JPS596842U - Cap for resin sealing - Google Patents
Cap for resin sealingInfo
- Publication number
- JPS596842U JPS596842U JP10233282U JP10233282U JPS596842U JP S596842 U JPS596842 U JP S596842U JP 10233282 U JP10233282 U JP 10233282U JP 10233282 U JP10233282 U JP 10233282U JP S596842 U JPS596842 U JP S596842U
- Authority
- JP
- Japan
- Prior art keywords
- cap
- resin sealing
- resin
- utility
- sealing cap
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Cable Accessories (AREA)
- Connector Housings Or Holding Contact Members (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
第１図は、本考案の第１の実施例を示す断面図であり、
第２図は本考案の第２の実施例を示す断面図である。
尚、図において、１・・・・・・電気絶縁材料、２・・
・・・・接着用樹脂材料、３・・・・・・吸質物質であ
る。FIG. 1 is a sectional view showing a first embodiment of the present invention,
FIG. 2 is a sectional view showing a second embodiment of the present invention. In the figure, 1... electrical insulating material, 2...
. . . Adhesive resin material, 3 . . . Absorbent material.
Claims (2)
プにおいて、該キャップの接着用樹脂には、吸湿物質を
含有していることを特徴とする樹脂封止用キャップ。(1) A resin sealing cap made of an electrically insulating material, wherein the adhesive resin of the cap contains a hygroscopic substance.
する樹脂層が設けられている登録実用新案請求の範囲、
第（１）項記載の樹脂封止用キャップ。(2) Registered utility model claims in which a resin layer containing a moisture-absorbing substance is provided on a part or the entire surface of the inner wall of the cap;
The resin sealing cap according to item (1).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10233282U JPS596842U (en) | 1982-07-06 | 1982-07-06 | Cap for resin sealing |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10233282U JPS596842U (en) | 1982-07-06 | 1982-07-06 | Cap for resin sealing |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS596842U true JPS596842U (en) | 1984-01-17 |
Family
ID=30241268
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP10233282U Pending JPS596842U (en) | 1982-07-06 | 1982-07-06 | Cap for resin sealing |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS596842U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH06232292A (en) * | 1993-02-08 | 1994-08-19 | Kyocera Corp | Package for housing semiconductor device |
| JP2006121052A (en) * | 2004-09-27 | 2006-05-11 | Idc Llc | Method and system for packaging mems device together with incorporated getter |
-
1982
- 1982-07-06 JP JP10233282U patent/JPS596842U/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH06232292A (en) * | 1993-02-08 | 1994-08-19 | Kyocera Corp | Package for housing semiconductor device |
| JP2006121052A (en) * | 2004-09-27 | 2006-05-11 | Idc Llc | Method and system for packaging mems device together with incorporated getter |
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