JPH05327184A - Manufacture of board on which electronic components are mounted - Google Patents

Abstract

PURPOSE:To provide a method for manufacturing a board on which electronic components are mounted in which reliability of the board can be improved without burr on a conductor pattern. CONSTITUTION:A method for manufacturing a board on which electronic components are mounted comprises the steps of forming a gold-plated layer 8 of Sn, Sn-Pb alloy, Ni, Ni-Au, etc., at least on one copper surface of a copper- clad laminated layer 3, then removing copper of an unnecessary part by etching and forming a conductor pattern 9 and further comprises the steps of forming a dry film 5 when the layer 8 is formed, then forming a pattern-placed layer 6 on the patterned part, and then forming the layer 8 on the layer 6.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for manufacturing an electronic component mounting board using a metal plating layer insoluble in a copper etching solution as an etching resist for forming a conductor pattern.

[0002]

2. Description of the Related Art Conventionally, when manufacturing a board for mounting electronic components by this type of method, first, a copper clad laminate is perforated for through holes, and then a panel copper plating is performed, and a plating resist is exposed. A dry film is applied and a pattern is printed. Next, nickel plating and gold plating are applied as etching resists, the dry film is peeled off, the conductor pattern is formed by etching, solder resist is applied, and then external processing is performed to mount electronic components. Was manufacturing a substrate for.

[0003]

However, as shown in FIGS. 4 and 5, a part of the conductor pattern 21 of the electronic component mounting board manufactured through the above manufacturing steps, that is, the gold plating layer 22 and the panel copper. Bearded burrs 25 were sometimes generated on the nickel plating layer 24 formed between the plating layers 23. Burrs 25 on the nickel plating layer 24
In the case of occurrence of the above, burrs 25 of adjacent conductor patterns (nickel plating layer 24) 21 on the insulating base material 26 may come into contact with each other to cause a short circuit. If so, there was a problem in terms of reliability.

As shown in FIG. 6, when the adhesion between the panel copper plating layer 23 and the dry film 27 is insufficient, the cause of the burr is degreasing and acid as a pretreatment for nickel-gold plating. In the treatment process, the treatment liquid enters between the panel copper plating layer 23 and the dry film 27 to form a gap. And because nickel plating is performed in this state,
As shown in FIG. 7, it is considered that when the nickel plating layer 24 is formed, the nickel plating enters between the dry film 27 and the panel copper plating layer 23 to generate a burr 25.

The present invention has been made in view of the above circumstances, and an object thereof is to mount an electronic component on which a reliability of a substrate for mounting an electronic component can be improved without generating burrs in a conductor pattern. It is to provide a method for manufacturing a substrate.

[0006]

In order to achieve the above object, according to the present invention, at least one copper surface of a copper-clad laminate is plated with a metal such as Sn, Sn-Pb, Ni, Ni-Au. After forming an etching resist that becomes, in the method of manufacturing an electronic component mounting substrate that forms a conductive pattern by etching away unnecessary portions of copper, after forming a plating resist pattern when forming the etching resist, Copper was applied to the pattern portion, and an etching resist was formed on the copper plated layer.

[0007]

According to the present invention, after the plating resist pattern for forming the etching resist is formed, the pattern portion is plated with copper, and the etching resist is formed on the copper plating layer.

[0008]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment embodying the present invention will now be described with reference to FIGS.
It will be described with reference to FIG. When manufacturing a board for mounting electronic components, first, a hole for a through hole (not shown) is formed in a copper clad laminate 3 in which a copper foil 2 is laminated on an insulating base material 1, and then,
Electroless plating is applied to form the panel copper plating layer 4 (FIG. 1A). Next, a dry film 5 for a plating resist is attached to the panel copper plating layer 4 by thermocompression bonding, and then a pattern is formed (FIG. 1 (b)).

Next, copper plating is performed on the panel copper plating layer 4 corresponding to the pattern portion to form a pattern copper plating layer 6 (FIG. 1 (c)). Next, a nickel plating layer 7 and a gold plating layer 8 as etching resists are formed on the patterned copper plating layer 6 (FIG. 2A). Then, the dry film 5 is peeled off (FIG. 2B),
Etching is performed to form the conductor pattern 9 (see FIG. 2).
(C)).

As shown in FIGS. 2 (c) and 3, the conductor pattern 9 formed as described above did not cause burrs unlike the prior art. This is the panel copper plating layer 4
Even if the dry film 5 does not adhere sufficiently to the
This is because unlike the conventional case, the nickel plating layer 7 does not enter the gap between the panel copper plating layer 4 and the dry film 5. That is, even if a gap is formed between the panel copper plating layer 4 and the dry film 5, the portion that enters the gap between the panel copper plating layer 4 and the dry film 5 when forming the pattern copper plating 6 is etched. Since the conductor pattern 9 is reliably removed in the process, it is possible to surely prevent burrs from being generated in the conductor pattern 9.

The present invention is not limited to the above-described embodiments. For example, Sn-Pb-based solder plating layer 10 as an etching resist may be used instead of Sn-Pb-based solder plating layer without departing from the spirit of the invention. The etching resist may be formed as a layer or instead of the nickel plating layer 7 and the gold plating layer 8 only with the nickel plating layer 7.

[0012]

As described in detail above, according to the present invention,
It is possible to surely prevent burrs from being formed in the conductor pattern and to improve the reliability of the electronic component mounting board.

[Brief description of drawings]

FIG. 1 is a schematic cross-sectional view showing an embodiment of the present invention and showing a manufacturing process of a board for mounting electronic components.

FIG. 2 is a schematic cross-sectional view showing the manufacturing process of the electronic component mounting substrate, which is subsequent to FIG.

FIG. 3 is a partial schematic perspective view showing a state of a conductor pattern.

FIG. 4 is a partial schematic perspective view showing a conventional conductor pattern having burrs.

FIG. 5 is a schematic cross-sectional view showing a conductor pattern having burrs.

[Fig. 6] After adhesion of a dry film to the panel copper plating layer,
It is a schematic cross section showing a state after performing degreasing and acid treatment steps as a pretreatment of nickel-gold plating.

FIG. 7 is a schematic cross-sectional view showing a state when a nickel plating layer and a gold plating layer are formed after performing a degreasing and acid treatment process.

[Explanation of symbols]

3 ... Copper clad laminate, 4 ... Panel copper plating layer, 5 ... Dry film as plating resist pattern, 6 ... Pattern plating layer as copper plating layer, 7 Nickel plating layer as etching resist, 8 ... As etching resist Gold plating layer, 9, 11 ... Conductor pattern, 10 ... Solder plating layer as etching resist.

Claims (1)

[Claims] 1. An etching resist made of metal plating such as Sn, Sn—Pb system, Ni, Ni—Au, etc. is formed on at least one copper surface of a copper clad laminate, and then unnecessary portions of copper are removed by etching. In the method for manufacturing an electronic component mounting substrate having a conductive pattern formed by forming a conductive resist pattern, a plating resist pattern is formed when the etching resist is formed, copper is plated on the pattern portion, and the copper plating layer is etched. A method of manufacturing a substrate for mounting electronic parts, which comprises forming a resist.