JPH03106791U - - Google Patents
Info
- Publication number
- JPH03106791U JPH03106791U JP1431390U JP1431390U JPH03106791U JP H03106791 U JPH03106791 U JP H03106791U JP 1431390 U JP1431390 U JP 1431390U JP 1431390 U JP1431390 U JP 1431390U JP H03106791 U JPH03106791 U JP H03106791U
- Authority
- JP
- Japan
- Prior art keywords
- circuit board
- printed circuit
- integrated circuit
- bonding
- printed
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Mounting Of Printed Circuit Boards And The Like (AREA)
Description
第1図はこの考案の一実施例によるプリント基
板回路機器の平面実装図、第2図は側面図、第3
図、第4図は部分拡大図及び断面図、第5図は従
来のプリント基板回路機器の平面実装図、第6図
はその側面図である。1……プリント基板、2…
…フラツトパツク型集積回路、3……結合材、9
……固定具、10……剛性部材である。なお図中
、同一符号は同一又は相当部分を示す。
Figure 1 is a plan view of a printed circuit board circuit device according to an embodiment of this invention, Figure 2 is a side view, and Figure 3 is a side view.
4 is a partially enlarged view and a sectional view, FIG. 5 is a plan view of a conventional printed circuit board circuit device, and FIG. 6 is a side view thereof. 1...Printed circuit board, 2...
...Flatpack integrated circuit, 3...Binding material, 9
. . . Fixture, 10 . . . Rigid member. In the figures, the same reference numerals indicate the same or equivalent parts.
Claims (1)
多数のリードを有するフラツトパツク型集積回路
を実装するプリント基板と、上記プリント基板に
集積回路本体を接合する結合材と、上記プリント
基板と集積回路本体を四隅で結合する固定具と、
上記プリント基板の集積回路実装部の反対側に接
合した集積回路寸法に対応した枠状の剛性部材を
備えたことを特徴とするプリント基板回路機器。 In electronic equipment using printed circuit board circuits,
a printed circuit board on which a flat pack integrated circuit having a large number of leads is mounted; a bonding material for bonding the integrated circuit body to the printed circuit board; a fixture for bonding the printed circuit board and the integrated circuit body at four corners;
A printed circuit board circuit device comprising a frame-shaped rigid member corresponding to the dimensions of the integrated circuit bonded to the opposite side of the integrated circuit mounting portion of the printed circuit board.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1431390U JPH03106791U (en) | 1990-02-16 | 1990-02-16 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1431390U JPH03106791U (en) | 1990-02-16 | 1990-02-16 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH03106791U true JPH03106791U (en) | 1991-11-05 |
Family
ID=31517682
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1431390U Pending JPH03106791U (en) | 1990-02-16 | 1990-02-16 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH03106791U (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR101039086B1 (en) * | 2007-12-07 | 2011-06-07 | 가부시키가이샤 히타치세이사쿠쇼 | Circuit board and image display device |
-
1990
- 1990-02-16 JP JP1431390U patent/JPH03106791U/ja active Pending
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR101039086B1 (en) * | 2007-12-07 | 2011-06-07 | 가부시키가이샤 히타치세이사쿠쇼 | Circuit board and image display device |
US8153903B2 (en) | 2007-12-07 | 2012-04-10 | Hitachi, Ltd. | Circuit board and image display apparatus |
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