JPS58135976U - Parts mounting structure - Google Patents

Parts mounting structure

Info

Publication number
JPS58135976U
JPS58135976U JP3372682U JP3372682U JPS58135976U JP S58135976 U JPS58135976 U JP S58135976U JP 3372682 U JP3372682 U JP 3372682U JP 3372682 U JP3372682 U JP 3372682U JP S58135976 U JPS58135976 U JP S58135976U
Authority
JP
Japan
Prior art keywords
mounting structure
parts mounting
circuit board
printed circuit
chip component
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP3372682U
Other languages
Japanese (ja)
Other versions
JPH0238462Y2 (en
Inventor
東堀　修一
Original Assignee
三菱電機株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 三菱電機株式会社 filed Critical 三菱電機株式会社
Priority to JP3372682U priority Critical patent/JPS58135976U/en
Publication of JPS58135976U publication Critical patent/JPS58135976U/en
Application granted granted Critical
Publication of JPH0238462Y2 publication Critical patent/JPH0238462Y2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【図面の簡単な説明】[Brief explanation of drawings]

第１図は従来のチップ部品取付構造を示す概要図、第２
図はこの考案の一実施例であるチップ部品の取付構造を
示す概要図である。 図中、１はプリント基板、２はチップ部品、３は接着剤
、４は半田付は部、５はチップ部品である。なお、図中
、同一符号は同一あるいは相当する部分を示すものとす
る。Figure 1 is a schematic diagram showing the conventional chip component mounting structure, Figure 2
The figure is a schematic diagram showing a mounting structure for a chip component, which is an embodiment of this invention. In the figure, 1 is a printed circuit board, 2 is a chip component, 3 is an adhesive, 4 is a soldering part, and 5 is a chip component. In addition, in the figures, the same reference numerals indicate the same or corresponding parts.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] プリント基板、このプリント基板の銅箔面側に接着、仮
固定されたチップ部品、このチップ部品上に接着、仮固
定されたチップ部品とを備え、上記プリント基板に、上
記一対のチップ部品を一括半田付けしたことを特徴とす
る部品取付構造。A printed circuit board, a chip component adhered and temporarily fixed to the copper foil side of the printed circuit board, and a chip component adhered and temporarily fixed on the chip component, and the pair of chip components are collectively mounted on the printed circuit board. Parts mounting structure characterized by soldering.
JP3372682U 1982-03-08 1982-03-08 Parts mounting structure Granted JPS58135976U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP3372682U JPS58135976U (en) 1982-03-08 1982-03-08 Parts mounting structure

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP3372682U JPS58135976U (en) 1982-03-08 1982-03-08 Parts mounting structure

Publications (2)

Publication Number Publication Date
JPS58135976U true JPS58135976U (en) 1983-09-13
JPH0238462Y2 JPH0238462Y2 (en) 1990-10-17

Family

ID=30045262

Family Applications (1)

Application Number Title Priority Date Filing Date
JP3372682U Granted JPS58135976U (en) 1982-03-08 1982-03-08 Parts mounting structure

Country Status (1)

Country Link
JP (1) JPS58135976U (en)

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57130495A (en) * 1981-02-04 1982-08-12 Matsushita Electric Ind Co Ltd Method of producing electric part mounting substrate

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57130495A (en) * 1981-02-04 1982-08-12 Matsushita Electric Ind Co Ltd Method of producing electric part mounting substrate

Also Published As

Publication number Publication date
JPH0238462Y2 (en) 1990-10-17

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