JPS6355572U - - Google Patents
Info
- Publication number
- JPS6355572U JPS6355572U JP14906786U JP14906786U JPS6355572U JP S6355572 U JPS6355572 U JP S6355572U JP 14906786 U JP14906786 U JP 14906786U JP 14906786 U JP14906786 U JP 14906786U JP S6355572 U JPS6355572 U JP S6355572U
- Authority
- JP
- Japan
- Prior art keywords
- electronic component
- mounting structure
- guide pin
- wiring board
- utility
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000853 adhesive Substances 0.000 claims 1
- 230000001070 adhesive effect Effects 0.000 claims 1
Landscapes
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Description
第１図乃至第３図は本考案の一実施例を示して
おり、第１図は本考案の全体構成を示す斜視図、
第２図は第１図のＬＳＩパツケージの平面図、第
３図は第２図のＬＳＩパツケージの側面図、第４
図及び第５図は従来例を示し、第４図は従来のＬ
ＳＩパツケージの平面図、第５図は第４図の従来
のＬＳＩパツケージの側面図である。
１……配線基板、２……電子部品（ＬＳＩパツ
ケージ）、３……ガイドピン、４……孔。
1 to 3 show an embodiment of the present invention, and FIG. 1 is a perspective view showing the overall structure of the present invention;
Figure 2 is a plan view of the LSI package in Figure 1, Figure 3 is a side view of the LSI package in Figure 2, and Figure 4 is a side view of the LSI package in Figure 2.
5 and 5 show conventional examples, and FIG. 4 shows the conventional L
FIG. 5 is a plan view of the SI package, and FIG. 5 is a side view of the conventional LSI package shown in FIG. 1... Wiring board, 2... Electronic component (LSI package), 3... Guide pin, 4... Hole.
Claims (1)
て電子部品を実装する電子部品の実装構造におい
て、上記電子部品の底部よりガイドピン３を突出
させ、このガイドピン３を上記配線基板１に設け
た孔４に挿通して電子部品の位置ずれを規制した
ことを特徴とする電子部品の実装構造。 (2) 電子部品より突出する信号ピン５が配線基
板１に設けたランド６に一致するように実装され
ることを特徴とする実用新案登録請求の範囲第１
項記載の電子部品の実装構造。 (3) ガイドピン３は、電子部品底部の３点より
突出し、当該ガイドピン３の位置に対応して孔４
を形成したことを特徴とする実用新案登録請求の
範囲第１項記載の電子部品の実装構造。[Claims for Utility Model Registration] (1) In an electronic component mounting structure in which an electronic component is mounted at a prescribed position on the surface of a wiring board 1 via an adhesive, a guide pin 3 is protruded from the bottom of the electronic component, and A mounting structure for electronic components, characterized in that a guide pin 3 is inserted into a hole 4 provided in the wiring board 1 to restrict misalignment of the electronic component. (2) Utility model registration claim 1, characterized in that the signal pin 5 protruding from the electronic component is mounted so as to coincide with the land 6 provided on the wiring board 1
Mounting structure of electronic components described in section. (3) The guide pin 3 protrudes from three points on the bottom of the electronic component, and the hole 4 corresponds to the position of the guide pin 3.
A mounting structure for an electronic component according to claim 1 of the utility model registration claim, characterized in that the electronic component mounting structure is formed by:
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14906786U JPS6355572U (en) | 1986-09-29 | 1986-09-29 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14906786U JPS6355572U (en) | 1986-09-29 | 1986-09-29 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6355572U true JPS6355572U (en) | 1988-04-14 |
Family
ID=31063925
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP14906786U Pending JPS6355572U (en) | 1986-09-29 | 1986-09-29 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6355572U (en) |
-
1986
- 1986-09-29 JP JP14906786U patent/JPS6355572U/ja active Pending