Then, it was applied using an applicator, dried and wound up. Next, a curing treatment was performed at 300 ° C. for 12 hours.

  Next, a photoresist dry film (Photec RY-3215 manufactured by Hitachi Chemical Co., Ltd.) was laminated on the metal copper surface side, and a predetermined pattern was exposed with a high-pressure mercury lamp. Next, it developed by spraying the anhydrous sodium carbonate aqueous solution (0.8 wt%). Next, the metal copper surface was etched for 30 minutes. (Material: water 400 cc, sulfuric acid (specific gravity 1.84 g / cc) 5 cc, pre-posit etch 748 (manufactured by Shipley) 18 g mixed solution), then mask stripping (material: sodium hydroxide aqueous solution (2 wt%), 50 ° C., (Time: 1 minute), and an attempt was made to create a flexible wiring board having a predetermined size.

  However, in the mask peeling process, it is not clear whether the resistance to the aqueous sodium hydroxide solution used in this process was insufficient, but the resin layer was broken, and a flexible wiring board having a desired size was obtained. I couldn't.

Comparative Example 3
To the polyester urethane resin (Toyobo's Byron UR-8700 solid content concentration: 30 wt% Tg: -22 ° C), an isocyanate compound (Nihon Polyurethane Industry Coronate L) is added at 15 wt%, and the solvent methyl ethyl ketone (hereinafter, MEK) is added. To obtain a lacquer solution having a concentration of 20 wt%.

  This lacquer solution is applied onto an electrolytic copper foil having a thickness of 12 μm (F1-WS-12 manufactured by Furukawa Circuit Co., Ltd.) using an applicator so that the layer thickness after drying becomes 10 μm, and after winding, I took it.

  Next, a curing treatment was performed at 100 ° C. for 12 hours. Next, a photoresist dry film (Photec RY-3215 manufactured by Hitachi Chemical Co., Ltd.) was laminated on the metal copper surface side, and a predetermined pattern was exposed with a high-pressure mercury lamp. Next, it developed by spraying the anhydrous sodium carbonate aqueous solution (0.8 wt%). Next, the metal copper surface was etched for 30 minutes. (Material: 400 cc of water, 5 cc of sulfuric acid (specific gravity 1.84 g / cc) 5 cc, mixed solution of pre-posit etch 748 (manufactured by Shipley Co., Ltd.) 18 g), then mask stripping (material: sodium hydroxide aqueous solution (2 wt%), 50 ° C., (Time: 1 minute) and an attempt was made to produce a flexible wiring board having a predetermined size.

  However, in the mask peeling process, the resin layer was broken and a flexible wiring board having a desired size was not obtained. The cause is considered to be that the polyester urethane resin has an ester group, and thus the resistance to the aqueous sodium hydroxide solution used in this step was insufficient.

Comparative Example 4
Polycarbonate polyurethane resin (N5230, manufactured by Nippon Polyurethane Industry Co., Ltd., solid content concentration: 30 wt%, Tg: -33 ° C, softening point: 130 ° C) was added with 15 wt% of isocyanate compound (Millionate MR200 manufactured by Nippon Polyurethane Industry Co., Ltd.), and solvent MEK. To prepare a lacquer solution having a concentration of 20 wt%.

  This lacquer solution is applied onto an electrolytic copper foil having a thickness of 12 μm (F1-WS-12 manufactured by Furukawa Circuit Co., Ltd.) using an applicator so as to have a layer thickness of 10 μm after drying. I took it.

  Next, a curing treatment was performed at 100 ° C. for 12 hours. Next, a photoresist dry film (Photec RY-3215 manufactured by Hitachi Chemical Co., Ltd.) was laminated on the metal copper surface side, and a predetermined pattern was exposed with a high-pressure mercury lamp. Next, it developed by spraying the anhydrous sodium carbonate aqueous solution (0.8 wt%). Next, the metal copper surface was etched for 30 minutes. (Material: Mixed solution of 400 cc of water, 5 cc of sulfuric acid (specific gravity 1.84 g / cc), 5 g of pre-posit etch 748 (manufactured by Shipley Co., Ltd.)) Mask peeling (Material: sodium hydroxide aqueous solution (2 wt%), 50 ° C., time : For 1 minute) to produce a flexible wiring board having a predetermined size.

  The flexible wiring board thus obtained was cut into a predetermined size, and in the assembly process, it was sequentially bent and heated, and a structure was formed by thermal bonding.

  However, the heat resistance is insufficient and the wiring pattern is deformed, and a desired structure cannot be obtained.

Comparative Example 5
Polyamideimide resin (Toyobo's Viromax HR11NN solid content concentration: 15 wt% Tg: 300 ° C.) and an epoxy resin (Stroas Epofix Resin) (5% with respect to polyamideimide resin) were added to this resin solution to a thickness of 12 μm. Was coated on an electrolytic copper foil (F1-WS-12 manufactured by Furukawa Circuit Co., Ltd.) using an applicator so that the layer thickness after drying was 5 μm, dried, and wound up.

  Next, 15% by weight of an isocyanate compound (Millionate MR200, manufactured by Nippon Polyurethane Industry Co., Ltd.) is added to polycarbonate polyurethane resin (N5199, solid content concentration: 30% by weight, Tg: -29 ° C., softening point: 105 ° C.) A 20 wt% concentration lacquer solution was prepared by dissolving with MEK. This lacquer solution was applied onto a polyamide-imide resin by using an applicator so that the layer thickness after drying was 5 μm, dried, and wound up.

  Next, a curing process was performed at 180 ° C. for 3 hours. Next, a photoresist dry film (Photec RY-3215 manufactured by Hitachi Chemical Co., Ltd.) was laminated on the metal copper surface side, and a predetermined pattern was exposed with a high-pressure mercury lamp. Next, it developed by spraying the anhydrous sodium carbonate aqueous solution (0.8 wt%). Next, the metal copper surface was etched for 30 minutes. (Material: Mixed solution of 400 cc of water, 5 cc of sulfuric acid (specific gravity 1.84 g / cc), 5 g of pre-posit etch 748 (manufactured by Shipley Co., Ltd.)) Mask peeling (Material: sodium hydroxide aqueous solution (2 wt%), 50 ° C., time : For 1 minute) to produce a flexible wiring board having a predetermined size.

  The flexible wiring board thus obtained was cut into a predetermined size, and in the assembly process, bending heating was sequentially performed, and a structure was formed by thermal bonding. However, the heat resistance of the polycarbonate polyurethane resin is insufficient, and the melt viscosity is low, so that it cannot be attached at a predetermined position.

Comparative Example 6
Add 15 wt% of isocyanurate compound (Coronate 2030, manufactured by Nippon Polyurethane Industry) to polycarbonate polyurethane resin (N5230, manufactured by Nippon Polyurethane Industry Co., Ltd., solid content concentration: 30 wt%, Tg: -33 ° C, softening point: 130 ° C). A lacquer solution having a concentration of 20 wt% was prepared.

  This lacquer solution was applied onto an electrolytic copper foil having a thickness of 12 μm (F1-WS-12 manufactured by Furukawa Circuit Co., Ltd.) using an applicator so that the layer thickness would be 10 μm after drying, and then wound up.

Next, a curing treatment at 100 ° C. for 12 hours was performed. Next, a photoresist dry film (Photec RY-3215 manufactured by Hitachi Chemical Co., Ltd.) was laminated on the metal copper surface side, and a predetermined pattern was exposed with a high-pressure mercury lamp. Next, it developed by spraying the anhydrous sodium carbonate aqueous solution (0.8 wt%). Next, the metal copper surface was etched for 30 minutes. (Materials: Mixed solution of 400 cc of water, 5 cc of sulfuric acid (specific gravity 1.84 g / cc), 18 g of pre-posit etch 748 (made by Shipley))
Subsequently, mask peeling (material: sodium hydroxide aqueous solution (2 wt%), 50 ° C., time: 1 minute) was performed to prepare a flexible wiring board having a predetermined size. The flexible wiring board obtained in this way was cut into a predetermined size, and then heated by bending, and a structure was created by thermal bonding. However, although it can be attached, the deformation of the wiring board is large and the desired structure Was not obtained.

Example 1
Polyamideimide resin (Toyobo's Viromax HR11NN solid content concentration: 15 wt% Tg: 300 ° C.) and an epoxy resin (Stroas Epofix Resin) (5% with respect to polyamideimide resin) were added to this resin solution to a thickness of 12 μm. On an electrolytic copper foil (F1-WS-12 manufactured by Furukawa Circuit Co., Ltd.), it was applied using an applicator so as to have a layer thickness of 5 μm after drying, and then wound up.

  Furthermore, 15 wt% of an isocyanurate compound (Nihon Polyurethane Industry Coronate 2030) was added to polycarbonate polyurethane resin (N5199 solid content concentration: 30 wt%, manufactured by Nippon Polyurethane Industry, Tg: −29 ° C., softening point: 105 ° C.). Then, it was dissolved with a solvent MEK to prepare a lacquer solution having a concentration of 20 wt%.

  The obtained lacquer solution was applied onto the polyamideimide resin layer using an applicator so that the layer thickness would be 5 μm after drying, and then wound up. Next, a curing process was performed at 180 ° C. for 3 hours.

  Next, a photoresist dry film (Photec RY-3215 manufactured by Hitachi Chemical Co., Ltd.) was laminated on the metal copper surface side, and a predetermined pattern was exposed with a high-pressure mercury lamp. Next, it developed by spraying the anhydrous sodium carbonate aqueous solution (0.8 wt%). Next, the metal copper surface was etched for 30 minutes. (Material: Mixed solution of 400 cc of water, 5 cc of sulfuric acid (specific gravity 1.84 g / cc), 5 g of pre-posit etch 748 (manufactured by Shipley Co., Ltd.)) Mask peeling (Material: sodium hydroxide aqueous solution (2 wt%), 50 ° C., time : For 1 minute) to produce a flexible wiring board having a predetermined size.

  The flexible wiring board obtained in this way was cut into a predetermined size, and in the assembly process, it was sequentially bent and heated, and a structure was produced by thermal bonding.

Example 2
Polyamideimide resin (Toyobo Viromax HR11NN solid content concentration: 15 wt% Tg: 300 ° C.) and an epoxy resin (Stroas Epofix Resin) (5% with respect to the polyamideimide resin) were added to this resin solution with a thickness of 12 μm. Was coated on an electrolytic copper foil (F1-WS-12 manufactured by Furukawa Circuit Co., Ltd.) using an applicator so as to have a layer thickness of 5 μm after drying, and then wound up.

  Furthermore, 15 wt% of an isocyanurate compound (Nihon Polyurethane Industry Coronate HX) is added to a polycarbonate polyurethane resin (N5230 solid content concentration: 30 wt%, manufactured by Nippon Polyurethane Industry, Tg: −33 ° C., softening point: 130 ° C.), and a solvent is added. A lacquer solution having a concentration of 20 wt% was prepared by dissolving with MEK.

  The obtained lacquer solution was applied onto the polyamideimide resin layer using an applicator so as to dry up to a layer thickness of 5 μm, dried, and then wound up.

  Next, a curing process was performed at 180 ° C. for 3 hours.

  Next, a photoresist dry film (Photec RY-3215 manufactured by Hitachi Chemical Co., Ltd.) was laminated on the metal copper surface side, and a predetermined pattern was exposed with a high-pressure mercury lamp. Next, it developed by spraying the anhydrous sodium carbonate aqueous solution (0.8 wt%). Next, the metal copper surface was etched for 30 minutes. (Material: Mixed solution of 400 cc of water, 5 cc of sulfuric acid (specific gravity 1.84 g / cc), 5 g of pre-posit etch 748 (manufactured by Shipley Co., Ltd.)) Mask peeling (Material: sodium hydroxide aqueous solution (2 wt%), 50 ° C., time : For 1 minute) to produce a flexible wiring board having a predetermined size.

  The flexible wiring board thus obtained was cut into a predetermined size, and in the assembly process, it was sequentially bent and heated, and a structure was formed by thermal bonding.

Example 3
Polyamideimide resin (Toyobo Viromax HR16NN solid content concentration: 15 wt% Tg: 320 ° C.) and an epoxy resin (Stroas Epofix Resin) (5% with respect to polyamideimide resin) were added to this resin solution to a thickness of 12 μm. Was coated on an electrolytic copper foil (F1-WS-12 manufactured by Furukawa Circuit Co., Ltd.) using an applicator so as to have a layer thickness of 5 μm after drying, and then wound up.

  Furthermore, to the polycarbonate polyurethane resin (N5230 solid content concentration: 30 wt%, manufactured by Nippon Polyurethane Industry, Tg: -33 ° C, softening point: 130 ° C), an isocyanurate compound (Coronate 2030, manufactured by Nippon Polyurethane Industry) was added at 15 wt%, A lacquer solution having a concentration of 20 wt% was prepared by dissolving with a solvent MEK.

  The obtained lacquer solution was applied onto the polyamideimide resin layer using an applicator so that the layer thickness would be 5 μm after drying, and then wound up. Next, a curing process was performed at 180 ° C. for 3 hours.

  Next, a photoresist dry film (Photec RY-3215 manufactured by Hitachi Chemical Co., Ltd.) was laminated on the metal copper surface side, and a predetermined pattern was exposed with a high-pressure mercury lamp. Next, it developed by spraying the anhydrous sodium carbonate aqueous solution (0.8 wt%). Next, the metal copper surface was etched for 30 minutes. (Material: water 400 cc, sulfuric acid (specific gravity 1.84 g / cc) 5 cc, pre-posit etch 748 (manufactured by Shipley) 18 g), then mask stripping (material: sodium hydroxide aqueous solution (2 wt%), 50 ° C., Time: 1 minute), and a flexible wiring board having a predetermined size was prepared.

  The flexible wiring board thus obtained was cut into a predetermined size, and in the assembly process, it was sequentially bent and heated, and a structure was produced by thermal bonding.

Example 4
This resin solution obtained by adding an epoxy resin (Epofix Resin manufactured by Struers) (5% with respect to the polyamideimide resin) to a polyamideimide resin (Viromax HR16NN manufactured by Toyobo Co., Ltd., solid content concentration: 15 wt%, Tg: 320 ° C.) The film was coated on a 12 μm electrolytic copper foil (F1-WS-12 manufactured by Furukawa Circuit Co., Ltd.) using an applicator so as to have a layer thickness of 5 μm after drying, and then wound up.

  Next, 5 wt% of an isocyanurate compound (Nihon Polyurethane Industry Coronate 2030) is added to a polycarbonate polyurethane resin (N5230 solid content concentration: 30 wt%, Tg: −33 ° C., softening point: 130 ° C., manufactured by Nippon Polyurethane Industry), Furthermore, it melt | dissolved with solvent MEK and created the lacquer solution of a 20 wt% density | concentration.

  The obtained lacquer solution was applied onto the polyamideimide resin layer using an applicator so that the layer thickness would be 5 μm after drying, and then wound up.

  Next, a curing process was performed at 180 ° C. for 3 hours.

  Next, a photoresist dry film (Photec RY-3215 manufactured by Hitachi Chemical Co., Ltd.) was laminated on the metal copper surface side, and a predetermined pattern was exposed with a high-pressure mercury lamp. Next, it developed by spraying the anhydrous sodium carbonate aqueous solution (0.8 wt%). Next, the metal copper surface was etched for 30 minutes. (Material: 400 cc of water, 5 cc of sulfuric acid (specific gravity 1.84 g / cc) 5 cc, Preposit etch 748 (manufactured by Shipley Co., Ltd.) 18 g), then mask stripping (Material: sodium hydroxide aqueous solution (2 wt%), 50 ° C., Time: 1 minute), and a flexible wiring board having a predetermined size was prepared.

  The flexible wiring board thus obtained was cut into a predetermined size, and in the assembly process, it was sequentially bent and heated, and a structure was formed by thermal bonding.

Example 5
Polyamideimide resin (Toyobo Viromax HR16NN solid content concentration: 15 wt% Tg: 320 ° C.) and an epoxy resin (Stroas Epofix Resin) (5% with respect to polyamideimide resin) were added to this resin solution to a thickness of 12 μm. On an electrolytic copper foil (F1-WS-12 manufactured by Furukawa Circuit Co., Ltd.), it was applied using an applicator so as to have a layer thickness of 5 μm after drying, and then wound up.

  Next, an isocyanurate compound (Coronate 2030 manufactured by Nippon Polyurethane Industry) was added at 30 wt% to a polycarbonate polyurethane resin (N5230 manufactured by Nippon Polyurethane Industry Co., Ltd., solid content concentration: 30 wt%, Tg: −33 ° C., softening point: 130 ° C.) A lacquer solution having a concentration of 20 wt% was prepared by dissolving in a solvent MEK.

  The obtained lacquer solution was applied onto the polyamideimide resin layer using an applicator so that the layer thickness would be 5 μm after drying, and then wound up. Next, a curing process was performed at 180 ° C. for 3 hours.

  Next, a photoresist dry film (Photec RY-3215 manufactured by Hitachi Chemical Co., Ltd.) was laminated on the metal copper surface side, and a predetermined pattern was exposed with a high-pressure mercury lamp. Next, it developed by spraying the anhydrous sodium carbonate aqueous solution (0.8 wt%). Next, the metal copper surface was etched for 30 minutes. (Material: 400 cc of water, 5 cc of sulfuric acid (specific gravity 1.84 g / cc) 5 cc, mixed solution of organic peroxide pre-posit etch 748 (manufactured by Shipley Co., Ltd.) 18 g), and then mask peeling. (Material: sodium hydroxide aqueous solution (2 wt%), 50 ° C., time: 1 minute) was performed to prepare a flexible wiring board having a predetermined size.

  The flexible wiring board thus obtained was cut into a predetermined size, and in the assembly process, bending and heating were sequentially performed, and a structure was formed by thermal bonding.

Example 6
Polyamideimide resin (Toyobo Viromax HR16NN solid content concentration: 15 wt% Tg: 320 ° C.) and an epoxy resin (Stroas Epofix Resin) (5% with respect to polyamideimide resin) were added to this resin solution to a thickness of 12 μm. On an electrolytic copper foil (F1-WS-12 manufactured by Furukawa Circuit Co., Ltd.), it was applied using an applicator so as to have a layer thickness of 5 μm after drying, and then wound up.

  Next, 10 wt% of an isocyanurate compound (Nihon Polyurethane Industry Coronate 2030) is added to a polycarbonate polyurethane resin (N5230 solid content concentration: 30 wt%, Tg: −33 ° C., softening point: 130 ° C., manufactured by Nippon Polyurethane Industry), Furthermore, it melt | dissolved with solvent MEK and the lacquer solution of a 20 wt% density | concentration was created.

  The obtained lacquer solution was applied onto the polyamideimide resin layer using an applicator so that the layer thickness would be 5 μm after drying, and then wound up. Next, a curing process was performed at 180 ° C. for 3 hours.

  Next, a photoresist dry film (Photec RY-3215 manufactured by Hitachi Chemical Co., Ltd.) was laminated on the metal copper surface side, and a predetermined pattern was exposed with a high-pressure mercury lamp. Next, it developed by spraying the anhydrous sodium carbonate aqueous solution (0.8 wt%). Next, the metal copper surface was etched for 30 minutes. (Material: water 400 cc, sulfuric acid (specific gravity 1.84 g / cc) 5 cc, pre-posit etch 748 (manufactured by Shipley) 18 g mixed solution), then mask stripping (material: sodium hydroxide aqueous solution (2 wt%), 50 ° C., Time: 1 minute), and a flexible wiring board having a predetermined size was prepared.

  The flexible wiring board thus obtained was cut into a predetermined size, and a structure was produced by thermal bonding in the assembly process.

Example 7
Polyamideimide resin (Toyobo's Viromax HR16NN solid content concentration: 15 wt% Tg: 320 ° C.) and an epoxy resin (Stroas Epofix Resin) (2 wt% with respect to polyamideimide resin) were added to this resin solution to a thickness of 12 μm. On an electrolytic copper foil (F1-WS-12 manufactured by Furukawa Circuit Co., Ltd.), it was applied using an applicator so as to have a layer thickness of 5 μm after drying, and then wound up.

  Next, 10 wt% of an isocyanurate compound (Nihon Polyurethane Industry Coronate 2030) is added to a polycarbonate polyurethane resin (N5230 solid content concentration: 30 wt%, Tg: −33 ° C., softening point: 130 ° C., manufactured by Nippon Polyurethane Industry), Furthermore, it melt | dissolved with solvent MEK and the lacquer solution of a 20 wt% density | concentration was created.

  The obtained lacquer solution was applied onto the polyamideimide resin layer using an applicator so that the layer thickness would be 5 μm after drying, and then wound up. Next, a curing process was performed at 180 ° C. for 3 hours.

  Next, a photoresist dry film (Photec RY-3215 manufactured by Hitachi Chemical Co., Ltd.) was laminated on the metal copper surface side, and a predetermined pattern was exposed with a high-pressure mercury lamp. Next, it developed by spraying the anhydrous sodium carbonate aqueous solution (0.8 wt%). Next, the metal copper surface was etched for 30 minutes. (Material: water 400 cc, sulfuric acid (specific gravity 1.84 g / cc) 5 cc, pre-posit etch 748 (manufactured by Shipley) 18 g), then mask stripping (material: sodium hydroxide aqueous solution (2 wt%), 50 ° C., Time: 1 minute), and a flexible wiring board having a predetermined size was prepared.

  The flexible wiring board thus obtained was cut into a predetermined size, and a structure was produced by thermal bonding in the assembly process.

Example 8
Polyamideimide resin (Toyobo's Viromax HR16NN solid content concentration: 15 wt% Tg: 320 ° C) and an epoxy resin (Stroas Epofix Resin) (20 wt% with respect to polyamideimide resin) were added to this resin solution to a thickness of 12 µm On an electrolytic copper foil (F1-WS-12 manufactured by Furukawa Circuit Co., Ltd.), it was applied using an applicator so as to have a layer thickness of 5 μm after drying, and then wound up.

  Next, 10 wt% of an isocyanurate compound (Nihon Polyurethane Industry Coronate 2030) is added to a polycarbonate polyurethane resin (N5230 solid content concentration: 30 wt%, Tg: −33 ° C., softening point: 130 ° C., manufactured by Nippon Polyurethane Industry), Furthermore, it melt | dissolved with solvent MEK and the lacquer solution of a 20 wt% density | concentration was created.

  The obtained lacquer solution was applied onto the polyamideimide resin layer using an applicator so that the layer thickness would be 5 μm after drying, and then wound up. Next, a curing process was performed at 180 ° C. for 3 hours.

  Next, a photoresist dry film (Photec RY-3215 manufactured by Hitachi Chemical Co., Ltd.) was laminated on the metal copper surface side, and a predetermined pattern was exposed with a high-pressure mercury lamp. Next, it developed by spraying the anhydrous sodium carbonate aqueous solution (0.8 wt%). Next, the metal copper surface was etched for 30 minutes. (Material: water 400 cc, sulfuric acid (specific gravity 1.84 g / cc) 5 cc, pre-posit etch 748 (manufactured by Shipley) 18 g mixed solution), then mask stripping (material: sodium hydroxide aqueous solution (2 wt%), 50 ° C., Time: 1 minute), and a flexible wiring board having a predetermined size was prepared.

  The flexible wiring board thus obtained was cut into a predetermined size, and a structure was produced by thermal bonding in the assembly process. In Table 1, the composition which comprises the 1st layer and the 2nd layer is shown about each of Examples 1-8 and Comparative Examples 1-6 mentioned above.

Next, Table 2 shows the results of evaluating alkali peelability, thermal adhesiveness, and handleability for Comparative Examples 1 to 6 and Examples 1 to 8. In Table 2, the alkali peelability was immersed in a 10 wt% aqueous sodium hydroxide solution (40 ° C.) for 1 hour, and the dissolution of the resin or the breakage of the resin layer was judged visually. A mark indicates no change, and a mark X indicates that the resin was dissolved or the resin layer was broken.

  The thermal adhesiveness was determined by stacking flexible wiring boards, heating to 280 ° C. with a load of 100 g, and then confirming the adhesive strength. A cross indicates that it has been peeled off with a slight force, a triangle indicates that the melt viscosity is low and the bonding position is not stable, or that the wiring pattern is deformed, and a circle indicates that the bonding position is stable and does not peel easily It is shown that. The handleability was observed by visually observing cracks by bending by hand. The symbol ◎ indicates that it is very easy to handle, the symbol ◯ indicates that there is no crack or the like, and the symbol X indicates that a crack has occurred.

  As shown in Table 2, all of Examples 3 to 10 exhibit good alkali peelability, thermal adhesiveness, and handleability in comparison with Comparative Examples 1 to 6.

  In addition, when 50 wt% or more of the isocyanurate compound added to the polycarbonate polyurethane resin in the production of the second layer is added to the polycarbonate polyurethane resin, it is applied on the polyamideimide resin, wound up, and then unwound after being unwound. It is expected that blocking (adhesion) occurs between the layer and the copper foil and the film is torn. On the other hand, in the case of addition of 5 wt% or less, the heat resistance is remarkably inferior, the viscosity at the time of melting becomes low, and it cannot be installed at a predetermined position.

  Next, the relationship between the glass transition temperature (Tg) and the thermal adhesiveness will be specifically described with reference to Examples 9 and 10.

Example 9
Polyamideimide resin (Toyobo's Viromax HR17NN solid content concentration: 35 wt% Tg: 230 ° C.) and an epoxy resin (Stroas Epofix Resin) (5% with respect to the polyamideimide resin) were added to this resin solution to a thickness of 12 μm. Was coated on an electrolytic copper foil (F1-WS-12 manufactured by Furukawa Circuit Co., Ltd.) using an applicator so that the layer thickness after drying was 5 μm, dried, and wound up.

  Next, an isocyanurate compound (Coronate 2030, manufactured by Nippon Polyurethane Industry Co., Ltd.) is added at 15 wt% to a polycarbonate polyurethane resin (N5230, manufactured by Nippon Polyurethane Industry Co., Ltd., solid content concentration: 30 wt%, Tg: −33 ° C., softening point: 130 ° C.) A lacquer solution having a concentration of 20 wt% was prepared by dissolving with a solvent MEK. This lacquer solution was applied onto a polyamide-imide resin by using an applicator so that the layer thickness after drying was 5 μm, dried, and wound up.

Next, a curing treatment at 100 ° C. for 12 hours was performed. Next, a photoresist dry film (Photec RY-3215 manufactured by Hitachi Chemical Co., Ltd.) was laminated on the metal copper surface side, and a predetermined pattern was exposed with a high-pressure mercury lamp. Next, it developed by spraying the anhydrous sodium carbonate aqueous solution (0.8 wt%). Next, the metal copper surface was etched for 30 minutes. (Material: 400 cc of water, 5 cc of sulfuric acid (specific gravity 1.84 g / cc) 5 cc, Preposit etch 748 (manufactured by Shipley Co., Ltd.) 18 g) Next, mask stripping (Material: sodium hydroxide aqueous solution (2 wt%), 50 ° C., time : For 1 minute) to produce a flexible wiring board having a predetermined size. The flexible wiring board obtained in this way was cut into a predetermined dimension, and then heated by bending, and a structure was created by thermal bonding.
Although it can be attached, the deformation of the wiring board at the time of thermal bonding is so great that it is extremely difficult to produce a desired structure.

Example 10
This resin solution obtained by adding an epoxy resin (Sporus Resin Epofix Resin) (5% to polyamideimide resin) to a polyamideimide resin (Toyobo Viromax HR85ET, solid content concentration: 25 wt%, Tg: 150 ° C.) has a thickness of 12 μm. Was coated on an electrolytic copper foil (F1-WS-12 manufactured by Furukawa Circuit Co., Ltd.) using an applicator so that the layer thickness after drying was 5 μm, dried, and wound up.

  Next, an isocyanurate compound (Coronate 2030 manufactured by Nippon Polyurethane Industry Co., Ltd., 15 wt%) was added to a polycarbonate polyurethane resin (N5230 solid content concentration: 30 wt% manufactured by Nippon Polyurethane Industry Co., Ltd., Tg: −33 ° C., softening point: 130 ° C.), A 20 wt% concentration lacquer solution was prepared by dissolving in a solvent MEK (methyl ethyl ketone). This lacquer solution was applied onto a polyamide-imide resin by using an applicator so that the layer thickness after drying was 5 μm, dried, and wound up.

Next, a curing treatment at 100 ° C. for 12 hours was performed. Next, a photoresist dry film (Photec RY-3215 manufactured by Hitachi Chemical Co., Ltd.) was laminated on the metal copper surface side, and a predetermined pattern was exposed with a high-pressure mercury lamp. Next, it developed by spraying the anhydrous sodium carbonate aqueous solution (0.8 wt%). Next, the metal copper surface was etched for 30 minutes. (Material: 400 cc of water, 5 cc of sulfuric acid (specific gravity 1.84 g / cc) 5 cc, Preposit etch 748 (manufactured by Shipley Co., Ltd.) 18 g) Next, mask stripping (Material: sodium hydroxide aqueous solution (2 wt%), 50 ° C., time : For 1 minute) to produce a flexible wiring board having a predetermined size. The flexible wiring board obtained in this way was cut to a predetermined size, and then heated by bending and creating a structure by thermal bonding.
Although it can be attached, the deformation of the wiring board at the time of thermal bonding is large, and it is extremely difficult to produce a desired structure.

  Table 3 below shows the composition components constituting the first and second layers for each of Examples 9 and 10 described above.

  Next, Table 4 shows the results of evaluating the alkali peelability, thermal adhesiveness, and handleability of Examples 1 to 8 and Examples 9 and 10. About alkali peelability, thermal adhesiveness, and handleability, it has the same meaning as what was described in Table 2, and (circle), (triangle | delta), and x of evaluation represent the same evaluation.

  In addition, although Example 1-8 was described in duplicate with Table 2, it is for the comparison with Example 9, 10, and evaluation is not different from what was described in Table 2.

From said Table 4, Example 9, 10 is good evaluation about alkali peelability and a handleability. However, when the thermal adhesiveness is compared with Examples 1 to 8, the evaluation is low. This is thought to be due to the difference in glass transition temperature. That is, a preferable glass transition temperature range is 300 degrees or more.

  Next, an electronic component using the flexible wiring board according to the present invention will be described taking a non-reciprocal circuit element as an example. FIG. 7 is an exploded perspective view showing an example of a non-reciprocal circuit device. The nonreciprocal circuit element shown in the figure includes a case member 1, a cover member 9, an electrical component, and a magnetic component, and constitutes an isolator. The case member 1 includes a magnetic metal portion 10 having electrical conductivity and an electrically insulating resin portion 11 and is formed in a box shape having an open top, and electrical components such as chip capacitors C1 to C3 and a chip resistor R, The magnetic rotor 2 and the permanent magnet are accommodated. A ground conductor 13 is provided at the bottom of the case member 1, and terminal portions 15 and 17 are provided on the electrically insulating resin portion 11.

  The cover member 9 is made of a magnetic metal material having conductivity, overlaps with the permanent magnet 7, is combined with the case member 1 so as to close the opening of the case member 1, and is magnetically coupled to the magnetic metal portion 10 of the case member 1. To form a yoke. The permanent magnet 7 faces the magnetic rotor 2 and applies a DC magnetic field to the magnetic rotor 2.

  The overall component arrangement and the electrical connection relationship are not limited to those shown in FIG. The illustrated nonreciprocal circuit element is characterized in that the flexible wiring board according to the present invention is applied to the portion of the central electrode constituting the magnetic rotor 2 in the general structure described above. Next, this point will be described.

  FIG. 8 is a plan view showing an example of the magnetic rotor 2. The illustrated magnetic rotor 2 includes a flexible wiring board 3 and a soft magnetic substrate 4. The soft magnetic substrate 4 is preferably a soft magnetic material such as yttrium / iron / garnet (YIG). The external shape is arbitrary. In the figure, the soft magnetic substrate 4 is formed in a rectangular flat plate shape.

  The flexible wiring board 3 has a metal foil layer 32 constituting a central electrode on one surface of a flexible insulating layer 31 and is attached to the outer surface of the soft magnetic substrate 4. This flexible wiring board 3 is composed of the flexible wiring board according to the present invention described with reference to FIGS. This is a feature of this nonreciprocal circuit device. In this example, the flexible wiring board 3 is attached to the soft magnetic substrate 4 with the surface on which the metal foil layer 32 is formed facing inside. The insulating layer 31 is composed of a polycarbonate polyurethane resin layer containing an isocyanurate compound as a curing agent, and a polyamideimide resin layer, and has a slightly larger pattern in accordance with the metal foil layer 32.

  A specific configuration of the flexible wiring board 3 described above is illustrated in FIGS. 9 and 10. 9 is a development view of the flexible wiring board 3, and FIG. 10 is a cross-sectional view taken along line 10-10 of FIG.

  The insulating layer 31 constituting the flexible wiring board 3 is preferably an electrically insulating material that is used in a high frequency region and has little loss. In addition to this, it is more desirable to have thermal adhesiveness. In this embodiment, the insulating layer 31 is composed of a polycarbonate polyurethane resin layer containing an isocyanurate compound as a curing agent and a polyamideimide resin layer, and satisfies a low loss at high frequencies. And the polycarbonate polyurethane resin layer containing an isocyanurate compound as a hardening | curing agent shows sufficient thermal adhesiveness at 280 degreeC. This temperature is higher than the solder reflow temperature of 260 ° C. in the assembly of the non-reciprocal circuit element described later, and is not melted in the reflow furnace. Therefore, the characteristics required for this type of flexible wiring board 3 can be satisfied almost perfectly. When ferrite magnetic powder is contained in the polycarbonate polyurethane resin layer or the heat resistant resin layer, the relative magnetic permeability characteristics of the magnetic rotor 2 can be improved.

  The metal foil layer 32 corresponds to the metal foil layers (301, 302) in FIGS. 1 to 6, and is formed by etching the copper foil or the like. The metal foil layer 32 may have a general pattern in this type of nonreciprocal circuit device. That is, the pattern has a common electrode part 320 and a plurality of central conductor parts 321 to 323 extending from the common electrode part 320, and the central conductor parts 321 to 323 are arranged so as to intersect each other at a predetermined angle. One end of the center conductor parts 321 to 323 is continuous with the common electrode part 320, and the other end constitutes terminal parts 331 to 333.

  In the illustrated flexible wiring board 3, the insulating layer 31 has a similar planar shape larger than the outer shape pattern of the metal foil layer 32, and has an edge portion that extends outward over the entire circumference of the metal foil layer 32. However, it does not necessarily have to be similar. For example, the non-similar shape such as a shape in which the edge of the insulating layer 31 is partially cut out may be used.

  As shown in FIG. 9 and FIG. 10, the flexible wiring board 3 has the metal foil layer 32 constituting the center electrode on one surface of the insulating layer 31. Mechanical reinforcement is obtained. For this reason, even when the magnetic rotor 2 is reduced in size and thickness, the metal foil layer 32 is reinforced by the insulating layer 31, and as the flexible wiring board 3, sufficient mechanical strength can be secured. Assembling becomes easy and reliability after assembling is also increased.

  Moreover, since the insulating layer 31 has flexibility, the insulating layer 31 is attached to the outer surface of the soft magnetic substrate 4 by a method such as folding the insulating layer 31 along the soft magnetic substrate 4 using the flexibility. The magnetic rotor 2 can be configured.

  Next, a method for attaching the flexible wiring board 32 to the soft magnetic substrate 31 will be described with reference to FIGS. In attaching the flexible wiring board 3 to the soft magnetic substrate 4, first, as shown in FIG. 11, the soft magnetic substrate 4 is disposed on the surface of the common electrode portion 320 of the flexible wiring board 3.

  Next, as shown in FIG. 12, the central conductor portion 321 is folded along the outer surface of the soft magnetic substrate 4. Since the insulating film constituting the flexible wiring board 3 is a thin film having flexibility, the center conductor portion 321 is bent from the lower right to the upper left in FIG.

  Next, as shown in FIG. 13, the central conductor portion 322 is bent along the outer surface of the soft magnetic substrate 4. The center conductor portion 322 is bent in the direction from the lower left to the upper right in FIG. 13 according to the shape thereof, and intersects the center conductor portion 321 at an intermediate portion thereof.

  Next, as shown in FIG. 14, the central conductor portion 323 is bent along the outer surface of the soft magnetic substrate 4. According to the shape of the central conductor portion 323, the central conductor portion 323 is bent from the center upper portion toward the center lower portion in FIG.

  As a result, the magnetic rotor 2 with the flexible wiring board 3 attached to the outer side so that the surface of the flexible wiring board 3 on which the metal foil layer is formed is inside and the soft magnetic substrate 4 is wrapped is obtained.

  In this case, since the insulating layers 31 made of a polycarbonate polyurethane resin layer and a heat resistant resin layer are interposed between the adjacent central conductor portions 321 to 322 and between the central conductor portions 322 to 323, the overlapping centers The conductor portions 321 to 322 and the center conductor portions 322 to 323 are insulated from each other by the insulating layer 31 at the intersections. Unlike the prior art, it is not necessary to individually sandwich a dedicated insulating sheet or apply an insulating material to the intersecting portions of the central conductor portions 321, 322, and 323. For this reason, the insulation process of an intersection part becomes easy.

  In addition, since the insulating layer 31 having a constant thickness is interposed at the intersecting portions of the overlapping central conductor portions 321 to 322 and 322 to 323, the distance between the central conductor portions 321 to 323 with respect to the soft magnetic base 4 is insulative. A constant value depending on the thickness of the layer 31 is maintained, and the characteristics are stabilized.

  The insulating layer 31 is made of a polycarbonate polyurethane resin layer and a heat-resistant resin layer, and can be essentially thin, so that the difference in distance between the central conductor portions 321 to 323 relative to the soft magnetic substrate 4 can be reduced. Therefore, a non-reciprocal circuit device having excellent electrical characteristics can be provided.

  Furthermore, the insulating layer 31 is composed of a polycarbonate polyurethane resin layer containing an isocyanurate compound as a curing agent and a heat-resistant resin layer, and exhibits weldability and adhesiveness by heating at around 280 ° C. Therefore, while electrically insulating the whole of the central conductor portions 321 to 323 with the insulating layer 31, the center conductor portions 321 to 323 can be reliably fixed while maintaining the predetermined crossing angle. .

  FIG. 15 is an electric circuit diagram of a non-reciprocal circuit device incorporating the magnetic rotor 2 shown in FIGS. 8 to 14. When the magnetic rotor 2 shown in FIGS. 8 to 14 is used, the terminal portions 331 to 333 of the central conductor portions 321 to 323 are connected to the chip capacitors C1 to C3 and the chip in the incorporation into the non-reciprocal circuit element of FIG. Since it faces the resistor R, it is easy to connect the terminal portions 331 to 333 of the central conductor portions 321 to 323 and the chip capacitors C1 to C3 and the chip resistor R.

  The terminal portions 331 to 333 of the central conductor portions 321 to 323 are connected to the chip capacitors C1 to C3 and the chip resistor R by soldering. At the time of soldering, the solder melting temperature is directly applied to the terminal portions 331 to 333 of the central conductor portion 321. As described with reference to FIGS. (301, 302) is adjacent to a heat-resistant resin layer (200) having high heat resistance. Therefore, the insulating layer 31 having high heat resistance can be configured.

  Moreover, since the insulating layer 31 is interposed between the common electrode part 320 of the flexible wiring board 3 and the ground conductor 13 of the case, the common electrode part 320 and the ground conductor 13 are The circuit configuration is such that the capacitor C0 by the insulating layer 31 is connected.

  16 is a rear view showing another example of the flexible wiring board, and FIG. 17 is a sectional view taken along line 17-17 of FIG. In the flexible wiring board 3 shown in these drawings, an opening 321 is provided in the surface of the insulating layer 31 with the common electrode portion 320.

  When the above-described flexible wiring board 3 is used to form a magnetic rotor as shown in FIG. 8 and the magnetic rotor 2 is used to assemble the non-reciprocal circuit device shown in FIG. Then, the common electrode part 320 is electrically connected by means such as soldering to the ground conductor 13 (see FIG. 7). Thereby, a nonreciprocal circuit device having a circuit configuration in which the common electrode portion 320 is directly grounded is obtained. Also in this case, as described with reference to FIGS. 1 to 6, the polyamideimide resin layer (200) having high heat resistance is adjacent to the metal foil layers (301, 302) that receive the solder melting heat. Therefore, an insulating layer having high heat resistance can be formed.

  18 is an exploded perspective view showing another embodiment of the non-reciprocal circuit device, and FIG. 19 is a plan view of the non-reciprocal circuit device shown in FIG. 18, with the permanent magnet 7 and the second yoke member 12 removed. It is. 20 is a cross-sectional view taken along line 20-20 of FIG. 19, and FIG. 21 is an electric circuit diagram of the non-reciprocal circuit device illustrated in FIGS. The following description will be given with reference to these drawings. In the figure, parts corresponding to the constituent parts appearing in FIGS. 7 to 17 are given the same reference numerals.

  The illustrated non-reciprocal circuit element includes a first yoke member 11, a second yoke member 12, a flexible wiring board 13, a magnetic rotor 2, a permanent magnet 7, chip capacitors C1 to C3, This is an isolator including a chip resistor R. Chip capacitors C1 and C3 are integrated on the same dielectric substrate.

  The first yoke member 11 is obtained by bending a magnetic metal plate material, and has a structure in which side plates 111 and 112 are erected on opposite sides of the main surface 110 constituting the bottom surface portion. . Both pieces sandwiched between the side plates 111 and 112 are open.

  A flexible wiring board 13 is attached to the first yoke member 11. The point that this flexible wiring board 13 is constituted by the flexible wiring board according to the present invention is the greatest feature of the non-reciprocal circuit device. This point will be described with reference to FIGS. 22 to 24 together with FIGS. 22 is a perspective view illustrating the configuration of the flexible wiring board 13 and the combination of the flexible wiring board 13 with respect to the first yoke member 11, FIG. 23 is a plan view of the flexible wiring board, and FIG. FIG. 24 is a cross-sectional view taken along line 24-24 in FIG.

  First, referring to FIG. 22 and FIG. 23, the flexible wiring board 13 has a plurality of conductor patterns 131 to 137 on one surface of the insulating film 130. The insulating film 130 includes a heat resistant resin layer and a polycarbonate polyurethane resin layer containing an isocyanurate compound as a curing agent.

  Of the conductor patterns 131 to 137, the conductor patterns 131 and 132 are used as input / output terminals, the conductor patterns 133, 135, 136, and 137 are used as ground electrodes, and the conductor pattern 34 is used as a relay electrode. The conductor patterns 133, 135, 136, and 137 are provided with via holes (conductors) 138 that penetrate the insulating film 130 in the thickness direction.

  In attaching the flexible wiring board 13 to the first yoke member 11, as shown in FIG. 22, the flexible wiring board 13 faces the main surface 110 of the first yoke member 11, and the arrow F1 As shown in FIG. Then, after overlapping on the main surface 110, as shown in FIG. 24, both sides of the flexible wiring board 13 are moved to the direction of the arrow F2 at the positions of the alternate long and short dash lines P1 and P2 corresponding to the edges of the main surface 110. As shown by, it is folded back to the outer bottom surface 113 opposite to the main surface 110. At this time, the via holes 138 provided in the conductor patterns 133, 135, 136, and 137 are electrically connected to the main surface 110 of the first yoke member 11. In the illustrated case, the conductor patterns 131 and 132 are input / output terminals, and the conductor patterns 133 and 135 are ground terminals.

  The magnetic rotor 2 and the permanent magnet 7 are mounted on a flexible wiring board 13 attached on the main surface 110 of the first yoke member 11. More specifically, the magnetic rotor 2 is mounted on the conductor pattern 136 constituting the ground electrode on the flexible wiring board 13, and the permanent magnet 7 is disposed on the magnetic rotor 2. It becomes a structure to be. The magnetic rotor 2 has a structure in which a center electrode 3 is attached to a soft magnetic substrate 4.

  In relation to the flexible wiring board 13, the chip capacitors C1 to C3 and the chip resistor R are electrically connected to the conductor pattern 131 with the electrode 515 (see FIG. 20) constituting the chip capacitor C1. An electrode 516 (see FIG. 20) to be configured is soldered to the conductor pattern 132, and an electrode 517 (see FIG. 20) common to the chip capacitors C1 and C3 is soldered to the conductor pattern 137. Since the flexible wiring board 13 is what was demonstrated in FIGS. 1-3, it has sufficient heat resistance also with respect to the heat at the time of soldering.

  In relation to the magnetic rotor 2, the central conductor portion 321 is electrically connected to the electrode 511 of the chip capacitor C1, and the central conductor portion 322 is electrically connected to the electrode 512 of the chip capacitor C3. Accordingly, the center conductor portion 321 of the center electrode 3 is electrically guided to the conductor pattern 131 used as the input / output terminal for external connection via the electrode 511 and the via hole 513 of the chip capacitor C1. Similarly, the center conductor portion 322 of the center electrode 3 is electrically guided to the conductor pattern 132 used as an input / output terminal for external connection via the electrode 512 and the via hole 514 of the chip capacitor C3.

  As a result, as shown in FIG. 21, a circuit configuration in which chip capacitors C1 and C3 are connected to input / output terminals constituted by the conductor patterns 131 and 132 is obtained. Further, the ground electrode portion 320 of the center electrode 3 is grounded.

  The chip capacitor C2 has electrodes 521 on both sides. The electrode 521 on the back surface side that does not appear in the drawing is soldered to the conductor pattern 133 and the conductor pattern 134 on the flexible wiring board 13. The chip resistor R has terminal electrodes 531 and 532 at both ends. The terminal electrode 531 is soldered to the conductor pattern 134, and the terminal electrode 532 is soldered to the conductor pattern 135. Further, the central conductor portion 523 of the central electrode 3 is connected in common to the electrode 521 of the chip capacitor C2 and the electrode 531 of the chip resistor R.

  Also in the soldering process described above, since the flexible wiring board 13 is formed of the laminated sheet according to the present invention, sufficient heat resistance can be ensured against heat during soldering.

  In the final assembled state, the second yoke member 12 is combined with the first yoke member 11 on which the flexible wiring board 13, the magnetic rotor 2, and the permanent magnet 7 are mounted. In the assembled isolator, as shown in FIG. 21, one end of the chip capacitors C <b> 1 to C <b> 3 and the chip resistor R is electrically connected to the center electrode of the magnetic rotor 2. The other ends of the chip capacitors C1 to C3 and the chip resistor R are grounded. The conductor pattern 131 constitutes an input terminal, and the conductor pattern 132 constitutes an output terminal. In the isolator circuit shown in FIG. 21, the circulator can be configured by removing the chip resistor R and forming the third terminal.

  The present invention has been described in detail with reference to the preferred embodiments. However, the present invention is not limited to these embodiments, and various modifications can be made by those skilled in the art based on the basic technical idea and teachings. It is self-evident that

It is a figure which shows typically the cross-sectional structure of the flexible wiring board which concerns on this invention. . It is a figure which shows the use condition of the flexible wiring board shown in FIG. It is a figure which shows the manufacturing process of the flexible wiring board shown in FIG. FIG. 4 is a diagram showing a step after the step shown in FIG. 3. It is a figure which shows the process after the process shown in FIG. FIG. 6 is a diagram showing a step after the step shown in FIG. 5. It is a disassembled perspective view of the nonreciprocal circuit device according to the present invention. It is a top view of the magnetic rotor used for the nonreciprocal circuit element shown in FIG. It is an expanded view of the flexible wiring board used for the magnetic rotor shown in FIG. FIG. 10 is a sectional view taken along line 10-10 in FIG. 9; It is a figure which shows the magnetic rotor assembly process using the flexible wiring board shown in FIG.9 and FIG.10. FIG. 12 is a diagram showing a step after the step shown in FIG. 11. FIG. 13 is a diagram showing a step after the step shown in FIG. 12. FIG. 4 is a diagram showing a step after the step shown in FIG. 3. FIG. 5 is an electric circuit diagram of a non-reciprocal circuit device incorporating the magnetic rotor shown in FIGS. 8 to 4. It is a rear view which shows another example of a flexible wiring board. FIG. 17 is a cross-sectional view taken along line 17-17 in FIG. 16. It is a disassembled perspective view which shows another Example of a nonreciprocal circuit device. It is a top view of the nonreciprocal circuit device shown in FIG. FIG. 20 is a sectional view taken along line 20-20 in FIG. 19. FIG. 21 is an electric circuit diagram of the nonreciprocal element shown in FIGS. 18 to 20. 3 is a perspective view illustrating a configuration of a flexible wiring board 13 and a combination of the flexible wiring board 13 with respect to a first yoke member 11. FIG. It is a top view of a flexible wiring board. FIG. 24 is a cross-sectional view taken along line 24-24 in FIG.

Explanation of symbols

100 Polycarbonate polyurethane resin layer 200 Heat resistant resin layer 301, 302 Metal foil layer

Claims (6)

The polycarbonate foil resin layer containing an isocyanurate compound as a curing agent includes a portion in which a heat-resistant resin layer containing a polyamideimide resin and a metal foil layer are laminated in this order on at least one surface, and the metal foil layer is patterned. Being
Flexible wiring board. The flexible wiring board according to claim 1, wherein the polyamideimide resin has a glass transition temperature of 300 ° C. or higher. The flexible wiring board according to claim 1 or 2, wherein the isocyanurate compound is mixed with 5 to 30 wt% with respect to the polycarbonate polyurethane resin. The flexible wiring board according to claim 1, wherein 2 to 20 wt% of an epoxy resin is mixed with the polyamideimide resin. An electronic component including a flexible wiring board,
The flexible wiring board is the one described in any one of claims 1 to 4.
Electronic components. The electronic component according to claim 5, wherein the electronic component is a non-reciprocal circuit device.

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