JPS5945541U - temperature sensing device - Google Patents
temperature sensing deviceInfo
- Publication number
- JPS5945541U JPS5945541U JP14091182U JP14091182U JPS5945541U JP S5945541 U JPS5945541 U JP S5945541U JP 14091182 U JP14091182 U JP 14091182U JP 14091182 U JP14091182 U JP 14091182U JP S5945541 U JPS5945541 U JP S5945541U
- Authority
- JP
- Japan
- Prior art keywords
- insertion hole
- sensing device
- temperature sensing
- glass fiber
- polyethylene terephthalate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Measuring Temperature Or Quantity Of Heat (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
第1図は背景技術の製造工程図、第2図は本考案の感温
装置の製造工保程図である。
10・・・ブロック、11・・・挿入孔、12・・・感
温素子、13・・・リード線、14・・・エポキシ樹脂
の充填材。FIG. 1 is a manufacturing process diagram of the background art, and FIG. 2 is a manufacturing process diagram of the temperature sensing device of the present invention. DESCRIPTION OF SYMBOLS 10... Block, 11... Insertion hole, 12... Temperature sensing element, 13... Lead wire, 14... Epoxy resin filler.
Claims (1)
形状に形成したガラス繊維強化ポリエチレンテレフタレ
ート樹脂製のブロックと、前記挿−人孔の底部に収納さ
れリード線を前記挿入孔外に延出した半導体の感温素子
と、該素子に密着して前記挿入孔内に′充填されて固化
したエポキシ樹脂の充填材より成る感温装置。A block made of glass fiber-reinforced polyethylene terephthalate resin is formed into a predetermined shape and has a bottomed insertion hole with one end opening to the outside in the center, and a block made of glass fiber reinforced polyethylene terephthalate resin is formed into a predetermined shape and has a bottomed insertion hole with one end opening to the outside. 1. A temperature-sensing device comprising a semiconductor temperature-sensing element extending from above, and an epoxy resin filler that is tightly attached to the element and filled into the insertion hole and solidified.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP14091182U JPS5945541U (en) | 1982-09-16 | 1982-09-16 | temperature sensing device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP14091182U JPS5945541U (en) | 1982-09-16 | 1982-09-16 | temperature sensing device |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS5945541U true JPS5945541U (en) | 1984-03-26 |
JPS6318903Y2 JPS6318903Y2 (en) | 1988-05-27 |
Family
ID=30315323
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP14091182U Granted JPS5945541U (en) | 1982-09-16 | 1982-09-16 | temperature sensing device |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5945541U (en) |
-
1982
- 1982-09-16 JP JP14091182U patent/JPS5945541U/en active Granted
Also Published As
Publication number | Publication date |
---|---|
JPS6318903Y2 (en) | 1988-05-27 |
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