WO2008132914A1 - Polyimide composition and flexible wiring board - Google Patents

Polyimide composition and flexible wiring board Download PDF

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Publication number
WO2008132914A1
WO2008132914A1 PCT/JP2008/055538 JP2008055538W WO2008132914A1 WO 2008132914 A1 WO2008132914 A1 WO 2008132914A1 JP 2008055538 W JP2008055538 W JP 2008055538W WO 2008132914 A1 WO2008132914 A1 WO 2008132914A1
Authority
WO
WIPO (PCT)
Prior art keywords
wiring board
flexible wiring
polyimide
polyimide compound
developed
Prior art date
Application number
PCT/JP2008/055538
Other languages
French (fr)
Japanese (ja)
Inventor
Hiroki Kanaya
Tomoyasu Sunaga
Mamiko Nomura
Junichi Ishii
Yoshio Omori
Original Assignee
Sony Chemical & Information Device Corporation
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP2007181531A external-priority patent/JP5242958B2/en
Application filed by Sony Chemical & Information Device Corporation filed Critical Sony Chemical & Information Device Corporation
Priority to CN2008800076200A priority Critical patent/CN101657506B/en
Publication of WO2008132914A1 publication Critical patent/WO2008132914A1/en

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/038—Macromolecular compounds which are rendered insoluble or differentially wettable
    • G03F7/0387—Polyamides or polyimides
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/1057—Polyimides containing other atoms than carbon, hydrogen, nitrogen or oxygen in the main chain
    • C08G73/106—Polyimides containing other atoms than carbon, hydrogen, nitrogen or oxygen in the main chain containing silicon
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/1057—Polyimides containing other atoms than carbon, hydrogen, nitrogen or oxygen in the main chain
    • C08G73/1064—Polyimides containing other atoms than carbon, hydrogen, nitrogen or oxygen in the main chain containing sulfur
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/49—Phosphorus-containing compounds
    • C08K5/51—Phosphorus bound to oxygen
    • C08K5/52—Phosphorus bound to oxygen only
    • C08K5/521—Esters of phosphoric acids, e.g. of H3PO4
    • C08K5/523—Esters of phosphoric acids, e.g. of H3PO4 with hydroxyaryl compounds
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0393—Flexible materials
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
    • H05K3/181—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating
    • H05K3/182—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating characterised by the patterning method
    • H05K3/184—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating characterised by the patterning method using masks

Abstract

Disclosed is a polyimide composition which comprises a polyimide compound having high alkali solubility and a resol resin, which has improved plating resistance, and which does not cause the reduction in thickness when developed with an aqueous alkali solution. Also disclosed is a flexible wiring board using the polyimide composition. A polyimide compound which is produced by polymerizing 3,3',4,4'-diphenylsulfonetetracarboxylic acid dianhydride and 3,3'-diamino-4,4'-dihydroxydiphenylsulfone has high alkali solubility. Therefore, a mixture of the polyimide compound with a photosensitizing agent can be developed with an alkali excellently. Further, a mixture of the polyimide compound with 1 to 4 parts by weight of a resol resin can be developed excellently with an aqueous alkali solution to form a desired pattern. Thus, a polyimide compound and a flexible wiring board each having plating resistance can be provided.
PCT/JP2008/055538 2007-04-13 2008-03-25 Polyimide composition and flexible wiring board WO2008132914A1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN2008800076200A CN101657506B (en) 2007-04-13 2008-03-25 Polyimide composition and flexible wiring board

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2007-106115 2007-04-13
JP2007106115 2007-04-13
JP2007181531A JP5242958B2 (en) 2007-04-13 2007-07-10 Polyimide composition and flexible wiring board
JP2007-181531 2007-07-10

Publications (1)

Publication Number Publication Date
WO2008132914A1 true WO2008132914A1 (en) 2008-11-06

Family

ID=39925375

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2008/055538 WO2008132914A1 (en) 2007-04-13 2008-03-25 Polyimide composition and flexible wiring board

Country Status (1)

Country Link
WO (1) WO2008132914A1 (en)

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004093816A (en) * 2002-08-30 2004-03-25 Toray Ind Inc Positive photosensitive resin composition, method for manufacturing semiconductor device and semiconductor device
JP2005250161A (en) * 2004-03-04 2005-09-15 Kyocera Chemical Corp Negative photosensitive resin composition and cured object thereof
JP2005250160A (en) * 2004-03-04 2005-09-15 Kyocera Chemical Corp Positive photosensitive resin composition and cured object thereof
JP2006323128A (en) * 2005-05-19 2006-11-30 Sumitomo Electric Ind Ltd Positive photosensitive resin composition, and positive photosensitive adhesive, resin film and photosensitive cover lay using same

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004093816A (en) * 2002-08-30 2004-03-25 Toray Ind Inc Positive photosensitive resin composition, method for manufacturing semiconductor device and semiconductor device
JP2005250161A (en) * 2004-03-04 2005-09-15 Kyocera Chemical Corp Negative photosensitive resin composition and cured object thereof
JP2005250160A (en) * 2004-03-04 2005-09-15 Kyocera Chemical Corp Positive photosensitive resin composition and cured object thereof
JP2006323128A (en) * 2005-05-19 2006-11-30 Sumitomo Electric Ind Ltd Positive photosensitive resin composition, and positive photosensitive adhesive, resin film and photosensitive cover lay using same

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