JPS612509B2 - - Google Patents

Info

Publication number
JPS612509B2
JPS612509B2 JP55150796A JP15079680A JPS612509B2 JP S612509 B2 JPS612509 B2 JP S612509B2 JP 55150796 A JP55150796 A JP 55150796A JP 15079680 A JP15079680 A JP 15079680A JP S612509 B2 JPS612509 B2 JP S612509B2
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP55150796A
Other languages
Japanese (ja)
Other versions
JPS5774166A (en
Inventor
Takaaki Myashita
Keiji Murasugi
Toshuki Iwabuchi
Yasuhisa Ikeda
Kazuyoshi Tateishi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nippon Telegraph and Telephone Corp
Oki Electric Industry Co Ltd
Original Assignee
Nippon Telegraph and Telephone Corp
Oki Electric Industry Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Telegraph and Telephone Corp, Oki Electric Industry Co Ltd filed Critical Nippon Telegraph and Telephone Corp
Priority to JP55150796A priority Critical patent/JPS5774166A/en
Publication of JPS5774166A publication Critical patent/JPS5774166A/en
Publication of JPS612509B2 publication Critical patent/JPS612509B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/491—Disposition
    • H01L2224/49105—Connecting at different heights
    • H01L2224/49109—Connecting at different heights outside the semiconductor or solid-state body

Landscapes

  • Facsimile Scanning Arrangements (AREA)
  • Led Device Packages (AREA)
  • Dot-Matrix Printers And Others (AREA)
  • Printers Or Recording Devices Using Electromagnetic And Radiation Means (AREA)
  • Exposure Or Original Feeding In Electrophotography (AREA)
  • Facsimile Heads (AREA)
JP55150796A 1980-10-29 1980-10-29 Array head of light emitting diode Granted JPS5774166A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP55150796A JPS5774166A (en) 1980-10-29 1980-10-29 Array head of light emitting diode

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP55150796A JPS5774166A (en) 1980-10-29 1980-10-29 Array head of light emitting diode

Publications (2)

Publication Number Publication Date
JPS5774166A JPS5774166A (en) 1982-05-10
JPS612509B2 true JPS612509B2 (en) 1986-01-25

Family

ID=15504614

Family Applications (1)

Application Number Title Priority Date Filing Date
JP55150796A Granted JPS5774166A (en) 1980-10-29 1980-10-29 Array head of light emitting diode

Country Status (1)

Country Link
JP (1) JPS5774166A (en)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58111981A (en) * 1981-12-25 1983-07-04 ミノルタ株式会社 Luminous segment driving circuit
JPS58110268A (en) * 1981-12-25 1983-06-30 Minolta Camera Co Ltd Controller for electrostatic recorder
JPS5990975A (en) * 1982-11-17 1984-05-25 Sanyo Electric Co Ltd Assembly of light-emitting diode
JPS6019565A (en) * 1983-07-13 1985-01-31 Sanyo Electric Co Ltd Luminous head for printing
JPS6083463A (en) * 1983-10-13 1985-05-11 Nec Corp Light source for original reading
JPH0680839B2 (en) * 1984-06-12 1994-10-12 三洋電機株式会社 Light emitting diode array
JPH0825302B1 (en) * 1984-09-27 1996-03-13 Sanyo Denki Kk
JPS61145877A (en) * 1984-12-19 1986-07-03 Mitsubishi Electric Corp Led array head
JPS61147584A (en) * 1984-12-20 1986-07-05 Mitsubishi Electric Corp Light-emitting diode array head
JPS61211063A (en) * 1985-03-15 1986-09-19 Kyocera Corp Optical printing head
JP2604574B2 (en) * 1986-03-20 1997-04-30 京セラ株式会社 Optical printer head
JPS62261465A (en) * 1986-05-08 1987-11-13 Mitsubishi Electric Corp Optical printer head

Also Published As

Publication number Publication date
JPS5774166A (en) 1982-05-10

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