JPS5323564A - Bump type semiconductor device - Google Patents

Bump type semiconductor device

Info

Publication number
JPS5323564A
JPS5323564A JP9788976A JP9788976A JPS5323564A JP S5323564 A JPS5323564 A JP S5323564A JP 9788976 A JP9788976 A JP 9788976A JP 9788976 A JP9788976 A JP 9788976A JP S5323564 A JPS5323564 A JP S5323564A
Authority
JP
Japan
Prior art keywords
semiconductor device
type semiconductor
thick
bump type
bump terminals
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP9788976A
Other languages
Japanese (ja)
Inventor
Masaru Nakamura
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp, Nippon Electric Co Ltd filed Critical NEC Corp
Priority to JP9788976A priority Critical patent/JPS5323564A/en
Publication of JPS5323564A publication Critical patent/JPS5323564A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/11—Manufacturing methods

Landscapes

  • Electrodes Of Semiconductors (AREA)

Abstract

PURPOSE: To obtain thick bump terminals free from spreading in sloped side faces by constructing the bump terminals in the laminated wiring of a thick Al film in contact with a semiconductor substrate, a metal film of an interlayer and other thick metal film and making the thickness of the Al layer in contact with the substrate 1/2 to 2/3 the entire thickness of the bump terminals.
COPYRIGHT: (C)1978,JPO&Japio
JP9788976A 1976-08-17 1976-08-17 Bump type semiconductor device Pending JPS5323564A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP9788976A JPS5323564A (en) 1976-08-17 1976-08-17 Bump type semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP9788976A JPS5323564A (en) 1976-08-17 1976-08-17 Bump type semiconductor device

Publications (1)

Publication Number Publication Date
JPS5323564A true JPS5323564A (en) 1978-03-04

Family

ID=14204307

Family Applications (1)

Application Number Title Priority Date Filing Date
JP9788976A Pending JPS5323564A (en) 1976-08-17 1976-08-17 Bump type semiconductor device

Country Status (1)

Country Link
JP (1) JPS5323564A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61108953A (en) * 1984-11-01 1986-05-27 Ngk Insulators Ltd Electrical connecting terminal of sensor element using ceramics
JPS6345826A (en) * 1986-08-11 1988-02-26 インターナショナル・ビジネス・マシーンズ・コーポレーシヨン Connection structure of semiconductor integrated circuit device
JPH06314723A (en) * 1993-04-28 1994-11-08 Nec Corp Semiconductor device and manufacture thereof

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61108953A (en) * 1984-11-01 1986-05-27 Ngk Insulators Ltd Electrical connecting terminal of sensor element using ceramics
JPH0475460B2 (en) * 1984-11-01 1992-11-30
JPS6345826A (en) * 1986-08-11 1988-02-26 インターナショナル・ビジネス・マシーンズ・コーポレーシヨン Connection structure of semiconductor integrated circuit device
JPH06314723A (en) * 1993-04-28 1994-11-08 Nec Corp Semiconductor device and manufacture thereof

Similar Documents

Publication Publication Date Title
JPS5365088A (en) Semiconductor device
JPS5323564A (en) Bump type semiconductor device
JPS5363993A (en) Production of semiconductor device
JPS5258491A (en) Semiconductor device
JPS5255881A (en) Semiconductor integrated circuit
JPS52156584A (en) Multilayer wiring type semiconductor device
JPS52102691A (en) Formation of wiring on insulating layer having steps
JPS52117063A (en) Preparation of ohmic ontact layer in semiconductor device
JPS5268388A (en) Semiconductor integrated circuit
JPS51132764A (en) Semiconductor device
JPS5380184A (en) Manufacture of semiconductor device
JPS5227391A (en) Contact forming method of semiconductor device
JPS5271994A (en) Semiconductor integrated circuit device
JPS52156556A (en) Electrode structure
JPS5259571A (en) Substrate for face down bonding
JPS5317286A (en) Production of semiconductor device
JPS53117970A (en) Resin seal type semiconductor device
JPS53124090A (en) Semiconductor device
JPS52117591A (en) Semiconductor integrating circuit device
JPS537174A (en) Production of semiconductor device
JPS5365059A (en) Bump type semiconductor device
JPS5289476A (en) Semiconductor device
JPS52101983A (en) Semiconductor integrated circuit device
JPS5331966A (en) Production of semiconductor device
JPS52153382A (en) Preparation of semiconductor device