JPH0378794B2 - - Google Patents
Info
- Publication number
- JPH0378794B2 JPH0378794B2 JP58033472A JP3347283A JPH0378794B2 JP H0378794 B2 JPH0378794 B2 JP H0378794B2 JP 58033472 A JP58033472 A JP 58033472A JP 3347283 A JP3347283 A JP 3347283A JP H0378794 B2 JPH0378794 B2 JP H0378794B2
- Authority
- JP
- Japan
- Prior art keywords
- electronic component
- hole
- board
- metal plate
- resin substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000000758 substrate Substances 0.000 claims description 39
- 239000002184 metal Substances 0.000 claims description 37
- 229910052751 metal Inorganic materials 0.000 claims description 37
- 229920005989 resin Polymers 0.000 claims description 35
- 239000011347 resin Substances 0.000 claims description 35
- 238000007747 plating Methods 0.000 claims description 31
- 239000004020 conductor Substances 0.000 claims description 17
- 238000004519 manufacturing process Methods 0.000 claims description 14
- 239000007767 bonding agent Substances 0.000 claims description 9
- 239000000853 adhesive Substances 0.000 claims description 8
- 230000001070 adhesive effect Effects 0.000 claims description 8
- 229910000679 solder Inorganic materials 0.000 claims description 4
- 238000003825 pressing Methods 0.000 claims description 2
- 239000010410 layer Substances 0.000 description 27
- 238000000034 method Methods 0.000 description 21
- 230000002093 peripheral effect Effects 0.000 description 9
- 239000011247 coating layer Substances 0.000 description 7
- 238000003780 insertion Methods 0.000 description 7
- 230000037431 insertion Effects 0.000 description 7
- 230000015572 biosynthetic process Effects 0.000 description 6
- 239000003822 epoxy resin Substances 0.000 description 6
- 230000017525 heat dissipation Effects 0.000 description 6
- 229920000647 polyepoxide Polymers 0.000 description 6
- 238000005530 etching Methods 0.000 description 5
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 4
- 239000004065 semiconductor Substances 0.000 description 4
- 239000011889 copper foil Substances 0.000 description 3
- 238000005520 cutting process Methods 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 239000003365 glass fiber Substances 0.000 description 2
- 239000005011 phenolic resin Substances 0.000 description 2
- 229920003002 synthetic resin Polymers 0.000 description 2
- 239000000057 synthetic resin Substances 0.000 description 2
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 description 1
- 239000003518 caustics Substances 0.000 description 1
- 238000005253 cladding Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 238000005553 drilling Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000000835 fiber Substances 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 229920001568 phenolic resin Polymers 0.000 description 1
- 230000002787 reinforcement Effects 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 229920002994 synthetic fiber Polymers 0.000 description 1
- 239000012209 synthetic fiber Substances 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
Landscapes
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
- Structure Of Printed Boards (AREA)
- Manufacturing Of Printed Circuit Boards (AREA)
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明は、電子部品の発熱に対して熱放散性を
改良し、耐湿性及び薄型コンパクト化の可能なプ
リント配線基板の製造方法に関する。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a method for manufacturing a printed wiring board that can improve heat dissipation against heat generated by electronic components, has moisture resistance, and can be made thin and compact.
従来のプリント配線基板においては、第１図に
示すごとく、銅箔２を積層貼着した樹脂基板１の
表面上に、半導体素子などの電子部品３を塔載し
たものがある。
In conventional printed wiring boards, as shown in FIG. 1, there is one in which electronic components 3 such as semiconductor elements are mounted on the surface of a resin substrate 1 on which copper foil 2 is laminated and adhered.
また、電子部品を実装（塔載）した状態におい
てプリント配線基板全体の厚みを薄型コンパクト
化するため、樹脂基板に電子部品塔載用凹所を設
ける場合がある。かかる電子部品塔載用凹所は切
削ドリルやエンドミルなどにより、ザグリ加工す
ることにより形成している。 Further, in order to reduce the overall thickness of the printed wiring board in a state where electronic components are mounted (mounted), the resin board may be provided with a recess for mounting the electronic components. Such electronic component mounting recesses are formed by counterboring with a cutting drill, end mill, or the like.
しかしながら、上記従来のプリント配線基板に
おいては、前記第１図に示すごとく、樹脂基板で
ある基板１の表面に電子部品３を塔載した場合は
その全体厚みが大きくなる。一方、上記ザグリ加
工により電子部品塔載用凹所を形成する場合には
切削ドリルやエンドミルの摩耗が激しく、生産性
が低下する。
However, in the above conventional printed wiring board, as shown in FIG. 1, when electronic components 3 are mounted on the surface of the board 1 which is a resin board, the overall thickness thereof becomes large. On the other hand, when a recess for mounting an electronic component is formed by the above-mentioned counterboring process, the cutting drill or end mill is severely worn, resulting in a decrease in productivity.
また、上記のごとく樹脂基板内に、電子部品塔
載用凹所を設け、この中に電子部品を塔載する場
合には、該電子部品塔載用凹所の内壁から電子部
品に対して湿気が侵入し、電子部品が損傷してし
まう。即ち、樹脂基板は、その内部に、ガラス繊
維基材、紙基材等を有しているため、これらの基
材を通じて、樹脂基板の外部から電子部品塔載用
凹所の内壁に湿気が侵入する。そして、この湿気
は電子部品内に侵入して、その電子機能に損傷を
与える。それ故、プリント配線基板にとつて、耐
湿性は、最も考慮しなければならない対策であ
る。 In addition, when a recess for mounting an electronic component is provided in the resin substrate as described above and the electronic component is mounted therein, moisture may be applied to the electronic component from the inner wall of the recess for mounting the electronic component. enters and damages electronic components. In other words, since the resin substrate has a glass fiber base material, paper base material, etc. inside, moisture can enter the inner wall of the recess for mounting electronic components from the outside of the resin substrate through these base materials. do. This moisture then enters the electronic components and damages their electronic functionality. Therefore, moisture resistance is the most important measure for printed wiring boards.
一方、実開昭56−78284号公報には、回路基板
の薄型化を図るために、基板に貫通穴を設け、次
いで該貫通穴内に凹状の金属プレートを圧入嵌合
し、その後該金属ブレート内に半導体素子を塔載
する方法が示されている。 On the other hand, in order to reduce the thickness of the circuit board, Japanese Utility Model Application Publication No. 56-78284 discloses that a through hole is provided in the circuit board, a concave metal plate is press-fitted into the through hole, and then a concave metal plate is press-fitted into the through hole. A method for mounting semiconductor elements is shown in .
この方法は、電子部品塔載用凹所の形成に当た
つて、ザグリ加工を施していないので、前記ドリ
ル摩耗の問題は解決できる。しかし、金属プレー
トを別途作製しておくこと、嵌合させることとい
う工程を必要とする。また、金属プレートは、電
子部品の大きさ、それに伴う電子部品塔載用凹所
の大きさにより全て異なるものを作製しておく必
要がある。また、パターン導体回路の形成後に、
別途金属プレートの嵌合を行う必要があり、工程
も煩雑である。 In this method, since no counterboring is performed when forming the recess for mounting the electronic component, the problem of drill wear can be solved. However, it requires a process of separately manufacturing a metal plate and fitting it together. Further, it is necessary to manufacture different metal plates depending on the size of the electronic component and the accompanying size of the recess for mounting the electronic component. In addition, after forming the patterned conductor circuit,
It is necessary to separately fit the metal plate, and the process is also complicated.
また、実開昭56−78282号公報には、同様に、
回路基板の薄型化を図るために、ガラスエポキシ
樹脂等の基板に貫通穴を設け、その底部に合成樹
脂を含浸させた繊維で形成されたプレートを加熱
圧着して、電子部品塔載用凹所を形成する方法が
示されている。 Also, in Utility Model Application Publication No. 56-78282, similarly,
In order to make the circuit board thinner, a through hole is made in a substrate made of glass epoxy resin, etc., and a plate made of fiber impregnated with synthetic resin is heat-pressed to the bottom of the hole to create a recess for mounting electronic components. A method is shown for forming the .
しかし、この方法で得られたものは、電子部品
塔載用凹所の内壁面及び底面が合成樹脂と繊維か
らなるプレートであるため、前記のごとく電子部
品内へ湿気が侵入する。また、上記プレートの加
熱圧着操作、そのための治具を要する。更に、パ
ターン導体回路を形成した後にプレートの加熱圧
着を行う必要があり、工程も煩雑である。更に、
電子部品の放熱性も悪い。 However, in the case obtained by this method, the inner wall surface and bottom surface of the recess for mounting the electronic component are plates made of synthetic resin and fibers, so that moisture infiltrates into the electronic component as described above. In addition, a jig for the heat-pressing operation of the plate is required. Furthermore, it is necessary to heat and press the plate after forming the patterned conductor circuit, which makes the process complicated. Furthermore,
The heat dissipation of electronic components is also poor.
更に、実開昭56−172974号公報には、洩れ電流
通路を形成させないために、樹脂基板の周辺端部
に金属メツキを施し、該周辺端部を密封する技術
が示されている。この技術は、高インピーダンス
を要求されるプリント回路基板において、樹脂基
板表面に形成されたパターン導体回路が水分によ
つて洩れ電流を生ずることを防止するものであ
る。 Further, Japanese Utility Model Application Publication No. 56-172974 discloses a technique of applying metal plating to the peripheral edge of a resin substrate and sealing the peripheral edge in order to prevent the formation of leakage current paths. This technique is used to prevent leakage current from occurring due to moisture in a patterned conductor circuit formed on the surface of a resin substrate in a printed circuit board that requires high impedance.
しかし、この方法は、樹脂基板の周辺端部から
の水分侵入を防止することはできるが、樹脂基板
の表面に装着（塔載）する電子部品に対する湿気
対策にはならない。 However, although this method can prevent moisture from entering from the peripheral edge of the resin substrate, it does not provide a measure against moisture for electronic components mounted (mounted) on the surface of the resin substrate.
また、樹脂基板の周辺端部にメツキを施すこと
は、非常に困難を伴う。即ち、このメツキは１枚
の個片化されたプリント回路基板の周辺端部に対
して行うものである。一方、プリント回路基板
は、個片化される前にシート状基板において多数
個が形成され、その後切断されて個々のプリント
回路基板（個片）とされる。それ故、個片化前に
パターン導体回路が形成されている。そのため、
パターン導体回路の形成と、周辺端部のメツキ層
形成とを別工程で行う必要がある。また、周辺端
部にメツキを施す際には、上記パターン導体回路
部分にマスクを施す必要がある。それ故、この方
法、工程が煩雑である。 Furthermore, it is extremely difficult to plate the peripheral edges of the resin substrate. That is, this plating is performed on the peripheral edge of one piece of individualized printed circuit board. On the other hand, printed circuit boards are formed into a large number of sheet-like substrates before being singulated, and then cut into individual printed circuit boards (individual pieces). Therefore, patterned conductor circuits are formed before singulation. Therefore,
It is necessary to perform the formation of the patterned conductor circuit and the formation of the plating layer at the peripheral end in separate steps. Furthermore, when plating the peripheral end portion, it is necessary to mask the patterned conductor circuit portion. Therefore, this method and process are complicated.
上記のごとく、上記３つの公報に示される製造
方法は、いずれも生産性が低い。また、電子部品
の発熱に対する放熱性、電子部品に対する耐湿性
が充分でない。 As mentioned above, the manufacturing methods shown in the above three publications all have low productivity. Further, the heat dissipation property against the heat generated by the electronic parts and the moisture resistance against the electronic parts are not sufficient.
本発明は、かかる従来の問題点に鑑み、生産性
が良く、薄型コンパクトで放熱性、耐湿性に優れ
たプリント配線基板を、製造することができるプ
リント配線基板の製造方法を提供しようとするも
のである。 In view of these conventional problems, the present invention aims to provide a method for manufacturing a printed wiring board that can produce a printed wiring board that has good productivity, is thin and compact, and has excellent heat dissipation and moisture resistance. It is.
本発明は、プリント配線用の樹脂基板に塔載す
べき電子部品の形状に相応した穴を開け、該穴の
形状に相応しかつ該樹脂基板よりも薄い板厚の金
属板を該穴内に、両者の裏面を略同一平面上にな
して、圧挿入固定し、電子部品塔載用凹所を形成
した後、該樹脂基板と該金属板との接触部分を接
着剤又はソルダーレジストからなる接合剤により
固着し、次いで、上記電子部品塔載用凹所、金属
板等を含めて樹脂基板の全表面にメツキ層を形成
し、然る後、該メツキ層をエツチングして、パタ
ーン導体回路を形成すると共に、上記電子部品塔
載用凹所の全表面、及び上記金属板の裏面から上
記接合剤の固着部分の間の全表面にメツキ層を残
存形成させることを特徴とするプリント配線基板
の製造方法にある。
The present invention involves drilling a hole corresponding to the shape of the electronic component to be mounted on a resin substrate for printed wiring, and inserting a metal plate in the hole that corresponds to the shape of the hole and has a thickness thinner than that of the resin substrate. After making the back surfaces of both surfaces substantially on the same plane and press-inserting and fixing them to form a recess for mounting electronic components, the contact area between the resin substrate and the metal plate is bonded with a bonding agent made of adhesive or solder resist. Then, a plating layer is formed on the entire surface of the resin substrate including the recess for mounting the electronic components, the metal plate, etc., and then the plating layer is etched to form a patterned conductor circuit. and manufacturing a printed wiring board characterized in that a plating layer is formed remaining on the entire surface of the electronic component mounting recess and the entire surface between the back surface of the metal plate and the part to which the bonding agent is fixed. It's in the method.
本発明において最も注目すべき点は、樹脂基板
に設けた貫通穴に薄板状の金属板を嵌合して電子
部品塔載用凹所を形成し、その後樹脂基板と金属
板との接触部分を上記接合剤により固着し、次い
で、これらの全表面に上記電子部品塔載用凹所の
内面も含めてメツキ層を形成し、然る後エツチン
グを施すことにある。 The most noteworthy point in the present invention is that a thin metal plate is fitted into a through hole provided in a resin substrate to form a recess for mounting an electronic component, and then the contact area between the resin substrate and the metal plate is After fixing with the above-mentioned bonding agent, a plating layer is formed on the entire surface including the inner surface of the above-mentioned electronic component mounting recess, and then etching is performed.
そして、ここに重要なことは、このエツチング
においては、パターン導体回路を形成すると共
に、電子部品塔載用凹所内のメツキ層はそのまま
残存させておくこと、また金属板の裏面から上記
接合剤の固着部分の間の裏面メツキ層もそのまま
残存させておくことである。 What is important here is that in this etching, while forming a patterned conductor circuit, the plating layer in the recess for mounting electronic components should remain as it is, and that the above bonding agent should be applied from the back side of the metal plate. The backside plating layer between the fixed parts should also remain intact.
即ち、上記メツキ層の形成とエツチングとによ
つて、パターン導体回路と共に電子部品塔載用凹
所内のメツキ層及び上記裏面メツキ層を一度に形
成することである。 That is, by forming the plating layer and etching, the plating layer in the electronic component mounting recess and the back surface plating layer are simultaneously formed together with the patterned conductor circuit.
このようにして得られたプリント配線基板は、
後述する第２図ｆに示すごとく、樹脂基板の穴と
金属板とによつて形成された電子部品塔載用凹所
内の全表面がメツキ層によつて完全に被覆されて
いる。また、樹脂基板の裏面側においては、金属
板から接合剤の固着部分にかけて、メツキ層が形
成されている。 The printed wiring board obtained in this way is
As shown in FIG. 2f, which will be described later, the entire surface of the electronic component mounting recess formed by the hole in the resin substrate and the metal plate is completely covered with the plating layer. Furthermore, on the back side of the resin substrate, a plating layer is formed from the metal plate to the part to which the bonding agent is fixed.
本発明においては、樹脂基板に設けた穴内に金
属板を圧挿入して電子部品塔載用凹所を形成し、
次いで接合剤による固着後該電子部品塔載用凹所
を含めて樹脂基板の全表面にメツキ層を形成し、
然る後上記エツチングを施している。
In the present invention, a metal plate is press-inserted into a hole provided in a resin substrate to form a recess for mounting an electronic component,
Next, after fixing with a bonding agent, a plating layer is formed on the entire surface of the resin substrate including the recess for mounting the electronic component,
After that, the etching described above is applied.
そのため、パターン導体回路の形成と電子部品
搭載用凹所内のメツキ層形成と上記裏面メツキ層
の形成とを、メツキ層形成工程とエツチング工程
の２工程のみで容易に達成することができ生産性
が良い。 Therefore, the formation of a patterned conductor circuit, the formation of a plating layer in the recess for mounting electronic components, and the formation of the above-mentioned backside plating layer can be easily achieved with only two steps, the plating layer forming process and the etching process, increasing productivity. good.
それ故、従来のごとく、パターン導体回路形成
後に、別途作製した箱状金属プレートを樹脂基板
の貫通穴に嵌合させたり、パターン導体回路形成
後に個片化した樹脂基板の周辺端部にメツキ層を
形成するといつた生産性の悪い、煩雑な工程は必
要としない。 Therefore, as in the past, after forming a patterned conductor circuit, a separately manufactured box-shaped metal plate is fitted into the through hole of the resin substrate, or after the patterned conductor circuit is formed, a plating layer is placed on the peripheral edge of the individualized resin substrate. There is no need for the complicated and unproductive processes that occur when forming a .
また、樹脂基板の穴の底部には金属板を圧挿入
して電子部品塔載用凹所を形成しているので、該
電子部品塔載用凹所内に搭載した電子部品の発熱
を、容易に外部に放出することができる。 In addition, a metal plate is press-inserted into the bottom of the hole in the resin board to form a recess for mounting electronic components, so it is easy to reduce the heat generated by the electronic components mounted in the recess for mounting electronic components. Can be released to the outside.
また、該金属板の裏面は樹脂基板の裏面と略同
一平面上に配設してあるので、金属板は樹脂基板
より突出せず、プリント配線基板は薄型コンパク
トとなる。 Further, since the back surface of the metal plate is disposed on substantially the same plane as the back surface of the resin substrate, the metal plate does not protrude from the resin substrate, and the printed wiring board becomes thin and compact.
更に、電子部品塔載用凹所内壁の全表面は、メ
ツキ層によつて完全に被覆されている。そのた
め、電子部品への湿気侵入を完全に防止できる。
つまり、電子部品に対向隣接している電子部品塔
載用凹所の内壁が、メツキ層によつて被覆されて
いるため、樹脂基板内に湿気が侵入したとしても
上記メツキ層によつて遮断され、電子部品は保護
される。 Furthermore, the entire surface of the inner wall of the electronic component mounting recess is completely covered with a plating layer. Therefore, it is possible to completely prevent moisture from entering the electronic components.
In other words, since the inner wall of the electronic component mounting recess that is opposite and adjacent to the electronic component is covered with a plating layer, even if moisture intrudes into the resin substrate, it will be blocked by the plating layer. , electronic components are protected.
もしも、前記従来技術のごとく樹脂基板の周辺
端部にメツキ層が形成されていたとしても、本発
明のごとく電子部品塔載用凹所の内壁にメツキ層
が形成されていなければ、樹脂基板の上下の表面
１ら侵入した湿気が、該内壁から電子部品内に侵
入してしまう。 Even if a plating layer is formed on the peripheral edge of the resin substrate as in the prior art, if the plating layer is not formed on the inner wall of the electronic component mounting recess as in the present invention, the resin substrate will Moisture that has entered from the upper and lower surfaces 1 will enter the electronic component from the inner wall.
また、上記金属板と樹脂基板との接触部分は上
記接合剤により固着しているので、金属板が離脱
するおそれがない。 Further, since the contact portion between the metal plate and the resin substrate is fixed by the bonding agent, there is no risk of the metal plate coming off.
以上のごとく、本発明によれば、生産性が良
く、薄型コンパクトで、放熱性、耐湿性に優れた
プリント配線基板を製造することができる。 As described above, according to the present invention, it is possible to manufacture a printed wiring board that is highly productive, thin and compact, and has excellent heat dissipation and moisture resistance.
以下、本発明につき、第２図に示す実施例を用
いて具体的に説明する。
Hereinafter, the present invention will be specifically explained using an embodiment shown in FIG.
第２図のａからｆは、本発明のプリント配線基
板の製造方法の工程の概要を示す該基板の断面図
であり、ｇは電子部品を実装した該基板の断面図
である。 2(a) to 2(f) are cross-sectional views of the printed wiring board showing an outline of the steps of the manufacturing method of the printed wiring board of the present invention, and g is a cross-sectional view of the printed wiring board on which electronic components are mounted.
ａの図面は本発明の製造方法において使用され
る両面銅張りプリント配線用基板の断面図を示す
ものであり、１はガラス繊維基材のエポキシ樹脂
板、紙基材のエポキシ樹脂板又は紙基材のフエノ
ール樹脂板などのいずれかから成るプリント配線
基板、２は該基板上に貼着された銅箔であり、本
図面においては両面銅張りの板を示すものであ
る。 Drawing a shows a cross-sectional view of a double-sided copper-clad printed wiring board used in the manufacturing method of the present invention, and 1 is a glass fiber-based epoxy resin board, a paper-based epoxy resin board, or a paper-based epoxy resin board. The printed wiring board 2 is made of a phenolic resin board or the like, and 2 is a copper foil stuck on the board, and this drawing shows a board with copper cladding on both sides.
ｂの図面は上記ａの図面に示した両面銅張りプ
リント配線用基板に穴４，４′を複数明けた状態
の該基板の断面図を示すものであり、４は金型な
どによる打ち抜き加工で形成される実装される電
子部品形状に相応した形状の穴、４′は切削ドリ
ルなどにより形成されるスルホール用の穴であ
る。 Drawing b shows a cross-sectional view of the double-sided copper-clad printed wiring board shown in drawing a above with a plurality of holes 4 and 4' drilled therein, and 4 is a cross-sectional view of the double-sided copper-clad printed wiring board shown in drawing a above. The hole 4' has a shape corresponding to the shape of the electronic component to be mounted and is a through-hole hole formed by a cutting drill or the like.
ｃの図面は上記ｂの図面に示した該基板の実装
される電子部品形状に相応した形状の穴の中に該
基板の厚さよりも薄い板厚の金属板（以下挿入板
という）を挿入固定した状態の該基板の断面図を
示すものであり、５は前記穴４に挿入固定された
上記挿入板を示すものである。 Drawing c shows a metal plate thinner than the thickness of the board (hereinafter referred to as an insert plate) inserted and fixed into a hole of a shape corresponding to the shape of the electronic component mounted on the board shown in drawing b above. 5 shows a cross-sectional view of the board in a state where the board is in a state where the board is in a state where the board is in a state where the board is in a state where the board is in a state where the board is in a state where the board is in a state where the board is in a state where the board is in a state where
ｄの図面は上記ｃの図面に示した挿入板と該基
板の接触部の一部とを接着剤、たとえばエポキシ
樹脂、フエノール樹脂などの熱硬化性樹脂の接着
剤又はマスク用インク、感光性フイルムなどのソ
ルダーレジストにより接合した状態を示す該基板
の断面図であり、６は上記接着剤の接合層であ
る。なお、前記挿入板と該基板との接触部分には
若干の空隙部なども存在するので、本図に図示し
た接合部分に限定することなく両板の接触部分の
全ての空隙部分にエポキシ樹脂などの接着剤を圧
入充填することもできる。これにより挿入固定の
みでは後の電子部品の実装工程又は実装後の工程
において挿入板が脱落するなど接合強度で不十分
であつたものが数倍ないしそれ以上の固着強度を
得ることができるようになり補強されると同時
に、接触部分の空隙部に各種の薬品や腐食性物質
が侵入しなくなり、両板間を完全に封止すること
が可能となつた。 In the drawing of d, the insertion plate shown in the drawing of c above and a part of the contact portion of the substrate are bonded with an adhesive, for example, a thermosetting resin adhesive such as epoxy resin or phenol resin, mask ink, or photosensitive film. FIG. 2 is a cross-sectional view of the substrate bonded using a solder resist such as the above, and 6 is a bonding layer of the adhesive described above. Note that since there are some gaps in the contact area between the insertion plate and the board, epoxy resin or the like is applied to all the gaps in the contact area between the two plates, not just the bonded area shown in this figure. Adhesive can also be press-fitted. As a result, it is now possible to obtain a bonding strength several times or more that was insufficient due to insertion and fixation alone, such as the insertion plate falling off during the subsequent electronic component mounting process or post-mounting process. At the same time, various chemicals and corrosive substances are prevented from entering the gap between the two plates, making it possible to completely seal the space between the two plates.
次に、ｅの図面は上記ｄの図面に示した接着剤
又はソルダーレジストなどにより両板を接合した
該基板の全表面にメツキを施した状態を示す該基
板の断面図であり、７は銅メツキ又はニツケルメ
ツキなどの金属被覆層である。この金属被覆層７
は前記電子部品形状に相応した形状の穴４及びス
ルホール用の穴４′の全表面にも施されているの
で該基板の底部などからの湿度を完全に防止する
ことが可能となつた。 Next, drawing e is a cross-sectional view of the board showing a state in which the entire surface of the board is plated with both boards bonded together using an adhesive or solder resist as shown in drawing d above, and 7 is a cross-sectional view of the board showing the state in which the entire surface of the board is plated. It is a metal coating layer such as plating or nickel plating. This metal coating layer 7
Since this is applied to the entire surface of the hole 4 and the through-hole hole 4' having a shape corresponding to the shape of the electronic component, it is possible to completely prevent moisture from entering the bottom of the board.
ｆの図面は、上記ｅの図面に示した全表面に金
属被覆を施した該基板の所望の部分の金属被覆層
を残して、他の不要部分はエツチングなどにより
除去しパターン導体回路７，７′を該基板の表裏
両面に形成する。 The drawing f shows the patterned conductor circuits 7, 7 by leaving the metal coating layer on the desired parts of the board shown in the drawing e above and removing the metal coating layer on the desired parts. ' are formed on both the front and back surfaces of the substrate.
そして、前記電子部品形状に相応した形状の穴
４及びスルホール用の穴４′の全表面にも金属被
覆されており、また上記穴４の内挿入板５は金属
板である。そのため、前者の穴４は半導体素子、
特に発熱し易い電子部品をこの穴の中に塔載すれ
ば熱伝導が良好であるため熱放散性が向上し蓄熱
することはなくなり、また該基板表面に電子部品
が突出しない。ただし、この穴４は前記パターン
導体回路とは遮断された独立した金属被覆層を形
成することがその性質上必要である。 The entire surfaces of the hole 4 and the through-hole hole 4', each having a shape corresponding to the shape of the electronic component, are also coated with metal, and the inner insertion plate 5 of the hole 4 is a metal plate. Therefore, the former hole 4 is a semiconductor element,
In particular, if electronic components that easily generate heat are mounted in these holes, the heat conduction is good, so heat dissipation is improved and no heat is accumulated, and the electronic components do not protrude from the surface of the substrate. However, due to the nature of this hole 4, it is necessary to form an independent metal coating layer that is isolated from the patterned conductor circuit.
一方、スルホール用の穴４′の全表面には、前
記パターン導体回路と連らなる金属被覆層が形成
されるためこの穴はスルホールを形成することに
なる。 On the other hand, on the entire surface of the through-hole hole 4', a metal coating layer that is continuous with the patterned conductor circuit is formed, so that this hole forms a through-hole.
また、ｇの図面は、本発明の製造方法によつて
得られたプリント配線基板上に電子部品を塔載し
前記パターン導体回路とワイヤイーボンデイング
で実装した状態を示す該基板の断面図であり、３
は各種の半導体素子などの電子部品であり、８は
挿入板の裏面及び接着剤の接合剤をメツキなどに
より金属被覆した層である。 Further, drawing g is a cross-sectional view of the printed wiring board obtained by the manufacturing method of the present invention, showing a state in which electronic components are mounted on the board and mounted with the patterned conductor circuit by wire e-bonding. ,3
Reference numeral 8 indicates electronic components such as various semiconductor elements, and 8 indicates a layer formed by coating the back surface of the insertion plate with a bonding agent such as an adhesive by plating or the like.
以上のように、本発明の製造方法によれば安価
でかつ信頼性が高く実装後も薄型コンパクトなプ
リント配線基板を提供することができる。 As described above, according to the manufacturing method of the present invention, it is possible to provide a printed wiring board that is inexpensive, highly reliable, and is thin and compact even after mounting.
第１図は従来の製造方法により得られたプリン
ト配線基板上に電子部品を実装した状態の該基板
の断面図、第２図のａ〜ｆは本発明の製造方法の
概要を示す各工程における該基板の断面図、第２
図のｇは本発明の製造方法によつて得られたプリ
ント配線基板上に電子部品を実装した状態の該基
板の断面図をそれぞれ示すものである。
１……基板、２……銅箔層、３……電子部品、
４……電子部品実装用の穴、４′……スルホール
用の穴、５……挿入板、６……接合層、７……金
属被覆層、８……金属被覆による補強層。
FIG. 1 is a cross-sectional view of a printed wiring board obtained by a conventional manufacturing method with electronic components mounted thereon, and FIGS. Cross-sectional view of the substrate, second
G in the figure shows a cross-sectional view of a printed wiring board obtained by the manufacturing method of the present invention with electronic components mounted thereon. 1...Substrate, 2...Copper foil layer, 3...Electronic component,
4... Hole for electronic component mounting, 4'... Hole for through hole, 5... Insertion plate, 6... Bonding layer, 7... Metal coating layer, 8... Reinforcement layer by metal coating.
Claims (1)
部品の形状に相応した穴を開け、該穴の形状に相
応しかつ該樹脂基板よりも薄い板厚の金属板を該
穴内に、両者の裏面を略同一平面上になして、圧
挿入固定し、電子部品塔載用凹所を形成した後、 該樹脂基板と該金属板との接触部分を接着剤又
はソルダーレジストからなる接合剤により固着
し、次いで、上記電子部品塔載用凹所、金属板等
を含めて樹脂基板の全表面にメツキ層を形成し、 然る後、該メツキ層をエツチングして、パター
ン導体回路を形成すると共に、上記電子部品塔載
用凹所の全表面、及び上記金属板の裏面から上記
接合剤の固着部分の間の全表面にメツキ層を残存
形成させることを特徴とするプリント配線基板の
製造方法。[Claims] 1. A hole corresponding to the shape of the electronic component to be mounted is made in a resin substrate for printed wiring, and a metal plate corresponding to the shape of the hole and thinner than the resin substrate is inserted. After pressing and fixing the two into the hole with their back surfaces on approximately the same plane to form a recess for mounting the electronic component, the contact area between the resin board and the metal plate is coated with adhesive or solder resist. Then, a plating layer is formed on the entire surface of the resin substrate including the electronic component mounting recess, metal plate, etc. After that, the plating layer is etched to form a patterned conductor. The printed wiring is characterized in that a circuit is formed and a plating layer remains on the entire surface of the electronic component mounting recess and the entire surface between the back surface of the metal plate and the part to which the bonding agent is fixed. Substrate manufacturing method.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3347283A JPS59158580A (en) | 1983-02-28 | 1983-02-28 | Method of producing printed circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3347283A JPS59158580A (en) | 1983-02-28 | 1983-02-28 | Method of producing printed circuit board |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS59158580A JPS59158580A (en) | 1984-09-08 |
| JPH0378794B2 true JPH0378794B2 (en) | 1991-12-16 |
Family
ID=12387479
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP3347283A Granted JPS59158580A (en) | 1983-02-28 | 1983-02-28 | Method of producing printed circuit board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS59158580A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2017059812A (en) * | 2015-09-16 | 2017-03-23 | 旭徳科技股▲ふん▼有限公司 | Package carrier and method for manufacturing the same |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6252992A (en) * | 1985-09-02 | 1987-03-07 | 松下電工株式会社 | Chip carrier for electronic element |
| JP6546496B2 (en) * | 2015-09-28 | 2019-07-17 | ニチコン株式会社 | Semiconductor power module |
| CN208597204U (en) | 2016-01-07 | 2019-03-12 | 株式会社村田制作所 | Multilager base plate and electronic equipment |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5669264U (en) * | 1979-10-25 | 1981-06-08 | ||
| JPS5678284U (en) * | 1979-11-09 | 1981-06-25 | ||
| JPS5678282U (en) * | 1979-11-09 | 1981-06-25 | ||
| US4278707A (en) * | 1980-05-19 | 1981-07-14 | Hewlett-Packard Company | Method for coating the edge of a printed circuit board to improve its moisture resistance |
-
1983
- 1983-02-28 JP JP3347283A patent/JPS59158580A/en active Granted
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2017059812A (en) * | 2015-09-16 | 2017-03-23 | 旭徳科技股▲ふん▼有限公司 | Package carrier and method for manufacturing the same |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS59158580A (en) | 1984-09-08 |
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