JPH0520885B2 - - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION Field of Industrial Application The present invention relates to a chip component that can be used in electronic circuits of television receivers, video tape recorders, and the like.

Conventional configurations and their problems In recent years, as electronic devices have become lighter, thinner, and smaller, various chip components such as chip resistors, chip capacitors, and chip coils have been developed and put into practical use in order to achieve high-density mounting on electronic circuit boards. These chip components can be broadly classified into those whose exteriors are made of sintered bodies for protecting the component elements from surrounding environmental conditions, and those whose exteriors are made of resin molded bodies.

Hereinafter, conventional chip components will be explained with reference to the drawings.

FIG. 1a is a perspective view showing the appearance of a conventional chip component, and FIG. 1b is a side view thereof. In FIGS. 1a and 1b, 1 is a resin molded body, 2a and 2b are metal terminal plates, and one end thereof is the resin molded body 1.
and are electrically connected to component elements (not shown). The other ends of the metal terminal plates 2a, 2b are drawn out from the middle part of the side surface of the resin molded body 1, and are bent along the side surface and the bottom surface.

Such conventional chip parts are usually made by arranging the component elements on a metal plate in which the metal terminal plates 2a and 2b are integrated, and simultaneously molding a large number of them using a resin molding method such as injection molding or transfer molding. Thereafter, it can be obtained by separating into individual pieces and then bending the metal terminal plates 2a, 2b along the surface of the resin molded body 1.

In the conventional chip component having the above configuration, the chip component wrapped in tape is first fed to a mounting machine, and when the chip component is surface mounted on an electronic circuit board by this mounting machine, the chip component protruding from the resin molded body 1 is There was a problem in that the metal terminals 2a and 2b got caught on the packaging tape and fell off the mounting machine, resulting in mounting errors. Secondly, in order to prevent the mounting mistakes as much as possible, the bending radius of the metal terminal plates 2a and 2b should be made small;
It is necessary to reduce the amount of protrusion of the metal terminal plates 2a, 2b as much as possible, but if the bending radius is made small, excessive force will be applied to the parts of the resin molded body 1 that are in contact with the metal terminal plates 2a, 2b, resulting in cracks, cracks, etc. In some cases, this problem occurs, resulting in a decrease in the production yield of chip parts.

Purpose of the Invention The purpose of the present invention is to eliminate the above-mentioned conventional drawbacks, to enable surface mounting on an electronic circuit board without being caught by packaging tape, and to prevent cracks or cracks from occurring in the resin molded product. An object of the present invention is to provide a chip component that allows bending of a metal terminal plate without any problems.

Structure of the Invention In order to achieve this object, the chip component of the present invention is a chip component that is tape-wrapped and surface-mounted on an electronic circuit board by a mounting machine.
A metal terminal plate electrically connected to this component element,
It consists of a resin molded body that covers the component element and a part of the metal terminal plate, and a step is formed from the side surface of the resin molded body where the other end of the metal terminal plate is drawn out to the bottom surface of the metal terminal plate. A cutout surface with the same thickness as the board is provided, and the externally drawn portion of the metal terminal board is bent along the cutout surface, which improves reliability when mounted on an electronic circuit board and improves the reliability of chip components. The yield in the metal terminal bending process can be greatly improved.

DESCRIPTION OF EMBODIMENTS An embodiment of the present invention will be described below with reference to the drawings. FIG. 2a is a perspective view showing the external appearance of a chip component according to an embodiment of the present invention, and FIG.
is its side view. In FIGS. 2a and 2b, 1 is a resin molded body, and 2a, 2b are metal terminal plates, one end of which is buried in the resin molded body 1 and electrically connected to a component element (not shown). ing. Metal terminals 2a and 2b pulled out from the side surface of the resin molded body 1
The other end is first bent along the notch surface 1a from the extraction surface to the bottom of the metal terminals 2a and 2b of the resin molded body 1 provided on the resin molded body 1, and then bent along the bottom surface of the resin molded body 1. There is. The resin molded body 1 is formed by arranging component elements on a metal plate in which metal terminal plates 2a and 2b are integrated, and performing transfer molding. The mold for transfer molding is divided into two parts, an upper mold and a lower mold, with the boundary A-A' shown in Figure 2b, and the longitudinal dimension of the lower mold is shorter than that of the upper mold. By doing so, the notch surface 1a can be provided in the resin molding 1. The optimum value of the level difference between the surface molded with the upper mold and the surface molded with the lower mold (notch surface) depends on the bending strength and thickness of the metal terminal plates 2a and 2b, and the strength of the resin molded body 1. Therefore, in this embodiment, the thickness was selected to be the same as that of the metal terminal plates 2a and 2b.

Next, an example of bending the metal terminal plates 2a and 2b will be described. FIG. 3 shows a side view of the bending process, and 3a and 3b are push-out pins for bending the metal terminal plates 2a and 2b;
4 and 5 are a fixing base and a fixing piece, respectively, for mechanically fixing the resin molded body 1. To explain the bending process shown in FIG.
, bend the tips of the metal terminal plates 2a and 2b by 90° by the required amount, and then push out the pins 3a and 3b.
is pushed out in the direction of the arrow, and the metal terminal plates 2a, 2b are bent along the cutout surface 1a. Metal terminal plate 2
The bending radius of a and 2b can be made relatively larger than that of conventional chip parts because the resin molded body 1 has the cutout surface 1a, and the bending radius of the resin molded body 1 can be made relatively larger than that of conventional chip parts. No force is applied.

The bending method shown in FIG. 3 is a conventionally commonly used method, and therefore, the chip component of the present invention also has the advantage that there is no need to significantly change the conventional method.

The gist of the present invention is to provide a notch surface 1a in the resin molded body 1 and to bend the metal terminal plates 2a, 2b along the notch surface 1a. , metal terminal plate 2a,
This holds true regardless of the type of 2b. Further, in this embodiment, the metal terminal plates 2a and 2b drawn out to the outside are bent into an L shape, but the present invention is also applicable to a shape in which the metal terminal plates 2a and 2b are simply bent along the notch surface 1a. It is.

Effects of the Invention As explained above, the chip component of the present invention is configured such that a notch surface is provided in the resin molded body and the metal terminal plate is bent along the notch surface, so that the protrusion amount of the metal terminal plate is This makes it possible to bend metal terminal plates without causing cracks or cracks in the resin molding, thereby reducing the yield of chip parts and preventing components from getting caught in the packaging tape during mounting. It has the advantage of being able to significantly improve reliability when mounted on a board, and has great industrial utility value.

[Brief explanation of the drawing]

FIG. 1a is a perspective view showing the appearance of a conventional chip component, FIG. 1b is a side view thereof, FIG. 2a is a perspective view showing the appearance of a chip component according to an embodiment of the present invention, and FIG.
Fig. b is a side view thereof, and Fig. 3 is a side view showing how the metal terminal plate is bent. 1... Resin molded body, 1a... Notch surface, 2
a, 2b...metal terminal board.

Claims (1)

[Claims] 1 Consisting of a component element, a metal terminal plate electrically connected to the component element, and a resin molded body covering the component element and a part of the metal terminal plate,
A notch surface is provided in the resin molded body from the side surface where the metal terminal plate is pulled out to the bottom surface, and the step is the same as the thickness of the metal terminal plate, and the portion of the resin molded body that is pulled out to the outside is the cutout surface. Chip parts are packaged with tape bent along the curve and surface-mounted onto electronic circuit boards using a mounting machine.