JPH02172299A - Manufacture of shielding apparatus - Google Patents

Abstract

PURPOSE:To easily obtain a shielding apparatus having a desired shape by plating magnetic metal on at least either one of the outer surface or the inner surface of a case body formed into a desired shape by resin molding, and forming a magnetic layer. CONSTITUTION:An upper lid 2 and a bottom plate 3 are formed by resin mold. A metal mold is provided with a plurality of small holes 4 for heat dissipation and protruding parts 5, 6 corresponding with leading-out holes 5, 6 for cables and the like. A plurality of the small holes 4 and the leading-out holes 5, 6 are formed concurrently with molding the upper lid 2. Magnetic metal is plated on the outer surface of the case body 2 formed by resin mold. In this manner, the case 1 is formed by resin mold, and a shielding apparatus is formed by plating magnetic material on the outer surface of the case body 1, so that the shielding apparatus having a desired shape can be easily obtained by working magnetic material member itself.

Description

DETAILED DESCRIPTION OF THE INVENTION [Object of the Invention] (Industrial Application Field) The present invention relates to a method of manufacturing a shielding device for shielding an electric circuit device.

(Prior art) For example, in an electric circuit device including a semiconductor device, etc., the electric circuit device may malfunction due to electromagnetic waves mixed in from the outside, or conversely, electromagnetic waves generated from the electric circuit device may have an adverse effect on the external device. It may be harmful. Therefore,
To eliminate such inconveniences, shielding of electrical circuit devices is required.

Usually, the shield includes an electromagnetic shield against electromagnetic waves, an electrostatic shield against electrostatic induction from nearby high-voltage cables, etc., a magnetic shield against lines of magnetic force, and the like. here,
The electromagnetic shield and the electrostatic shield are made of a conductive material such as copper or aluminum, and the magnetic shield is made of a magnetic material such as iron or an alloy of iron and silicon.

(Problem to be Solved by the Invention) However, when forming a shield device that can also be used as a case body for housing an electric circuit device using a conductive member or a magnetic member, conventionally, the conductive member or magnetic member itself is shaped into a desired shape. The disadvantage was that it was time-consuming.

SUMMARY OF THE INVENTION The present invention aims to eliminate the above-mentioned drawbacks, and an object of the present invention is to provide a manufacturing method that allows a shield device of a desired shape to be easily obtained.

[Structure 1 of the Invention (Means for Solving the Problems) In order to solve the above problems, the shield device according to the present invention includes a step of forming a case body of a predetermined shape by resin molding as a first structure; a step of forming a magnetic layer by plating at least one of the outer surface and the inner surface of the case body with a magnetic metal; plating at least one of the outer surface and the inner surface of the case body with a conductive material to form a conductive layer,
As a third configuration, a process of forming a case body of a predetermined shape by resin molding, and alternately repeating magnetic metal plating and conductive material plating on at least one of the outer surface or inner surface of the formed case body to form a magnetic layer. and forming a stack of conductive layers alternately.

(Function) Forming the case body by resin molding is much easier than processing the conductive member or magnetic member itself into a desired shape. Further, plating of a magnetic material or a conductive material onto the case body using this resin mold is also easily performed.

(Example) Hereinafter, the present invention will be specifically explained with reference to Examples.

FIG. 1 is a perspective view of a shield device obtained by the manufacturing method according to the present invention, and FIG. 2 is a sectional view taken along the line A--A in FIG. 1.

This shield device comprises a box-shaped case body 1 and a magnetic layer 7 provided on the outer surface thereof. The case body 1 is molded from a resin material 8, and the magnetic layer 7 is formed directly on this resin material 8. The case body 1 includes a top cover 2 and a bottom plate 3.

A plurality of small holes 4 for heat dissipation of the electric circuit device housed inside the case body 1 are formed in the upper surface and the upper side of the upper M2, and the lower side of the case body 1 is provided with a plurality of small holes 4 for heat radiation of the electric circuit device housed inside the case body 1. Outlet holes 5 and 6 are provided for connecting cables and the like.

Such a shield device is manufactured as follows.

First, the upper lid 2 and the bottom plate 3 are formed by resin molding. The mold used in this molding process has two protrusions (2) corresponding to a plurality of small holes 4 for heat dissipation and pull-out holes 5 and 6 for cables, etc. Therefore, a plurality of small holes 4
and draw-out holes 5 and 6 are formed at the same time when the upper cover 2 is molded.

Next, the case body 2 formed by the above resin mold
Plating the outer surface with magnetic metal. Here, the magnetic metal plating method may be either a dry plating method or a wet plating method. Examples of the dry plating method include a vacuum evaporation method, a sputtering method, and an ion blating method, and examples of the wet plating method include an electroless plating method, an electric field plating method, and a coating method. In particular, the wet plating method has excellent productivity, so it is preferable to employ this plating method.

The magnetic layer 7 can also be formed into a multi-layer structure, in which case the process of forming the magnetic layer and the process of forming the electrically insulating layer are repeated alternately. The purpose of interposing the electrically insulating layer is to reduce eddy current loss, and for this purpose, a resistive layer having a predetermined electrical resistance is interposed instead of the electrically insulating layer described above. You can. Note that this resistance layer preferably has as high a resistance as possible.

Through this plating process, the shield device shown in FIGS. 1 and 2 is obtained.

As described above, in this embodiment, the case body 1 is formed by resin molding, and the shield device is formed by plating the outer surface of the case body 1 with magnetic metal. This method is much easier than the conventional method in which a shield device of a desired shape is obtained by processing the magnetic member itself.

This is because, according to the conventional method, there is a step of shearing a flat magnetic member, a step of drilling a plurality of small holes 4 and extraction holes 5 and 6 for heat radiation, a step of bending the magnetic member, and a step of joining the bent pieces. This is because many steps are required.

Note that the present invention is not limited to the above embodiments.

For example, after forming the case body 1 by resin molding, the inner surface of the case body 1 is plated with magnetic metal to make it magnetic@7.
(see FIG. 3), or the magnetic layer 7 may be formed by plating both the outer and inner surfaces of the case body 1 with magnetic metal.

Furthermore, in the above embodiments, a magnetic metal is plated. However, if the purpose is electromagnetic shielding or electrostatic shielding, but not magnetic shielding, there is no need to use magnetic metal, and conductive metal is used. It is sufficient to plate the parts.

Furthermore, the magnetic layer 7 and the conductive layer 9 may be alternately laminated on the outer surface, inner surface, or both of the case body 1 by alternately repeating the magnetic metal plating and the conductive material plating (see FIG. 4). In this case, a shielding device with excellent magnetic shielding effect, electromagnetic shielding effect, and electrostatic shielding effect can be obtained.

[Effects of the Invention] As described in detail above, according to the present invention, it is possible to provide a manufacturing method that allows a shield device of a desired shape to be easily obtained.

[Brief explanation of the drawing]

FIG. 1 is a perspective view of a shield device obtained by a manufacturing method of an embodiment of the device of the present invention, FIG. 2 is a sectional view taken along the line A-A in FIG. 1, and FIGS. 3 and 4 are views of other embodiments. FIG. 3 is a cross-sectional view for explaining an example manufacturing method. DESCRIPTION OF SYMBOLS 1... Case body, 7... Magnetic layer, 8... Resin material, 9... Conductive layer. / / Figure 2 Figure 4

Claims (3)

[Claims] (1) It is characterized by comprising a step of forming a case body of a predetermined shape by resin molding, and a step of plating at least one of the outer surface and inner surface of the formed case body with a magnetic metal to form a magnetic layer. A method for manufacturing a shielding device. (2) It is characterized by comprising a step of forming a case body of a predetermined shape by resin molding, and a step of plating at least one of the outer surface and inner surface of the formed case body with a conductive material to form a conductive layer. A method for manufacturing a shielding device. (3) Forming a case body of a predetermined shape by resin molding, and alternately repeating magnetic metal plating and conductive material plating on at least either the outer surface or the inner surface of the formed case body to form a magnetic layer and a conductive layer. 1. A method for manufacturing a shield device, comprising a step of alternately laminating layers.