JPH01139420U - - Google Patents
Info
- Publication number
- JPH01139420U JPH01139420U JP3466588U JP3466588U JPH01139420U JP H01139420 U JPH01139420 U JP H01139420U JP 3466588 U JP3466588 U JP 3466588U JP 3466588 U JP3466588 U JP 3466588U JP H01139420 U JPH01139420 U JP H01139420U
- Authority
- JP
- Japan
- Prior art keywords
- layer
- substrate
- component
- conductor layer
- integrated circuit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000758 substrate Substances 0.000 claims description 5
- 239000004020 conductor Substances 0.000 claims 4
- 238000004519 manufacturing process Methods 0.000 description 1
Description
第１図は本考案による混成集積回路部品の一実
施例を示す断面図、第２図ないし第５図は該実施
例の製造工程を示す各工程における部品の斜視図
、第６図はＣネツトワークを基板としＩＣ等の部
品を搭載した従来の混成集積回路部品を示す斜視
図、第７図はＣネツトワークを基板としＩＣ等の
部品を搭載すると共に、外部端子と部品との間に
抵抗を挿入した従来の混成集積回路部品を示す斜
視図である。
FIG. 1 is a sectional view showing an embodiment of a hybrid integrated circuit component according to the present invention, FIGS. 2 to 5 are perspective views of the components at each step showing the manufacturing process of the embodiment, and FIG. 6 is a C-net A perspective view showing a conventional hybrid integrated circuit component in which a workpiece is used as a substrate and components such as ICs are mounted, and FIG. FIG. 2 is a perspective view showing a conventional hybrid integrated circuit component into which a .
Claims (1)
クを基板とし、該基板の側面に設けた複数個の外
部端子の少なくとも一部と、前記基板の表面また
はおよび裏面に搭載する部品との間に抵抗を設け
た混成集積回路部品において、前記基板上の前記
部品搭載面に、前記外部端子に接続された第１の
導体層と、該導体層より離れた第２の導体層と、
前記第１、第２の導体層間を接続する抵抗層とを
形成し、前記抵抗層上に絶縁層を形成し、該絶縁
層上に、前記第２の導体層に接続した第３の導体
層を形成し、該第３の導体層に前記部品の端子を
接続した混成集積回路部品。 A laminated C network or LC network is used as a substrate, and a resistor is provided between at least a part of a plurality of external terminals provided on the side surface of the substrate and a component mounted on the front or back surface of the substrate. In the hybrid integrated circuit component, a first conductor layer connected to the external terminal on the component mounting surface of the substrate, and a second conductor layer separated from the conductor layer;
a resistive layer connecting the first and second conductive layers, an insulating layer formed on the resistive layer, and a third conductive layer connected to the second conductive layer on the insulating layer; A hybrid integrated circuit component, wherein a terminal of the component is connected to the third conductor layer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988034665U JPH0638416Y2 (en) | 1988-03-16 | 1988-03-16 | Hybrid integrated circuit component |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988034665U JPH0638416Y2 (en) | 1988-03-16 | 1988-03-16 | Hybrid integrated circuit component |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH01139420U true JPH01139420U (en) | 1989-09-22 |
| JPH0638416Y2 JPH0638416Y2 (en) | 1994-10-05 |
Family
ID=31261362
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1988034665U Expired - Lifetime JPH0638416Y2 (en) | 1988-03-16 | 1988-03-16 | Hybrid integrated circuit component |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0638416Y2 (en) |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS60151122U (en) * | 1984-03-16 | 1985-10-07 | 日本電気株式会社 | multilayer composite parts |
-
1988
- 1988-03-16 JP JP1988034665U patent/JPH0638416Y2/en not_active Expired - Lifetime
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS60151122U (en) * | 1984-03-16 | 1985-10-07 | 日本電気株式会社 | multilayer composite parts |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0638416Y2 (en) | 1994-10-05 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JPH01133701U (en) | ||
| JPH01139420U (en) | ||
| JPH0288269U (en) | ||
| JPH03110871U (en) | ||
| JPS6346844U (en) | ||
| JPS6348111Y2 (en) | ||
| JPS62119964A (en) | Composite circuit device | |
| JPS6316426U (en) | ||
| JPS6280322U (en) | ||
| JPH0338921U (en) | ||
| JPH0390468U (en) | ||
| JPS6346873U (en) | ||
| JPS6312853U (en) | ||
| JPH0482881U (en) | ||
| JPS6096817U (en) | Chip type electronic components | |
| JPH0479448U (en) | ||
| JPS5839061U (en) | semiconductor integrated circuit | |
| JPH01153626U (en) | ||
| JPH0312461U (en) | ||
| JPH0189774U (en) | ||
| JPS6194376U (en) | ||
| JPH0440558U (en) | ||
| JPH01173970U (en) | ||
| JPS63193882U (en) | ||
| JPS60125722U (en) | composite parts |