JP2002076582A - Component mounting board and its producing method - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a highly reliable component mounting board on which a solder metal film can be formed even for a nonconductive micro pattern by applying electroplating method. SOLUTION: Conductor patterns P1-P5 comprises first metal films 211 and 221, second metal films 221 and 222 and solder metal films 31 and 32. The first metal films 211 and 221 are bonded to one side of a supporting substrate 1. The second metal films 221 and 222 are plating films having a film thickness thinner than that of the first metal films 211 and 221 and bonded onto the first metal films 211 and 221. The solder metal films 31 and 32 are bonded onto the second metal films 221 and 222.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

The present invention relates to a component mounting board and a method for manufacturing the same.

[0002]

2. Description of the Related Art Conventionally, when an electronic component is soldered to a component mounting board, as disclosed in, for example, Japanese Patent Application Laid-Open No.
A component mounting board is prepared by applying a solder paste to the land. Then, the component is placed on the solder paste formed on the component mounting board, and then passed through a reflow furnace to perform soldering.

[0003] By the way, electronic devices constructed by mounting components on a component mounting board are required to be further miniaturized or to have more complex functions, and accordingly, the arrangement intervals of the mounted components are also narrowed. It has been demanded. Under these conditions,
When a component is soldered to a component mounting board using a solder paste, the solder paste applied on the land will
Due to the pressure at the time of component mounting, it oozes out from the outer periphery of the land,
A short circuit due to solder occurs between adjacent lands. In addition, a technique for reliably printing the solder paste on the land with a narrow pitch is also required.

[0004] As a soldering method, a solder leveler method is also known. In the solder leveler method, the amount of solder obtained by the solder leveler is small. For this reason,
When soldering electronic components to a substrate, the solder metal must be supplied using a solder paste.

[0005] Furthermore, the surface of the solder formed by the solder leveler is convex, and if the electronic component is temporarily fixed with a flux or the like without using a solder paste, the electronic component is obliquely soldered. Troubles such as

As a method of forming a land, there is an electroplating method. However, in the electroplating method, it is difficult to form a solder metal film on a land that is not electrically connected.

One method of electroplating the nonconductive lands is to temporarily connect the nonconductive lands to the conductive lands and perform electroplating. As another method, a method of performing electroplating by bringing a probe into contact with a nonconductive land is also known. Then, after the electroplating is completed, the above-mentioned connection is mechanically cut. However, both methods are complicated.

Instead of the solder plating, a method of forming a land film on the non-conductive land by a solder paste printing method is also conceivable. However, if the surface area is e.g.
When the solder paste is to be printed on the micro land, the solder paste cannot be removed from the metal mask, and the land cannot be formed on the land having a small surface area.

[0009]

An object of the present invention is to provide a component mounting board capable of forming a solder metal film by applying an electroplating method to a conductor pattern such as a land which is not electrically connected. And a method for producing the same.

Another object of the present invention is to provide a component mounting board capable of forming a solder metal film on a conductor pattern of any shape, and a method of manufacturing the same.

Still another object of the present invention is to provide a component mounting board capable of providing a solder metal film even on a conductor pattern having a small area, and a method of manufacturing the same.

Still another object of the present invention is to provide a component mounting board capable of performing soldering without fear of short-circuiting even when an arrangement interval of conductor patterns is narrow, and a method of manufacturing the same.

Still another object of the present invention is to provide a highly reliable component mounting board having a conductor pattern with extremely small side etching, and a method of manufacturing the same.

[0014]

In order to solve the above-mentioned problems, a component mounting board according to the present invention includes a support board and at least one conductor pattern. The conductor pattern includes a first metal film, a second metal film, and a solder metal film.

[0015] The first metal film is attached to the one surface of the support substrate. The second metal film is an electroless plating film, has a thickness smaller than the thickness of the first metal film, and is adhered on the first metal film. The solder metal film is attached on the second metal film.

As described above, in the component mounting board according to the present invention, the conductor pattern includes the solder metal film. The solder metal film is attached on the laminated film composed of the first metal film and the second metal film. Unlike the solder paste, the solder metal film does not cause bleeding. Therefore, according to the conductor pattern having the solder metal film, even when the interval between the conductor patterns is narrow, no short circuit occurs between the adjacent solder metal films.

The conductor pattern according to the present invention includes a first metal film. The first metal film is attached to one surface of the support substrate. The first metal film is made of a metal foil such as a Cu foil or a plating film.

The conductor pattern further includes a second metal film. The second metal film is an electroless plating film, and is attached on the first metal film. As described above, by providing the second metal film in addition to the first metal film, the first metal film is provided.
After patterning the metal film to a predetermined pattern required for the conductor pattern, a second metal film is formed on the first metal film by an electroless plating method, and the second metal film is By connecting to a plating power source, a solder metal film can be formed on the second metal film by plating. For this reason, a solder metal film can be provided on a conductor pattern of a minute pattern that is not electrically connected or a conductor pattern of any shape.

In addition, since the second metal film has a thickness smaller than that of the first metal film, when the second metal film is patterned by chemical etching, The side etching amount is smaller than in the case where the first metal film made of a foil or a plating film is chemically etched. Therefore, it is possible to obtain a component mounting board having a highly reliable conductor pattern without side etching.

The above advantages of the present invention will be more specifically described by the manufacturing method disclosed in the present invention.

[0021]

FIG. 1 is a plan view showing an example of a component mounting board manufactured by a manufacturing method according to the present invention.
FIG. 2 is an enlarged sectional view taken along line 2-2 of FIG. The illustrated component mounting board has a support board 1, three conductor patterns P1 to P3, and two conductor patterns P4 and P5. The three conductor patterns P1 to P3 form a land. Inside the support substrate 1, one or more layers of internal conductors 51 and 52 are embedded. The support substrate 1 can be configured by an organic insulating layer, an inorganic insulating layer, or a combination thereof. Generally, it has a laminated structure, but may have a single-layer structure. The organic insulating layer that constitutes the support substrate 1 is made of various synthetic resin materials, and may include glass fibers or the like. The inorganic insulating layer constituting the support substrate 1 is made of various ceramic materials, for example, alumina or the like.

The conductor patterns P1 to P3, which are lands,
It is formed in one surface (mounting surface) of the support substrate 1. Although the number of the illustrated conductor patterns P1 to P3 is three, the number is arbitrary. The number may be only one or two or more. The conductor patterns P1 to P3 have the same metal film structure. FIG. 2 exemplarily shows a metal film structure of the conductor pattern P3.

Referring to FIG. 2, the conductor pattern P3 is
It has a first metal film 211, a second metal film 212, and a solder metal film 31. The first metal film 211 is configured as a metal foil or a plating film, and is attached to the surface of the support substrate 1. A typical example of the metal foil is a Cu foil when a Cu foil-bonded substrate is used. A typical example of the plating film is a Cu plating film formed by an electroless plating method. When obtaining a plating film, it is preferable to roughen the surface of the support substrate 1 on which the plating process is performed. If the plating film thickness is insufficient,
Electroless plating (electroplating) on the electroless plating film
Can be applied.

The second metal film 212 is an electroless plating film, and is attached on the first metal film 211. When the first metal film 211 is made of Cu foil, the second metal film 212 is preferably a Cu film. The thickness of the second metal film 212 is smaller than the thickness of the first metal film 211. Specifically, when the thickness of the first metal film 211 made of Cu foil is 9 to 18 μm, the second metal film 212
Is set to a thickness in the range of 0.3 to 5 μm.

The solder metal film 31 is a second metal film 212
And has a film structure with good solderability. As a specific example, the illustrated solder metal film 31 includes a first plating film 311 and a second plating film 312. The first plating film 311 is in close contact with the second metal film 212. Such a first plating film 311 can be formed as a Ni plating film.

The second plating film 312 is provided mainly for ensuring solderability. Specifically, C
An alloy film of Sn and at least one selected from u, Bi, Pb, Zn or Ag can be included.

The conductor patterns P4 and P5 can also have the same metal film and laminated film structure as the conductor patterns P1 to P3. For example, taking the conductor pattern P4 as an example,
As shown in FIG. 2, a first metal film 221 is provided.
It has a second metal film 222 and a solder metal film 32.
The first metal film 221 is made of Cu foil,
Is attached to the surface. The second metal film 222 is an electroless plating film of Ni or the like.

The solder metal film 32 is a second metal film 222
And has a film structure with good solderability. The illustrated solder metal film 32 includes a first plating film 321 and a second plating film 322.
The first plating film 321 can be composed of a Ni film. The first plating film 321 is formed on the second metal film 22.
Close contact with 2. Such a first plating film 321
Can be formed as a Ni plating film.

The second plating film 322 is provided mainly for ensuring solderability. Specifically, C
An alloy plating film of Sn and at least one selected from u, Bi, Pb, Zn or Ag can be included. In the conductor patterns P4 and P5, the solder metal film 3
2 has conductor areas P4, P5
May be formed smaller than the plane area of. The number, arrangement and pattern of the conductor patterns P4 and P5 are arbitrary.

As shown in FIG. 2, almost the entire surface of each of the solder metal films 31 and 32 is a flat surface substantially parallel to one surface (mounting surface) of the support substrate 1. The thickness of the solder metal films 31 and 32 is in a range of 35 to 80 μm, particularly preferably in a range of 35 μm or more and 60 μm or less.

The illustrated component mounting board further has a protective film 4. The protective film 4 is formed on the mounting surface of the support substrate 1, and has conductor patterns P1 to P3 and conductor patterns P
4. The space generated around P5 is filled. The protective film 4 can be made of a resist that is frequently used in this type of component mounting board.

The above-mentioned component mounting board is composed of the solder metal film 3
1 and 32, electronic components such as a chip component, a circuit module or an integrated circuit component are connected to the conductor pattern P
When the electronic components are mounted on 1 to P3 and the conductor patterns P4 and P5, the electronic components are mounted on the solid solder metal films 31 and 32. For this reason, even if the solder metal films 31 and 32 receive the mounting pressure of the electronic components before passing through the reflow furnace, the solder metal components are not in contact with the conductor patterns P1 to P3 and the outside of the conductor patterns P4 and P5. Does not seep into Therefore, the conductor patterns P1 to P3 and the conductor patterns P4 and P4 between the terminal electrodes of the components adjacent to each other at the reduced arrangement interval or on the component mounting board.
There is no short circuit between the five parts due to the exuded solder metal component, and no failure due to a short circuit occurs. Flux is applied between the solder metal films 31 and 32 and the electronic component, but oozing of the flux does not cause a short circuit. For this reason, the space between the mounted components can be reduced as compared with the related art. In addition, it can contribute to miniaturization of electronic components and reduction of the interval between terminal electrodes.

The conductor pattern further includes a second metal film 21
2,222. This second metal film 212,2
Reference numeral 22 denotes an electroless plating film, and a first metal film 211,
221. Thus, in addition to the first metal films 211 and 221, the second metal films 212 and 222
By providing the first metal films 221 and 221,
After patterning into a predetermined pattern required for the conductor pattern, second metal films 212 and 222 are formed on the first metal films 211 and 221 by an electroless plating method. By connecting the 212 and 222 to a plating power source, the solder metal films 31 and 32 can be formed on the second metal films 212 and 222 by plating. For this reason, a solder metal film can be provided on a conductor pattern of a minute pattern that is not electrically connected or a conductor pattern of any shape.

In addition, the second metal films 212 and 222
Since the film thickness is smaller than the film thicknesses of the first metal films 211 and 221, the support substrate 1 and the first
The electroless plating films attached to the entire surfaces of the metal films 211 and 221 are patterned to form second metal films 212 and
When chemical etching is applied to obtain 22, the side etching amount is smaller than when the first metal films 211 and 221 made of Cu foil or the like are chemically etched. Therefore, it is possible to obtain a component mounting board having a highly reliable conductor pattern without side etching.

As described above, the conductor patterns P1 to P3
And the conductor patterns P4, P5 are connected to the solder metal films 31, 32.
In particular, it is difficult to form the conductor patterns P1 to P3 serving as lands. That is, as the pitch between the components mounted on the component mounting board and the miniaturization of the mounted components progress, the diameter of the conductor patterns P1 to P3 decreases and the solder metal film 3
In forming the conductor patterns P1 to P3 having the number 1, it is difficult to secure an area for contacting a probe for electroplating.

Conductor patterns P1 to P3 forming lands
Are, for example, internal conductors 5 embedded in the support substrate 1.
1, 52, and are electrically connected to the inner conductors 51, 5
If the structure can be connected to a power supply for plating via the second electrode 2, plating can be performed. However, actually, in the arrangement of the conductor patterns described with reference to FIGS.
Some or all of the conductor patterns P1 to P3 are not electrically connected (disconnected) to other circuit elements, for example, conductor patterns formed inside or on the surface of the support substrate 1, and become independent lands. May be.

For example, in an integrated circuit component or the like, some of a large number of terminals may not need to be connected in a circuit (so-called floating state). Even in such a case, a non-conductive conductor pattern is prepared for the connection unnecessary terminal, and the connection terminal of the integrated circuit component is soldered to the non-conductive conductor pattern, so that the mechanical connection strength and its reliability are improved. It is common to ensure the nature. It is difficult to plate such a nonconductive pattern.

The present invention discloses a manufacturing method effective to overcome such difficulties. Hereinafter, description will be made with reference to the drawings.

3 to 13 are views showing a method for manufacturing a substrate according to the present invention. First, as shown in FIG. 3, a component mounting board in which the first metal film 200 is attached to one surface of the support board 1 is prepared in advance. As the support substrate 1, a Cu foil-bonded substrate in which a Cu foil serving as the first metal film 200 is heat-pressed on one or both surfaces can be used. The first metal film 200 is formed on substantially one or both surfaces of the support substrate 1.

The first metal film 200 may be configured as a plating film. In this case, after the surface of the support substrate 1 is roughened, a Cu plating film is formed by an electroless plating method to form a first metal film 200. In the case where the plating film thickness is insufficient, electrolytic plating (electroplating) can be further performed on the electroless plating film.

Then, as shown in FIG. 4, an electrically insulating resist film 41 is formed on the first metal film 200 provided on one surface of the support substrate 1. The resist film 41 is formed as shown in FIG.
In the position where the conductor pattern P3 and the conductor pattern P4 are to be formed, the conductor pattern P3 and the conductor pattern P4
Is formed as a pattern corresponding to.

This resist film 41 is formed by removing the pattern P20.
Having. Although not shown, the resist film 41 is
It also has a pattern corresponding to the other conductor patterns P1, P2 and the conductor pattern P5, and a blank pattern. Such a resist film 41 can be formed by patterning a photoresist by a photolithography process, or can be formed by means such as printing. Specific examples of the resist material for the resist film 41 include PER-20TR3227 (manufactured by Taiyo Ink Mfg. Co., Ltd.). When this resist material is used, it is heated at a temperature of 90 ° C. for 15 minutes.

Next, as shown in FIG. 5, the first metal film 20 in the pattern P20 for removing the first resist film 41 is formed.
Etch 0. Thus, the first metal film 211 for the conductor pattern P3 and the first metal 221 for the conductor pattern P4 are patterned into a predetermined shape. The etching of the first metal film 200 can be performed using an alkaline etchant. A specific example is an A process bath manufactured by Meltex Corporation.

Next, the first resist film 41 is removed, and the removed pattern P20 from which the first metal film 41 has been removed is filled with a second resist film 42 as shown in FIG. The surface of the second resist film 42 is the first metal film 21.
1 is formed so as to constitute substantially the same surface (the same surface) as the surface of the first substrate. As a specific example of the resist material for the second resist film 42, PER-20TR3227 (manufactured by Taiyo Ink Manufacturing Co., Ltd.) can be given. When this resist material is used, it is heated at a temperature of 90 ° C. for 15 minutes.

Next, as shown in FIG. 7, the first metal film 2
A second metal film 230 is formed on the surfaces of the first and second resist films 42 by an electroless plating method. The second metal film 230 can be formed as a Cu electroless plating film. The thickness of the second metal film 230 is preferably about 0.3 to 5 μm, which is smaller than the thickness of the first metal film 200 of 9 to 18 μm.

Next, as shown in FIG. 8, the second metal film 2
A third resist film 43 is formed on the surface of 30 and above the second resist film 42. The third resist film 43 has punched patterns P3 and P4 above the first metal films 211 and 221. Punched pattern P3, P4
Corresponds to the shapes and positions of the conductor patterns P3 and P4 in FIGS. Although not shown, a cutout pattern that matches the shape and position of the conductor patterns P1, P2, and P5 in FIGS. 1 and 2 is also formed.

Next, as shown in FIG. 9, the second metal film 2
The first plating films 311 and 321 are formed by plating on the cut patterns P3 and P4.
The first plating films 311 and 321 are Ni plating films, and have a thickness of, for example, 2 μm.
Adhere on 30. Since the second metal film 230 is formed on almost the entire surface of the support substrate 1, when the first plating films 311 and 321 are formed by a plating process, the second metal film 230 is connected to a plating power source. can do. Therefore, the first plating films 311 and 321
Are not hindered by plating.

Next, as shown in FIG. 10, second plating films 312 and 322 are formed by plating on the first plating films 311 and 321 in the removal patterns P3 and P4. The second plating films 312 and 322 are, for example, 50
The first plating films 311, 32 are formed to have a thickness of μm.
1 on top. Since the first plating films 311 and 321 are attached on the second metal film 230, even when the second plating films 312 and 322 are formed by a plating process, the second metal film 230 is connected to a plating power source. Can be connected to Therefore, the second plating films 312, 32
There is no obstacle in forming 2 by plating.

As described above, the second plating films 312 and 322 can include an alloy plating film of at least one selected from Cu, Bi, Pb, Zn or Ag, and Sn. Thereby, the solder metal film 31 including the first plating film 311 and the second plating film 312 and the solder metal film 32 including the first plating film 321 and the second plating film 322 are formed. Solder metal films 31, 32
As described above, the film thickness is set in the range of 35 to 80 μm, particularly preferably in the range of 35 μm or more and 60 μm or less.

Thereafter, as shown in FIG. 11, the third resist film 43 is removed. As the third resist film 43,
The removal treatment using PER-20TR3227 (manufactured by Taiyo Ink Mfg. Co., Ltd.) is performed by immersing the sample in a 5% NaOH bath and keeping it at 50 ° C. for 3 minutes in a stationary state.

Next, after removing the third resist film 43, the solder metal films 31, 3 of the second metal film 230 are removed.
The second metal film 230 is selectively etched except for a portion located below the second metal film 230.

FIG. 12 is a view showing a state after the second metal film 230 has been selectively etched. As shown in FIG. 12, a first metal film 211, a second metal film 212,
And a conductor pattern P4 having a laminated film structure of the metal film 22, the first plating film 321 and the second plating film 322, and a conductive pattern P3 having a laminated film structure of the plating film 311 and the second plating film 312. It is formed. Although not shown, the conductor patterns P1, P2 and the conductor pattern P5 shown in FIG. 1 are simultaneously formed as the same laminated film structure as the conductor pattern P3 and the conductor pattern P4.

The etching of the second metal film 230 is performed by using Cu
The etching can be performed using an alkaline etching solution that exhibits selective etching with respect to the above. A specific example is an A process bath manufactured by Meltex Corporation.

Thereafter, as shown in FIG. 13, a protective film 44 is formed around the conductor patterns P1 to P3 and the conductor patterns P4 and P5, so that the component mounting board as shown in FIGS. Is obtained. Next, examples will be described.

Embodiment 1 First, as shown in FIG.
A support substrate 1 having a double-sided Cu foil and having internal conductor layers 51 and 52 is obtained, and as shown in FIG. 4, an electric insulating property is formed on a first metal film 200 provided on one surface of the support substrate 1. A first resist film 41 having the same was formed.

Next, as shown in FIG. 6, a second resist film 42 was formed on the first resist film 41 and the first metal film 200. As a resist material for the second resist film 42, PER-20TR3227 (manufactured by Taiyo Ink Mfg. Co., Ltd.) was used.

Next, the first resist film 41 was peeled off, and the removed pattern P20 from which the first metal film 41 was removed was filled with a second resist film 42 as shown in FIG. As a resist material for the second resist film 42, PER-20TR3227 (manufactured by Taiyo Ink Manufacturing Co., Ltd.)
And heated at a temperature of 90 ° C. for 15 minutes.

Next, as shown in FIG. 7, the first metal film 2
The second metal film 2 made of a Cu electroless plating film is formed on the surfaces of the first and second resist films 42 by an electroless plating method.
No. 30 was formed. The thickness of the second metal film 230 is 0.3 μm.
m.

Next, as shown in FIG. 8, the second metal film 2
A third resist film 43 was formed on the surface of the substrate 30 and above the second resist film. The third resist film 43 was patterned so as to form punched patterns P1 to P5 corresponding to the patterns and positions of the conductor patterns P1 to P5 above the first metal films 211 and 221. As a resist material for the third resist film 43, P
ER-20TR3227 (manufactured by Taiyo Ink Mfg. Co., Ltd.) was used, and the thickness was set to 50 μm corresponding to the solder metal film thickness.

Next, as shown in FIG. 9, first plating films 311 and 321 were formed in the punched patterns P3 and P4 by electroplating. The Ni plating film thickness was 2 μm. The Ni plating film thickness may be such a thickness that Cu of the conductor pattern does not diffuse into the joining film (Sn and Sn alloy film) during reflow soldering.

Next, as shown in FIG. 10, the second plating films 312, 312, 312, 312 are formed on the first plating films 311, 321 in the removal patterns P3, P4 by electroplating.
No. 22 was formed. As a plating bath, Sn manufactured by Ishihara Chemical Co., Ltd. was used.
A Bi (Bi 3%) bath was used. The current density is 5 A / d
It was m ^2. The thickness of the Sn-Bi plating was adjusted so that the final thickness was 50 μm while checking the thickness during plating.

Next, as shown in FIG. 11, the third resist film 43 was removed. 5% NaO as stripper
An H bath was used. PER-20TR3 used in Examples
227 (manufactured by Taiyo Ink Mfg. Co., Ltd.) does not swell in electrolytic baths of Sn and Sn alloy baths. However, if the resist can be removed in a NaOH bath and a pattern of the same quality can be formed,
The product name does not matter.

Next, as shown in FIG. 12, the third resist film 43 is removed. Thereby, the second metal film 23 made of the Cu electroless plating film is exposed. So, C
u The second metal film 230 made of an electroless plating film was alkali-etched. Specifically, a process A bath manufactured by Meltex was used.

Finally, as shown in FIG. 13, a protective film 43 was formed. The protective film 43 was formed using PSR-4400 (manufactured by Taiyo Ink Mfg. Co., Ltd.) so as not to cover the Sn-Bi layer.

<Mounting Example 1> A commonly used rosin flux was formed on a conductor pattern of a substrate prepared in Example 1 by a printing method, and electronic components were mounted.
Thereafter, the electronic components were joined on the conductor pattern of the substrate by passing through a reflow oven. The Sn—Bi alloy layer formed on the substrate by the electroplating method and the terminal electrode of the electronic component are:
Bonded in good condition via rosin flux.

<Mounting Example 2> A flux composed of an epoxy resin and a carboxylic acid was applied on the substrate prepared in Example 1 by a screen printing method on a conductive pattern of the substrate, and electronic components were mounted. Thereafter, the electronic components were joined on the conductor pattern of the substrate by passing through a reflow oven. Sn-Bi formed on the substrate by electroplating
The alloy layer and the terminal electrode of the electronic component were joined in a good state via a flux containing an epoxy resin and a carboxylic acid. As the flux, (bisphenol A resin / phthalic anhydride) was mixed at a mass ratio of 1: 1 and the solvent was 1
What added 0 mass% was used.

In the electronic component mounting method of mounting example 2 and a conventional mounting method using a solder paste, the short-circuiting ratio between components at each interval between adjacent components was compared. Adjacent parts spacing is 30
The test was performed at four levels of 0, 200, 150, and 100 μm.
FIG. 14 shows the results.

In a component mounting board prepared by the conventional solder paste printing method, when an electronic component is mounted on the solder paste, the solder paste bleeds out due to the mounting pressure of the electronic component, and an adjacent component may be damaged. Short circuit occurred. The distance between adjacent parts could not be reduced to 200 μm or less. Implementation example 2
In the mounting method (1), no short circuit occurred between adjacent components even when the interval between adjacent components was 100 μm.

[0069]

As described above, according to the present invention, the following effects can be obtained. (A) It is possible to provide a method of manufacturing a component mounting board capable of forming a solder metal film by applying an electroplating method to a conductor pattern that is not electrically connected. (B) It is possible to provide a method of manufacturing a component mounting board capable of forming a solder metal film on a conductor pattern of any shape. (C) It is possible to provide a method for manufacturing a component mounting board capable of providing a solder metal film even on a conductor pattern having a small surface area. (D) It is possible to provide a method for manufacturing a component mounting board that can perform soldering without fear of short-circuiting even when the arrangement intervals of the conductor patterns are narrow. (E) A highly reliable component mounting board having a conductor pattern with extremely small side etching and a method for manufacturing the same can be provided.

[Brief description of the drawings]

FIG. 1 is a plan view showing an example of a component mounting board according to the present invention.

FIG. 2 is an enlarged sectional view taken along line 2-2 of FIG.

FIG. 3 is a diagram showing steps included in a manufacturing method according to the present invention.

FIG. 4 is a view showing a step included in the manufacturing method according to the present invention and after the step shown in FIG. 3;

FIG. 5 is a view showing a step included in the manufacturing method according to the present invention and after the step shown in FIG. 4;

FIG. 6 is a view showing a step included in the manufacturing method according to the present invention and after the step shown in FIG. 5;

FIG. 7 is a view showing a step included in the manufacturing method according to the present invention and after the step shown in FIG. 6;

8 is a view showing a step included in the manufacturing method according to the present invention, which is a step after the step shown in FIG. 7;

FIG. 9 is a view showing a step included in the manufacturing method according to the present invention and after the step shown in FIG. 8;

FIG. 10 is a view showing a step included in the manufacturing method according to the present invention and after the step shown in FIG. 9;

FIG. 11 is a view showing a step included in the manufacturing method according to the present invention and after the step shown in FIG. 10;

FIG. 12 is a view showing a step included in the manufacturing method according to the present invention, which is a step after the step shown in FIG. 11;

FIG. 13 is a view showing a step included in the manufacturing method according to the present invention and after the step shown in FIG. 12;

FIG. 14 is experimental data showing the relationship between the short-circuit occurrence rate between adjacent components and the interval between adjacent components.

[Explanation of symbols]

 REFERENCE SIGNS LIST 1 support substrate 211, 221 first metal film 221, 222 second metal film 31, 32 solder metal film 41, 42, 43 resist film

──────────────────────────────────────────────────の Continued on the front page (51) Int.Cl. ⁷ Identification symbol FI Theme coat ゛ (Reference) H05K 3/06 H05K 3/06 A 3/34 501 3/34 501F 505 505A F-term (reference) 4E351 AA01 BB01 BB23 BB24 BB33 BB38 CC07 DD04 DD08 DD12 DD13 DD19 GG15 5E319 AA03 AA07 AC04 AC17 AC18 CC33 CD26 GG05 5E339 AD01 AD05 BC01 BC02 BD03 BD08 BD11 BE13 BE17 CD01 CE02 CE13 CE15 CF02 CG01 5E343 AA02 BB24 BB14 BB14 BB14 BB14 BB14 BB14 CC62 DD33 DD43 EE31 FF16 5F044 KK11 KK19

Claims (24)

[Claims] 1. A component mounting board including a support board and at least one conductor pattern, wherein the conductor pattern includes a first metal film, a second metal film, and a solder metal film. The first metal film is attached to the one surface of the support substrate, and the second metal film is a plating film and has a thickness smaller than the thickness of the first metal film. A component mounting board, wherein the solder metal film is attached on the first metal film, and the solder metal film is attached on the second metal film. 2. The component mounting board according to claim 1, wherein said support substrate includes an organic insulating layer. 3. The component mounting board according to claim 2, wherein the first metal film is made of a metal foil or a plating film, and is provided in the organic insulating layer. 4. The component mounting board according to claim 3, wherein the metal foil is a Cu foil. 5. The component mounting board according to claim 1, wherein the support substrate includes an inorganic insulating layer. 6. The component mounting board according to claim 5, wherein the first metal film is a plating film, and is provided on one surface of the inorganic insulating layer. 7. The component mounting board according to claim 1, wherein the second metal film is an electroless plating film. 8. The component mounting board according to claim 7, wherein the second metal film is a Cu electroless plating film. 9. The component mounting board according to claim 1, wherein said second metal film has a thickness of 0.5 mm.
Component mounting board in the range of 3 to 5 μm. 10. The component mounting board according to claim 1, wherein the solder metal film is a plating film. 11. The component mounting board according to claim 10, wherein the solder metal film includes a first plating film and a second plating film, and the first plating film is A component mounting board attached to the second metal film; and the second plating film attached to the first plating film. 12. The component mounting board according to claim 11, wherein the first plating film includes a Ni film. 13. The component mounting board according to claim 11, wherein said second plating film is made of Cu, Bi, Pb, Zn or A.
g. A component mounting board including an alloy film of at least one selected from g and Sn. 14. The component mounting board according to claim 1, further comprising a protection film, wherein the protection film is formed on the substrate surface and is formed around the conductor pattern. Component mounting board filling the space. 15. The component mounting board according to claim 1, wherein the thickness of the solder metal film is 35 μm or more and 60 μm or more.
Component mounting board in the following range. 16. A method for manufacturing a component mounting board, comprising: forming a first metal film on one surface of a support substrate;
Forming a resist film, the first resist film has a punched pattern, the first metal film in the punched pattern of the first resist film is removed by etching, Removing the first resist film, filling the removed pattern from which the first metal film has been removed with a second resist film, wherein the surface of the second resist film is the first resist film;
Next, a second metal film is formed on the surfaces of the first metal film and the second resist film by an electroless plating method. Forming a third resist film on the surface of the second metal film and above the second resist film, wherein the third resist film is formed above the first metal film; Forming a solder metal film by plating in the cut pattern of the third resist film, removing the third resist film, and exposing the second metal film. And a method of manufacturing a component mounting board, comprising a step of selectively etching the exposed second metal film. 17. The method according to claim 16, wherein the support substrate includes an organic insulating layer, and wherein the first metal film is provided on one surface of the organic insulating layer. 18. The method according to claim 17, wherein the first metal film is a metal foil or a plating film. 19. The method according to claim 16, wherein the support substrate includes an inorganic insulating layer, and wherein the first metal film is provided on one surface of the inorganic insulating layer. Production method. 20. The method according to claim 19, wherein the first metal film is formed by electroless plating the one surface of the inorganic insulating layer after roughening the one surface of the inorganic insulating layer. A method for manufacturing a component mounting board formed by applying the method. 21. The method according to claim 20, wherein the first metal film is formed by performing the electroless plating and then performing the electrolytic plating. 22. The method according to claim 16, wherein the first metal film and the second metal film are made of Cu. 23. The method according to claim 16, wherein the solder metal film includes a first plating film and a second plating film. The plating film includes a Ni film, and the second plating film includes Cu, Bi, Pb, Zn or A
g. A method of manufacturing a component mounting board including an alloy film of at least one selected from g and Sn and formed on the first plating film. 24. The method according to claim 22, wherein the second metal film is etched using an alkaline etchant that shows selective etching with respect to Cu. Substrate manufacturing method.