JPS6459953A - Manufacture of compound integrated circuit - Google Patents

Abstract

PURPOSE:To enable reduction of a compound integrated circuit in size and weight, on which a thick and a thin film circuit element need to be mixedly mounted, by a method wherein the thin film circuit element which is to be connected to a via-hole is formed on a polyimide layer. CONSTITUTION:A thick film circuit element and a thin film circuit element are mixedly mounted on a compound integrated circuit 11, which is formed in such a structure that a thick film circuit element, which is composed a thick film conductor layer 13 composed of, for instance, Ag-Pd and a thick resistor layer 14 formed of, for instance, RuO2, is formed on a upper face of an alumina substrate 12, a polyimide layer 16 is coated thereon, an a required thin conductor layer 19 and a required thin film capacitor 20 are built on the polyimide layer 16. An external connecting terminal 15 as a part of the conductor layer 13 is exposed at one end of a upper face of the substrate 12, and the thick conductor layer 13 and the thin film conductor layer 19 are electrically connected with each other through the intermediary of a conductor layer 18 of a via-hole 17 provided to the polyimide layer 16.