JPS62217678A - Manufacture of optical printer head - Google Patents
Manufacture of optical printer headInfo
- Publication number
- JPS62217678A JPS62217678A JP61061635A JP6163586A JPS62217678A JP S62217678 A JPS62217678 A JP S62217678A JP 61061635 A JP61061635 A JP 61061635A JP 6163586 A JP6163586 A JP 6163586A JP S62217678 A JPS62217678 A JP S62217678A
- Authority
- JP
- Japan
- Prior art keywords
- light emitting
- light
- emitting diodes
- leds
- common electrodes
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 230000003287 optical effect Effects 0.000 title claims description 14
- 238000004519 manufacturing process Methods 0.000 title claims description 7
- 239000000758 substrate Substances 0.000 claims abstract description 17
- 238000000034 method Methods 0.000 claims abstract description 11
- 238000007639 printing Methods 0.000 abstract description 4
- 239000006185 dispersion Substances 0.000 abstract 2
- 239000010408 film Substances 0.000 description 6
- 239000010931 gold Substances 0.000 description 5
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 3
- 239000013078 crystal Substances 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 3
- 239000004065 semiconductor Substances 0.000 description 3
- 239000011701 zinc Substances 0.000 description 3
- XYFCBTPGUUZFHI-UHFFFAOYSA-N Phosphine Chemical compound P XYFCBTPGUUZFHI-UHFFFAOYSA-N 0.000 description 2
- 229910052581 Si3N4 Inorganic materials 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 239000000919 ceramic Substances 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 239000012777 electrically insulating material Substances 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 2
- 229910052737 gold Inorganic materials 0.000 description 2
- 239000003960 organic solvent Substances 0.000 description 2
- 229910052698 phosphorus Inorganic materials 0.000 description 2
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 2
- JBRZTFJDHDCESZ-UHFFFAOYSA-N AsGa Chemical compound [As]#[Ga] JBRZTFJDHDCESZ-UHFFFAOYSA-N 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- GYHNNYVSQQEPJS-UHFFFAOYSA-N Gallium Chemical compound [Ga] GYHNNYVSQQEPJS-UHFFFAOYSA-N 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 1
- 238000003491 array Methods 0.000 description 1
- RBFQJDQYXXHULB-UHFFFAOYSA-N arsane Chemical compound [AsH3] RBFQJDQYXXHULB-UHFFFAOYSA-N 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 229910052733 gallium Inorganic materials 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 230000010365 information processing Effects 0.000 description 1
- 238000004020 luminiscence type Methods 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 239000011574 phosphorus Substances 0.000 description 1
- 229910000073 phosphorus hydride Inorganic materials 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
- 238000007740 vapor deposition Methods 0.000 description 1
- 229910052725 zinc Inorganic materials 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/42—Wire connectors; Manufacturing methods related thereto
- H01L24/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
- H01L24/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
- H01L2224/491—Disposition
- H01L2224/4912—Layout
- H01L2224/49175—Parallel arrangements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/12—Passive devices, e.g. 2 terminal devices
- H01L2924/1204—Optical Diode
- H01L2924/12041—LED
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Led Devices (AREA)
- Dot-Matrix Printers And Others (AREA)
- Printers Or Recording Devices Using Electromagnetic And Radiation Means (AREA)
- Exposure Or Original Feeding In Electrophotography (AREA)
- Led Device Packages (AREA)
Abstract
Description
【発明の詳細な説明】
（産業上の利用分野）
本発明は電子写真式プリンタなどの記録装置の光源とし
て使用される光プリンタヘッドの改良に関するものであ
る。DETAILED DESCRIPTION OF THE INVENTION (Field of Industrial Application) The present invention relates to an improvement in an optical printer head used as a light source in a recording device such as an electrophotographic printer.
（従来の技術）
近時、情報処理技術ならびに通信技術の進展に伴い普通
紙に任意の漢字や図形を高速度、高品質で大量に出力す
ることができる小型で、かつ安価な電子写真式プリンタ
が要求されている。そのためこの要求に対処するために
プリンタの光源として絶縁基板上に複数個の発光ダイオ
ード（ＬＥＤ）を直線状に配列取着して成る光プリンタ
ヘッドを使用した電子写真式プリンタが小型、高解像度
のものとして提案されている。(Prior art) With the recent advances in information processing technology and communication technology, small and inexpensive electrophotographic printers that can output large quantities of arbitrary kanji and figures on plain paper at high speed and with high quality have become popular. is required. To meet this demand, an electrophotographic printer using an optical printer head consisting of a plurality of light emitting diodes (LEDs) mounted in a linear array on an insulating substrate as a light source for the printer is a small, high-resolution printer. It is proposed as such.
この従来の電子写真式プリンタに使用されている光プリ
ンタヘッドは通常、第３図及び第４図に示すようにセラ
ミック、ガラス等の電気絶縁材料から成る基板１１上に
アルミニウム（ＡＩ）、金（Ａｕ）等の金属から成る共
通電極１２及び個別駆動電極１３を被着形成するととも
に該共通電極１２上にガリウム−砒素−リン（ＧａＡｓ
Ｐ）等から成る発光ダイオード（ＬＥＤ） １４を多数
個、直線状に配列取着した構造を有しており、絶縁基板
１１上に搭載された駆動用ＩＣ素子１５の駆動により直
線状に配列した発光ダイオード１４の個々に印加される
電力を制御し、発光ダイオード１４を選択的に発光させ
ることによって電子写真式プリンタの光源として機能す
る。As shown in FIGS. 3 and 4, the optical printer head used in this conventional electrophotographic printer is usually mounted on a substrate 11 made of an electrically insulating material such as ceramic or glass. A common electrode 12 and individual drive electrodes 13 made of metal such as Au) are deposited and formed, and gallium-arsenic-phosphorus (GaAs) is deposited on the common electrode 12.
It has a structure in which a large number of light emitting diodes (LEDs) 14 consisting of P) etc. are arranged and attached in a linear manner, and are arranged in a linear manner by driving a driving IC element 15 mounted on an insulating substrate 11. It functions as a light source for an electrophotographic printer by controlling the power applied to each of the light emitting diodes 14 and selectively causing the light emitting diodes 14 to emit light.
尚、前記複数個の発光ダイオード１４は通常、６４個が
１単位として１つの発光ダイオードアレイ１４ａを構成
し、Ｂ４サイズの電子写真式プリンタの光源として使用
される場合には前記発光ダイオードアレイ１４ａは３２
個が直線状に配列される。Note that the plurality of light emitting diodes 14 usually constitute one light emitting diode array 14a with 64 pieces as one unit, and when used as a light source of a B4 size electrophotographic printer, the light emitting diode array 14a is 32
The pieces are arranged in a straight line.
（発明が解決しようとする問題点）
しかし乍ら、この従来の光プリンタヘッドは発光ダイオ
ード１４が取着される共通電極１２が蒸着やスパッタリ
ング等の薄膜手法によって絶縁基板ｌｌ上に被着形成さ
れており、この厚みが２．０μｍと極めて薄く、熱伝導
が悪いことから発光ダイオード１４に電力を印加し、発
光させた際、発光ダイオード１４が発する熱は共通電極
１２に吸収されることなく発光ダイオード１４内部に蓄
積してしまい、その結果、発光ダイオード１４が高温と
なって発光波長、発光輝度にバラツキを生じ、高品質の
印字、印画ができないという欠点を有していた。(Problems to be Solved by the Invention) However, in this conventional optical printer head, the common electrode 12 to which the light emitting diode 14 is attached is formed on the insulating substrate 11 by a thin film method such as vapor deposition or sputtering. This thickness is extremely thin at 2.0 μm, and heat conduction is poor, so when power is applied to the light emitting diode 14 and it emits light, the heat generated by the light emitting diode 14 is not absorbed by the common electrode 12 and the light is emitted. The light emitting diode 14 accumulates inside the diode 14, and as a result, the light emitting diode 14 becomes hot, causing variations in the emission wavelength and luminance, which has the disadvantage that high-quality printing cannot be performed.
また共通電極１２はその電気抵抗が厚みが薄いことに起
因して極めて高く、そのためすべての発光ダイオード１
４を同時に発光させた際、共通電極１２に大きな電流が
流れると前記共通電極１２が有する電気抵抗によって大
きな電圧降下を発生してしまい、その結果、発光ダイオ
ードに所定電力を印加することができなくなって発光ダ
イオードの発光輝度や発光波長にバラツキを生じ、高品
質の印字、印画ができないという欠点も有していた。Further, the electric resistance of the common electrode 12 is extremely high due to its thin thickness, so that all the light emitting diodes 1
4 simultaneously emit light, if a large current flows through the common electrode 12, a large voltage drop will occur due to the electrical resistance of the common electrode 12, and as a result, it becomes impossible to apply a predetermined power to the light emitting diodes. This also has the disadvantage that the luminance and wavelength of light emitted by the light emitting diodes vary, making it impossible to print with high quality.
（発明の目的）
本発明は上述の諸欠点に鑑み案出されたもので、その目
的は共通電極の電気抵抗を小とするとともに発光ダイオ
ードが発する熱を良好に吸収し、発光ダイオードに発生
する発光輝度や発光波長のバラツキを有効に防止して高
品質の印字、印画を得ることができる光プリンタヘッド
の製法を提供することにある。(Object of the Invention) The present invention was devised in view of the above-mentioned drawbacks, and its purpose is to reduce the electrical resistance of the common electrode and to absorb heat generated by the light-emitting diode well, thereby reducing the heat generated in the light-emitting diode. An object of the present invention is to provide a method for manufacturing an optical printer head that can effectively prevent variations in luminance and wavelength of luminescence and obtain high-quality prints.
（問題点を解決するための手段）
本発明は絶縁基板上に被着された共通電極上に複数個の
発光ダイオードを直線状に配列取着した光プリンタヘッ
ドの製法において、前記共１ｉ１１電極を厚膜手法によ
り形成することを特徴とするものである。(Means for Solving the Problems) The present invention provides a method for manufacturing an optical printer head in which a plurality of light emitting diodes are arranged and attached in a linear manner on a common electrode deposited on an insulating substrate. It is characterized by being formed by a thick film method.
（実施例） 次に、本発明を添付図面に基づき詳細に説明する。(Example) Next, the present invention will be explained in detail based on the accompanying drawings.
第１図及び第２図は本発明の光プリンタヘッドの一実施
例を示し、１はセラミック、ガラス等の電気絶縁材料か
ら成る基板であり、その表面に共通電極２が被°着形成
されている。1 and 2 show an embodiment of the optical printer head of the present invention, in which 1 is a substrate made of an electrically insulating material such as ceramic or glass, and a common electrode 2 is formed on the surface of the substrate. There is.
前記共通電極２はその上部に発光ダイオード３が接合さ
れ、発光ダイオード３に電力を印加し発光させるための
一方の電極として作用する。The common electrode 2 has a light emitting diode 3 connected thereto, and acts as one electrode for applying power to the light emitting diode 3 to cause it to emit light.
前記共通電極２上に接合される発光ダイオード３はＧａ
ＡｓＰ系、ＧａＰ系等の発光ダイオードが使用され、例
えばＧａＡｓＰ系の発光ダイオードの場合には、まずＧ
ａＡｓの基板を炉中にて高温に加熱するとともにＡＳＩ
Ｉ：ｌ （アルシン）とｐＨ，（ホスヒン）とＧａ（ガ
リウム）を適量に含むガスを接触させて基板表面にｎ型
半導体のＧａＡｓＰ （ガリウム−砒素−リン）の単結
晶を成長させ、次にＧａＡｓＰ単結晶表面に５ｉ３Ｎｏ
（窒化シリコン）の窓付膜を被着させるとともに該窓部
にＺｎ（亜鉛）のガスをさらし、ｎ型半導体のＧａＡｓ
Ｐ単結晶層の一部にＺｎを拡散させてｎ型半導体を形成
し、ｐｎ接合をもたすことによって形成される。The light emitting diode 3 bonded on the common electrode 2 is made of Ga.
AsP-based, GaP-based, etc. light-emitting diodes are used. For example, in the case of a GaAsP-based light-emitting diode, first the G
AAs substrate is heated to high temperature in a furnace and ASI
A single crystal of GaAsP (gallium-arsenic-phosphide), an n-type semiconductor, is grown on the substrate surface by contacting I:l (arsine) with pH, a gas containing appropriate amounts of (phosphine) and Ga (gallium), and then 5i3No on the GaAsP single crystal surface
A film with a window of silicon nitride (silicon nitride) is deposited, and the window is exposed to Zn (zinc) gas.
It is formed by diffusing Zn into a part of the P single crystal layer to form an n-type semiconductor and create a pn junction.
また前記発光ダイオード（ＬＥＤ）３は絶縁基板１上の
共通電極２に直線状に配列されて取着接合されており、
Ｂ４サイズの電子写真式プリンタに使用される光プリン
タヘッドの場合には２０４８個（１ｍｍ当たり８個）の
発光ダイオード４が直線状に配列される。Further, the light emitting diodes (LEDs) 3 are linearly arranged and attached to the common electrode 2 on the insulating substrate 1,
In the case of an optical printer head used in a B4 size electrophotographic printer, 2048 (8 per 1 mm) light emitting diodes 4 are arranged in a straight line.
尚、この場合、発光ダイオード３はその６４個が１単位
として１つの発光ダイオードアレイ３ａを構成し、該発
光ダイオードアレイ３ａを３２個、直線状に配列するこ
とによって２０４８個の発光ダイオード３が共通電極２
上に直線状に配列取着される。In this case, 64 light emitting diodes 3 constitute one light emitting diode array 3a, and by arranging 32 light emitting diode arrays 3a in a straight line, 2048 light emitting diodes 3 are common. Electrode 2
are attached in a linear array on the top.
前記絶縁基板１上の共通電極２に直線状に配列接合され
た発光ダイオード３の両側には該発光ダイオード３の配
列に対し平行となるように駆動用ＩＣ素子４が搭載され
ており、駆動用ＩＣ素子４の各出力電極４ａは該ＩＣ素
子４の一側辺で、且つ発光ダイオード３の配列と平行と
なるように形成されている°。これにより各発光ダイオ
ード３と駆動用ＩＣ素子４の各出力電極４ａとの距離は
実質的にすべて同一となすことができる。Driving IC elements 4 are mounted on both sides of the light emitting diodes 3 linearly arranged and bonded to the common electrode 2 on the insulating substrate 1 so as to be parallel to the arrangement of the light emitting diodes 3. Each output electrode 4a of the IC element 4 is formed on one side of the IC element 4 and parallel to the arrangement of the light emitting diodes 3. Thereby, the distances between each light emitting diode 3 and each output electrode 4a of the driving IC element 4 can be made substantially the same.
尚、前記駆動用ＩＣ素子４は発光ダイオード３の両側に
分けて搭載したが、上下いずれか片側にのみ搭載しても
よい。Although the driving IC element 4 is mounted separately on both sides of the light emitting diode 3, it may be mounted only on either the upper or lower side.
前記駆動用ＩＣ素子４は従来周知の半導体技術により作
製され、発光ダイオード３に印加される電力を制御して
、発光ダイオード３を選択的に発光させる作用を為す。The driving IC element 4 is manufactured using a conventionally well-known semiconductor technology, and has the function of controlling the power applied to the light emitting diode 3 to cause the light emitting diode 3 to selectively emit light.
また前記駆動用ＩＣ素子４の各出力電極４ａは各発光ダ
イオード３にアルミニウム（ＡＩ）、金（Ａｕ）等の細
線（ボンディングワイヤ）５を介しワイヤボンディング
されており、これによって各発光ダイオード３と駆動用
ＩＣ素子４とはボンディングワイヤ５を介し電気的に接
続されることとなる。Further, each output electrode 4a of the driving IC element 4 is wire-bonded to each light-emitting diode 3 via a thin wire (bonding wire) 5 made of aluminum (AI), gold (Au), etc. It will be electrically connected to the driving IC element 4 via a bonding wire 5.
尚、この場合、各発光ダイオード３と駆動用ＩＣ素子４
の各出力電極４ａとの距離がすべて実質的に同一である
ことから各発光ダイオード３と駆動用ＩＣ素子４の各出
力電極４ａとを電気的に接続するボンディングワイヤ５
の長さも実質的に同一となり、その電気抵抗値を均等と
なすことができる。In this case, each light emitting diode 3 and the driving IC element 4
The bonding wires 5 electrically connect each light emitting diode 3 and each output electrode 4a of the driving IC element 4 because the distances to each output electrode 4a of the driving IC element 4 are all substantially the same.
The lengths of the two are also substantially the same, and the electrical resistance values thereof can be made equal.
かくして、駆動用ＩＣ素子４の駆動により、共通電極２
及び駆動用ＩＣ素子４の出力電極４ａを介し発光ダイオ
ード３の個々に印加される電力を制御し、発光ダイオー
ド３を均一波長、均一輝度で選択的に発光させることに
よって電子写真式プリンタの光源として機能する。Thus, by driving the driving IC element 4, the common electrode 2
The power applied to each light emitting diode 3 is controlled through the output electrode 4a of the driving IC element 4, and the light emitting diode 3 is selectively emitted with uniform wavelength and uniform brightness, so that it can be used as a light source for an electrophotographic printer. Function.
本発明の光プリンタヘッドの製法においては、発光ダイ
オード３に取着接合される共通電極２を厚膜手法によっ
て形成することが重要である。In the method for manufacturing the optical printer head of the present invention, it is important to form the common electrode 2, which is attached and bonded to the light emitting diode 3, by a thick film technique.
このように共通電極２を厚膜手法により形成するとその
膜厚を１０乃至３０μｍとして、共通電極２の電気抵抗
を小となすことができ、同時に発光ダイオード３が発す
る熱を良好に吸収させることができる。そのためこれに
よりすべての発光ダイオード３を同時に発光させ、共通
電極２に大電流がながれたとしても共通電極２はその電
気抵抗が小さいことから大きな電圧降下を発生すること
はなく、発光ダイオード３に発光に必要な所定電力を印
加させることが可能となる。また発光ダイオード３が熱
を発したとしても核熱を共通電極２に良好に吸収させる
ことができ、発光ダイオード３自身を高温となして発光
輝度、発光波長にバラツキが発生するのを有効に防止す
ることができる。When the common electrode 2 is formed by a thick film method in this way, the film thickness can be set to 10 to 30 μm, and the electrical resistance of the common electrode 2 can be made small, and at the same time, the heat generated by the light emitting diode 3 can be absorbed well. can. Therefore, this causes all the light emitting diodes 3 to emit light at the same time, and even if a large current flows through the common electrode 2, a large voltage drop will not occur because the common electrode 2 has a small electrical resistance, and the light emitting diodes 3 will emit light. It becomes possible to apply the necessary predetermined power to the Furthermore, even if the light-emitting diode 3 generates heat, the nuclear heat can be well absorbed by the common electrode 2, effectively preventing the light-emitting diode 3 from heating itself to a high temperature and causing variations in luminance and wavelength. can do.
前記共通電極２は金（Ａｕ）、銀（Ａｇ）、ニッケル（
Ｎｉ）もしくは銅（Ｃｕ）の粉末に適当な有機溶剤、有
機溶媒を添加混合しペースト状となしたものをスクリー
ン印刷法により絶縁基板１上に塗布し、しかる後これを
焼成することによって絶縁基板ｌ上に被着形成される。The common electrode 2 is made of gold (Au), silver (Ag), nickel (
An insulating substrate is produced by adding and mixing a suitable organic solvent or organic solvent to powder of Ni) or copper (Cu) to form a paste, which is applied onto the insulating substrate 1 by screen printing, and then fired. It is deposited on l.
（発明の効果）
かくして本発明の光プリンタヘッドの製法によれば、絶
縁基板上の発光ダイオードが取着接合される共通電極を
厚膜手法により形成したことから共通電極の電気抵抗を
小さなものとなすことができ、共通電極にすべての発光
ダイオードが発光する際、大電流が流れたとしても大き
な電圧降下を発生することはなく発光ダイオードに所定
電力の印加を可能として発光ダイオードを発光輝度等に
バラツキを生じることなく正常に発光させることができ
る。(Effects of the Invention) Thus, according to the method for manufacturing an optical printer head of the present invention, the common electrode to which the light emitting diode on the insulating substrate is attached and bonded is formed by a thick film method, so that the electrical resistance of the common electrode can be made small. When all the light emitting diodes emit light to a common electrode, even if a large current flows, a large voltage drop does not occur, and a predetermined power can be applied to the light emitting diodes, so that the light emitting brightness of the light emitting diodes can be adjusted. It is possible to emit light normally without causing variations.
また同時に発光ダイオードの発する熱は共通電極が良好
に吸収することから発光ダイオードは高温になことが皆
無であり、各発光ダイオードが発する光の発光波長、発
光輝度を常に均一として極めて高品質の印字、印画を出
力させることが可能となる。At the same time, the heat emitted by the light-emitting diodes is well absorbed by the common electrode, so the light-emitting diodes never reach high temperatures, and the wavelength and brightness of the light emitted by each light-emitting diode are always uniform, resulting in extremely high-quality printing. , it becomes possible to output a print.
第１図は本発明の光プリンタヘッドの要部拡大平面図、
第２図は第１図の縦断面図、第３図は従来の光プリンタ
ヘッドの要部拡大平面図、第４図は第３図の縦断面図で
ある。
１．１１・・・絶縁基板
２．１２・・・共通電極
３．１４・・・発光ダイオード
４、Ｉ５・・・駆動用ＸＣ素子FIG. 1 is an enlarged plan view of the main parts of the optical printer head of the present invention;
2 is a longitudinal cross-sectional view of FIG. 1, FIG. 3 is an enlarged plan view of a main part of a conventional optical printer head, and FIG. 4 is a longitudinal cross-sectional view of FIG. 3. 1.11... Insulating substrate 2.12... Common electrode 3.14... Light emitting diode 4, I5... XC element for drive
Claims (1)
オードを直線状に配列取着した光プリンタヘッドの製法
において、前記共通電極を膜厚手法により形成すること
を特徴とする光プリンタヘッドの製法。An optical printer head manufacturing method in which a plurality of light emitting diodes are linearly arranged and attached on a common electrode deposited on an insulating substrate, the common electrode being formed by a film thickness method. manufacturing method.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP61061635A JPS62217678A (en) | 1986-03-18 | 1986-03-18 | Manufacture of optical printer head |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP61061635A JPS62217678A (en) | 1986-03-18 | 1986-03-18 | Manufacture of optical printer head |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS62217678A true JPS62217678A (en) | 1987-09-25 |
Family
ID=13176852
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP61061635A Pending JPS62217678A (en) | 1986-03-18 | 1986-03-18 | Manufacture of optical printer head |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS62217678A (en) |
-
1986
- 1986-03-18 JP JP61061635A patent/JPS62217678A/en active Pending
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