JPS61206675A - Photoprinter head - Google Patents
Photoprinter headInfo
- Publication number
- JPS61206675A JPS61206675A JP60048683A JP4868385A JPS61206675A JP S61206675 A JPS61206675 A JP S61206675A JP 60048683 A JP60048683 A JP 60048683A JP 4868385 A JP4868385 A JP 4868385A JP S61206675 A JPS61206675 A JP S61206675A
- Authority
- JP
- Japan
- Prior art keywords
- light emitting
- conductors
- emitting diodes
- diodes
- emitting diode
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/435—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of radiation to a printing material or impression-transfer material
- B41J2/447—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of radiation to a printing material or impression-transfer material using arrays of radiation sources
- B41J2/45—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of radiation to a printing material or impression-transfer material using arrays of radiation sources using light-emitting diode [LED] or laser arrays
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/02—Bonding areas; Manufacturing methods related thereto
- H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
- H01L2224/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
- H01L2224/0554—External layer
- H01L2224/0555—Shape
- H01L2224/05552—Shape in top view
- H01L2224/05553—Shape in top view being rectangular
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
- H01L2224/491—Disposition
- H01L2224/4912—Layout
- H01L2224/49175—Parallel arrangements
Landscapes
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Health & Medical Sciences (AREA)
- General Health & Medical Sciences (AREA)
- Toxicology (AREA)
- Dot-Matrix Printers And Others (AREA)
- Printers Or Recording Devices Using Electromagnetic And Radiation Means (AREA)
- Led Device Packages (AREA)
- Led Devices (AREA)
Abstract
Description
【発明の詳細な説明】
（産業上の利用分野）
本発明は電子写真式プリンタなどの記録装置の光源とし
て使用される光プリンタヘッドの改良に関するものであ
る。DETAILED DESCRIPTION OF THE INVENTION (Field of Industrial Application) The present invention relates to an improvement in an optical printer head used as a light source in a recording device such as an electrophotographic printer.
（従来の技術）
近時、情報処理技術ならびに通信技術の進展に伴ない普
通紙に任意の漢字や図形を高速度、高品質で大量に出力
することができる小型で、かつ安価な電子写真式プリン
タが要求されている。そのためこの要求に対処するため
にプリンタの光源として絶縁基板上に複数個の発光ダイ
オード（丁、ＦＤ）を直線状に配列取着して成る光プリ
ンタヘッドを使用した電子写真式プリンタが小型、高解
像度のものとして提案されている。(Prior technology) Recently, with the advancement of information processing technology and communication technology, small and inexpensive electrophotographic type that can output large quantities of arbitrary kanji and figures on plain paper at high speed and high quality has become available. A printer is requested. To meet this demand, an electrophotographic printer using an optical printer head consisting of a plurality of light emitting diodes (FDs) mounted in a linear array on an insulating substrate as a light source for the printer has been developed. It is proposed as a resolution.
この従来の電子写真式プリンタに使用されている光プリ
ンタヘッドは通常、第２図及び第３図に示すようにセラ
ミック、ガラス等の電気絶縁材料から成る基板１１上に
ガリウム−砒素−リン（ＧａＡｓＰ ）等から成る発光
ダイオード（ＬＥＤ ） １２を多数個、直線状に配列
取着するとともに該発光ダイオード１２を駆動する駆動
用ＩＣ素子１３を搭載した構造を有しており、駆動用Ｉ
Ｃ素子１３の駆動によシ直線状に配列した発光ダイオー
ド１２の個々に印加される電力を制御し、発光ダイオー
ド１２を選択的に発光させることによって電子写真式プ
リンタの光源として機能する。As shown in FIGS. 2 and 3, the optical printer head used in this conventional electrophotographic printer is usually mounted on a substrate 11 made of an electrically insulating material such as ceramic or glass. It has a structure in which a large number of light emitting diodes (LEDs) 12 such as
By controlling the power applied to each of the linearly arranged light emitting diodes 12 by driving the C element 13 and selectively causing the light emitting diodes 12 to emit light, it functions as a light source for an electrophotographic printer.
尚、前記複数個の発光ダイオード１２は通常、６４個が
１単位として１つの発光ダイオードアレイ１２ａを構成
し、Ｂ４サイズの電子写真式プリンタの光諒として使用
される場合には前記発光ダイオードアレイ１２ａは３２
個が直線状に配列される。Incidentally, the plurality of light emitting diodes 12 are usually 64 as one unit and constitute one light emitting diode array 12a, and when used as a light source for a B4 size electrophotographic printer, the light emitting diode array 12a is 32
The pieces are arranged in a straight line.
（発明が解決しようとする問題点）
しかし乍ら、この従来の光プリンタヘッドは発光ダイオ
ード（ＬＥＤ ） １２の個々に電力を印加し、各発光
ダイオード１２を選択的に発光させる駆動用ＩＣ素子１
３の各出力電極１３ａが該駆動用ＩＣ素子１３の両端に
分かれて形成されており、かつ発光ダイオード１２の配
列方向に対し垂直方向に配列されていることから駆動用
ＩＣ素子１３の各出力″ｄ１Ｍｘ３ａは発光ダイオード
１２との距離がそれぞれ異なり、駆動用ＩＣ素子１３の
各出力電極１３ａと各発光ダイオード１２とを電気的に
接続するだめの配線導体１４の長さも異なるものであっ
た。そのためこの従来の光プリンタヘッドを使用して漢
字や図形を出力した場合、各配線導体１４はその電気抵
抗値が長さの相違によって異なることから該配線導体１
４を介し駆動用Ｉ Ｃ素子１３がら各発光ダイオード１
２に印加される電力の大きさもばらつきを有し、その結
果、各発光ダイオード１２の発光輝度や発光波長にむら
を生じて高品質の印字、印画ができないという欠点を有
していた。(Problems to be Solved by the Invention) However, this conventional optical printer head has a driving IC element 1 that applies power to each of the light emitting diodes (LEDs) 12 and causes each light emitting diode 12 to selectively emit light.
The output electrodes 13a of the drive IC element 13 are formed separately at both ends of the drive IC element 13, and are arranged in a direction perpendicular to the arrangement direction of the light emitting diodes 12. Therefore, each output electrode 13a of the drive IC element 13 is The distances between the d1Mx3a and the light emitting diodes 12 were different, and the lengths of the wiring conductors 14 for electrically connecting each output electrode 13a of the driving IC element 13 and each light emitting diode 12 were also different. When a conventional optical printer head is used to output kanji or figures, each wiring conductor 14 has a different electrical resistance value depending on its length.
4 through each light emitting diode 1 from the driving IC element 13.
The magnitude of the power applied to the light emitting diodes 12 also varies, and as a result, the luminance and wavelength of light emitted from each light emitting diode 12 vary, making it impossible to perform high-quality printing.
（発明の目的）
本発明は上記欠点に鑑み案出されたもので発光ダイオー
ドと駆動用ＩＣ素子とを電気的に接続する配線導体のす
べての電気抵抗値を実質的に同一となし、各発光ダイオ
ードに印加される電力の大きさを均等となすことによっ
て発光ダイオードに発生する発光輝度や発光波長のむら
を解消し、高品質の印字、印画を得ることができる光プ
リンタヘッドを提供することにある。(Object of the Invention) The present invention was devised in view of the above-mentioned drawbacks, and all the electrical resistance values of the wiring conductors that electrically connect the light emitting diode and the driving IC element are made to be substantially the same, so that each light emitting An object of the present invention is to provide an optical printer head that can eliminate unevenness in luminance and wavelength of light emitted from light emitting diodes by equalizing the magnitude of electric power applied to the diodes, and can obtain high-quality prints and prints. .
（問題点を解決するだめの手段）
本発明は電気絶縁性基板の一主面上で直線状に配列した
複数個の発光ダイオードと、該発光ダイオードに一端が
接続される発光ダイオードと同数の配線導体と、前記配
線導体の他端に接続される駆動用ＩＣ素子を取着搭載し
て成る光プリンタヘッドにおいて、前記配線導体のそれ
ぞれの比抵抗を該配線導体の電気抵抗値がすべて実質的
に同一となるように異ならしめたことを特徴とするもの
である。(Means for solving the problem) The present invention includes a plurality of light emitting diodes arranged linearly on one principal surface of an electrically insulating substrate, and the same number of wiring lines as the number of light emitting diodes connected to the light emitting diodes at one end. In an optical printer head comprising a conductor and a driving IC element connected to the other end of the wiring conductor, the specific resistance of each of the wiring conductors is substantially equal to the electric resistance value of the wiring conductor. It is characterized by being made to be different so that they are the same.
（実施例）
次に、本発明を添付図面に示す実施例に基づき詳細に説
明する。(Example) Next, the present invention will be described in detail based on an example shown in the accompanying drawings.
第１図は本発明の光プリンタヘッドの一実施例を示し、
１はセラミック、ガラス等の電気絶縁材料から成る基板
であり、その−主面に発光ダイオード（ＬＦＪ） ）
２及び駆動用ＩＣ素子３がそれぞれ取着されている。FIG. 1 shows an embodiment of the optical printer head of the present invention,
1 is a substrate made of an electrically insulating material such as ceramic or glass, and a light emitting diode (LFJ) is mounted on its main surface.
2 and a driving IC element 3 are respectively attached.
前記発光ダイオード２はＧａＡｓＰ糸、ＧａＰ糸等の発
光ダイオードが使用され、例えばＧａＡ、ｓＰ糸の発光
ダイオードの場合には、先ずＧａＡＳの基板を炉中にて
高温に加熱するとともにＡｓ１３（アルシン）トＰＩ−
Ｔ３（ホスヒン）とＧａ （ガリウム）を適量に含むガ
スを接触させて基板表面にｎ型半導体の（）ａＡｓＪ？
（ガリウム−砒素−リン）の単結晶を成長させ、次に
前記ＧａＡｓＰ単結晶層表面にＳｉ３Ｎ＜ （窒化シリ
コン）の窓付膜を被着させるとともに該窓部にＺｎ （
亜鉛）のガスをさらし、 ｎ型半導体のＧａＡＳＰ単結
晶層の一部にＺｎを拡散させてＰ型半導体を形成し、ｐ
ｎ接合をもたすことによって形成される。As the light emitting diode 2, a light emitting diode made of GaAsP thread, GaP thread, etc. is used. For example, in the case of a light emitting diode made of GaA or sP thread, first, a GaAS substrate is heated to a high temperature in a furnace, and then As13 (arsine) is heated. PI-
An n-type semiconductor ()aAsJ? is formed on the substrate surface by contacting a gas containing appropriate amounts of T3 (phosphine) and Ga (gallium).
A single crystal of (gallium-arsenic-phosphorous) is grown, and then a windowed film of Si3N< (silicon nitride) is deposited on the surface of the GaAsP single crystal layer, and Zn (
Zinc) gas is exposed to diffuse Zn into a part of the n-type semiconductor GaASP single crystal layer to form a p-type semiconductor.
It is formed by providing an n-junction.
また前記発光ダイオード（ＬＥＤ ） ２は絶縁性基板
１上に直線状に配列されて取着されており、Ｂ４サイズ
の電子写真式プリンタに使用される光プリンタヘッドの
場合には２０４８個（ｌ ｍｍ当り ８個）の発光ダイ
オード２が直線状に配列される。The light emitting diodes (LEDs) 2 are linearly arranged and attached on the insulating substrate 1, and in the case of an optical printer head used for a B4 size electrophotographic printer, there are 2048 light emitting diodes (LEDs) (1 mm). A total of 8 light emitting diodes 2 are arranged in a straight line.
尚、この場合、発光ダイオード２は６４個が１単位とし
て１つの発光ダイオードアレイ２ａヲ構成し、該発光ダ
イオードアレイ２ａを３２個直線状に配列することによ
って２０４８個の発光ダイオード２が絶縁性基板１上に
直線状に配列取着される。In this case, 64 light emitting diodes 2 constitute one light emitting diode array 2a, and by arranging 32 light emitting diode arrays 2a in a straight line, 2048 light emitting diodes 2 are arranged on an insulating substrate. 1 in a linear arrangement.
前記絶縁性基板１上の直線状に配列された発光ダイオー
ド２の両側には駆動用丁Ｃ素子３が搭載されており、該
ＩＣ素子３の各出力電極３ａは後述する配線導体４を介
し各発光ダイオードのそれぞれに接続されている。Driving IC elements 3 are mounted on both sides of the light emitting diodes 2 arranged linearly on the insulating substrate 1, and each output electrode 3a of the IC element 3 is connected to each other via a wiring conductor 4, which will be described later. connected to each of the light emitting diodes.
前記駆動用ＩＣ素子３は従来周知の半導体技術により作
製され、各発光ダイオード２に印加される電力を制御し
て発光ダイオード２を選択的に発光させる作用を為す。The driving IC element 3 is manufactured by a conventionally well-known semiconductor technology, and has the function of controlling the power applied to each light emitting diode 2 to selectively cause the light emitting diode 2 to emit light.
尚、前記駆動用ｉＣ素子３は直線状に配列した発光ダイ
オード２の両側に分けて搭載したが上下いずれかの片側
にのみ搭載してもよい。Although the driving iC elements 3 are separately mounted on both sides of the linearly arranged light emitting diodes 2, they may be mounted only on either the upper or lower side.
また前記駆動用ＩＣ素子３と発光ダイオード２との間の
絶縁性基板１上には該駆動用ＩＣ素子３の各出力電極３
ａと各発光ダイオード２とを電気的に接続するだめの配
線導体４が被取着形成されている。この配線導体４は金
属材料から成り、従来周知のスクリーン印刷による厚膜
手法や蒸着、スパンタリング等による薄膜手法を採用す
ることにより絶縁性基板１上で駆動用ＩＣ素子３と発光
ダイオード２との間に被着形成される。Further, each output electrode 3 of the driving IC element 3 is disposed on the insulating substrate 1 between the driving IC element 3 and the light emitting diode 2.
A wiring conductor 4 for electrically connecting the light emitting diode 2 and the light emitting diode 2 is formed to be attached. The wiring conductor 4 is made of a metal material, and the driving IC element 3 and the light emitting diode 2 are formed on the insulating substrate 1 by employing a conventionally well-known thick film method using screen printing or a thin film method using vapor deposition, sputtering, etc. An adhesion is formed between the two.
前記配線導体４はその両端に発光ダイオード２及び駆動
用ＩＣ素子３の出力型４’Ｍ ３ａがそれぞれアルミニ
ウム（Ａｌ）、金（Ａｕ）等の細線（ボンディングワイ
ヤ）５を介し接続され、これによって各発光ダイオード
２と駆動用ＩＣ素子３とは配線導体４を介し電気的に接
続されることとなる。The wiring conductor 4 is connected to both ends of the light emitting diode 2 and the output type 4'M 3a of the driving IC element 3 via thin wires (bonding wires) 5 made of aluminum (Al), gold (Au), etc., and thereby Each light emitting diode 2 and the driving IC element 3 are electrically connected via a wiring conductor 4.
本発明においては各発光ダイオード２と駆動用ＩＣ素子
３の各出力電極３ａとを電気的に接続するためのそれぞ
れの配線導体の比抵抗を配線導体の長さに対応させて異
ならしめることが重要である。このため第１図に示す実
施例では配線長さが比較的長い配線導体４１，４２．４
３・・４ｎは例えば金（Ａｌｌ） 、銀（Ａ、ｇ） 、
銅（Ｃｏ ）もしくはこれらを主成分とする比抵抗が２
．５ Ｘ １０ Ω・ａｍ以下の金属で形成され、配
線長さが比較的短かい配線導体４ｎ１・・・４ｎｍ−＋
、４ｎｍは例えばアルミニウム（Ａ７） 、 ニッケ
ｔｖ（Ｎ５−）もしくはこれらを主成分とする比抵抗が
２．６ Ｘ １０ Ω・ｃｍ以」二の金属で形成され
ている。この各配線導体４１ 、４２−＝ ４Ｔ］ｍ−
１、４ｎｍを配線長さに対応して比抵抗の異なる金属で
形成することによりその電気抵抗値は実質的に同一とな
すことができ、各発光ダイオード２に印加される電力を
均等として発光ダイオード２０発光輝度及び発光波長を
すべて均等となすことができる。In the present invention, it is important to make the specific resistance of each wiring conductor for electrically connecting each light emitting diode 2 and each output electrode 3a of the driving IC element 3 to be different depending on the length of the wiring conductor. It is. Therefore, in the embodiment shown in FIG. 1, the wiring conductors 41, 42.
3...4n is, for example, gold (All), silver (A, g),
Copper (Co) or copper with a resistivity of 2 as the main component
．． Wiring conductor 4n1...4nm-+ made of metal with a resistance of 5 x 10 Ω・am or less and having a relatively short wiring length
, 4 nm is formed of, for example, aluminum (A7), nickel tv (N5-), or a metal containing these as main components and having a specific resistance of 2.6 x 10 Ω·cm or more. Each wiring conductor 41, 42-=4T]m-
By forming the wires with a thickness of 1 to 4 nm using metals with different resistivities depending on the length of the wiring, the electrical resistance value can be made substantially the same, and the electric power applied to each light emitting diode 2 can be equalized. 20. Emission brightness and emission wavelength can all be made equal.
（発明の効果）
かくして、本発明の光プリンタヘッドによれば各発光ダ
イオードと駆動用ＩＣ素子の各出力電極とを電気的に接
続するだめの配線導体の比抵抗を該配線導体の長さに対
応させて異ならしめたことから各配線導体のそれぞれは
その電気抵抗値がすべて実質的に同一となすことができ
、これによって配線導体を介し駆動用ＩＣ素子から発光
ダイオードに印加される電力の大きさは均等となシ、各
発光ダイオードが発する光の発光輝度及び発光波長を均
等として極めて高品質の印字、印画を出力させることが
可能となる。(Effects of the Invention) Thus, according to the optical printer head of the present invention, the specific resistance of the wiring conductor for electrically connecting each light emitting diode and each output electrode of the driving IC element can be adjusted to the length of the wiring conductor. Since the wiring conductors are made to correspond to each other and have different electrical resistance values, it is possible to make the electrical resistance values of each of the wiring conductors substantially the same, thereby reducing the amount of power applied from the driving IC element to the light emitting diode via the wiring conductor. By making the luminance and wavelength of the light emitted by each light emitting diode uniform, it is possible to output extremely high quality prints and prints.
第１図は本発明の光プリンタヘッドの要部拡大平面図、
第２図は従来の光プリンタヘッドの一部分を示す平面図
、第３図は第２図の縦断面図である。FIG. 1 is an enlarged plan view of the main parts of the optical printer head of the present invention;
FIG. 2 is a plan view showing a portion of a conventional optical printer head, and FIG. 3 is a longitudinal sectional view of FIG. 2.
Claims (1)
の発光ダイオードと、該発光ダイオードに一端が接続さ
れる発光ダイオードと同数の配線導体と、前記配線導体
の他端に接続される駆動用ＩＣ素子を取着搭載して成る
光プリンタヘッドにおいて、前記配線導体のそれぞれの
比抵抗を該配線導体の電気抵抗値がすべて実質的に同一
となるように異ならしめたことを特徴とする光プリンタ
ヘッド。A plurality of light emitting diodes arranged linearly on one main surface of an electrically insulating substrate, a number of wiring conductors having one end connected to the light emitting diodes and the same number as the number of light emitting diodes, and a number of wiring conductors connected to the other ends of the wiring conductors. An optical printer head equipped with a driving IC element, characterized in that the specific resistance of each of the wiring conductors is made to be different so that the electrical resistance values of the wiring conductors are all substantially the same. optical printer head.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP60048683A JPS61206675A (en) | 1985-03-11 | 1985-03-11 | Photoprinter head |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP60048683A JPS61206675A (en) | 1985-03-11 | 1985-03-11 | Photoprinter head |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS61206675A true JPS61206675A (en) | 1986-09-12 |
Family
ID=12810117
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP60048683A Pending JPS61206675A (en) | 1985-03-11 | 1985-03-11 | Photoprinter head |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS61206675A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS63216391A (en) * | 1987-03-04 | 1988-09-08 | Nec Corp | Led recording read |
-
1985
- 1985-03-11 JP JP60048683A patent/JPS61206675A/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS63216391A (en) * | 1987-03-04 | 1988-09-08 | Nec Corp | Led recording read |
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