JPS63216391A - Led recording read - Google Patents
Led recording readInfo
- Publication number
- JPS63216391A JPS63216391A JP62050622A JP5062287A JPS63216391A JP S63216391 A JPS63216391 A JP S63216391A JP 62050622 A JP62050622 A JP 62050622A JP 5062287 A JP5062287 A JP 5062287A JP S63216391 A JPS63216391 A JP S63216391A
- Authority
- JP
- Japan
- Prior art keywords
- led array
- array chip
- bonding wire
- led
- recording head
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000007639 printing Methods 0.000 claims abstract description 6
- 230000000630 rising effect Effects 0.000 claims description 4
- 230000000694 effects Effects 0.000 abstract description 3
- 230000002411 adverse Effects 0.000 abstract 1
- 238000000034 method Methods 0.000 description 3
- 238000010586 diagram Methods 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- 235000010582 Pisum sativum Nutrition 0.000 description 1
- 240000004713 Pisum sativum Species 0.000 description 1
- 235000002492 Rungia klossii Nutrition 0.000 description 1
- 244000117054 Rungia klossii Species 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/484—Connecting portions
- H01L2224/4847—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond
- H01L2224/48472—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond the other connecting portion not on the bonding area also being a wedge bond, i.e. wedge-to-wedge
Abstract
Description
【発明の詳細な説明】 〔産業上の利用分野〕 本発明はＬＥＤ記録ヘッドに関する。[Detailed description of the invention] [Industrial application field] The present invention relates to an LED recording head.
第２図は、この種のＬＥＤ記録ヘッドの従来例の概略構
造を示す側面図である。FIG. 2 is a side view showing a schematic structure of a conventional example of this type of LED recording head.
基板１１−に設置された複数個のＬＥＤアレイチップ２
は、ボンディングワイヤー３０によりノ、（板１１−の
配線パターン４に接続され、同様にＬＥＤアレイチ・ツ
ブ２を駆動するドライバＩＣ７は、ボンディングワイヤ
ー６．８によりそれぞれ配線パターン４、および外部接
続端子部９に接続されている。ボンディングワイヤー３
０は、ドライバＩＣ７からの電流をＬＥＤアレイチップ
２内の発光部５に供給するための接続線である０通電さ
れた発光部５から放出された光は、矢印の方向に収束レ
ンズ１０を経て、発光部５の面積の大きさに対応するド
ツトが感光面１１４二に投影される。このドツトは、電
子写αと同じプロセスにより紙−Ｌにプリントされる。A plurality of LED array chips 2 installed on the substrate 11-
is connected to the wiring pattern 4 of the board 11- by the bonding wire 30, and the driver IC 7 for driving the LED array tube 2 is connected to the wiring pattern 4 and the external connection terminal part by the bonding wire 6.8, respectively. 9. Bonding wire 3
0 is a connection line for supplying current from the driver IC 7 to the light emitting section 5 in the LED array chip 2.0 The light emitted from the energized light emitting section 5 passes through the converging lens 10 in the direction of the arrow. , a dot corresponding to the area size of the light emitting section 5 is projected onto the photosensitive surface 1142. These dots are printed on paper-L using the same process as the electronic copy α.
ドツトの密度はインチ当り２００ないし４００ ドー
ノト、−列に並んだドーノトの配列長はＡ４ないし３４
判の大きさに相当する良さである０例えば１インチ当り
４００ ド−／１・、Ｂ４判長の場合。Density of dots is 200 to 400 dots per inch. - Arrangement length of dots in rows is A4 to 34.
The quality corresponds to the size of the paper, for example 400 do/1/inch, for B4 size.
８３．５ｕピー、チで４０８６個のドツトが並ぶことに
なる。There will be 4086 dots lined up in 83.5u peas and chips.
第３図は、第２図の従来例の発光部５から出力された尤
の経路の状況を示す説明図である。FIG. 3 is an explanatory diagram showing the likely path outputted from the light emitting unit 5 of the conventional example shown in FIG.
１−レ１〜した従来のＬＥＤ記録ヘッドのワイヤーポン
ディングには ？Ｙ通ポールポンディングによる方法が
用いられているが、第３図に示すように、ボンデインク
ワイヤー３０は、ＬＥＤアレイチップ２の面からほぼ屯
直に立上がっており、その立上がり長さａは１５０ない
し３５０−が一般的な値となっている。一方、発光部５
から放出された光は広がりをもっているため、経路Ｒ２
の方向に向う光はボンディングワイヤー３０の垂直な、
または大角度のケトがり部分にあたって反射され、光の
出力が大きい場合は収束レンズ１０を経て感光面１１に
至るｌこの経路Ｒ２の光のエネルギーも・大きくなる。What about wire bonding for conventional LED recording heads? A method using Y-type pole bonding is used, and as shown in FIG. 150 to 350- is a common value. On the other hand, the light emitting section 5
Since the light emitted from has a spread, the path R2
The light heading in the direction is perpendicular to the bonding wire 30,
Alternatively, if the light is reflected by hitting a large angle corner and the output of the light is large, the energy of the light on this path R2, which passes through the converging lens 10 and reaches the photosensitive surface 11, also becomes large.
このエネルギーが感光面１１を感光させるのに充分な値
になると、正常な経路Ｒ１で感光面Ｈに到達した光によ
り紙にプリントされたドツトの周辺まで、さらに黒くプ
リントされて隣接するドツトどうしが干渉するため、所
定のドツト密度が確保できないとともにプリント品質も
劣化する。When this energy reaches a value sufficient to expose the photosensitive surface 11, the light that reaches the photosensitive surface H through the normal path R1 prints even more black to the periphery of the dots printed on the paper, and the adjacent dots become invisible. Due to the interference, it is not possible to secure a predetermined dot density, and print quality also deteriorates.
いま、ピッチ８４．５−で配列された４０Ｘ６０μｓ角
の発光部を有するＧａＡＳＰのＬＥＤアレイチップを用
いて実験した結文、ボンディングワイヤーの立ｌ−かり
角度が約４５＠ないし９０″″の場合、発光部の通゛１
１（品を増加させて８ｍＡとしたとき、ボンディングワ
イヤーによる光の反射のため１．１：述したプリントの
不Ｌ↓合が発生した。The result of an experiment using a GaASP LED array chip having light emitting parts of 40 x 60 μs square arranged at a pitch of 84.5 mm is that when the vertical angle of the bonding wire is about 45 @ to 90'', Light emitting part 1
1 (When the product was increased to 8 mA, the above-mentioned print failure occurred due to the reflection of light by the bonding wire.
このため、光の１−眼を限定する必要があり、そのマー
ジンが狭く、ひいては、発光部５に通電される電流のマ
ージンも狭くなるのでＬＥＤ記録ヘッドとしての安定性
に欠け、またＬＥＤアレイチ・、ブ２の発光のばらつき
を極力押える必要があるためＬＥＤアレイチップ２、最
終的にはＬＥＤ記録ヘッドが高価になるという欠点があ
る。For this reason, it is necessary to limit one eye of light, and the margin is narrow, which in turn narrows the margin of the current applied to the light emitting section 5, resulting in a lack of stability as an LED recording head, and also for LED array chips. Since it is necessary to suppress variations in the light emission of the bulbs 2 as much as possible, there is a drawback that the LED array chip 2 and ultimately the LED recording head become expensive.
本発明のＬＥＤ記録ヘッドは、ＬＥＤアレイチップと外
部回路を接続しているボンディングワイヤーのＬＥＤア
レイチップ面に対する立」−がり角度を、ほぼ４５″以
下としている。In the LED recording head of the present invention, the vertical angle of the bonding wire connecting the LED array chip and the external circuit with respect to the surface of the LED array chip is approximately 45'' or less.
Ｉ−述した実験において、ボンディングワイヤーの＼Ｌ
／′、１−がり角度をほぼ４５＠以下としたとき、その
反射光によるプリントの不珪合がなくなり、−ヒ述した
欠Ｑが解消した。I-In the experiment described, the \L of the bonding wire
/', 1 - When the bending angle was set to approximately 45@ or less, the print misalignment caused by the reflected light disappeared, and the defect Q described in -B was eliminated.
次に１本発明の実施例について図面を参照して説明する
。Next, an embodiment of the present invention will be described with reference to the drawings.
第１図は、本発明のＬＥＤ記録ヘッドの一実施例の要部
構成を示す側面図である。 ′ヒ述した従来例と
同様に、基板ｌヒに複数個のＬＥＤアレイチップ２が搭
載されており、各ＬＥＤアレイチップ２は、ボンディン
グワイヤー３を介１、て配線パターン４に接続され、外
部から供給された電流により駆動されたとき、それぞれ
の発光部５から所要の光が出力される。FIG. 1 is a side view showing the main structure of an embodiment of the LED recording head of the present invention. ``Similar to the conventional example described above, a plurality of LED array chips 2 are mounted on the substrate 1, and each LED array chip 2 is connected to a wiring pattern 4 via a bonding wire 3, and is connected to an external circuit. When driven by a current supplied from each light emitting section 5, the required light is output from each light emitting section 5.
いま、ＬＥＤアレイチ、プ２の面に対するボンディング
ワイヤー３の立−ヒがり角度を約４５°以下として電流
値８ｍＡで実験した結果、前述したプリントの不具合は
全くなかった。さらに電流値を１５ｍＡまで増加しても
同様にプリントの不具合は発生しなかった。したがって
、立上がり角度Ａを約４５°以下にすれば、ボンディン
グワイヤー３の尤の反射によるプリントに対する悪影響
をごけることができ、電ＩＡｄ値の許容マージンも増大
する。Now, as a result of an experiment at a current value of 8 mA with the vertical angle of the bonding wire 3 relative to the surface of the LED array plate 2 being about 45 degrees or less, there was no problem with the above-mentioned printing. Even when the current value was further increased to 15 mA, no printing problems occurred. Therefore, by setting the rising angle A to about 45 degrees or less, it is possible to eliminate the negative influence on printing due to excessive reflection of the bonding wire 3, and the allowable margin for the electric IAd value can also be increased.
角度Ａを４５°以下に設定する一つの手段としてウェッ
ジポンディングがあげられる。なお、第１図ではＬＥＤ
アレイチップ２と基板ｌ」−の配線パターン４を接続し
た例を示しているが、ＬＥＤアレイチップ２を配線パタ
ーン４を介せずにドライバＩＣ（不図示）に直接接続し
た場合も、同様であることを付記する。Wedge pounding is one method for setting the angle A to 45° or less. In addition, in Figure 1, the LED
Although an example is shown in which the array chip 2 is connected to the wiring pattern 4 of the board l''-, the same applies if the LED array chip 2 is directly connected to the driver IC (not shown) without going through the wiring pattern 4. I would like to add something.
以に説明したように本発明は、ＬＥＤアレイチップに接
続されたボンディングワイヤーのＬＥＤアレイチップ面
からの立上がり角度を、約４５°以下に設定することに
より、許容′１−ヒ流マージンを増加させることができ
、安定で高信頼性を有し、かつ安価なＬＥＤ記録ヘッド
を実現できる効果がある。As explained above, the present invention increases the permissible '1-hi flow margin by setting the rising angle of the bonding wire connected to the LED array chip from the LED array chip surface to about 45 degrees or less. This has the effect of realizing a stable, highly reliable, and inexpensive LED recording head.
第１図は、本発明のＬＥＤ記録ヘッドの一実施例の要部
構成を示す側面図、第２図は、ＬＥＤ記録ヘッドの従来
例の概略構造を示す側面図、第３図は、第２図の従来例
の発光部５から出力された尤の経路Ｒ，，Ｒ２の状況を
示す説明図である。
１・・・・・・ノ、（板、 ２・・・・・・ＬＥＤ
アレイチップ、３．６，８．３０・・・・・・ボンディ
ングワイヤー、４・・・・・・配線パターン、
５・・・・・・発光部、 ７・・・・・・］・ライパＩ
Ｃ１９・・・・・・外部接続端子部、
１０・・・・・・収束レンズ、
１１・・・・・・感光面、 ａ・・・・・・立上がり
長さ、１（１，Ｒ２・・・・・・光の経路、
Ａ・・・・・・角度。
′１１訂出ｌ１ｔｑ１人 １１杢電気株式会社第１図
第２図FIG. 1 is a side view showing the main structure of an embodiment of the LED recording head of the present invention, FIG. 2 is a side view showing the schematic structure of a conventional example of the LED recording head, and FIG. FIG. 4 is an explanatory diagram showing the situation of possible routes R, , R2 outputted from the light emitting unit 5 of the conventional example shown in the figure. １・・・・・・ノ、(board, ２・・・・・・LED
Array chip, 3.6, 8.30...Bonding wire, 4...Wiring pattern, 5...Light emitting part, 7...]・Leiper I
C19... External connection terminal section, 10... Converging lens, 11... Photosensitive surface, a... Rising length, 1 (1, R2... ...Path of light, A...Angle. '11 revised edition l1tq1 person 11 Moku Denki Co., Ltd. Figure 1 Figure 2
Claims (1)
グワイヤーを介してＬＥＤアレイチップに供給された電
流により出力した光を用いてプリントを行なうＬＥＤ記
録ヘッドにおいて、 ＬＥＤアレイチップに接続されたボンディングワイヤー
の該ＬＥＤアレイチップ面に対する立上がり角度が、ほ
ぼ４５度以下であることを特徴とするＬＥＤ記録ヘッド
。[Claims] In an LED recording head that is equipped with an LED array chip and performs printing using light output from an electric current supplied to the LED array chip from an external circuit via a bonding wire, An LED recording head characterized in that a rising angle of the bonding wire with respect to the surface of the LED array chip is approximately 45 degrees or less.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP62050622A JPS63216391A (en) | 1987-03-04 | 1987-03-04 | Led recording read |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP62050622A JPS63216391A (en) | 1987-03-04 | 1987-03-04 | Led recording read |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS63216391A true JPS63216391A (en) | 1988-09-08 |
Family
ID=12864076
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP62050622A Pending JPS63216391A (en) | 1987-03-04 | 1987-03-04 | Led recording read |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS63216391A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5285217A (en) * | 1991-04-04 | 1994-02-08 | Agfa-Gevaert N. V. | Led exposure head |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6129562A (en) * | 1984-07-20 | 1986-02-10 | Sanyo Electric Co Ltd | Light-emitting diode for printing |
| JPS61150388A (en) * | 1984-12-25 | 1986-07-09 | Toshiba Corp | Light-emitting diode array device |
| JPS61206675A (en) * | 1985-03-11 | 1986-09-12 | Kyocera Corp | Photoprinter head |
-
1987
- 1987-03-04 JP JP62050622A patent/JPS63216391A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6129562A (en) * | 1984-07-20 | 1986-02-10 | Sanyo Electric Co Ltd | Light-emitting diode for printing |
| JPS61150388A (en) * | 1984-12-25 | 1986-07-09 | Toshiba Corp | Light-emitting diode array device |
| JPS61206675A (en) * | 1985-03-11 | 1986-09-12 | Kyocera Corp | Photoprinter head |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5285217A (en) * | 1991-04-04 | 1994-02-08 | Agfa-Gevaert N. V. | Led exposure head |
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