JPS5856481U - Resin molded electronic circuit unit - Google Patents
Resin molded electronic circuit unitInfo
- Publication number
- JPS5856481U JPS5856481U JP15187181U JP15187181U JPS5856481U JP S5856481 U JPS5856481 U JP S5856481U JP 15187181 U JP15187181 U JP 15187181U JP 15187181 U JP15187181 U JP 15187181U JP S5856481 U JPS5856481 U JP S5856481U
- Authority
- JP
- Japan
- Prior art keywords
- electronic circuit
- resin molded
- circuit unit
- molded electronic
- cylindrical body
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Casings For Electric Apparatus (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
第1図は従来の樹脂モールド型電子回路ユニットの一例
を示す断面図、第2図は本考案樹脂モールドを電子回路
ユニットの一例を示す断面図である。
符号の説明、1・・・・・・回路基板、2・・・・・・
可変型素−子、4・・・・・・ケース、6・・・・・・
筒状体、8・・・・・・合成樹脂、9・・・・・・筒状
体の開口端。FIG. 1 is a sectional view showing an example of a conventional resin molded electronic circuit unit, and FIG. 2 is a sectional view showing an example of an electronic circuit unit made of a resin mold according to the present invention. Explanation of symbols, 1...Circuit board, 2...
Variable element, 4... Case, 6...
Cylindrical body, 8...Synthetic resin, 9...Open end of the cylindrical body.
Claims (1)
板をケース内に収納し、前記可変型素子に筒状体を冠着
し、ケース内に前記筒状体の開口端を埋設しない程度に
合成樹脂を充填したことを特徴とする樹脂モールド型電
子回路、ユニット。A circuit board on which a circuit using one or several variable elements is formed is housed in a case, a cylindrical body is attached to the variable element, and the open end of the cylindrical body is not buried in the case. A resin molded electronic circuit or unit characterized by being filled with synthetic resin to a certain extent.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15187181U JPS5856481U (en) | 1981-10-13 | 1981-10-13 | Resin molded electronic circuit unit |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15187181U JPS5856481U (en) | 1981-10-13 | 1981-10-13 | Resin molded electronic circuit unit |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5856481U true JPS5856481U (en) | 1983-04-16 |
| JPH0319243Y2 JPH0319243Y2 (en) | 1991-04-23 |
Family
ID=29944550
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP15187181U Granted JPS5856481U (en) | 1981-10-13 | 1981-10-13 | Resin molded electronic circuit unit |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5856481U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6267104U (en) * | 1985-10-16 | 1987-04-25 | ||
| JPS62204204U (en) * | 1986-06-17 | 1987-12-26 |
-
1981
- 1981-10-13 JP JP15187181U patent/JPS5856481U/en active Granted
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6267104U (en) * | 1985-10-16 | 1987-04-25 | ||
| JPS62204204U (en) * | 1986-06-17 | 1987-12-26 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0319243Y2 (en) | 1991-04-23 |
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