JPH0720919Y2 - Package for microwave integrated circuit - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION [Industrial application] The present invention relates to a package for a microwave integrated circuit, and more specifically, a microwave requiring super high frequency characteristics and super airtightness suitable for mounting on a satellite. The present invention relates to a package for a microwave integrated circuit containing an amplifier and the like.

[Prior Art] Conventionally, as a package for storing an amplifier or the like which constitutes a microwave integrated circuit, for example, a package shown in FIG. 3A disclosed in Japanese Utility Model Laid-Open No. 59-3548 is known. There is. Here, 1 is a metal base that can be attached to a case or the like (not shown) with screws or the like, and 2 is a metal or ceramic frame provided on the metal base 1. In addition,
The frame 2 is often made of metal because it has an electromagnetic shield effect and can suppress unnecessary resonance phenomena.

A microwave integrated circuit amplifier 3 is mounted on the metal substrate 1 in the frame body 2, while a high frequency input / output terminal 4 is formed as a ceramic terminal on the parallel walls in the same direction of the frame body 2. A plurality of bias voltage supply terminals 5 are arranged as shown in the drawing. That is, 4A is a microstrip substrate for high frequency input, 4B is a microstrip substrate for high frequency output, 5A is a microstrip substrate for supplying bias voltage, and 6 is a surface by microstrips arranged on these strips substrate. A conductor or a line conductor, and 7 is an insulator made of ceramics or the like embedded in the frame wall 2A so as to be superposed on these strip substrates.

Thus, the microwave integrated circuit amplifier 3 and the conductor 6 are electrically connected by the bonding wire 8A and the gold ribbon 8B. Reference numeral 9 is a lid member which covers the upper surface of the frame body 2, and 10 is a screw hole for fixing the metal base 1 to a case (not shown).

However, in such a conventional microwave integrated circuit package, both the bias voltage supply terminal 5 and the high frequency input / output terminal 4 have a structure in which the insulator 7 is disposed on the microstrip substrate. The insulator 7 for securing the electrode of the conductor 6 on the microstrip substrate is the microstrip substrate (4A, 4B, 5A)
The high-frequency input / output terminal 4 and the bias voltage supply terminal 5 were formed shorter and were arranged in parallel to the frame wall 2A in the same direction.

By the way, in order to achieve an ultrahigh frequency of microwaves, as a high frequency characteristic, the narrower the width of the sealing frame in the direction perpendicular to the input / output direction, the higher the frequency.
As is clear from FIG. 3A, when the plurality of high frequency input / output terminals 4 and the bias voltage supply terminals 5 arranged on the frame wall 2A in the same direction are brought close to each other and the distance between them is shortened, Not only the structure of the frame wall 2A itself becomes mechanically weak, but also the electrical characteristics are deteriorated.

In addition, the high frequency input / output terminal 4 and the bias voltage supply terminal 5
And are arranged on the same frame wall of the frame body 2, it is necessary to consider that sufficient insulation is maintained between the line conductor 6 and the metal substrate 1 in the bias voltage supply terminal 5. In addition, a short circuit is prevented when the connection wiring by the bonding wire 8A or the gold ribbon 8B is performed between the line conductor 6 of the bias voltage supply terminal 5 or the high frequency input / output terminal 4 and the circuit terminal of the microwave integrated circuit amplifier 3. For these reasons, the distance between the terminals cannot be made too narrow, and therefore the length of the frame wall in which these terminals 4 and 5 are arranged becomes long, and the high frequency is increased. Had been an obstacle.

Furthermore, in the terminals 4 and 5 described above, as shown in FIG. 3C, the ceramic microstrip substrates 4A, 4B and 5A are integrated with the insulator 7 provided thereon. Since the shapes of the substrates 4A, 4B and 5A formed on one surface as an electrode pattern are different from the shape of the insulator 7 which may also be formed of ceramic, the two green sheet shapes are purposely cut out in the manufacturing process. This is not preferable in terms of cost reduction because the number of manufacturing processes is increased accordingly.

In particular, the greatest drawback of the conventional example is that the airtightness between the ceramic substrates 4A, 4B and 5A and the ceramic insulator 7 and the metal base 1 and the metal frame 2 is poor. That is, in such a microwave integrated circuit package,
After its mounting, an inert gas or the like is enclosed in the frame so that stable performance can be maintained in any environment, for example, in the space environment such as when mounting on a satellite. Airtightness is extremely important. However, in the past,
Since the above-mentioned joint between the ceramic and the metal is treated by using, for example, an adhesive or the like, there is a point that the fitting is poor and sufficient airtightness cannot be obtained.

[Problems to be Solved by the Invention] That is, as described above, the conventional microwave integrated circuit package has various problems. In particular, the bias voltage supply terminal is As the density is increased, the number of arrangements tends to increase, so it has a compact form with a simple manufacturing process, and also has a bias voltage supply terminal that is easy to maintain airtightness and downsized to achieve higher frequencies. The desired package is desired.

An object of the present invention is to focus on the above-mentioned conventional problems, and to solve the problems, a bias voltage supply terminal can be obtained by a simple manufacturing process with excellent airtightness between a metal frame and a metal base. It is possible to reduce the size of the package and increase the frequency by appropriately disposing such a bias voltage supply terminal on the frame wall separately from the high frequency input / output terminals. It is to provide a package for a microwave integrated circuit.

[Means for Solving the Problems] In order to achieve such an object, the present invention provides a base body on which a microwave integrated circuit is attached, and a rectangular frame provided on the base body to surround the microwave integrated circuit. In a package for a microwave integrated circuit having a body, first and second rectangular ceramic members each having the same size of each part are vertically stacked, and at least one strip is provided between layers of the first and second ceramic members. A line conductor is interposed, and the line conductor is bent and extended along the first ceramic member to its upper surface to expose both ends, and the line conductor is provided on the outer peripheral portion of the laminated body formed of the first and second ceramic members. A plurality of vias of the microwave integrated circuit, in which a metal strip is circumferentially provided along a direction intersecting the wiring direction of the line conductor so as to maintain a predetermined gap between the metal strip and both ends of the line conductor. Voltage supply terminal member, the terminal member is embedded in the base body with its upper surface in contact with the lower surface of the frame body, and the outer peripheral portion of the terminal member is covered with the metal strip through the base body and the frame. It is characterized by being joined to the body.

[Operation] According to the microwave integrated circuit package of the present invention, the metal band is surrounded by the portion of the ceramic terminal member forming the bias voltage supply terminal that is joined to the metal base and the metal frame. Familiarity with each other can be obtained and airtightness can be improved, and since the terminal member can be embedded in the metal base, no groove processing for embedding the insulator is required in the frame body joined to the upper part of the base body. ,that's all,
It contributes to the improvement of airtightness by reducing the number of parts related to airtightness / sealing of the frame. Furthermore, since the upper and lower ceramic plates that hold the conductors can have the same shape, it contributes to the simplification of the manufacturing process, and the conductors formed in the substantially C-shape also allow the upper surface of the terminal member to be formed. Since the terminals are formed horizontally, electrical connection can be obtained by bonding etc. in a state of being completely insulated from the metal frame, the base body and the metal strip. In particular, the bias voltage supply terminal configured in this way can be used as a high frequency input / output terminal. By arranging them on the frame wall orthogonal to the frame wall to be arranged, it is possible to provide a microwave integrated circuit package suitable for achieving higher frequencies.

[Embodiment] An embodiment of the present invention will be specifically described below with reference to the drawings.

1A to 1D show an example of the structure of the bias voltage supply terminal according to the present invention. Here, reference numeral 15 is a bias voltage supply terminal, and the terminal 15 has a first insulating substrate 15A and a second insulating substrate 15B (both are referred to as ceramic members) made of ceramic, which are vertically stacked. Make a square shape with the same dimensions. 16 is the first ceramic member 15A and the second
This is a single-line or multiple-line line conductor interposed between the ceramic member 15B and the example of the single line is shown in this example, but the line conductor 16 is bent along the upper first ceramic member 15A. It has a C-shape and both ends thereof are guided to the upper surface of the first ceramic member 15A.

Reference numeral 17 denotes a metal band which is provided around the first ceramic member 15A and the second ceramic member 15B in the above-mentioned state in a direction orthogonal to the direction in which the line conductor 16 is arranged. As will be described later, the metal substrate 21 and the metal frame
An adhesive metallization layer between 22 and this terminal 15 is constituted. Therefore, the band width of the metal band 17 may be substantially the thickness of the frame wall, and a predetermined space is maintained between the metal band 17 and both end portions of the line conductor 16.

FIGS. 2A and 2B show an example in which a plurality of the bias voltage supply terminals 15 as described above are arranged on the side of the frame wall 22B perpendicular to the frame wall 22A on which the high frequency input / output terminal 4 is provided. ,
In this example, the metal base 21 is provided with a raised step portion 21A, the terminal 15 is embedded in the step portion 21A, and the metal frame body 22 is attached.

Therefore, in the microwave integrated circuit package configured as described above, the metal strip 17 is provided around the ceramic members 15A and 15B forming the bias voltage supply terminal 15.
Since the metal base 21 and the metal frame body 22 are bonded to each other through the metal band 17, the adhesion between the metals is good and therefore the airtightness is enhanced. In addition to being able to
17, Since it is completely enclosed by the metal base 21 and the metal frame 22, the electromagnetic shield effect can be improved. Further, by configuring as shown in FIG. 2A and FIG. 2B, it becomes possible to narrow the width in the longitudinal direction of the frame wall 22A on which the high frequency input / output terminal 4 is provided, and it is possible to increase the frequency accordingly. , The package itself can be made strong and highly airtight.

[Effects of the Invention] As described above, according to the present invention, the base has the microwave integrated circuit attached thereto, and the rectangular frame body is provided on the base so as to surround the microwave integrated circuit. In a package for a microwave integrated circuit, first and second rectangular ceramic members having the same size in each part are vertically stacked, and at least one line conductor is interposed between the first and second ceramic members. The line conductor is bent along the first ceramic member to the upper surface thereof to expose both ends thereof, and the line is provided along the outer peripheral portion of the laminated body of the first and second ceramic members. A plurality of bias voltage supply ends of the microwave integrated circuit in which a metal band is provided in a direction intersecting with the wiring direction of the conductor so as to keep a predetermined space between the metal strip and both ends of the line conductor. A sub-member, the terminal member is embedded in the base body so that the upper surface of the terminal member contacts the lower surface of the frame body, and the outer peripheral portion of the terminal member is joined to the base body and the frame body via the metal band. Therefore, both ends of the line conductor, which are bent and extended to the upper surface of the line conductor, are electrically connected to the power supply side and the microwave integrated circuit side through the connection wirings. Not only can the airtightness between the metal substrate and the frame and the bias voltage supply terminal be improved, but the electromagnetic shielding effect can be enhanced and the structure can be made strong. It is possible to simplify the manufacturing process by making the upper and lower ceramic members of the same shape.
By disposing the high-frequency input / output terminal and the bias voltage supply terminal as described above on the parallel walls which are orthogonal to each other, the width of the frame wall on which the high-frequency input / output terminal of the package is disposed is shortened to increase the applied frequency. Can be achieved.

[Brief description of drawings]

FIG. 1A is a perspective view showing an example of the structure of a bias voltage supply terminal according to the present invention, and FIGS. 1B, 1C and 1D are respectively the A of FIG. 1A.
Direction, a side view from the B direction and a side view from the C direction, FIG. 2A is a perspective view showing an example of the structure of the microwave integrated circuit package of the present invention, and FIG. 2B is the Y view of FIG. 2A. -Y 'sectional view, FIGS. 3A and 3B are perspective views showing two examples of the structure of a conventional microwave integrated circuit package, and FIG. 3C is a high-frequency input / output terminal in the package shown in FIG. 3A. FIG. 3 is a perspective view showing a configuration of a bias voltage supply terminal. 1,21 …… Metal base, 2,22 …… Metal frame, 2A, 21A, 21B ……
Frame wall, 3 ... Microwave integrated circuit amplifier, 4 ... High frequency input / output terminal, 5,15 ... Bias voltage supply terminal, 6,16 ...
Line conductor, 7 Insulator, 8A Bonding wire, 8B Gold ribbon, 9 Lid member, 15A, 15B Insulation substrate (ceramic member), 17 Metal band.

Claims (2)

[Scope of utility model registration request] 1. A substrate on which a microwave integrated circuit is mounted,
In a package for a microwave integrated circuit having a rectangular frame body surrounding the microwave integrated circuit on the base body, first and second rectangular ceramic members having the same size in each part are vertically arranged. At least one line conductor is laminated between layers of the first and second ceramic members, and the line conductor is bent and extended along the first ceramic member to its upper surface so that both ends thereof are bent. A metal strip is exposed and a predetermined interval is provided between both ends of the line conductor in a direction intersecting the wiring direction of the line conductor along the outer periphery of the laminated body formed of the first and second ceramic members. A plurality of bias voltage supply terminal members for the microwave integrated circuit, which are circumferentially provided so as to be kept, and the terminal members are embedded in the base body so that their upper surfaces are in contact with the lower surface of the frame; A package for a microwave integrated circuit, wherein an outer peripheral portion of the terminal member is joined to the base body and the frame body via a band. 2. A microwave integrated circuit package according to claim 1, wherein the plurality of bias voltage supply terminal members are parallel frame walls on which terminals for high frequency input / output are arranged. A package for a microwave integrated circuit, which is disposed on a frame wall in a direction intersecting with.