JPS5945541U - temperature sensing device - Google Patents

temperature sensing device

Info

Publication number
JPS5945541U
JPS5945541U JP14091182U JP14091182U JPS5945541U JP S5945541 U JPS5945541 U JP S5945541U JP 14091182 U JP14091182 U JP 14091182U JP 14091182 U JP14091182 U JP 14091182U JP S5945541 U JPS5945541 U JP S5945541U
Authority
JP
Japan
Prior art keywords
insertion hole
sensing device
temperature sensing
glass fiber
polyethylene terephthalate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP14091182U
Other languages
Japanese (ja)
Other versions
JPS6318903Y2 (en
Inventor
大越 四男
時雄 堀田
Original Assignee
三洋電機株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 三洋電機株式会社 filed Critical 三洋電機株式会社
Priority to JP14091182U priority Critical patent/JPS5945541U/en
Publication of JPS5945541U publication Critical patent/JPS5945541U/en
Application granted granted Critical
Publication of JPS6318903Y2 publication Critical patent/JPS6318903Y2/ja
Granted legal-status Critical Current

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  • Measuring Temperature Or Quantity Of Heat (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。
(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第1図は背景技術の製造工程図、第2図は本考案の感温
装置の製造工保程図である。 10・・・ブロック、11・・・挿入孔、12・・・感
温素子、13・・・リード線、14・・・エポキシ樹脂
の充填材。
FIG. 1 is a manufacturing process diagram of the background art, and FIG. 2 is a manufacturing process diagram of the temperature sensing device of the present invention. DESCRIPTION OF SYMBOLS 10... Block, 11... Insertion hole, 12... Temperature sensing element, 13... Lead wire, 14... Epoxy resin filler.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 中央部に一端が外面に開口した有底の挿入孔を有し所定
形状に形成したガラス繊維強化ポリエチレンテレフタレ
ート樹脂製のブロックと、前記挿−人孔の底部に収納さ
れリード線を前記挿入孔外に延出した半導体の感温素子
と、該素子に密着して前記挿入孔内に′充填されて固化
したエポキシ樹脂の充填材より成る感温装置。
A block made of glass fiber-reinforced polyethylene terephthalate resin is formed into a predetermined shape and has a bottomed insertion hole with one end opening to the outside in the center, and a block made of glass fiber reinforced polyethylene terephthalate resin is formed into a predetermined shape and has a bottomed insertion hole with one end opening to the outside. 1. A temperature-sensing device comprising a semiconductor temperature-sensing element extending from above, and an epoxy resin filler that is tightly attached to the element and filled into the insertion hole and solidified.
JP14091182U 1982-09-16 1982-09-16 temperature sensing device Granted JPS5945541U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP14091182U JPS5945541U (en) 1982-09-16 1982-09-16 temperature sensing device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP14091182U JPS5945541U (en) 1982-09-16 1982-09-16 temperature sensing device

Publications (2)

Publication Number Publication Date
JPS5945541U true JPS5945541U (en) 1984-03-26
JPS6318903Y2 JPS6318903Y2 (en) 1988-05-27

Family

ID=30315323

Family Applications (1)

Application Number Title Priority Date Filing Date
JP14091182U Granted JPS5945541U (en) 1982-09-16 1982-09-16 temperature sensing device

Country Status (1)

Country Link
JP (1) JPS5945541U (en)

Also Published As

Publication number Publication date
JPS6318903Y2 (en) 1988-05-27

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