JPS58177967U - wiring board - Google Patents

wiring board

Info

Publication number
JPS58177967U
JPS58177967U JP7466582U JP7466582U JPS58177967U JP S58177967 U JPS58177967 U JP S58177967U JP 7466582 U JP7466582 U JP 7466582U JP 7466582 U JP7466582 U JP 7466582U JP S58177967 U JPS58177967 U JP S58177967U
Authority
JP
Japan
Prior art keywords
wiring board
wiring
conductor wiring
abstract
conductor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP7466582U
Other languages
Japanese (ja)
Inventor
鷲塚　諌
幸弘 井上
Original Assignee
シャープ株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by シャープ株式会社 filed Critical シャープ株式会社
Priority to JP7466582U priority Critical patent/JPS58177967U/en
Publication of JPS58177967U publication Critical patent/JPS58177967U/en
Pending legal-status Critical Current

Links

Landscapes

  • Non-Metallic Protective Coatings For Printed Circuits (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Abstract] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【図面の簡単な説明】[Brief explanation of drawings]

第１図乃至第４図は印刷配線基板を製造する工程の説明
図である。 ４・・・・・・レジスト、５・・・・・・導電層、６・
・・・・・基板、７・・・・・・側面被覆層。FIGS. 1 to 4 are explanatory diagrams of the process of manufacturing a printed wiring board. 4...Resist, 5...Conductive layer, 6.
. . . Substrate, 7 . . . Side covering layer.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 片面若しくは両面に導体配線を形成してなる基板におい
て、導体配線形成時における配線表面を覆うレジスト膜
とは別に導体配線側部を覆う被覆層を設けたことを特徴
とする配線基板。1. A wiring board having conductor wiring formed on one or both sides, characterized in that a coating layer is provided to cover the side portion of the conductor wiring, in addition to a resist film that covers the surface of the wiring when the conductor wiring is formed.
JP7466582U 1982-05-20 1982-05-20 wiring board Pending JPS58177967U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP7466582U JPS58177967U (en) 1982-05-20 1982-05-20 wiring board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP7466582U JPS58177967U (en) 1982-05-20 1982-05-20 wiring board

Publications (1)

Publication Number Publication Date
JPS58177967U true JPS58177967U (en) 1983-11-28

Family

ID=30084078

Family Applications (1)

Application Number Title Priority Date Filing Date
JP7466582U Pending JPS58177967U (en) 1982-05-20 1982-05-20 wiring board

Country Status (1)

Country Link
JP (1) JPS58177967U (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63164491A (en) * 1986-12-26 1988-07-07 三菱電線工業株式会社 Circuit board and manufacture of the same
JP2009231771A (en) * 2008-03-25 2009-10-08 Nippon Mektron Ltd Manufacturing method of printed wiring board

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63164491A (en) * 1986-12-26 1988-07-07 三菱電線工業株式会社 Circuit board and manufacture of the same
JP2009231771A (en) * 2008-03-25 2009-10-08 Nippon Mektron Ltd Manufacturing method of printed wiring board

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