JPS61211063A - Optical printing head - Google Patents
Optical printing headInfo
- Publication number
- JPS61211063A JPS61211063A JP60052898A JP5289885A JPS61211063A JP S61211063 A JPS61211063 A JP S61211063A JP 60052898 A JP60052898 A JP 60052898A JP 5289885 A JP5289885 A JP 5289885A JP S61211063 A JPS61211063 A JP S61211063A
- Authority
- JP
- Japan
- Prior art keywords
- light emitting
- emitting diode
- led
- driving
- drive
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/435—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of radiation to a printing material or impression-transfer material
- B41J2/447—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of radiation to a printing material or impression-transfer material using arrays of radiation sources
- B41J2/45—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of radiation to a printing material or impression-transfer material using arrays of radiation sources using light-emitting diode [LED] or laser arrays
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48135—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
- H01L2224/48137—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being arranged next to each other, e.g. on a common substrate
Abstract
Description
【発明の詳細な説明】
（産業上の利用分野）
本発明は電子写真式プリンタなどの記録装置の光源とし
て使用される光プリンタヘッドの改良に関するものであ
る。DETAILED DESCRIPTION OF THE INVENTION (Field of Industrial Application) The present invention relates to an improvement in an optical printer head used as a light source in a recording device such as an electrophotographic printer.
（従来の技術）
近時、情報処理技術ならびに通信技術の進展に伴ない普
通紙に任意の漢字や図形を高速度、高品質で大量に出力
することができる小型で、かつ安価な電子写真式プリン
タが要求されている。そのためこの要求に対処するため
にプリンタの光源として絶縁基板上に複数個の発光ダイ
オード（ＬＥＤ）を直線状に配列取着して成る光プリン
タヘッドを使用した電子写真式プリンタが小型、高解像
度のものとして提案されている。(Prior technology) Recently, with the advancement of information processing technology and communication technology, small and inexpensive electrophotographic type that can output large quantities of arbitrary kanji and figures on plain paper at high speed and high quality has become available. A printer is requested. To meet this demand, an electrophotographic printer using an optical printer head consisting of a plurality of light emitting diodes (LEDs) mounted in a linear array on an insulating substrate as a light source for the printer is a small, high-resolution printer. It is proposed as such.
この従来の電子写真式プリンタに使用されている光プリ
ンタヘッドは通常、第２図に示すようにセラミック、ガ
ラス等の電気絶縁材料から成る基板１１上にガリウム−
砒素−リン（ＧａＡｓＰ ）等から成る発光ダイオード
（ＩＪＤ ） １２を多数個、直線状に配列取着すると
ともに該発光ダイオード１２を駆動する駆動用ＩＣ素子
１３を搭載した構造を有しておυ、駆動用ＩＣ素子１３
の駆動により直線状に配列した発光ダイオード１２の個
々に印加される電力を制御し、発光ダイオード１２を選
択に発光させることによって電子写真式プリンタの光源
としで機能する。As shown in FIG. 2, the optical printer head used in this conventional electrophotographic printer is usually made of gallium on a substrate 11 made of an electrically insulating material such as ceramic or glass.
It has a structure in which a large number of light emitting diodes (IJD) 12 made of arsenic-phosphorous (GaAsP) etc. are arranged and attached in a linear manner, and a driving IC element 13 for driving the light emitting diodes 12 is mounted. Drive IC element 13
The light emitting diode 12 functions as a light source for an electrophotographic printer by controlling the power applied to each of the linearly arranged light emitting diodes 12 and selectively causing the light emitting diodes 12 to emit light.
尚、前記複数個の発光ダイオードは通常、６４個が１単
位として１つの発光ダイオードアレイ１２ａを構成し、
Ｂ４サイズの電子写真式プリンタの光源として使用され
る場合には前記発光ダイオードアレイ１２ａは３２個が
直線状に配列される。Note that the plurality of light emitting diodes usually constitute one light emitting diode array 12a with 64 pieces as one unit,
When used as a light source for a B4 size electrophotographic printer, 32 light emitting diode arrays 12a are arranged in a straight line.
しかし乍ら、この従来の光プリンタヘッドは発光ダイオ
ード（ＬＥＩ：Ｄ ） １２の個々に電力を印加し、各
発光ダイオード１２を選択的に発光させる駆動用ＩＣ素
子１３の各出力型ｍ１ａａが該駆動用ＩＣ素子１３の両
端に分かれて形成されており、かつ発光ダイオード１２
の配列方向に対し垂直方向に配列されていることから駆
動用ＩＣ素子１３の各出力電極１３ａは発光ダイオード
１２との距離がそれぞれ異なり、駆動用ＩＣ素子１３の
各出力電極１３ａと各発光ダイオード１２とを電気的に
接続するための電気配線１４の長さも異なるものであっ
た。そのためこの従来の光プリンタヘッドを使用して漢
字や図形を出力した場合、各電気配線１４はその電気抵
抗値が長さの相違によって異なることから該電気配線１
４を介し駆動用ＩＣ素子１３から各発光ダイオード１２
に印加される電力の大きさもばらつきを有し、その結果
、各発光ダイオード戎の発光輝度や発光波長にむらを生
じて高品質の印字、印画ができないという欠点を有して
いた。However, in this conventional optical printer head, power is applied to each of the light emitting diodes (LEI:D) 12, and each output type m1aa of the driving IC element 13 that selectively causes each light emitting diode 12 to emit light is The light emitting diode 12 is formed separately at both ends of the IC element 13 for use.
Since each output electrode 13a of the driving IC element 13 is arranged in a direction perpendicular to the arrangement direction of the driving IC element 13, the distance between each output electrode 13a of the driving IC element 13 and each light emitting diode 12 is different. The length of the electrical wiring 14 for electrically connecting the two was also different. Therefore, when using this conventional optical printer head to output kanji or figures, each electrical wiring 14 has a different electrical resistance value depending on its length.
4 from the driving IC element 13 to each light emitting diode 12 through
There is also variation in the magnitude of the electric power applied to the light emitting diode, which results in unevenness in the luminance and wavelength of light emitted from each light emitting diode, resulting in a drawback that high quality printing cannot be achieved.
そこでこの従来の光プリンタヘッドにおける発光ダイオ
ードの発光輝度や発光波長のむら発生を防止するために
第３図に示すような駆動用ＩＣ素子１３のすべての出力
電極１３ａと発光ダイオード１２との距離を実質的に同
一とし、該駆動用ＩＣ素子１３の出力型１ｉｉ １３ａ
と発光ダイオード１２とを電気的に接続するための配線
導体１４の長さを実質的ｌ；同一となして、すべての配
線導体１４の電気抵抗値を均等とした光プリンタヘッド
を本出願人は先に提案した。Therefore, in order to prevent unevenness in the light emission brightness and light emission wavelength of the light emitting diodes in this conventional optical printer head, the distances between all the output electrodes 13a of the driving IC element 13 and the light emitting diodes 12 as shown in FIG. and the output type 1ii 13a of the driving IC element 13
The applicant has created an optical printer head in which the length of the wiring conductor 14 for electrically connecting the light emitting diode 12 and the light emitting diode 12 is substantially the same, and the electrical resistance values of all the wiring conductors 14 are made equal. I suggested it earlier.
しかし乍ら、この光プリンタヘッドは発光ダイオードが
発する光の発光輝度や発光波長のむらは有効に防止し得
るものの駆動用ＩＣ素子の各出力電極と発光ダイオード
とを電気的に接続する配線導体を絶縁基板上に形成して
おかなければならず、該配線導体を形成するためのスペ
ースが必要なことから光プリンタヘッドが比較的大型化
するとともに高価となる課題を有していた。However, although this optical printer head can effectively prevent unevenness in the luminance and wavelength of the light emitted by the light emitting diode, it does not insulate the wiring conductor that electrically connects each output electrode of the driving IC element and the light emitting diode. Since the wiring conductor must be formed on a substrate and a space is required for forming the wiring conductor, the optical printer head becomes relatively large and expensive.
（発明の目的）
本発明は上述の諸欠点に鑑み案出されたもので発光ダイ
オードに印加される電力の大きさを均等となすことによ
って発光ダイオードに発生する発光輝度や発光波長のむ
らを解消し、高品質の印字、印画を得ることができる小
型、かつ安価な光プリンタヘッドを提供することにある
。(Object of the Invention) The present invention was devised in view of the above-mentioned drawbacks, and it eliminates the unevenness in luminance and wavelength of light emitted from light emitting diodes by equalizing the amount of power applied to the light emitting diodes. The object of the present invention is to provide a small, inexpensive optical printer head that can produce high-quality prints and prints.
（問題点を解決するための手段）
本発明は絶縁基板上に複数個の発光ダイオードを直線状
に配列取着するとともに該発光ダイオードを選択的に発
光させる駆動用ＩＣ素子を搭載して成る光プリンタヘッ
ドにおいて、前記駆動用ＩＣ素子のすべての出力電極を
発光ダイオードと実質的に同一距離となすとともに該駆
動用ＩＣ素子のすべての出力電極を発光ダイオードに直
線ワイヤボンディングしたことを特徴とするものである
。(Means for Solving the Problems) The present invention provides a light emitting diode comprising a plurality of light emitting diodes linearly arranged and mounted on an insulating substrate and a driving IC element for selectively emitting light from the light emitting diodes. In the printer head, all output electrodes of the driving IC element are arranged at substantially the same distance from the light emitting diode, and all output electrodes of the driving IC element are linearly wire-bonded to the light emitting diode. It is.
（実施例）
次に本発明を添付図面に示す実施例に基づき詳細に説明
する。(Example) Next, the present invention will be described in detail based on an example shown in the accompanying drawings.
第１図は本発明の光プリンタヘッドの一実施例を示し、
１はセラミック、ガラス等の電気絶縁材料から成る基板
であシ、その表面に発光ダイオード（ＩＪＤ ） ２及
び駆動用ＩＣ素子３がそれぞれ取着搭載されている。FIG. 1 shows an embodiment of the optical printer head of the present invention,
Reference numeral 1 denotes a substrate made of an electrically insulating material such as ceramic or glass, on the surface of which a light emitting diode (IJD) 2 and a driving IC element 3 are respectively attached and mounted.
前記発光ダイオード２はＧａＡｓＰ糸、ＧａＰ糸等の発
光ダイオードが使用され、例えばＧａＡｓＰ ；４％の
発光ダイオードの場合には、先ずＧａＡｓの基板を炉中
にて高温に加熱するとともにＡｓＨｎ （７μシン）と
ＰＨｓ （ホスヒン）とＧａ （ガリウム）を適量に含
むガスを接触させて基板表面にｎ型半導体のＧａＡｓＰ
（ガリウム−砒素−リン）の単結晶を成長させ、次に
前ｆａＧａＡ８Ｆ単結晶表面に５１ｓＮａ （窒化シリ
コン）の窓付膜を被着させるとともに該窓部にＺｎ （
亜鉛）のガスをさらし、 ｎ型半導体のＧａＡ８Ｆ単結
晶層の一部にＺｎを拡散させてＰ型半導体を形成し、Ｐ
ｎ接合をもたすことＫよって形成される。The light emitting diode 2 is a light emitting diode made of GaAsP thread, GaP thread, etc. For example, in the case of a GaAsP 4% light emitting diode, first, a GaAs substrate is heated to a high temperature in a furnace and AsHn (7μ thin) is used. A gas containing appropriate amounts of PHs (phosphine) and Ga (gallium) is brought into contact with the substrate to form an n-type semiconductor, GaAsP, on the surface of the substrate.
(Gallium-Arsenic-Phosphorus) single crystal is grown, and then a windowed film of 51sNa (silicon nitride) is deposited on the surface of the faGaA8F single crystal, and Zn (
Zn) gas is exposed to diffuse Zn into a part of the GaA8F single crystal layer, which is an n-type semiconductor, to form a P-type semiconductor.
It is formed by forming an n-junction.
また前記発光ダイオード（ＩＩＪＤ ） ２は絶縁基板
１上に直線状に配列されて取着されておシ、Ｂ４サイズ
の電子写真式プリンタに使用される光プリンタヘッドの
場合には２０４８個（１ｍ１１１当シ８個）の発光ダイ
オード２が直線状に配列される。The light emitting diodes (IIJD) 2 are linearly arranged and attached on the insulating substrate 1, and in the case of an optical printer head used for a B4 size electrophotographic printer, there are 2048 light emitting diodes (IIJD) (1 m 111). 8) light emitting diodes 2 are arranged in a straight line.
尚、この場合、発光ダイオード２はその６４個が１単位
として１つの発光ダイオードアレイ２ａを構成し、該発
光ダイオードアレイ２ａを３２個、直線状に配列するこ
とによって２０４８個の発光ダイオード２が絶縁基板１
上に直線状に配列取着される。In this case, 64 light emitting diodes 2 constitute one light emitting diode array 2a, and by arranging 32 light emitting diode arrays 2a in a straight line, 2048 light emitting diodes 2 are insulated. Board 1
are attached in a linear array on the top.
前記絶縁基板１上の直線状に配列された発光ダイオード
２の両側には該発光ダイオード２の配列に対し平行とな
るように駆動用ＩＣ素子３が搭載されており、駆動用Ｉ
Ｃ素子３の各出力電極３ａは該ＩＣ素子３の一側辺で、
かつ発光ダイオード２の配列と平行となるように形成さ
れている。これによシ各発光ダイオード２と駆動用ＩＣ
素子３の各出力型［３ａとの距離は実質的にすべて同一
となすことが可能となる。Drive IC elements 3 are mounted on both sides of the light emitting diodes 2 arranged linearly on the insulating substrate 1 so as to be parallel to the arrangement of the light emitting diodes 2.
Each output electrode 3a of the C element 3 is on one side of the IC element 3,
Moreover, it is formed so as to be parallel to the arrangement of the light emitting diodes 2. With this, each light emitting diode 2 and driving IC
The distances from each output type [3a of the element 3] can be made substantially the same.
尚、前記駆動用ＩＣ素子３は発光ダイオード２の両側に
分けて搭載したが、上下いずれかの片側にのみ搭載して
もよい。Although the driving IC element 3 is mounted separately on both sides of the light emitting diode 2, it may be mounted only on either the upper or lower side.
前記駆動用ＩＣ素子３は従来周知の半導体技術により作
製され、発光ダイオード２に印加される電力を制御して
発光ダイオード２を選択的に発光させる作用を為すう
また前記駆動用ＩＣ素子３の各出力電極３ａは各発光ダ
イオード２にアルミニウム（ＡＩ）、金 （Ａｕ）等の
細線（ボンデインワイヤ）５を介しワイヤボンディング
されてお）、これによって各発光ダイオード２と駆動用
ＩＣ素子３とはボンディングワイヤ５を介し電気的に接
続されることとなる。The driving IC element 3 is manufactured by a conventionally well-known semiconductor technology, and has the function of controlling the power applied to the light emitting diode 2 to selectively cause the light emitting diode 2 to emit light. The output electrode 3a is wire-bonded to each light-emitting diode 2 via a thin wire (bond-in wire) 5 made of aluminum (AI), gold (Au), etc.), so that each light-emitting diode 2 and the driving IC element 3 are connected to each other. They will be electrically connected via bonding wires 5.
尚、この場合、各発光ダイオード２と駆動用ＩＣ素子３
の各出力型Ｗｉ３ａとの距離がすべて実質的に同一であ
ることから各発光ダイオード２と駆動用ＩＣ素子３の各
出力電極３ａとを電気的に接続するボンディングワイヤ
５の長さも実質的に同一となシ、その電気抵抗値を均等
となすことができる。In this case, each light emitting diode 2 and driving IC element 3
Since the distances to each output type Wi 3a are all substantially the same, the lengths of the bonding wires 5 that electrically connect each light emitting diode 2 and each output electrode 3a of the driving IC element 3 are also substantially the same. In other words, the electrical resistance values can be made equal.
（発明の効果）
かくして本発明の光プリンタヘッドによれば発光ダイオ
ードを選択発光させる駆動用ＩＣ素子のすべての出力電
極を発光ダイオードと実質的に同一距離となすとともに
該駆動用ＩＣ素子の出力電極と発光ダイオードとを直接
ワイヤボンディングしたことにより駆動用ＩＣ素子と発
光ダイオードとを電気的に接続するための絶縁基板上に
形成される配線導体が不用となり、光プリンタヘッドを
極めて小型、かつ安価となすことができる。また駆動用
ＩＣ素子と発光ダイオードとを電気的に接続するボンデ
ィングワイヤの電気抵抗値を実質的に同一となすことが
でき、これによって各発光ダイオードに印加される電力
の大きさは均等となり、各発光ダイオードが発する光の
発光輝度及び発光波長も均等となって極めて高品質の印
字、印画を出力させることが可能となる。(Effects of the Invention) Thus, according to the optical printer head of the present invention, all the output electrodes of the driving IC element that causes the light emitting diode to selectively emit light are substantially the same distance from the light emitting diode, and the output electrodes of the driving IC element Direct wire bonding between the drive IC element and the light emitting diode eliminates the need for a wiring conductor formed on an insulating substrate to electrically connect the driving IC element and the light emitting diode, making the optical printer head extremely compact and inexpensive. It can be done. In addition, the electrical resistance value of the bonding wire that electrically connects the driving IC element and the light emitting diode can be made substantially the same, so that the magnitude of the electric power applied to each light emitting diode is equalized, and each The luminance and wavelength of the light emitted by the light emitting diodes are also made uniform, making it possible to output extremely high quality prints.
第１図は本発明の光プリンタヘッドの要部拡大平面図、
第２図は従来の光プリンタヘッドの要部拡大平面図、第
３図は本出願人が先に提案した光プリンタヘッドの要部
拡大平面図である。
１ 、１１−・・絶縁基板
２．１２−・・発光ダイオード
３．１３・・・駆動用ＩＣ素子FIG. 1 is an enlarged plan view of the main parts of the optical printer head of the present invention;
FIG. 2 is an enlarged plan view of a main part of a conventional optical printer head, and FIG. 3 is an enlarged plan view of a main part of an optical printer head previously proposed by the present applicant. 1, 11-...Insulating substrate 2.12-...Light emitting diode 3.13...Drive IC element
Claims (1)
着するとともに該発光ダイオードを選択的に発光させる
駆動用ＩＣ素子を搭載して成る光プリンタヘッドにおい
て、前記駆動用ＩＣ素子のすべての出力電極を発光ダイ
オードと実質的に同一距離となすとともに該駆動用ＩＣ
素子のすべての出力電極を発光ダイオードに直接ワイヤ
ボンディングしたことを特徴とする光プリンタヘッド。In an optical printer head comprising a plurality of light emitting diodes linearly arranged and mounted on an insulating substrate and a driving IC element for selectively emitting light from the light emitting diodes, all outputs of the driving IC element are mounted. The electrode is placed at substantially the same distance as the light emitting diode, and the driving IC
An optical printer head characterized in that all output electrodes of the element are wire-bonded directly to the light emitting diode.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP60052898A JPS61211063A (en) | 1985-03-15 | 1985-03-15 | Optical printing head |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP60052898A JPS61211063A (en) | 1985-03-15 | 1985-03-15 | Optical printing head |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS61211063A true JPS61211063A (en) | 1986-09-19 |
Family
ID=12927673
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP60052898A Pending JPS61211063A (en) | 1985-03-15 | 1985-03-15 | Optical printing head |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS61211063A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH02175270A (en) * | 1988-12-28 | 1990-07-06 | Oki Electric Ind Co Ltd | Light emitting diode printing head |
| JPH02277274A (en) * | 1989-04-18 | 1990-11-13 | Sharp Corp | Led indicator |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5774166A (en) * | 1980-10-29 | 1982-05-10 | Oki Electric Ind Co Ltd | Array head of light emitting diode |
| JPS58142872A (en) * | 1982-02-19 | 1983-08-25 | アグフア・ゲヴエルト・ナ−ムロゼ・ベンノ−トチヤツプ | Recorder |
-
1985
- 1985-03-15 JP JP60052898A patent/JPS61211063A/en active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5774166A (en) * | 1980-10-29 | 1982-05-10 | Oki Electric Ind Co Ltd | Array head of light emitting diode |
| JPS58142872A (en) * | 1982-02-19 | 1983-08-25 | アグフア・ゲヴエルト・ナ−ムロゼ・ベンノ−トチヤツプ | Recorder |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH02175270A (en) * | 1988-12-28 | 1990-07-06 | Oki Electric Ind Co Ltd | Light emitting diode printing head |
| JPH02277274A (en) * | 1989-04-18 | 1990-11-13 | Sharp Corp | Led indicator |
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