JP4655757B2 - Positive photosensitive adhesive - Google Patents

Description

  The present invention is produced using a positive photosensitive resin composition used for production of a wiring board in electronic equipment, mounting of components, etc., a positive photosensitive adhesive using the composition, and the composition. The present invention relates to a resin film and a coverlay for a flexible printed circuit board.

  Polymer materials used for fabrication of wiring boards in electronic devices and mounting of elements on wiring boards are required to have various properties such as adhesiveness, insulation, and heat resistance that can be used for mounting by solder reflow. It has been.

  In recent years, as electronic devices have become smaller and lighter, and the density of parts has been increased, it has become necessary to reduce the size of elements such as semiconductor chips, and to increase the density of wiring on circuit boards and component mounting. There is a need for polymer materials that enable fine processing.

  As a fine processing method using a polymer material, a photosensitive resin is irradiated with ultraviolet rays or the like through a mask to alter only the exposed part, and only the exposed part (positive type) or only the non-irradiated part (negative type). There are known methods for removing. This method is used, for example, in the manufacture of a surface protection layer (coverlay) such as a circuit or a substrate, an insulating film or the like in the manufacture of a semiconductor laminate such as a printed electronic circuit or a flexible printed circuit board.

  Moreover, polyimide is known as a polymer material that exhibits excellent heat resistance and good electrical insulation. Therefore, in order to enable fine processing using these, active researches have been made to impart photosensitivity to polyimide and polyamideimide.

  For example, as a polyimide composition having negative photosensitivity, a composition in which a compound having a carbon-carbon double bond and an amino group polymerizable by light or electron beam or a quaternary salt thereof is added to polyamic acid, or polyamide A composition in which an acrylamide is added to an acid is known.

  In addition, International Publication WO99 / 19771 (Patent Document 1) discloses a positive photosensitive polyimide composition obtained by adding a photoacid generator to a block copolymerized polyimide soluble in an organic solvent. This photosensitive polyimide composition exhibits the characteristics of a high-sensitivity positive photoresist, and forms a fine pattern of a polyimide thin film on a substrate by light irradiation and development (cleaning with an organic alkaline aqueous solution). It can be used as an insulating film as it is.

  Japanese Patent Laid-Open No. 2003-76013 (Patent Document 2) proposes a reaction image forming method, which comprises a condensed polymer having a carbonyl group bonded to a hetero atom in the main chain and a photoacid generator. A positive photosensitive composition is described. This is because the main chain scission proceeds by the reaction during development, thereby enabling image formation.

By using such a photosensitive resin composition, it is possible to finely process a wiring board, an element, and the like. Moreover, the heat resistance which can respond to solder reflow etc. is also obtained by using a polyimide or a polyamideimide. However, the demand for polymer materials used in such processing has become more and more advanced in recent years. In particular, in order to obtain excellent mounting strength and peel strength even in fine processing, better adhesion is required. Yes. However, some of the conventional photosensitive resin compositions as described above cannot satisfy these requirements.
WO99 / 19771 JP 2003-76013 A

  The present invention is a positive photosensitive resin composition used for processing such as production of a wiring board and mounting of an element on the wiring board, enabling fine processing, and excellent heat resistance and excellent It is an object of the present invention to provide a positive photosensitive resin composition having adhesiveness.

  The present invention also provides a product that can exhibit the excellent characteristics of the photosensitive resin composition, that is, a positive photosensitive adhesive using the composition, and a resin film produced using the composition. It is another object of the present invention to provide a coverlay for a flexible printed circuit board.

  The present invention provides a positive photosensitive resin composition comprising a thermoplastic polyamideimide resin, a thermosetting resin, and a photoacid generator as a positive photosensitive resin composition that solves the above problems. provide. The positive photosensitive resin composition of the present invention has excellent heat resistance by containing a thermoplastic polyamideimide resin, and has excellent adhesiveness by containing a thermosetting resin.

  Here, the polyamideimide resin refers to a resin having an amide group and an imide group in the main chain skeleton, and other structures are not particularly limited. However, a thermoplastic polyamide-imide resin is preferably used in order to exhibit excellent adhesion by heating and pressurization.

  In order to obtain excellent heat resistance, those having many aromatic components including a benzene ring and a naphthalene ring are preferred. In addition, a report that the polyamideimide resin is modified with siloxane improves its adhesion (Patent No. 3432409, Kazumasa Takeuchi et al., “High Adhesive Heat Resistant Material Siloxane Modified Polyamideimide” Hitachi Chemical Technical Report No. 39 (2002) -7)), and it is considered that Tg (glass transition point) can be lowered with a small amount of silicone modification without lowering the thermal decomposability, but it is also possible to use a polyamide-imide resin with such modification. it can.

  In addition, it does not specifically limit about the manufacturing method of a thermoplastic polyamide-imide resin, It can manufacture using a well-known method. For example, a mixture containing diimide dicarboxylic acid may be reacted with an aromatic diisocyanate, or may be produced by a general reaction of trimellitic anhydride (TMA) with diisocyanate or an acid chloride method.

  Examples of the thermosetting resin that is an essential component of the positive photosensitive resin composition of the present invention include epoxy resins, phenol resins, polyester resins, polyimide resins, bismaleimide triazine resins, and the like. It is mixed with other components of the photosensitive resin composition. These resins are considered to react with the polyamide-imide resin by pressurization and heating at the time of use of the positive photosensitive resin composition, and it is considered that the whole is cured by this reaction.

  The photoacid generator, which is another essential component of the positive photosensitive resin composition of the present invention, refers to a compound that generates acid upon irradiation (exposure) to ultraviolet rays or visible light. Examples of the photoacid generator include quinonediazide compounds, onium salts, sulfonic acid esters, and organic halogen compounds. The acid generated by the exposure of these substances dissolves in an alkali developer (usually an alkali solution such as an amine), and the alkali developer that subsequently penetrates into the composition attacks the amide group or imide group. As a result, the main chain of the polyamideimide resin is cleaved to make it soluble in the developer. At this time, the thermosetting resin component in the composition is also dissolved or decomposed in the developer.

  In addition, it is thought that a photo-acid generator suppresses melt | dissolution to the developing solution (amine) of a polyamideimide resin in a non-exposed part. For this reason, the difference in solubility between the exposed portion and the non-exposed portion is increased, and the positive photosensitive resin composition is made suitable for finer processing.

  The positive photosensitive resin composition of the present invention is preferably 1 to 100 parts by weight of the thermosetting resin and 1 to 100 parts by weight of the photoacid generator with respect to 100 parts by weight of the thermoplastic polyamideimide resin. contains. Claim 2 corresponds to this preferable mode.

  The blending amount of the thermosetting resin is more preferably 5 to 50 parts by weight, and particularly preferably 10 to 30 parts by weight with respect to 100 parts by weight of the thermoplastic polyamideimide resin. Moreover, the compounding quantity of a photo-acid generator becomes like this. More preferably, it is 5-50 weight part with respect to 100 weight part of a thermoplastic polyamide-imide resin, More preferably, it is 15-25 weight part.

  The positive photosensitive resin composition of the present invention may contain other components such as a conventional modifier (additive) in addition to the above essential components. Conventional modifiers include coupling agents, leveling agents, plasticizers, film-forming resins other than essential components, surfactants and stabilizers. In addition, even if all these modifiers combine, it is desirable that it is 25 weight% or less of the whole solid content (weight which does not contain the solvent mentioned later) of the positive photosensitive resin composition.

  The positive photosensitive resin composition of the present invention can be obtained by mixing the above essential components and other components, and is usually obtained by dissolving these components in a solvent. In order to remove dust and the like that hinder precise microfabrication, the obtained solution may be filtered through a filtration membrane having pores of 0.1 to 1 μm.

  The positive photosensitive resin composition of the present invention may be used as a composition mainly composed of solids by removing the solvent from the solution thus obtained, as in the resin film described later. Sometimes used as. For example, it may be applied as a solution to a wiring board or component to be processed, and then the solvent is removed, exposed, developed, etc., and left only at a predetermined position where processing is desired.

  The solvent used is preferably a volatile solvent that is easy to remove, dissolves other components such as polyamideimide resin, thermosetting resin, photoacid generator and various modifiers, and does not react with them. Volatile solvents can be used. Specifically, aprotic polar solvents such as N-methyl-2-pyrrolidone, γ-butyrolactone, γ-valerolactone, cyclohexanone, diacetoxyethylene glycol, sulfolane, tetramethylurea, N, N′-dimethylacetamide, Examples include dimethylformamide, dimethyl sulfoxide, acetonitrile, digram, phenol, cresol, and toluene. These solvents may be used alone or in combination of two or more.

  If the base resin used for varnish synthesis is mainly used, the step of exchanging the solvent becomes unnecessary, which is preferable from the viewpoint of production efficiency. For applications where a large area is applied, such as when used as an adhesive or a coverlay, a lactone system is preferred from the viewpoint of low hygroscopicity, coating characteristics, printability, and the like.

  As the photoacid generator, a quinonediazide compound widely used in semiconductor manufacturing resists is preferable because of its excellent property that the difference in solubility between the exposed and unexposed areas can be increased. Claim 3 corresponds to this preferable mode.

  Examples of the quinonediazide compound include 1,2-naphthoquinone-2-diazide-5-sulfonic acid or 1,2-naphthoquinone-2-diazide-4-sulfonic acid and a low-molecular aromatic hydroquinone compound such as 2,3,4. -Trihydroxy benzene phenone, 2,3,4,4'-tetrahydroxy benzophenone, trihydroxy benzene, such as 1,3,5-trihydroxy benzene, or ester compounds with cresol are exemplified. In particular, 1,2-naphthoquinone-2-diazide-5-sulfonic acid-p-cresol ester is preferred.

  Examples of the onium salt used as the photoacid generator include triphenylsulfonium hexafluoroantimonate and triphenylsulfonium hexafluorophosphate. These are used with esters such as t-butyl benzoate. As the photoacid generator, almost the same photoacid generator as that used in the positive resist used in the semiconductor manufacturing process can be used as it is.

  Epoxy resins are preferable as the thermosetting resin because they are excellent in handleability and excellent in adhesion after curing. Claim 4 corresponds to this preferred embodiment. Due to heating during use of the composition, this epoxy resin also reacts with the amide group of the polyamideimide resin.

  Preferred examples of the epoxy resin include a mixture of an uncured epoxy resin having two or more glycidyl groups and a curing agent thereof. The larger the number of glycidyl groups, the smaller the blending amount of the curing agent. Further, a curing accelerator may be used, but the curing accelerator is not essential.

  Any curing agent may be used as long as it reacts with the epoxy resin and accelerates curing. For example, amines, polyfunctional phenols, acid anhydrides and the like are used as the curing agent, and imidazoles are used as the curing accelerator. It can be used. Examples of amines include dicyandiamide and diaminodiphenylmethane, examples of imidazoles include alkyl group-substituted imidazole and benzimidazole, and examples of polyfunctional phenols include hydroquinone, resorcinol, bisphenol A, and halides thereof. Examples of acid anhydrides include phthalic anhydride and benzophenone tetracarboxylic acid.

  The positive photosensitive resin composition of the present invention is used in electronic devices and various products used in the production thereof. The present invention also provides the following uses of the positive photosensitive resin composition.

  A positive photosensitive adhesive comprising the positive photosensitive resin composition (Claim 5). The positive photosensitive adhesive is formed from the positive photosensitive resin composition. For example, the positive photosensitive adhesive can be used as a paste containing a small amount of a fluidity-imparting agent such as a solvent, or the components are dissolved in a solvent. It can also be used as a solution. Moreover, after apply | coating the said solution on base materials, such as a resin film, it can also use by the form (after-mentioned resin film) as a film formed by removing a solvent and forming into a film.

  In any case, since the positive photosensitive resin composition is used, excellent heat resistance and adhesiveness are given. This positive photosensitive adhesive is applied to a desired processing position, for example, a position for mounting an element on a wiring board, and if necessary, removes the solvent, and then irradiates using a mask. A predetermined position is exposed. Thereafter, development is performed to remove the exposed portion, whereby a finely processed adhesive coating portion remains. The adhesive is applied and bonded to the application part of the adhesive, and then the adhesive is cured by heating to obtain a strong bond. In this way, a high-density and strong bonding process can be performed.

  A resin film obtained by film formation of the positive photosensitive resin composition (Claim 6). Film formation of the positive photosensitive resin composition can be performed, for example, by a method in which a solution of the positive photosensitive resin composition is applied on a substrate film and dried to remove the solvent. Instead of the solution, a paste of a positive photosensitive resin composition can be applied.

  The base film is preferably a resin film that can be easily peeled, and specific examples include a polyethylene terephthalate (PET) film. The resin film of the present invention may be used as an integral part of the base film, or may be peeled off from the base film and used alone as the resin film of the present invention. In view of the above, it is usually preferable to use the substrate film integrally. This resin film is attached to a desired processing position, and processing such as mounting of elements is performed using this resin film. In the case of use as an integral part of the base film, after pasting this resin film at the desired processing position, only the base film is peeled off to leave only the resin film at the desired processing position. Using a resin film, patterning is performed by the same method as that described for the positive photosensitive adhesive, and mounting of elements and adhesion of a heat sink, a reinforcing plate, and the like are performed.

  Further, the resin film of the present invention can be used in a state before the positive photosensitive resin composition is exposed, or the positive photosensitive resin composition is exposed and developed to form a predetermined fine pattern. It can also be used in a state in which only this portion remains. However, when it is used in a state in which only a portion consisting of a predetermined fine pattern remains, it is used as an integral part of the base film. When used in a state prior to exposure, after being applied to a desired processing position, exposure and development using a mask are performed to leave a finely processed positive photosensitive resin composition coated portion. And using this application part, a process is performed by the method similar to the method demonstrated about the said positive photosensitive adhesive.

  On the other hand, in the case of using only a part consisting of a predetermined fine pattern after exposure, the part consisting of this fine pattern is pasted at a desired processing position to form an application part, and the application part is used. The same processing as described above is performed. In any of the above cases, since the positive photosensitive resin composition is used, excellent heat resistance and adhesiveness are given.

  A cover lay for a flexible printed circuit board produced using the positive photosensitive resin composition (Claim 7). The positive photosensitive resin composition of the present invention can be used for a photosensitive coverlay for a flexible printed circuit board.

  This photosensitive cover lay is manufactured by, for example, printing and applying a solution or paste of the positive photosensitive resin composition to a desired position on a flexible printed circuit board, and then heating and drying (for example, 90 ° C. for 30 minutes). The solvent can be removed by a method. Moreover, it can also manufacture by the method of affixing the photosensitive resin film of the said this invention in the desired position on a flexible printed circuit board.

  The portion corresponding to the fine wiring of the photosensitive cover lay thus obtained was masked, and this cover lay was exposed and developed to finely process the cover lay, leaving the necessary portions. A pattern can be formed. Since the thus obtained cover lay uses the positive photosensitive resin composition, it provides excellent heat resistance and excellent adhesion between elements, circuits and the like.

  The positive photosensitive resin composition of the present invention enables fine processing and provides excellent heat resistance and excellent adhesiveness in processing such as production of a wiring substrate and mounting of an element on the wiring substrate. . Further, a positive photosensitive adhesive using this positive photosensitive resin composition and a photosensitive resin film produced using the composition are used for fine processing such as mounting of an element on a wiring board. It provides excellent heat resistance and excellent adhesion. The cover lay manufactured using this positive photosensitive resin composition is finely processed or capable of fine processing, covers and protects a predetermined position with high precision, and It provides excellent heat resistance and excellent adhesion between elements and circuits protected by a substrate or coverlay.

  Hereinafter, the best mode for carrying out the present invention will be described based on the embodiments. The examples are not intended to limit the scope of the invention. Various modifications can be made to the following embodiments without departing from the spirit of the present invention.

Synthesis Example 1 and Synthesis Example 2 (Production of polyamideimide resin)
BAPP (2,2-bis [4- (4-aminophenoxy) phenyl) as a diamine was added to a 1-liter separable flask equipped with a 10 ml water meter with a cock connected to a reflux condenser, a thermometer, and a stirrer. Propane), reactive silicone oil X-22-161A (Shin-Etsu Chemical Co., Ltd., amine equivalent 800) as siloxane diamine, trimellitic anhydride (TMA), N-methylpyrrolidone (NMP) as aprotic polar solvent Were prepared at a blending ratio (weight ratio) shown in Table 1 and stirred at 80 ° C. for 30 minutes. Then, after adding 100 ml of toluene as an aromatic hydrocarbon azeotropic with water, the temperature was raised and the mixture was refluxed at about 160 ° C. for 2 hours. Confirm that water of approximately 4.0 ml or more has accumulated in the moisture determination receiver and that no outflow of water has been observed, and remove the effluent stored in the moisture determination receiver. The temperature was raised to remove toluene.

  Thereafter, the solution was returned to room temperature, 30.0 g (0.12 mol) of 4,4′-diphenylmethane diisocyanate (MDI) was added as an aromatic diisocyanate, and the mixture was reacted at 160 ° C. for 3 hours. After completion of the reaction, an NMP solution (varnish) of siloxane-modified polyamideimide resin was obtained.

Synthesis Example 3 (Production of polyamideimide resin)
An NMP solution (varnish) of polyamideimide resin was obtained in the same manner as in Synthesis Example 1 except that reactive silicon oil X-22-161A was not used and other raw materials were charged at the blending ratio shown in Table 1.

＊１６１Ａ： 反応性シリコンオイルＸ−２２−１６１Ａを表わす。

* 161A: Reactive silicone oil X-22-161A.

When the molecular weight of the polyamideimide resin obtained in Synthesis Examples 1 to 3 was measured by GPC using an NMP solution of 0.005NLiBr as an eluent,
Synthesis Example 1 has Mw = 70800, Mw / Mn = 2.0,
Synthesis Example 2 has Mw = 59800, Mw / Mn = 2.0,
The synthesis example 3 was Mw = 42400 and Mw / Mn = 2.2. In addition, Mw is a weight average molecular weight, Mn is a number average molecular weight, and is the value calculated | required in polystyrene conversion. The powder obtained by reprecipitation and purification of the obtained varnish with methanol was dissolved in d-DMSO and subjected to ¹ H-NMR and ¹³ C-NMR spectral analysis. As a result, the target polyamideimide resin was synthesized. It was confirmed that

Examples 1-4 and Comparative Examples 1-7
(Manufacture of positive photosensitive resin composition)
As the thermoplastic polyamideimide resin, the siloxane-modified polyamideimide resin varnish obtained in Synthesis Example 1 (polyamideimide resin solid content 24%), the siloxane-modified polyamideimide resin varnish obtained in Synthesis Example 2 (polyamideimide resin solid content 26). %), The polyamideimide resin varnish obtained in Synthesis Example 3 (polyamideimide resin solid content 18.8%), and a low Tg polyamideimide resin varnish HPC-5020-30 (polyamideimide resin solid content manufactured by Hitachi Chemical Co., Ltd.) 30%)
As epoxy resin of thermosetting resin, Epicoat 828, 834 (Japan Epoxy Resin Co., Ltd. bisphenol A type liquid epoxy resin, trade name, epoxy equivalent: Epicoat 828: 184-194 g / equivalent, Epicoat 834: 230-270 g / equivalent ), And Curazole 2E4MZ, 2PZ (made by Shikoku Kasei Co., Ltd., trade name, 2E4MZ is 2-ethyl-4-methylimidazole, 2PZ is 2-phenylimidazole), which is an imidazole epoxy resin curing agent, as a curing agent,
As photoacid generator, diazonaphthoquinone ester mixture 4NT-300 (trade name, 2,3,4,4′-tetrahydroxybenzophenone and 6-diazo-5,6-dihydro-5-oxo, manufactured by Toyo Gosei Co., Ltd.) -Mono-tetraester with naphthalene-1-sulfonic acid),
These were blended in the blending amounts shown in Table 2, stirred for about 3 minutes until a uniform solution was obtained, and then defoamed for 2 minutes using a defoamer. Thereafter, the mixture was allowed to stand at room temperature for 24 hours to obtain a positive photosensitive resin composition varnish.

(Evaluation of adhesion performance)
The obtained positive photosensitive resin composition varnish was applied onto a 25 μm thick electrolytic copper foil (glossy surface) so that the film thickness after drying was 30 μm, dried at 90 ° C. for 20 minutes, and then ethanolamine. After being immersed in a 1: 1: 1 solution (developer) of N: methylpyrrolidone (NMP): water for 5 minutes at 40 ° C., washed with water and dried at room temperature. The same electrolytic copper foil as above was overlaid on this resin film, heated and pressurized at 240 ° C. for 300 seconds at a pressure of 5 kg / cm ² , and further heated at 220 ° C. for 1 hour to obtain a sample for measuring adhesive strength.

  Adhesive strength was measured by bonding the sample to a resin plate with an epoxy resin adhesive (Aral Daito AW2101, etc.), peeling the copper foil 5 mm wide at the varnish drying interface, and measuring the copper foil adhesive force by a 180 ° C. peel test. . The results are shown in Table 2. The PAI in Table 2 indicates the type of polyamideimide resin varnish (indicated by No. in the synthesis example, and the low Tg polyamideimide resin varnish manufactured by Hitachi Chemical Co., Ltd. is indicated as low TgPAI).

(Resolution and sensitivity evaluation)
For the sample to which a photosensitizer was added, the resin composition varnish was applied onto a 100 mm × 100 mm electrolytic copper foil by spin coating so that the film thickness after drying was 10 μm, dried at 90 ° C. for 20 minutes, and then ULVAC. Using a UV exposure machine manufactured by the company, exposure with an energy amount of 1000 mJ / cm ² was performed through a PET photomask to determine the resolution (minimum L / S width at which the pattern was resolved).

The photosensitivity is Kodak Photographic Step Tablet No. 2 is used as a photomask, exposure is performed at an energy of 2000 mJ / cm ² , and the mixing ratio is appropriately changed depending on the sample such as a specified developer (ethanolamine: NMP: water = 1: 1: 1). ) Was developed from the exposure development characteristic curve obtained by developing. The values of resolution and photosensitivity are also shown in Table 2.

＊ エピコート８２８又はエピコート８３４
＊＊ 単位Ｋｇｆ／ｃｍ
＊＊＊単位ｍＪ／ｃｍ^２
表２に示されるように、エポキシ樹脂と硬化剤を配合していない比較例１、２、４、６、７は、接着力が弱いのに対し、エポキシ樹脂と硬化剤を配合している本発明例（実施例）では、優れた接着力が得られている。又、ポリアミドイミド樹脂と光酸発生剤を配合している本発明例（実施例）では、感光性が発現し、優れた感光感度及び解像度が得られており、高い生産性での微細加工、パターニングが可能であることが示されている。

* Epicoat 828 or Epicoat 834
** Unit Kgf / cm
*** Unit mJ / cm ²
As shown in Table 2, Comparative Examples 1, 2, 4, 6, and 7 in which the epoxy resin and the curing agent are not blended have weak adhesive strength, whereas the epoxy resin and the curing agent are blended. In the inventive examples (examples), excellent adhesive strength is obtained. Moreover, in the present invention example (Example) in which a polyamideimide resin and a photoacid generator are blended, photosensitivity is exhibited, excellent photosensitivity and resolution are obtained, and fine processing with high productivity, It has been shown that patterning is possible.

Example 5 (Production and Evaluation of Resin Film)
The photosensitive adhesive resin composition varnish obtained in Example 1 was applied onto PET as a base film using a doctor knife so that the film thickness after drying was 30 μm, and dried at 90 ° C. for 20 minutes. Thus, a B-stage resin film (photosensitive adhesive film) was obtained. This resin film can be easily peeled off from the PET film and can be attached to other adherends. In addition, it has been confirmed that the residual volatile solvent content in the B stage before bonding is about 5% or less of the entire resin composition.

Reference example (solder heat resistance evaluation)
The resin composition varnishes obtained in Examples 1 to 4 and Comparative Examples 1 to 7 were applied on a copper foil with a thickness of about 20 μm and heated at 220 ° C. for 1 hour. Thereafter, the film was immersed in a solder bath maintained at 260 ° C. for 3 minutes to conduct a solder heat resistance test. In any sample, no abnormality was observed on the film surface and the interface with the copper foil. This result shows that the heat resistance of these materials is excellent.

Example 6 (Use and Evaluation as Photosensitive Coverlay)
The resin composition varnish obtained in Example 1 was applied to the entire surface of a polyimide substrate with a single-sided copper foil whose circuit was previously patterned so that the film thickness after drying was about 15 μm, and dried at 90 ° C. for 30 minutes. I let you. A coverlay pattern made of PET was brought into intimate contact with this sample, and exposed at an energy of 2000 mJ / cm ^{2 using} a UV exposure machine manufactured by ULVAC. Then, after developing with a developing solution (40 ° C.) of ethanolamine: NMP: water = 2: 3: 4, the sample was washed with water and an aqueous isopropyl alcohol solution and then dried at 220 ° C. for 1 hour. At minimum, a pattern in which holes of 0.2 mm square and 0.2 mmφ were formed was obtained. This coverlay material showed no abnormality in the solder heat resistance test at 260 ° C. for 3 minutes.

The present invention greatly contributes to downsizing, weight reduction, high density, and reduction of the mounting area of a semiconductor chip and the like of an electronic device, its components and a wiring board. For example, it is suitably used as a power package adhesive, a laminated package interposer, or the like where heat resistance, adhesiveness, and fine processing are required.

Claims (3)

Thermoplastic polyamide-imide resin, a positive photosensitive adhesive which comprises using a positive photosensitive resin composition containing an epoxy resin and a photoacid generator. 2. The positive photosensitive resin according to claim 1, comprising 1 to 100 parts by weight of an epoxy resin and 1 to 100 parts by weight of a photoacid generator with respect to 100 parts by weight of the thermoplastic polyamideimide resin . Glue . The positive photosensitive adhesive according to claim 1 or 2, wherein the photoacid generator is a quinonediazide compound.