JPS62119964A - Composite circuit device - Google Patents

Abstract

PURPOSE:To enable forming out only such as a transistor but also a condenser on a substrate and to minimize the size and the weight of a construction by using a ceramic sintered body for the substrate when an electrode conductor, a conductor pattern, a transistor, a resistance, etc. are provided on the insulating substrate. CONSTITUTION:A ceramic sintered body which is a dielectric is used for an insulating substrate 1 which constitutes a composite circuit device and an upper electrode conductor 2a and a lower electrode conductor 2b facing to the front the back surfaces of a half of the substrate formed to make a condenser. Then, on the other half of the surface of the substrate, a conductor pattern P, a resistance R connected to the pattern P, a transistor T positioned on the pattern P, etc. are provided for the parts of a circuit. Then, a through-hole 3 is made on the substrate 1, the end of the lower electrode conductor 2b is connected to the pattern P on the upper surface via the hole 3 and the end of the upper electrode conductor 2a is directly connected to the pattern P. In this way, the number of connection points is reduced and the composite circuit device is simplified.

Description

[Detailed Description of the Invention] [Industrial Application Field] The present invention provides a method of forming a capacitor by providing a conductor film on both sides of a part of a sintered ceramic capacitor substrate, and at the same time providing a conductor pattern on another part of the substrate. , relates to a composite circuit device equipped with circuit components.

[Conventional technology]

Conventionally, when configuring a circuit including a ceramic capacitor, a single capacitor, resistors, semiconductor components, etc. that make up the circuit were mounted on a motherboard.

[The problem that the invention aims to solve]

In this method, the motherboard and the ceramic capacitor are manufactured separately, so they are large, heavy, and expensive.

[Means for solving problems]

In view of this point, the present invention provides a compact, lightweight, and inexpensive composite circuit device that uses a ceramic capacitor sintered substrate as a dielectric layer of a capacitor and a motherboard on which circuit components are mounted.

〔Example〕

Next, the present invention will be explained by examples.

FIG. 1(a) is a plan view of an embodiment of the present invention before resin sealing, and FIG. 1(b) is an A-Alr plane view of FIG. 1(a). In Figures 1(a) and (b), l is made by the ceramic manufacturing process of a ceramic capacitor,
This is a continuum length substrate made of a ceramic sintered body, and electrode conductors 2a and 2b forming a capacitor using the substrate as a dielectric layer are formed on the upper and lower surfaces of approximately the left half of this substrate, respectively. In addition, approximately the right half of the board l is also used as a general circuit board, and a conductor pattern P and a resistor R connected to this conductor pattern are formed on the upper surface, and a desired portion of the conductor pattern P is has a transistor T
is installed. In addition, the capacitor electrode conductor 2 on the top surface
The electrode conductor 2b is drawn out to the upper surface through the through hole 3 and connected to the conductor pattern P of the circuit section.

In such a composite circuit device of the present invention, the electrode conductor of the capacitor and the conductor pattern of the circuit portion, in which the substrate 1 is a dielectric layer, can be constructed using the same material. Also,
Lead terminals for external connection can be those for ordinary integrated circuits, and the final resin sealing process can be performed in the same process as that for general ceramic capacitors.

〔Effect of the invention〕

This configuration of the present invention produces a first-order effect.

(1) Simple structure and small shaft size.

(2) It will be cheaper.

(3) Reliability is improved by reducing the number of connection points.

(4) Management becomes easier due to a reduction in the number of parts.

As described above, according to the present invention, it is possible to provide a compact and inexpensive composite circuit device.

[Brief explanation of drawings]

□ 1stab Plan view of one embodiment of the present invention before resin sealing,
The figure (b) is a sectional view taken along the line AA in the figure (a). 1...-Ceramic capacitor board, 2a °
゛°°°°Top electrode conductor, 2b...Bottom electrode conductor, 3...Through hole.

Claims (1)

[Claims] The capacitor is characterized by including a capacitor section formed by providing a conductor film on both sides of a part of a sintered ceramic capacitor board, a conductor pattern provided on another part of the board, and a circuit component attached to the conductor pattern. Composite circuit device.