JPS5993144U - Adapter for leadless chip carrier - Google Patents
Adapter for leadless chip carrierInfo
- Publication number
- JPS5993144U JPS5993144U JP18842282U JP18842282U JPS5993144U JP S5993144 U JPS5993144 U JP S5993144U JP 18842282 U JP18842282 U JP 18842282U JP 18842282 U JP18842282 U JP 18842282U JP S5993144 U JPS5993144 U JP S5993144U
- Authority
- JP
- Japan
- Prior art keywords
- chip carrier
- adapter
- leadless chip
- rubber
- leadless
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Abstract] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
第１図はリードレスチップキャリヤを説明するだめの図
、第２図は本考案によるリードレスチップキャリヤ用ア
ダプタの第１の実施例を示す図、第３図は第２の実施例
を示す図、第４図は第３の実施例を示す図である。
図面において、１はアダプタ、２はリードレスチップキ
ャリヤのパッケージ、３はその端子、４は基板、５はそ
のパッド、６は絶縁壁、７は良導電性のゴム、８，８′
は端子、９はパイプ、１０はピンをそれぞれ示す。FIG. 1 is a diagram for explaining a leadless chip carrier, FIG. 2 is a diagram showing a first embodiment of an adapter for a leadless chip carrier according to the present invention, and FIG. 3 is a diagram showing a second embodiment. , FIG. 4 is a diagram showing the third embodiment. In the drawing, 1 is an adapter, 2 is a leadless chip carrier package, 3 is its terminal, 4 is a substrate, 5 is its pad, 6 is an insulating wall, 7 is a highly conductive rubber, 8, 8'
9 indicates a terminal, 9 indicates a pipe, and 10 indicates a pin.
Claims (1)
行なうアダプタであって、チップキャリヤの複数個の端
子にそれぞれ対応して絶縁壁で区切られた領域を形成し
、該領域に良導電性のゴムを充填し、該ゴムの上面及び
下面に金属製の端子をその頭部が露出するようにして埋
設したことを特徴とするリードレスチップキャリヤ用ア
ダプタ。This is an adapter for making a temporary electrical connection between a leadless chip carrier and a substrate, and has a region separated by an insulating wall corresponding to a plurality of terminals of the chip carrier, and a highly conductive material is provided in the region. 1. An adapter for a leadless chip carrier, characterized in that it is filled with rubber, and metal terminals are buried in the upper and lower surfaces of the rubber so that their heads are exposed.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP18842282U JPS5993144U (en) | 1982-12-15 | 1982-12-15 | Adapter for leadless chip carrier |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP18842282U JPS5993144U (en) | 1982-12-15 | 1982-12-15 | Adapter for leadless chip carrier |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS5993144U true JPS5993144U (en) | 1984-06-25 |
Family
ID=30406483
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP18842282U Pending JPS5993144U (en) | 1982-12-15 | 1982-12-15 | Adapter for leadless chip carrier |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5993144U (en) |
-
1982
- 1982-12-15 JP JP18842282U patent/JPS5993144U/en active Pending
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JPS596839U (en) | semiconductor equipment | |
| JPS5993144U (en) | Adapter for leadless chip carrier | |
| JPS6142842U (en) | Semiconductor device alignment equipment | |
| JPS5933255U (en) | semiconductor equipment | |
| JPS58109254U (en) | Chip carrier for face-down connected chips | |
| JPS5970347U (en) | integrated circuit device | |
| JPS602832U (en) | semiconductor equipment | |
| JPS58144848U (en) | Hybrid IC | |
| JPS58170835U (en) | semiconductor equipment | |
| JPS58155852U (en) | semiconductor equipment | |
| JPS59138237U (en) | semiconductor equipment | |
| JPS58159756U (en) | integrated circuit device | |
| JPS59131155U (en) | semiconductor equipment | |
| JPS6094836U (en) | semiconductor equipment | |
| JPS5869935U (en) | Lead plate for connecting ultra-thin ICs | |
| JPS5858328U (en) | electronic components | |
| JPS5937747U (en) | semiconductor equipment | |
| JPS58191650U (en) | semiconductor equipment | |
| JPS6144835U (en) | semiconductor equipment | |
| JPS5829848U (en) | semiconductor equipment | |
| JPS58166052U (en) | integrated circuit device | |
| JPS5929050U (en) | Package with shield | |
| JPS58148931U (en) | semiconductor equipment | |
| JPS593556U (en) | semiconductor equipment | |
| JPS60149166U (en) | Hybrid integrated circuit device |