JPS5945540U - temperature sensing device - Google Patents

temperature sensing device

Info

Publication number
JPS5945540U
JPS5945540U JP14091082U JP14091082U JPS5945540U JP S5945540 U JPS5945540 U JP S5945540U JP 14091082 U JP14091082 U JP 14091082U JP 14091082 U JP14091082 U JP 14091082U JP S5945540 U JPS5945540 U JP S5945540U
Authority
JP
Japan
Prior art keywords
case
temperature sensing
sensing device
lid
lead wire
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP14091082U
Other languages
Japanese (ja)
Inventor
大越　四男
Original Assignee
三洋電機株式会社
東京三洋電機株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 三洋電機株式会社, 東京三洋電機株式会社 filed Critical 三洋電機株式会社
Priority to JP14091082U priority Critical patent/JPS5945540U/en
Publication of JPS5945540U publication Critical patent/JPS5945540U/en
Pending legal-status Critical Current

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  • Measuring Temperature Or Quantity Of Heat (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第１図は背景技術の製造工程図、第２図乃至第４図は本
考案の実施例に関し、第２図はケースの縦断側面図、第
３図は蓋と感温素子との一体化した断面図、第４図は感
温装置の縦断側面図である。 １０・・・ケース、１１・・・ケースの開口、１２・・
・感温素子、１３・・・リード線、１４・・・蓋、１５
・・・エポキシ樹脂の充填材。Figure 1 is a manufacturing process diagram of the background technology, Figures 2 to 4 are examples of the present invention, Figure 2 is a vertical side view of the case, and Figure 3 is a diagram of the integrated lid and temperature sensing element. The sectional view, FIG. 4, is a longitudinal side view of the temperature sensing device. 10...Case, 11...Case opening, 12...
・Temperature sensing element, 13... Lead wire, 14... Lid, 15
...Epoxy resin filling material.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 一面が開口したガラス繊維強化ポリエチレンテレフタレ
ート樹脂製のケースと、半導体感温素子と、前記ケース
と同材にて該素子のリード線が中央部を貫通するよう該
リード線に合体成形され前記ケースの開口を塞ぐ蓋と１
．前記ケースと蓋とで形成した空間に充填され前記素子
を埋設するエポキシ樹脂の充填材とよりなる感温装置。A case made of glass fiber-reinforced polyethylene terephthalate resin with one side open, and a semiconductor temperature-sensitive element made of the same material as the case and molded together with the lead wire of the element so that the lead wire of the element passes through the center of the case. A lid that closes the opening and 1
．． A temperature sensing device comprising an epoxy resin filler that fills a space formed by the case and the lid and embeds the element.
JP14091082U 1982-09-16 1982-09-16 temperature sensing device Pending JPS5945540U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP14091082U JPS5945540U (en) 1982-09-16 1982-09-16 temperature sensing device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP14091082U JPS5945540U (en) 1982-09-16 1982-09-16 temperature sensing device

Publications (1)

Publication Number Publication Date
JPS5945540U true JPS5945540U (en) 1984-03-26

Family

ID=30315321

Family Applications (1)

Application Number Title Priority Date Filing Date
JP14091082U Pending JPS5945540U (en) 1982-09-16 1982-09-16 temperature sensing device

Country Status (1)

Country Link
JP (1) JPS5945540U (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03119731U (en) * 1990-03-22 1991-12-10

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03119731U (en) * 1990-03-22 1991-12-10

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